MJD340 (NPN)

MJD350 (PNP)
Preferred Device

High Voltage Power

Transistors
DPAK For Surface Mount Applications
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Designed for line operated audio output amplifier, switchmode
power supply drivers and other switching applications.
SILICON
Features POWER TRANSISTORS
• Lead Formed for Surface Mount Applications in Plastic Sleeves 0.5 AMPERE
(No Suffix) 300 VOLTS, 15 WATTS
• Electrically Similar to Popular MJE340 and MJE350
• 300 V (Min) − VCEO(sus)
• 0.5 A Rated Collector Current 4
• Epoxy Meets UL 94 V−0 @ 0.125 in
• ESD Ratings: Human Body Model, 3B u 8000 V 1 2
3
Machine Model, C u 400 V
• Pb−Free Packages are Available
DPAK
CASE 369C
MAXIMUM RATINGS
STYLE 1
Rating Symbol Max Unit
Collector−Emitter Voltage VCEO 300 Vdc
Collector−Base Voltage VCB 300 Vdc
MARKING DIAGRAM
Emitter−Base Voltage VEB 3 Vdc

Collector Current − Continuous IC 0.5 Adc

− Peak 0.75

PD 15 W YWW
Total Power Dissipation @ TC = 25°C
0.12 W/°C J3x0G
Derate above 25°C

Total Power Dissipation (Note 1) PD

@ TA = 25°C 1.56 W
Derate above 25°C 0.012 W/°C
Y = Year
Operating and Storage Junction TJ, Tstg −65 to +150 °C
Temperature Range WW = Work Week
J3x0 = Device Code
THERMAL CHARACTERISTICS x= 4 or 5
G = Pb−Free Package
Characteristic Symbol Max Unit
Thermal Resistance, Junction−to−Case RqJC 8.33 °C/W
ORDERING INFORMATION
Thermal Resistance, Junction−to−Ambient RqJA 80 °C/W
See detailed ordering and shipping information in the package
(Note 1)
dimensions section on page 4 of this data sheet.
Leading Temperature for Soldering Purpose TL 260 °C
Maximum ratings are those values beyond which device damage can occur.
Preferred devices are recommended choices for future use
Maximum ratings applied to the device are individual stress limit values (not
and best overall value.
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. These ratings are applicable when surface mounted on the minimum pad
sizes recommended.

© Semiconductor Components Industries, LLC, 2005 1 Publication Order Number:

December, 2005 − Rev. 5 MJD340/D
 MJD340 (NPN) MJD350 (PNP)

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ELECTRICAL CHARACTERISTICS (TC = 25_C unless otherwise noted)

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Characteristic Symbol Min Max Unit

OFF CHARACTERISTICS
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
Collector−Emitter Sustaining Voltage (Note 2) VCEO(sus) 300 − Vdc

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
(IC = 1 mAdc, IB = 0)
ÎÎÎ
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
Collector Cutoff Current
ÎÎÎ
ÎÎÎ ICEO − 0.1 mAdc

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ
ÎÎÎÎ ÎÎÎ
ÎÎÎ
(VCB = 300 Vdc, IE = 0)

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎ
Emitter Cutoff Current IEBO − 0.1 mAdc

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ ÎÎÎ
ÎÎÎ
(VBE = 3 Vdc, IC = 0)

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ ÎÎÎ
ÎÎÎ
ON CHARACTERISTICS (Note 2)

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎ
DC Current Gain hFE 30 240 −
(IC = 50 mAdc, VCE = 10 Vdc)
2. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2%.

TYPICAL CHARACTERISTICS
MJD340

300

200 VCE = 2 V
VCE = 10 V
hFE , DC CURRENT GAIN

TJ = 150°C
100
70
+100°C
50
+25 °C
30

20 −55 °C

10
1 2 3 5 7 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mAdc)

Figure 1. DC Current Gain

MJD340

1
TJ = 25°C
0.8 VBE(sat) @ IC/IB = 10
V, VOLTAGE (VOLTS)

0.6 VBE @ VCE = 10 V

0.4

VCE(sat) @ IC/IB = 10
0.2
IC/IB = 5
0
10 20 30 50 100 200 300 500
IC, COLLECTOR CURRENT (mA)
Figure 2. “On” Voltages

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2
 MJD340 (NPN) MJD350 (PNP)

MJD350 MJD350
200 1 1
TJ = 150°C
TJ = 25°C

25°C 0.8
100 VBE(sat) @ IC/IB = 10
hFE , DC CURRENT GAIN

V, VOLTAGE (VOLTS)
70
−55 °C 0.6 VBE @ VCE = 10 V
50

0.4 IC/IB = 10
30

20 VCE = 2 V 0.2
VCC = 10 V
VCE(sat)
IC/IB = 5
10 0
5 7 10 20 30 50 70 100 200 300 500 5 7 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
Figure 3. DC Current Gain Figure 4. “On” Voltages

1
0.7 D = 0.5
0.5
RESISTANCE (NORMALIZED)
r(t), TRANSIENT THERMAL

0.3 0.2
0.2 0.1 P(pk)
RqJC(t) = r(t) RqJC
0.05 RqJC = 8.33°C/W MAX
0.1
D CURVES APPLY FOR POWER
0.07 0.01
PULSE TRAIN SHOWN t1
0.05 READ TIME AT t1 t2
TJ(pk) − TC = P(pk) qJC(t) DUTY CYCLE, D = t1/t2
0.03 SINGLE PULSE
0.02

0.01
0.01 0.02 0.03 0.05 0.1 0.2 0.3 0.5 1 2 3 5 10 20 30 50 100 200 300 500 1k
t, TIME (ms)

Figure 5. Thermal Response

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 MJD340 (NPN) MJD350 (PNP)

1000 There are two limitations on the power handling ability of

100 ms
500 a transistor: average junction temperature and second
300 500 ms breakdown. Safe operating area curves indicate IC − VCE
IC, COLLECTOR CURRENT (mA)

200
1 ms limits of the transistor that must be observed for reliable
100 operation; i.e., the transistor must not be subjected to greater
50 dissipation than the curves indicate.
30 dc The data of Figure 6 is based on T J(pk) = 150_C; TC is
20
variable depending on conditions. Second breakdown pulse
10 limits are valid for duty cycles to 10% provided T J(pk)
5 v 150_C. T J(pk) may be calculated from the data in
3 Figure 5. At high case temperatures, thermal limitations will
2
reduce the power that can be handled to values less than the
1 limitations imposed by second breakdown.
10 20 30 50 70 100 200 300 500 700 1000
VCE, COLLECTOR−EMITTER VOLTAGE (VOLTS)

Figure 6. Active Region Safe Operating Area

TA TC
2.5 25
PD, POWER DISSIPATION (WATTS)

2 20

1.5 15
TA
1 10 TC

0.5 5

0 0
25 50 75 100 125 150
T, TEMPERATURE (°C)

Figure 7. Power Derating

ORDERING INFORMATION
Device Package Shipping †
MJD340 DPAK
MJD340G DPAK 75 Units / Rail
(Pb−Free)

MJD340RL DPAK
MJD340RLG DPAK 1800 / Tape & Reel
(Pb−Free)

MJD340T4 DPAK
MJD340T4G DPAK 2500 / Tape & Reel
(Pb−Free)

MJD350 DPAK
MJD350G DPAK 75 Units / Rail
(Pb−Free)

MJD350T4 DPAK
MJD350T4G DPAK 2500 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.

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4
 MJD340 (NPN) MJD350 (PNP)

PACKAGE DIMENSIONS

DPAK
CASE 369C
ISSUE O

NOTES:
−T− SEATING
PLANE 1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
B C 2. CONTROLLING DIMENSION: INCH.

V R E INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.235 0.245 5.97 6.22
B 0.250 0.265 6.35 6.73
4
C 0.086 0.094 2.19 2.38
Z D 0.027 0.035 0.69 0.88
A
E 0.018 0.023 0.46 0.58
S F 0.037 0.045 0.94 1.14
1 2 3
U G 0.180 BSC 4.58 BSC
K H 0.034 0.040 0.87 1.01
J 0.018 0.023 0.46 0.58
K 0.102 0.114 2.60 2.89
F L 0.090 BSC 2.29 BSC
J
R 0.180 0.215 4.57 5.45
L H S 0.025 0.040 0.63 1.01
U 0.020 −−− 0.51 −−−
D 2 PL V 0.035 0.050 0.89 1.27
Z 0.155 −−− 3.93 −−−
G 0.13 (0.005) M T STYLE 1:
PIN 1. BASE
2. COLLECTOR
3. EMITTER
4. COLLECTOR

SOLDERING FOOTPRINT*

6.20 3.0
0.244 0.118
2.58
0.101

5.80 1.6 6.172

0.228 0.063 0.243

SCALE 3:1 ǒinches

mm Ǔ

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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5