Вы находитесь на странице: 1из 254

Field automation level

assembly catalog

FAL-5

Documentation Parts 1, 3, 5

 Structure and function


 Maintenance and repair
(Plant personnel)
 Illustrated parts catalog

E 531 439 / 04 E
assuring you

 certification:

Quality assurance in design/development,


production, installation and service

 conformity:

– Guideline 73/23/EEC – Low voltage guideline – dated


February 19, 1973 with amendment dated July 22, 1993
(guideline 93/68/EEC)

– Guideline 89/336/EEC – Guideline on electromagnetic


compatibility – dated May 3, 1989 with amendment
dated April 28, 1992 (guideline 92/31/EEC)

CE conformity is influenced if the product is installed incorrectly, an assembly or system is


misused and/or genuine MTU components are not used.
Guide Page I
FRIEDRICHSHAFEN

Table of contents
Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . X
General information about documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . XIV

1 Structure and function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.1 Peripheral Interface Modules (PIMs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.1.1 Use of the PIMs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.1.2 Structure of the PIMs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

1.1.3 Slots and terminals of the PIMs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5


1.1.4 Overview of PIM printed circuit boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.1.4.1 MPU 23 printed circuit boards (microprocessor systems) . . . . . . . . . . . . . . 6
1.1.4.2 MPU 23 extension printed circuit boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.1.4.3 Connection printed circuit boards (motherboards) . . . . . . . . . . . . . . . . . . . . . 6
1.1.4.4 PIM printed circuit boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

1.1.5 Technical data of the PIMs (screw terminals) . . . . . . . . . . . . . . . . . . . . . . . . . 9

1.1.6 Technical data of the PIMs (spring-cage terminals) . . . . . . . . . . . . . . . . . . . . 10

1.2 Filter module 1 (FIM 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

1.2.1 Use of FIM 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

1.2.2 Structure of FIM 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

1.2.3 Terminals of FIM 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

1.2.4 Technical data of FIM 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

1.3 Dimmer module 3 (DIM 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

1.3.1 Use of DIM 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

1.3.2 Structure of DIM 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

1.3.3 Terminals of DIM 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

1.3.4 Circuitry for DIM 3 dimmer voltage setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

1.3.5 Technical data of DIM 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

1.4 Power supply modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

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Table of contents (cont.)

1.4.1 PSM 3-01 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22


1.4.1.1 Use of PSM 3-01 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
1.4.1.2 Structure of PSM 3-01 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
1.4.1.3 Terminals of PSM 3-01 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
1.4.1.4 Technical data of PSM 3-01 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

1.4.2 PSM 3-01/A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25


1.4.2.1 Use of PSM 3-01/A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
1.4.2.2 Structure of PSM 3-01/A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
1.4.2.3 Terminals of PSM 3-01/A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
1.4.2.4 Technical data of PSM 3-01/A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

1.5 Mechanical installation of PIMs, FIMs, DIMs and PSMs . . . . . . . . . . . . . . . . 28

1.5.1 Mounting variants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

1.5.2 Installation in protective housing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

1.6 EMC specifications for PIM and FIM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

1.7 Printed circuit board MPU 23 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

1.7.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

1.7.2 Performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

1.7.3 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

1.7.4 Connection assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34


1.7.4.1 Connection assignment of MPU 23 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
1.7.4.2 Connection assignment of MPU 23 with CCB 1 . . . . . . . . . . . . . . . . . . . . . . . 34
1.7.4.3 Connection assignment for MPU 23 with SCB 2 . . . . . . . . . . . . . . . . . . . . . . 35
1.7.4.4 Connection assignment for MPU 23 with SCB 4 . . . . . . . . . . . . . . . . . . . . . . 35

1.7.5 Technical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

1.8 Printed circuit board COB 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

1.8.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

1.8.2 Performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

1.8.3 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

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Table of contents (cont.)

1.8.4 Technical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

1.9 Printed circuit board COB 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

1.9.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

1.9.2 Performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

1.9.3 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

1.9.4 Technical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

1.10 Printed circuit board AIB 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

1.10.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

1.10.2 Performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

1.10.3 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

1.10.4 Connection assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

1.10.5 Examples for connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

1.10.6 Technical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

1.11 Printed circuit board AIB 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

1.11.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

1.11.2 Performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

1.11.3 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

1.11.4 Connection assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

1.11.5 Technical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

1.12 Printed circuit board AIB 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

1.12.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

1.12.2 Performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

1.12.3 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

1.12.4 Connection assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

1.12.5 Technical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

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Table of contents (cont.)

1.13 Printed circuit board AIB 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

1.13.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

1.13.2 Performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

1.13.3 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

1.13.4 Connection assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

1.13.5 Technical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

1.14 Printed circuit board BIB 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

1.14.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

1.14.2 Performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

1.14.3 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

1.14.4 Connection assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

1.14.5 Technical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

1.15 Printed circuit board BIB 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73

1.15.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73

1.15.2 Performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

1.15.3 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

1.15.4 Connection assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

1.15.5 Technical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77

1.16 Printed circuit board BOB 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

1.16.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

1.16.2 Performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80

1.16.3 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80

1.16.4 Connection assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82

1.16.5 Technical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83

1.17 Printed circuit board BOB 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85

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Table of contents (cont.)

1.17.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85

1.17.2 Performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86

1.17.3 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86

1.17.4 Connection assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87

1.17.5 Technical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88

1.18 Printed circuit board BOB 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89

1.18.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89

1.18.2 Performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90

1.18.3 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90

1.18.4 Connection assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91

1.18.5 Technical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92

1.19 Printed circuit board CCB 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93

1.19.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93

1.19.2 Performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93

1.19.3 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93

1.19.4 Technical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94

1.20 Printed circuit board EGB 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95

1.20.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95

1.20.2 Performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96

1.20.3 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96

1.20.4 Connection assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97

1.20.5 Technical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98

1.21 Printed circuit board FCB 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99

1.21.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99

1.21.2 Performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100

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1.21.3 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101

1.21.4 Connection assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104

1.21.5 Technical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105

1.22 Printed circuit board IIB 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107

1.22.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107

1.22.2 Performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108

1.22.3 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108

1.22.4 Connection assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110

1.22.5 Technical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111

1.23 Printed circuit board INB 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113

1.23.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113

1.23.2 Performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114

1.23.3 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

1.23.4 Connection assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117

1.23.5 Technical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118

1.24 Printed circuit board INB 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121

1.24.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121

1.24.2 Performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122

1.24.3 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122

1.24.4 Connection assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124

1.24.5 Technical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125

1.25 Printed circuit board INB 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127

1.25.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127

1.25.2 Performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128

1.25.3 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128

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Table of contents (cont.)

1.25.4 Connection assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130

1.25.5 Technical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131

1.26 Printed circuit board MFB 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133

1.26.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133

1.26.2 Performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134

1.26.3 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135

1.26.4 Connection assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137

1.26.5 Technical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138

1.27 Printed circuit board MFB 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141

1.27.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141

1.27.2 Performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142

1.27.3 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142

1.27.4 Connection assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147

1.27.5 Technical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148

1.28 Printed circuit board MOB 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151

1.28.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151

1.28.2 Performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152

1.28.3 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153

1.28.4 Connection assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156

1.28.5 Technical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157

1.29 Printed circuit board PAB 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159

1.29.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159

1.29.2 Performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159

1.29.3 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160

1.29.4 Technical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161

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Table of contents (cont.)

1.30 Printed circuit board SAB 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163

1.30.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163


1.30.2 Performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164

1.30.3 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165

1.30.4 Connection assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168


1.30.5 Technical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 169

1.31 Printed circuit board SCB 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171

1.31.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171

1.31.2 Performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171


1.31.3 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171

1.31.4 Technical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172

1.32 Printed circuit board SCB 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173


1.32.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173

1.32.2 Performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173

1.32.3 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174


1.32.4 Connection assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175

1.32.5 Technical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176

1.33 Printed circuit board SCB 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177

1.33.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177


1.33.2 Performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177

1.33.3 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177

1.33.4 Technical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178

2 Operation
Not applicable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179

3 Maintenance and repair (Plant personnel) . . . . . . . . . . . . . . . . . . . . . . . . . 183

3.1 Safety requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183

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Table of contents (cont.)

3.2 Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185

3.3 Troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186

3.3.1 General information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186

3.3.2 Malfunctions caused by faulty wiring and terminal connections . . . . . . . . . 186

3.3.3 LED indicators on the printed circuit boards . . . . . . . . . . . . . . . . . . . . . . . . . . 186


3.3.3.1 LED indicators on MPU 23 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187
3.3.3.2 LED indicators on AIB 1-02 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188
3.3.3.3 LED indicators on AIB 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189
3.3.3.4 LED indicators on BIB 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190
3.3.3.5 LED indicators on BIB 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191
3.3.3.6 LED indicators on BOB 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192
3.3.3.7 LED indicators on BOB 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193
3.3.3.8 LED indicators on BOB 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 194
3.3.3.9 LED indicators on EGB 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 195
3.3.3.10 LED indicators on FCB 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196
3.3.3.11 LED indicators on INB 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197
3.3.3.12 LED indicators on MFB 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 198
3.3.3.13 LED indicators on SAB 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199

3.4 Repair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201

3.4.1 Power supply (+24 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201

3.4.2 Replacing printed circuit boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202

3.4.3 Replacing fuses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203

3.4.4 Replacing a PIM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204


3.4.4.1 Rail mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204
3.4.4.2 Screw mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206

3.5 Storage, packaging, transport . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207

4 Maintenance and repair (Specialist personnel)


Not applicable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 209

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Table of contents (cont.)

5 Illustrated parts catalog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212

5.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212

5.2 Illustrations and tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215

5.3 Cross-reference list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233

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Abbreviations
°C Degrees Celsius
Ω Ohm

a Acceleration (formula)
A Ampere, unit of current intensity
A/D Analog/Digital
AIB Analog Input Board

Bd Baud (bits per second)


BIB Binary Input Board
BOB Binary Output Board

C Capacitor
CAN Controller Area Network, bus standard
CCB CAN Connection Board
COB Connection Board

D Depth
D/A Digital/Analog
dB Decibel
DIN Deutsches Institut für Normung, German National Standards Institute

EEPROM Electrically Erasable and Programmable Read Only Memory


EGB Exhaust Gas Board
EMC Electromagnetic compatibility
EPROM Electrically Programmable Read Only Memory

f Frequency (formula)
fL Limit frequency
fs Scanning frequency
F Fuse
FAL Field Automation Level
FCB Fault Code Board

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Abbreviations (cont.)

FEPROM Flash EPROM


FIM Filter module

g Gravitation (acceleration due to gravity)


GND Ground

H Height
HF High Frequency
Hz Hertz, unit of frequency

I Current (formula)
IIB Instrument Input Board
INB Instrument Board
IP International Protection
I2C-Bus Inter Integrated Circuit Bus
IEC International Electrotechnical Commission
ISO International Organization for Standardization

K Kelvin
kBd Kilobaud
kg Kilogram
kHz Kilohertz

L Length
LED Light Emitting Diode

m Meter
mA Milliampere
mm Millimeter
ms Millisecond
mV Millivolt
M Equipment ID for electric Motors
MBd Megabaud

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FRIEDRICHSHAFEN

Abbreviations (cont.)

MCS-5 Monitoring and Control System, 5th generation


MCU Management Computer Unit
MFB Multi Function Board (speed acquisition and relay outputs)
MOB Modulation Output Board
MOS Metal-Oxide Silicone (transistor), semiconductor
MPU Microprocessor Unit

n (Connection) terminal
NiCr-Ni Nickel-chrome nickel

PAB Programming Adapter Board


PE Earth
PIM Peripheral Interface Module
PPS Programmable Process Station
PWM Pulse Width Modulation

R Resistance
RAM Random Access Memory
ROM Read Only Memory
RS232 Recommended Standard
RS422 Recommended Standard
RX Receive, receiving line on a serial interface

s Second
SAB Sensor Actor Board
SCB Serial Connection Board
STANAG Standardisation Agreement (NATO)

TTL Transistor-Transistor Logic


TX Transmit, transmitting line on a serial interface

U Voltage (formula)

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Abbreviations (cont.)

V Volt
VAC Voltage Alternating Current
VDC Voltage Direct Current
VDE Verband deutscher Elektrotechniker, Association of German Electrotechnical
Engineers
VG Verteidigungsgerätenorm, defense equipment standard
Vpp Voltage from peak to peak

W Width
W Watt

Xpp Vibration test deflection peak – peak value

Y Electrical equipment ID for magnets/valves

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General information about documentation

Documentation structure

Documentation Title/contents Target group


Part
1 Structure and function Operating personnel, plant personnel

2 Operation Operating personnel

3 Maintenance and Operating personnel, plant personnel


repair
(Plant personnel)
4 Maintenance and Electronics service personnel
repair familiar with the plant
(Service personnel)
5 Illustrated Operating, service and logistics personnel
parts catalog
6 Order-specific Electronics service personnel
adaptation
7 Installation Electromechanical specialists

Note: Not all documentation parts are written for every product!

Required knowledge
To understand each part of the documentation, we recommend reading the preceding
parts, if applicable.

Reference numbers and reference lines


Details in figures are provided with reference numbers and reference lines if necessary.
If reference is made in the text to a detail provided with a reference number, the figure
number and, separated by an oblique, the reference number of the detail are written in
brackets. Example: (5/2) means fig. 5, reference number 2.
A point at the end of the reference line means that the detail is visible in the
figure.
An arrow at the end of the reference line indicates that the detail cannot be
seen in the figure.

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Structure and function
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Part 1

Structure and function

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Structure and function
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1 Structure and function

1.1 Peripheral Interface Modules (PIMs)

1.1.1 Use of the PIMs

PIMs are input and output modules used on the field automation level. They have the
following tasks:
 Acquisition (data, signals etc.)
 Control (actuators)
 Communication (CAN, RS422)

Management
Printer Computer Unit Monitor
(MCU)

Î
ÎÎ Trackball

Keyboard
(Option)
Management level

Process bus

Field bus

Programmierbare Prozeßstation (PPS)


PIM no. 25
PIM no. 1

Field automation level

Sensors Actuators External devices

Fig. 1: Example of a possible application (e.g. in the MCS-5 system)

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1.1.2 Structure of the PIMs

The PIMs are available in two versions:

PIM 1

1 PIM 1 comprises:
 The modular cassette 1 (2/1) to accom-
modate an MPU 23 printed circuit
2
board and a PIM printed circuit board
3  Basic module 1 (2/2) with printed circuit
board COB 1-02 (2/3)

Fig. 2: PIM 1

PIM 2
1
PIM 2 comprises:
2
 The modular cassette 1 (3/1) to accom-
modate an MPU 23 printed circuit
3 board and a PIM printed circuit board
 The modular cassette 2 (3/2) to accom-
modate two PIM printed circuit boards
 Basic module 2 (3/3) with printed
circuit board COB 3-03 (3/4)
4

Fig. 3: PIM 2

Note: Some PIMs have terminal screws. However, these are no longer used in newer
applications. Structure, function and terminal assignment is identical to the
PIMs depicted in figs. 2 and 3.

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Structure and function
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1.1.3 Slots and terminals of the PIMs

The slots of the PIMs are defined in figs. 4 and 5. Slot 1 is always reserved for the
microprocessor PCB (MPU 23). All other slots may be equipped with PIM printed circuit
boards.
For this reason, the following conventions have been adopted for description of the
individual PIM printed circuit boards:
Example: In “n09”, “n” stands for the slot used and “09” defines
the terminal. “209” means: slot 2, terminal 9.

PIM 1

116 114 112 110 108 106 104 102


Slot 1 115 113 111 109 107 105 103 101

Elektronik

201 203 205 207 209 211 213 215


Slot 2 202 204 206 208 210 212 214 216

Fig. 4: Slots and terminals of PIM 1

PIM 2

116 114 112 110 108 106 104 102 316 314 312 310 308 306 304 302
Slot 1 115 113 111 109 107 105 103 101 315 313 311 309 307 305 303 301
Slot 3

Elektronik Elektronik

201 203 205 207 209 211 213 215 401 403 405 407 409 411 413 415
202 204 206 208 210 212 214 216 402 404 406 408 410 412 414 416 Slot 4
Slot 2

Fig. 5: Slots and terminals of PIM 2

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1.1.4 Overview of PIM printed circuit boards

1.1.4.1 MPU 23 printed circuit boards (microprocessor systems)

PCB Function Page


MPU 23  Single-chip processor with main and data memory 31
 1 CAN interface in accordance with ISO 11 898
 Power supply for PIM printed circuit boards

1.1.4.2 MPU 23 extension printed circuit boards

PCB Function Page


CCB 1  1 additional CAN interface in accordance with 93
ISO 11 898
SCB 2  1 additional RS422 interface 171
SCB 4  1 additional RS232 interface 177

1.1.4.3 Connection printed circuit boards (motherboards)

PCB Function Page


COB 1  Printed circuit board for connection between the 37
terminals and the 2 printed circuit boards of PIM 1
COB 3  Printed circuit board for connection between the 41
terminals and the 4 printed circuit boards of PIM 2

1.1.4.4 PIM printed circuit boards

PCB Function Page


AIB 1-01  4 analog measuring channels for the acquisition of resi- 45
stance, voltage and current signals
AIB 1-02  4 analog measuring channels for the acquisition of resi- 45
stance, voltage and current signals
AIB 2  2 analog input channels for the acquisition of voltage 53
and current signals
 2 analog output channels for the output of voltage and
current signals
AIB 3  8 analog input channels for the acquisition of current 61
signals
AIB 4  4 electrically-isolated analog input channels for the acqui- 65
sition of current signals (external power supply)

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PCB Function Page


BIB 1  8 electrically-isolated binary inputs (external power 69
supply)
 Line break monitoring
BIB 2  8 electrically-isolated binary inputs (internal power 73
supply)
 Line break monitoring
BOB 1  4 independent relay outputs (changeover contacts) 79
 Switching state monitoring
BOB 1-02/A  4 independent relay outputs (changeover contacts) 79
without line break monitoring
BOB 2  14 transistor output stages (positive switching) 85
BOB 3  14 transistor output stages (ground switching) 89
EGB 1  8 analog input channels for the acquisition of voltage 95
signals (for NiCr-Ni temperature sensor)
FCB 1  Indication of alarms and fault codes 99
 2 transistor output stages (positive switching)
 2 transistor output stages (ground switching)
 2 independent relay outputs (changeover contacts)
IIB 1  4 analog voltage outputs for instrument control 107
(0 VDC … 10 VDC)
 4 electrically-isolated binary inputs
INB 1  4 outputs for display instrument control 113
(2 bipolar outputs and 2 unipolar outputs)
 Dimmer (external power supply)
INB 2  4 outputs for display instrument control 121
(each output bipolar or unipolar)
 Dimmer (internal power supply)
INB 3  7 current outputs for instrument control 127
(4 mA … 20 mA)
 1 frequency output for instrument control
(0 Hz … 1500 Hz)
 Use in conjunction with MPU 29 only!

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PCB Function Page


MFB 1  2 electrically-isolated inputs for analog speed signals 133
with hysteresis control
 2 electrically-isolated inputs for binary speed signals or
binary signals (status interrogation)
 Power supply (24 VDC) for electronic transmitters or
sensors
 2 independent relay outputs (changeover contacts)
MFB 2  2 analog input channels for voltage signal acquisition 141
(the analog channels are specially designed for poten-
tiometer signal acquisition)
 3 electrically-isolated binary inputs (external power
supply)
 5 transistor output stages (positive switching) with
internal power supply (24 VDC)
 Power supply (24 VDC) for electronic transmitters or
sensors
 Use in conjunction with MPU 29 only!
MOB 1  4 electrically-isolated transistor amplifiers to control 151
and regulate inductive loads and stepping motors
PAB 2  PIM node address and baud rate programming 159
SAB 1  1 CAN in accordance with ISO 11 898 163
 3 independent relays to output binary information
 1 electrically-isolated transistor output stage (positive
switching)
 1 electrically-isolated binary input with line break
monitoring
SCB 3  2 interfaces in accordance with RS422 or RS232 173
standards

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1.1.5 Technical data of the PIMs (screw terminals)

Installation position As desired


Operating voltage 24 VDC, –50 % to +30 %
Residual ripple less than 5 %,
in accordance with STANAG 1008
Power consumption Less than 0.8 A (depending on the printed circuit
boards used)
Cable cross-section Max. 2 x 2.5 mm2 solid or
max. 2 x 1.5 mm2 strand with sleeve in
accordance with DIN 64 228
Protection IP 20 in accordance with DIN 40 050
Shock 10 g, 11 ms
Vibrostability
Rail mounting 2 Hz … 12.8 Hz: Xpp = 2 mm
12.8 … 100 Hz: a = 1 g
Screw mounting 2 Hz … 25 Hz: Xpp = 3.22 mm
25 Hz … 100 Hz: a = 4 g
EMC specification See chap. 1.6
Ambient temperature –30 °C … +70 °C
Storage temperature –35 °C … +85 °C
Relative humidity 0 % … 97 %, non-condensing
Colour Blue (RAL 5015)
Material Fibre-glass-reinforced polycarbonate

PIM 1
Dimensions (H x W x D) 75 mm x 70 mm x 90 mm
Number of terminals 32
Weight Approx. 0.3 kg (with components fitted)

PIM 2
Dimensions (H x W x D) 75 mm x 140 mm x 90 mm
Number of terminals 64
Weight Approx. 0.6 kg (with components fitted)

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1.1.6 Technical data of the PIMs (spring-cage terminals)

Installation position As desired


Operating voltage 24 VDC, –50 % to +30 %
Residual ripple less than 5 %,
in accordance with STANAG 1008
Power consumption Less than 0.10 A (depending on the printed circuit
boards used)
Cable cross-section 0.1 x 2.5 mm2
Protection IP 20 in accordance with DIN 40 050
Shock 10 g, 11 ms
Vibrostability
Rail mounting 2 Hz … 12.8 Hz: Xpp = 3 mm
12.8 … 100 Hz: a = 1 g
Screw mounting 2 Hz … 25 Hz: Xpp = 3.2 mm
25 Hz … 100 Hz: a = 4 g
EMC specification See chap. 1.6
Ambient temperature –30 °C … +70 °C
Storage temperature –35 °C … +70 °C
Relative humidity 0 % … 97 %, non-condensing
Colour Blue (RAL 5015)
Material Fibre-glass-reinforced polycarbonate

PIM 1
Dimensions (H x W x D) 75 mm x 70 mm x 90 mm
Number of terminals 32
Weight Approx. 0.3 kg (with components fitted)

PIM 2
Dimensions (H x W x D) 75 mm x 140 mm x 90 mm
Number of terminals 64
Weight Approx. 0.6 kg (with components fitted)

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1.2 Filter module 1 (FIM 1)

1.2.1 Use of FIM 1

 Smoothing of external operating voltages


 Overvoltage protection
 Overcurrent protection (self-restoring fuses)
 Reverse-battery protection
 EMC filter

1.2.2 Structure of FIM 1

FIM 1 comprises:
 The basic module 3 (6/1) with printed
1 circuit board FIB 1 (6/2)

Fig. 6: FIM 1

Note: Some FIMs have terminal screws. However, these are no longer used in newer
applications. Structure, function and terminal assignment is identical to the FIM
depicted in fig. 6.

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1.2.3 Terminals of FIM 1

FIM 1

Fig. 7: Terminals of FIM 1

The operating voltage (filter input) is supplied via terminals 101 to 116. The filtered
operating voltage (filter output) is available at terminals 201 to 216.

Self-restoring fuses

201
101 203
103 205
107 207
+UIN 109 209 +UOUT
111 F1 211
113 213
115 215
F2
102 202
104 204
108 206
GND(+UIN ) 110 208 GND(+UOUT )
112 210
114 212
116 214
216
PE 105
106

Fig. 8: Block circuit diagram of FIM 1

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1.2.4 Technical data of FIM 1

Dimensions (H x W x D) 60 mm x 70 mm x 90 mm
Weight 0.3 kg
Installation position As desired
Input voltage 12 VDC … 36 VDC
Output current I  6 A at an ambient temperature of up to 45 °C
I  4 A at an ambient temperature of up to 70 °C
Filter power consumption Less than 0.05 A (at 24 VDC)
Cable cross-section Max. 2 x 2.5 mm2 solid or
max. 2 x 1.5 mm2 strand with sleeve
in accordance with DIN 64 228
Protection IP 20 in accordance with DIN 40 050
Shock 10 g, 11 ms
Vibrostability
Rail mounting 2 Hz … 12.8 Hz: Xpp = 3 mm
12.8 Hz … 100 Hz: a = 1 g
Screw mounting 2 Hz … 25 Hz: Xpp = 3.2 mm
25 Hz … 100 Hz: a = 4 g
EMC specification See chap. 1.6
Ambient temperature –30 °C … +70 °C
Storage temperature –35 °C … +85 °C
Relative humidity 0 % … 97 %, non-condensing
Colour Blue (RAL 5015)
Material Fibre-glass-reinforced polycarbonate
Number of terminals 32
Reverse-battery protection Yes
Overcurrent protection Yes (self-restoring fuses)

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1.3 Dimmer module 3 (DIM 3)

1.3.1 Use of DIM 3

The dimmer voltage module DIM 3 supplies a pulse-width-modulated 24 V output signal to


supply the background illumination on dimmable instruments.
 PWM output signal (3 ... 100 %), positive switching (high-side)
 Total output current at all terminals max. 2 A
 Input filter
 Various set signal inputs:
– PWM input signal (e.g. from printed circuit board INB 2 which can control up
to 10 DIM 1 in parallel)
– Potentiometer (10 k)
– 7 ... 28 V analog voltage
– 0 ... 10 V analog voltage
 Adjustable basic brightness
 Wide input voltage range controlled (typ. 17 ... 29 V)
 Little power dissipation

1.3.2 Structure of DIM 3

DIM 3 comprises
 The basic module 3 (6/1) with printed
1
circuit board DIM 3-01 (6/2)

Fig. 9: DIM 1

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1.3.3 Terminals of DIM 3

DIM 3

Fig. 10 : Terminals of DIM 3

The supply voltage is applied to terminals 101 and 102 (+24 VDC) and 103 and 104
(ground). 8 outputs to control the lamps are provided at terminals 201 to 216. The dimmer
voltage setting is made by varying the assignment of terminals 107 to 116 (see chap.
1.3.4).

Self-restoring fuse

201
+UIN 101
102
203
205
F1
GND(+UIN ) 103
104
207
209 +UPWM OUT
211
213
215
107
108 202
109 204
110 206
111 Control +UB 208
112 unit 210 GND(+ UPWM OUT )
113 +UDIM 212
114 214
115 216
116

PE 105
106

Fig. 11 : Block circuit diagram of DIM 3

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1.3.4 Circuitry for DIM 3 dimmer voltage setting

The various possible connections for setting the dimmer voltage are shown below. Termi-
nals 107 to 116 only are connected.

PIM
101
+UIN 102
GND(+UIN ) 103
104

n13 107
108
n14 109
110
111 Control
INB 2-01 112 unit
113
114
115
116

PE 105
106

Fig. 12 : Pulse-width setting with INB 2

101
+UIN 102
GND(+UIN ) 103
104

107
108
109
110
111 Control
112 unit
113
114
115
116

PE 105
106

Fig. 13 : Pulse-width setting from external device

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101
+UIN 102
GND(+UIN ) 103
104

_ 107
108
109
0 ... 10 V = 110
111 Control
+ 112 unit
113
114
115
116

PE 105
106

Fig. 14 : 0 ... 10 V analog voltage

101
+UIN 102
GND(+UIN ) 103
104

_ 107
108
109
7 ... 28 V = 110
111 Control
+ 112 unit
113
114
115
116

PE 105
106

Fig. 15 : 7 ... 28 V analog voltage

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101
+UIN 102
GND(+UIN ) 103
104

107
108
H 109
110
111 Control
5 k 112 unit
S 113
T 114
115
116

PE 105
106

Fig. 16 : Potentiometer with basic brightness 3 % pulse width

101
+UIN 102
GND(+UIN ) 103
104

107
108
H 109
110
5 k 111 Control
112 unit
S 113
T 114
115
116

PE 105
106

Fig. 17 : Potentiometer with basic brightness 6 % pulse width

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101
+UIN102
GND(+UIN ) 103
104

107
108
H 109
110
5 k 111 Control
112 unit
S 113
T 114
115
116

PE 105
106

Fig. 18 : Potentiometer with basic brightness 12 % pulse width

101
+UIN102
GND(+UIN ) 103
104

107
108
H 109
110
5 k 111 Control
112 unit
S 113
T 114
115
116

PE 105
106

Fig. 19 : Potentiometer with basic brightness 18 % pulse width

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101
+UIN102
GND(+UIN ) 103
104

107
108
H 109
110
5 k 111 Control
112 unit
S 113
T 114
115
116

PE 105
106

Fig. 20 : Potentiometer with basic brightness 24 % pulse width

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1.3.5 Technical data of DIM 1

Dimensions (H x W x D) 60 mm x 70 mm x 90 mm
Weight 0.3 kg
Installation position As desired
Input voltage 17 VDC … 29 VDC
Output current I2A
Power dissipation Less than 1 W
Cable cross-section 0.1 x 2.5 mm2
Protection IP 20 in accordance with DIN 40 050
Shock 10 g, 11 ms
Vibrostability
Rail mounting 2 Hz … 12.8 Hz: Xpp = 3 mm
12.8 Hz … 100 Hz: a = 1 g
Screw mounting 2 Hz … 25 Hz: Xpp = 3.2 mm
25 Hz … 100 Hz: a = 4 g
EMC specification See chap. 1.6
Ambient temperature –30 °C … +70 °C
Storage temperature –35 °C … +85 °C
Relative humidity 0 % … 97 %, non-condensing
Colour Blue (RAL 5015)
Material Fibre-glass-reinforced polycarbonate
Number of terminals 32
Reverse-battery protection Yes
Overcurrent protection Yes (self-restoring fuses)

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1.4 Power supply modules

1.4.1 PSM 3-01

1.4.1.1 Use of PSM 3-01

 Input voltage filter


 Electrical isolation of output voltages
 Self-restoring fuses
 6 x 5 VDC outputs (50 mA resp.)
 8 x 10 VDC outputs (50 mA resp.)

1.4.1.2 Structure of PSM 3-01

PSM 3-01 comprises


 the basic module 3 (21/1) with printed
1
circuit board PSM 3-01 (21/2)

Fig. 21 : PSM 3-01

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1.4.1.3 Terminals of PSM 3-01

PSM 3-01

Fig. 22 : Terminals of PSM 3-01

The primary voltage (supply voltage) is applied via terminals 101 and 102 (+V) and 103
(ground). The regulated output voltages are available at terminals 105 to 116 and 201 to
216.

Self-restoring fuses 105


107
109 +5 V (U
111 OUT1 )
113
DC 115
DC 106
108
110
112 GND(+ UOUT )
101 114
+UIN 102 116
F1
GND(+UIN ) 103 202
204
PE 104 206
208 GND(+ U
210 OUT )
212
214
216
DC 201
203
DC
205
207 +10 V (UOUT2 )
209
211
213
215

Fig. 23 : Block circuit diagram of PSM 3-01

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1.4.1.4 Technical data of PSM 3-01

Dimensions (H x W x D) 60 mm x 70 mm x 90 mm
Weight 0.3 kg
Installation position As desired
Input voltage 12 VDC … 36 VDC
Output current I  50 mA for each 5 V output
I  50 mA for each 10 V output
Output voltage 6 x 5 VDC 2 %
8 x 10 VDC 2 %
Cable cross-section 0.1 x 2.5 mm2
Protection IP 20 in accordance with DIN 40 050
Shock 10 g, 11 ms
Vibrostability
Rail mounting 2 Hz … 12.8 Hz: Xpp = 3 mm
12.8 Hz … 100 Hz: a = 1 g
Screw mounting 2 Hz … 25 Hz: Xpp = 3 mm
25 Hz … 100 Hz: a = 4 g
EMC specification See chap. 1.6
Ambient temperature –30 °C … +70 °C
Storage temperature –35 °C … +85 °C
Relative humidity 0 % … 97 %, non-condensing
Colour Blue (RAL 5015)
Material Fibre-glass-reinforced polycarbonate
Number of terminals 32
Reverse-battery protection Yes
Overcurrent protection Yes (self-restoring fuses)

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1.4.2 PSM 3-01/A

1.4.2.1 Use of PSM 3-01/A


 Input voltage filter
 Electrical isolation of output voltages
 Self-restoring fuses
 +15 VDC and –15 VDC outputs

1.4.2.2 Structure of PSM 3-01/A

PSM 3-01/A comprises


 Basic module 3 (24/1) with printed
1 circuit board PSM 3-01/A (24/2)

Fig. 24 : PSM 3-01/A

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1.4.2.3 Terminals of PSM 3-01/A

PSM 3-01/A

Fig. 25 : Terminals of PSM 3-01/A

The primary voltage (supply voltage) is applied via terminals 101 and 102 (+V) and 103
(ground). The regulated output voltages are available at terminals 105 and 107 and 201
and 203.

Self-restoring fuses

105
DC 107
GND(+UOUT )
DC 106
108
110
112
101 114
+UIN 102 116
F1 –15 V (UOUT1 )
GND(+UIN ) 103 202
204
PE 104 206
208
210
212
214
216
DC 201 +15 V (U
203 OUT2 )
DC

Fig. 26 : Block circuit diagram of PSM 3-01/A

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1.4.2.4 Technical data of PSM 3-01/A

Dimensions (H x W x D) 60 mm x 70 mm x 90 mm
Weight 0.3 kg
Installation position As desired
Input voltage 12 VDC … 36 VDC
Output current I  50 mA
Output voltage 2 x +15 VDC  2 %
2 x –15 VDC  2 %
Cable cross-section 0.1 x 2.5 mm2
Protection IP 20 in accordance with DIN 40 050
Shock 10 g, 11 ms
Vibrostability
Rail mounting 2 Hz … 12.8 Hz: Xpp = 3 mm
12.8 Hz … 100 Hz: a = 1 g
Screw mounting 2 Hz … 25 Hz: Xpp = 3.2 mm
25 Hz … 100 Hz: a = 4 g
EMC specification See chap. 1.6
Ambient temperature –30 °C … +70 °C
Storage temperature –35 °C … +85 °C
Relative humidity 0 % … 97 %, non-condensing
Colour Blue (RAL 5015)
Material Fibre-glass-reinforced polycarbonate
Number of terminals 32
Reverse-battery protection Yes
Overcurrent protection Yes (self-restoring fuses)

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1.5 Mechanical installation of PIMs, FIMs, DIMs and PSMs

1.5.1 Mounting variants


The following possibilities are available for mounting the modules:
 Rail mounting
 Screw mounting
Note: A spring mechanism on the PIM automatically grounds the module when moun-
ted on a rail. Grounding must be realized using a separate cable (terminal 106
or 105 and 106) in the case of screw mounting.

Retaining clip
Rail mounting

PIM

Rail

Terminator clip
Terminator clip

Retaining clip

Fig. 27 : Rail mounting

Retaining clip
Screw mounting

PIM

Fixing screws (M4)

Retaining clip

Fig. 28 : Screw mounting

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1.5.2 Installation in protective housing

For use in severe ambient conditions (protection exceeding IP 20), the modules must be
accommodated in a protective housing.

The modules may be screw-mounted (see fig. 28) or rail-mounted (see fig. 27) in the pro-
tective housing.

Fig. 29 : Installation in a proctive housing (open)

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1.6 EMC specifications for PIM and FIM

EMC protection in accordance with EN 50 081-2 and EN 50 082-02


Electromagnetic emission in accordance with EN 55 022
 Emission Class A
 Supply lines Class A
Electromagnetic fields in accordance with ICE 1000-4-3
 80 MHz … 1 GHz 10 V/m
Electrostatic discharge in accordance with ICE 1000-4-2
 Indirect 8 kV
Transient bursts in accordance with ICE 1000-4-4
 Supply lines 2 kV
 Data line (shielded) 2 kV
 Signal lines (unshielded) 1 kV
 Signal lines (shielded or with ferrite) 2 kV
Transient pulses on supply lines in accordance with ICE 1000-4-5
 Symmetrical (2 ) 0.5 kV
 Asymmetrical (12 ) 0.5 kV
 Symmetrical (42 ) 1 kV
 Asymmetrical (42 ) 2 kV
Compatibility of line-related faults in accordance with ICE 1000-4-6
 150 kHz … 80 MHz 10 V

Notes on electrical connection

The following points must be considered in order to maintain EMC limit values:
 The earthing cable between protective earth (PE) and terminal 106 on the PIM
and terminals 105 and 106 on the FIM must be at least 2.5 mm2 in cross-sec-
tion and must not exceed 10 cm in length.
 Only twisted cables may be used to connect sensors/actuators. The maximum
cable length for unshielded cables is 5 m and 50 m for shielded cables.
 The burst requirements (2 kV) can only be fulfilled with shielded cables.

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1.7 Printed circuit board MPU 23

1.7.1 Overview

Component side Conductor side

LED (green) “Power supply (+5 V)”


Side view LED (red) “Processor reset/fault”
Sub PCB for 2nd interface
LED (yellow) “Communication CAN interface”
LED (yellow) “Communication 2nd interface”

Fig. 30 : Views of printed circuit board MPU 23

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1.7.2 Performance characteristics

 Single-chip processor (68HC11E1) involving HCMOS technology


 Integral Watchdog circuit (program run monitoring)
 7.5 Kbyte RAM main memory
 2 x 56 Kbyte FEPROM program and data memory
 512 byte EEPROM for dialog parameters
 I2C bus for communication with the serial EEPROM (configuration data)
 8 interruptable 16-bit timers for PIM real-time processes
 Low power consumption (less than 100 mA)
 Wide supply voltage range (24 VDC, –50 % to +30 %)
 Electrical isolation of the power supply by DC/DC converter
 Internal voltage stabilization (5 VDC) for MPU 23 and the PIM printed circuit
boards used
 CAN interface in accordance with ISO 11898, electrically-isolated
 Extendable interface (option) by the use of sub PCBs
– CAN by printed circuit board MPU 23 with CCB 1
– RS 422 by printed circuit board MPU 23 with SCB 2
– RS 232 by printed circuit board MPU 23 with SCB 4
 Electrically-isolated interface power supply
 Status indication by LEDs
 Temperature and operating voltage monitoring

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1.7.3 Functional description

MPU 23 has the following tasks:


 Communication of PIM with higher-order systems
 Process control, data acquisition and processing

A microprocessor system is used to realize these tasks.

The standard software is stored in the FEPROM of MPU 23.


Application-specific data (e.g. configurations etc.) can also be transferred to the FEPROM
via the CAN bus.
Dialog parameters (e.g. limit values etc.) can be stored in the internal EEPROM.

MPU 23 facilitates the control of the printed circuit boards of a PIM and the processing of
their data.
The configuration of the PIMs used, e.g. the PIM printed circuit boards used, the baud
rate, the field bus identifier etc.) are stored in a serial EEPROM located on printed circuit
board COB 1 or COB 3.
Communication between MPU 23 and the serial EEPROM is realized via the I2C bus.

Communication with the user side is realized via the CAN interface.
Printed circuit board MPU 23 has one CAN interface (CAN1).

A second interface may be defined as an option by using a subprint inserted on MPU 23. It
is possible to choose between an RS232, RS422 or second CAN interface.
Printed circuit board MPU 23 with CCB 1 has an additional CAN interface (CAN2).
Printed circuit board MPU 23 with SCB 2 has an additional RS 422 interface.
Printed circuit board MPU 23 with SCB 4 has an additional RS 232 interface.

MPU 23 is available as a spare part with or without the initial program loader.
The system software and the basic software is automatically loaded into the MPU 23 with
initial program loader (MTU order no. 504 530 87 97 / S0013) providing that a PPS (Pro-
grammable Process Station) is included in the system. If there is no PPS, the software can
be loaded via the BDM (Backup Data Module). This procedure is described in detail in
MTU document E 531 718.
The download procedure is executed with the help of programming unit SST 1-01 in the
case of an MPU 23 without initial program loader (MTU order no. 504 530 87 97). This
procedure is described in detail in MTU document E 531 658.

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1.7.4 Connection assignment

1.7.4.1 Connection assignment of MPU 23

The following table shows the relationship between printed circuit board MPU 23 and the
terminals of the PIM.
MPU 23 is always located at slot 1 of the PIM.

Terminal Designation
101
Positive supply voltage (+24 VDC)
102
103
Supply voltage ground
104
105 Ground of the CAN1 controller GND(CAN1)
106 Earthing connection (PE) of the COB/housing (external shielding)
107
CAN1 interface: Negative input CAN1(L)
108
109
CAN1 interface: Positive input CAN1(H)
110
111 – 116 Reserved for extension sub-PCBs (see table in chap. 1.7.4.2, 1.7.4.3 and
1.7.4.4)

1.7.4.2 Connection assignment of MPU 23 with CCB 1

The following table shows the relationship between printed circuit board MPU 23 with
CCB 1 and the terminals of the I/O module.
MPU 23 with CCB 1 is always located at slot 1 of the I/O module.

The following terminals are additionally assigned when using MPU 23 with CCB 1:

Terminal Designation
101 – 110 See table in chap. 1.7.4.1
111 Ground of the CAN2 controller GND(CAN2)
112 Not used
113
CAN2 interface: Negative input CAN2(L)
114
115
CAN2 interface: Positive input CAN2(H)
116

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1.7.4.3 Connection assignment for MPU 23 with SCB 2


The following table shows the relationship between printed circuit board MPU 23 with
SCB 2 and the terminals of the PIM.
MPU 23 is always located at slot 1 of the PIM.
The following terminals are additionally assigned when using MPU 23 with SCB 2:

Terminal Designation
101 – 110 See table in chap. 1.7.4.1
111 RS422 interface: Positive output A2 (TX)
112 RS422 interface: Negative output A1 (TX)
113
RS422 interface: Negative input E1 (RX)
114
115
RS422 interface: Positive input E2 (RX)
116

1.7.4.4 Connection assignment for MPU 23 with SCB 4


The following table shows the relationship between printed circuit board MPU 23 with
SCB 4 and the terminals of the PIM.
MPU 23 is always located at slot 1 of the PIM.
The following terminals are additionally assigned when using MPU 23 with SCB 4:

Terminal Designation
101 – 110 See table in chap. 1.7.4.1
111 RS232 interface: GND
112 RS232 interface: TXD
113
RS232 interface: RXD
114
115
Not used
116

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1.7.5 Technical data

General
Dimensions (L x W x H) 59 mm x 63 mm x 17 mm
Weight 0.050 kg
Input voltage 24 VDC, –50 % to +30 %
Power consumption Less than 135 mA (with one CAN interface)
Less than 185 mA (with an additional interface)
Power dissipation Less than 1675 mW
Microcontroller 68HC11E1
with 512 byte EEPROM and 256 byte RAM
Memory 7.5 Kbyte RAM
112 Kbyte FEPROM

Data transmission
CAN bus system In accordance with ISO 11 898
Baud rate 3.78 kbd to 1 Mbd
Electrical isolation By optocoupler
Bit-serial In accordance with RS232 or RS422 standard
Baud rate 1.2 kbd to 19.2 kbd
Electrical isolation By optocoupler

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1.8 Printed circuit board COB 1

1.8.1 Overview

Top view

Terminal strip 1

Slot 1 (MPU 23)

Slot for serial EPROM

Slot 2
(PIM printed circuit board)

Terminal strip 2

Fig. 31 : View of printed circuit board COB 1

1.8.2 Performance characteristics

 Realizes the connection between the module environment and the printed
circuit boards of the PIM
 Slots for one MPU and one PIM printed circuit board
 Protective circuitry in the power supply input circuit:
– Overvoltage protection
– Reverse-battery protection
– Overcurrent protection (self-restoring fuses)
– EMC filter
 Protective circuitry for the CAN and serial interface:
– EMC filter
 Serial EEPROM for PIM module identification and configuration data
 Temperature sensor for terminal temperature

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1.8.3 Functional description


Printed circuit board COB 1 establishes the electrical connection between the terminals
and the printed circuit boards of the PIM used.
Printed circuit board COB 1 has connectors to accommodate the MPU 23 (slot 1) and one
PIM printed circuit board (slot 2).

Furthermore, two double-row terminal strips are provided on printed circuit board COB 1.
The following connections are established via terminal strip 1 (terminals 101 to 116)
 Power supply of the PIM
 CAN interface
(option: 2nd CAN interface, RS232 interface or RS422 interface)
The following connections are established via terminal strip 2 (terminals 201 to 216)
 Depending on the PIM printed circuit board used

Module configuration data of the PIM is stored in a serial EEPROM. The data is read by
the MPU 23 of the PIM via the I2C bus.

The supply voltage of the printed circuit boards of the PIM is protected by an EMC filter
and circuitry for overvoltage, short-circuit and reverse-battery protection.

The bus interfaces for communication with other systems are equipped with EMC filters.
A sensor to monitor terminal temperature is located on printed circuit board COB 1. The
sensor signal is evaluated by MPU 23.

Printed circuit board COB 1 is supplied as a spare part (MTU order no. 528 530 00 83) in
the form of a complete PIM 1 (module housing, module cassette and COB 1). The serial
EEPROM on COB 1 is programmed by programming cassette SST 2-01.
This procedure is described in detail in MTU document E 531 658.

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PIM printed circuit board


109
CAN1(H)
110

107
CAN1(L) 201
108

.....
GND(CAN1) 105
F2 216
+24 VDC
Options
+5 VDC
 CAN2(H) 115
 E2 116

 CAN2(L) 113
 E1 114
 RXD

 GND(CAN2) 111
 A2
 GND

 A1 112
 TXD +24 VDC
MPU 23

+U IN 101 F1 F3
102 +5 VDC

103
GND(+Uin )
104

PE 106
COB 1

Fuse: F1…1.85 A (self-restoring) F2…0.4 A (self-restoring) F3…1.1 A (self-restoring)


Options: …when using CCB 1 …when using SCB 2 …when using SCB 4

Fig. 32 : Block circuit diagram of printed circuit board COB 1

1.8.4 Technical data


Dimensions (L x W x H) 84 mm x 67 mm x 36 mm
Weight 0.120 kg
Input voltage 24 VDC, –50 % to +30 %
Power consumption Less than 350 mA (depending on the printed
circuit boards used)
Serial EEPROM 256 byte
Overcurrent protection Yes (self-restoring fuse F1, F2 and F3)

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1.9 Printed circuit board COB 3

1.9.1 Overview

Top view

Terminal strip 1 Terminal strip 3

Slot 1 (MPU 23) Slot 3


(PIM printed circuit
board)

Slot for serial


EPROM

Slot 2 Slot 4
(PIM printed circuit (PIM printed circuit
board) board)

Terminal strip 2 Terminal strip 4

Fig. 33 : View of printed circuit board COB 3

1.9.2 Performance characteristics

 Realizes the connection between the module environment and the printed
circuit boards of the PIM
 Slots for one MPU and three PIM printed circuit boards
 Protective circuitry in the power supply input circuit:
– Overvoltage protection
– Reverse-battery protection
– Overcurrent protection (self-restoring fuses)
– EMC filter
 Protective circuitry for the CAN and serial interface:
– EMC filter
 Serial EEPROM for PIM module identification and configuration data
 Temperature sensor for terminal temperature

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1.9.3 Functional description

Printed circuit board COB 3 establishes the electrical connection between the terminals
and the printed circuit boards of the PIM used.

Printed circuit board COB 3 has connectors to accommodate the MPU 23 (slot 1) and
max. three PIM printed circuit boards (slots 2 to 4).

Furthermore, four double-row terminal strips are provided on printed circuit board COB 3.

The following connections are established via terminal strip 1 (terminals 101 to 116)
 The power supply of the PIM and
 The CAN interface
(option: 2nd CAN interface, RS232 interface or RS422 interface)

The following connections are established via terminal strip 2 (terminals 201 to 216)
 The PIM printed circuit board of slot 2

The following connections are established via terminal strip 3 (terminals 301 to 316)
 The PIM printed circuit board of slot 3

The following connections are established via terminal strip 4 (terminals 401 to 416)
 The PIM printed circuit board of slot 4

Module configuration data of the PIM is stored in a serial EEPROM. The data is read by
the MPU 23 of the PIM via the I2C bus.

The supply voltage of the printed circuit boards of the PIM is protected by an EMC filter
and circuitry for overvoltage, short-circuit and reverse-battery protection.

The bus interfaces for communication with other systems are equipped with EMC filters.

A sensor to monitor terminal temperature is located on printed circuit board COB 3. The
sensor signal is evaluated by MPU 23.

Printed circuit board COB 3 is supplied as a spare part (MTU order no. 528 530 01 83) in
the form of a complete PIM 2 (module housing, module cassette and COB 3). The serial
EEPROM on COB 3 is programmed by programming cassette SST 2-01.
This procedure is described in detail in MTU document E 531 658.

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COB 3
109
CAN1(H)
110

PIM PCB
107 201
CAN1(L) 108

.....
F3
+24 VDC
GND(CAN1) 105 216
+5 VDC
Options

 CAN2(H) 115
 E2 116

 CAN2(L) 113
 E1 114 301

PIM PCB
 RXD

.....
F5
 GND(CAN2) 111 +24 VDC 316
 A2
 GND +5 VDC
112
 A1
 TXD +24 VDC
MPU 23

101 F1 F2
+U IN
102 +5 VDC
401

PIM PCB
103

.....
GND(+Uin ) F4
104
+24 VDC
416
+5 VDC
PE 106

Fuse: F1…1.85 A (self-restoring) F2…1.1 A (self-restoring) F3…0.4 A (self-restoring)


F4…0.4 A (self-restoring) F5…0.4 A (self-restoring)
Options: …when using CCB 1 …when using SCB 2 …when using SCB 4

Fig. 34 : Block circuit diagram of printed circuit board COB 3

1.9.4 Technical data

Dimensions (L x W x H) 84 mm x 135 mm x 36 mm
Weight 0.230 kg
Input voltage 24 VDC, –50 % to +30 %
Power consumption Less than 800 mA (depending on the printed
circuit boards used)
Serial EEPROM 256 byte
Overcurrent protection Yes (self-restoring fuse F1, F2, F3, F4 and F5)

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1.10 Printed circuit board AIB 1

1.10.1 Overview

Component side Conductor side

Î
Î
LED (green) “Power supply (+5 V)”
Side view LED (red) “Processor reset/fault”

Fig. 35 : Views of printed circuit board AIB 1

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1.10.2 Performance characteristics

 Four independent analog channels


 Each analog channel is suitable for the acquisition of resistance, voltage and
current signals
 Configuration of the analog channels by software
 Automatic calibration of measuring amplifiers and the A/D converter
 High resolution with 12-bit A/D converter
 Internal reference voltage sources
 All inputs equipped with EMC protective filters

1.10.3 Functional description

Printed circuit board AIB 1 is used for the acquisition of resistance, current and voltage
signals. Typical applications are shown in chap. 1.10.5.

The various input signals are connected according to defined connection diagrams (see
chap. 1.10.5).

The type of signal connected to the respective analog channel is configurable by software.

An analog channel has four input terminals with the following functions:
 The internally generated 10 VDC reference voltages are tapped for resistance
measurements (e.g. for Pt100 resistance thermometers) via terminal A. The
reference voltage (or reference current) is only connected when channels are
appropriately configured.
 Terminals B and C are differential voltage inputs of an operation amplifier.
A differential filter between the terminals provides optimum interference
suppression and simultaneously realizes EMC protection.
 A reference potential (ground) is provided via terminal D. A resistor which
is required for current measuring (4 mA ... 20 mA) is connected between
terminal D and ground of the pin.

The input signals of the four analog channels are selected by a multiplexer and supplied to
a measuring amplifier.
The measuring amplifier is automatically controlled by the software. It is independent of
the configured signal source of the corresponding analog channel.

A 12-bit A/D converter converts the amplified analog input signal into a data word for
digital processing by MPU 23.

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1.10.4 Connection assignment

The following table shows the relationship between printed circuit board AIB 1 and the
terminals of the PIM.
The variable n for identification of the terminals (column 1) represents the slot of the PIM
used.

Terminal Abbreviation Designation


n01 A Reference voltage Uref1 *)
n02 B Differential voltage input (–)
n03 C Differential voltage input (+)
n04 D Ground
n05 A Reference voltage Uref2 *)
n06 B Differential voltage input (–)
n07 C Differential voltage input (+)
n08 D Ground
n09 A Reference voltage input Uref3 *)
n10 B Differential voltage input (–)
n11 C Differential voltage input (+)
n12 D Ground
n13 A Reference voltage Uref4 *)
n14 B Differential voltage input (–)
n15 C Differential voltage input (+)
n16 D Ground

*) Depending on channel configuration.

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1.10.5 Examples for connection

Fig. 36 shows the terminal assignment of


PIM printed circuit board AIB 1.
The variable n depends on the slot used
(see chap. 1.1.3).
Channel 1 Channel 2 Channel 3 Channel 4

Figs. 37 to 42 show the various examples


for connection.

Terminal strip
for one
PIM printed circuit board

Fig. 36 : Terminal assignment

Connection of a 4-wire sensor


A

e.g.: Pt100, Ni100


C
ϑ
PIM

Fig. 37 : 4-wire-sensor

Connection of a 2-wire sensor


A

e.g.: Pt1000, Ni1000


C
ϑ
PIM

Fig. 38 : 2-wire-sensor

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Connection of an NiCr-Ni sensor


A

PIM
B

Fig. 39 : NiCr-Ni sensor


Connection of a current source
+ 24 VDC A

C
PIM

4 mA … 20 mA
B
50 

Fig. 40 : Current source


Connection of a DC voltage source
A

C
+
PIM

0 VDC … 10 VDC

B

Fig. 41 : DC voltage source


Connection of a potentiometer
A 10 VDC

221 k* +
* This resistor (221 k) is used for line

C break monitoring (faulty slider or cable
connection disrupted).
PIM

1 k … 10 k B

Fig. 42 : Potentiometer

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1.10.6 Technical data

General
Dimensions (L x W x H) 59 mm x 63 mm x 15 mm
Weight 0.030 kg
Supply voltages +5 VDC (5 %) from MPU 23
+24 VDC (–50 % to +30 %) via COB
Power consumption (5 VDC) Less than 110 mA
Power consumption (24 VDC) Less than 50 mA
Power dissipation Less than 550 mW
Electrical isolation Yes, from module bus
Common-mode voltage at Less than 10 VDC (to ground)
inputs B and C

Analog input temperature sensor


Sensor power supply Internal, short-circuit proof
Sensor current Approx. 1.2 mA
Sensor connection 2 or 4 wire possible
Sensor monitoring Short-circuit and interruption
Measuring range –60 °C … +150 °C
Input filter fL = 22 Hz (RC low-pass) with 6 dB/decade
Resolution 0.1 K
Measuring error 1.2 K (without sensor)

Analog input current source


Sensor current supply 16.8 VDC … 32 VDC, external,
note on ground distribution: Module ground
terminal 103 or 104 necessary
Sensor monitoring
Signal: 4 mA … 20 mA Sensor fault at I < 2 mA and I > 22 mA
(configurable)
Signal: 0 mA … 20 mA Sensor fault at I > 22 mA (configurable)
Measuring range 0 mA … +25 mA
Input filter fL = 10 Hz (RC low-pass) with 6 dB/decade
Resolution 12 bit internal
Measuring error Less than 0.5 % absolute (without sensor)

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Scanning rate fs > 20 Hz


Compliance voltage Less than 4 VDC
Input resistance 50 Ω

Analog input voltage source


Measuring range –0.25 VDC … +10.25 VDC
Input filter fL = 22 Hz (RC low-pass) with 6 dB/decade
Input resistance Greater than 50 kΩ
Resolution 12 bit internal
Measuring error Less than 0.5 % absolute (without sensor)

Analog input potentiometer


Power supply 10 VDC, 0.5 %, internal
Measuring current Max. 10 mA, short-circuit proof
Source resistance 1 k ≤ R ≤ 10 k
Measuring range –0.25 VDC … +10.25 VDC
Sensor monitoring Short-circuit and interruption
Input filter fL = 22 Hz (RC low-pass) with 6 dB/decade
Input resistance Greater than 50 kΩ
Resolution 12 bit internal
Measuring error Less than 0.5 % absolute (without sensor)

Analog input thermocouple


Measuring range –5 mV … +50 mV
Sensor monitoring Interruption
Input filter fL = 22 Hz (RC low-pass) with 6 dB/decade
Input resistance Greater than 50 kΩ
Resolution 12 bit internal
Measuring error Less than 0.5 % absolute (without sensor)
Terminal temperature
compensation Yes, with temperature sensor

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1.11 Printed circuit board AIB 2

1.11.1 Overview

Component side Conductor side

Side view

LED (yellow) “Output 2 active”


LED (yellow) “Output 1 active”

Fig. 43 : Views of printed circuit board AIB 2

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1.11.2 Performance characteristics

 Two independent analog input channels for the acquisition of:


– One voltage signal (0 VDC to +10 VDC) respectively or
– One current signal from 4 mA to 20 mA (2-wire connection) respectively
 Two independent analog output channels for the output of:
– One voltage signal (0 VDC to +10 VDC) respectively or
– One current signal from 4 mA to 20 mA (2-wire connection) respectively
 Configuration of the analog channels by software
 Electrically-isolated inputs/outputs
 All inputs/outputs equipped with EMC protective filters
 Status indication by LEDs

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1.11.3 Functional description

Printed circuit board AIB 2 is used for the acquisition and output of current and voltage
signals.
The type of signal connected to the respective analog channel is configurable by software
and appropriate connection.

Input channels

Two input channels are provided for the acquisition of current and voltage signals. Each
input channel may be used for the acquisition of one voltage or current signal. Typical
applications are shown in figs. 44 and 45.

+10 VDC Module housing with AIB 2

COB

n01 AIB 2
n02

Input channel 1

GND

Fig. 44 : Example for the acquisition of voltage signals

+ UEXT Module housing with AIB 2

I (4 mA … 20 mA) COB

n03 AIB 2
n02

Input channel 1

GNDEXT

Fig. 45 : Example for the acquisition of current signals (AIB 2)

The input signals are filtered and subsequently digitalized by a 12-bit A/D converter. The
input circuit is electrically-isolated from the electronics by optocouplers. Further processing
and evaluation of data is realized by MPU 23.

Note: Both input channels are referenced to the same ground, i.e. terminals n02 and
n06 are internally connected.

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Note: The external operating voltage (+ UEXT) must be filtered by filter module FIM 1
before feeding.

Output channels

Two output channels are provided for the output of current and voltage signals. One
voltage or current signal is available at each output channel. Typical applications are
shown in figs. 46 and 47.

Readiness of output channels 1 and 2 is indicated by two LEDs.

COB Output channel 1


AIB 2 n11
+ UEXT
n12
GNDEXT

n09

0 VDC … 10 VDC
Module housing with BOB 2

Fig. 46 : Example for the output of voltage signals

Output channel 1
COB
AIB 2 n11
+ UEXT

n10
GNDEXT

4 mA … 20 mA
Module housing with BOB 2

Fig. 47 : Example for the output of current signals

A 12-bit D/A converter generates one voltage signal and one current signal from the data
from MPU 23. These signals may alternatively be tapped at the appropriate terminals.

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1.11.4 Connection assignment

The following table shows the relationship between printed circuit board AIB 2 and the
terminals of the PIM.
The variable n for identification of the terminals (column 1) represents the slot of the PIM
used.
The configuration of the individual slots is shown in chap. 1.1.3.

Terminal Designation
n01 Input channel 1: Positive input voltage
(0 VDC … 10 VDC)
n02 Input channel 1: Ground (GND), internally connected to n06
n03 Input channel 1: Current input (4 mA … 20 mA)
n04 Input channel 2: Current input (4 mA … 20 mA)
n05 Input channel 2: Positive input voltage
(0 VDC … 10 VDC)
n06 Input channel 2: Ground (GND), internally connected to n02
n07 Not used
n08 Not used
n09 Output channel 1: Positive output voltage
(0 VDC … 10 VDC)
n10 Output channel 1: Current output (4 mA … 20 mA)
n11 Output channel 1: Positive external supply voltage
(+ UEXT) via filter module FIM 1
n12 Output channel 1: External supply voltage ground
(GNDEXT)
n13 Output channel 2: Positive output voltage
(0 VDC … 10 VDC)
n14 Output channel 2: Current output (4 mA … 20 mA)
n15 Output channel 2: Positive external supply voltage
(+ UEXT) via filter module FIM 1
n16 Output channel 2: External supply voltage ground
(GNDEXT)

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1.11.5 Technical data

General
Dimensions (L x W x H) 59 mm x 63 mm x 15 mm
Weight 0.030 kg
Supply voltages +5 VDC (5 %) from MPU 23 external
+24 VDC (–50 % to +30 %) via COB
Power consumption (5 VDC) Less than 80 mA
Power dissipation Less than 720 mW

Input channels
Input filter fL = 70 Hz (RC low-pass) with 6 dB/decade
Resolution 12 bit internal
Measuring error Less than 0.5 % absolute (without sensor)
Scanning rate fs > 20 Hz
Electrical isolation Yes, from electronics and outputs
No, between the inputs of a channel

Analog input current signal


Signal monitoring
Signal: 4 mA … 20 mA Sensor fault at I < 2 mA and I > 22 mA
(configurable)
Signal: 0 mA … 20 mA Sensor fault at I > 22 mA (configurable)
Compliance voltage Less than 4 VDC
Input resistance Approx. 120 Ω
Measuring range 0 mA … +25 mA

Analog input voltage signal


Measuring current Less than 1 mA
Measuring range 0 VDC … +10.25 VDC
Sensor monitoring Interruption
Input resistance Greater than 25 kΩ

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Output channels

Analog output current signal


Power supply 7.5 VDC … 32 VDC, external
Compliance voltage 7.5 VDC
Output current of the current source 4 mA … 20 mA
Resolution 12 bit
Measuring error Less than 0.5 % absolute
Electrical isolation Yes

Analog output voltage signal


Power supply 16.8 VDC … 32 VDC, external
Power consumption Less than 15 mA
Output voltage 0 VDC … 10 VDC
Output current of the voltage source Less than 10 mA
Resolution 12 bit
Measuring error Less than 0.5 % absolute
Electrical isolation Yes

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1.12 Printed circuit board AIB 3

1.12.1 Overview

Component side Conductor side

Side view
LED (yellow) “Spare”
LED (yellow) “Spare”
LED (red) “Fault”
LED (green) “Operation”

LED (green) “Power supply (+15 V)”


LED (green) “Power supply (–15 V)”

Fig. 48 : Views of printed circuit board AIB 3

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1.12.2 Performance characteristics

 8 analog channels for the acquisition of current signals


 Automatic calibration of the measuring amplifiers and the A/D converter
 High resolution with 12-bit A/D converter
 Internal reference voltage sources
 All inputs equipped with EMC protective filters
 Status indication by LEDs
 Overcurrent protection

1.12.3 Functional description

Printed circuit board AIB 3 is used for the acquisition of a maximum of eight current
signals (4 mA … 20 mA). The function of one analog channel is described. All other
analog channels are identical in structure.

Each analog channel has an input for the acquisition of the current signal and a voltage
output (+24 VDC). The output voltage is supplied by printed circuit board AIB 3 and
protected by a fuse for each analog channel. A typical application is shown in fig. 49.

The current signal is selected by a multiplexer and subsequently amplified. A 12-bit A/D
converter digitalizes the current signal. The data is processed and evaluated by MPU 23.

Module housing with AIB 3


Analog channel 1 COB
F1 (0.2 A) AIB 3
n01
+ 24 VDC
I (self-restoring)
n02

(4 mA … 20 mA)

Fig. 49 : Example for the acquisition of current signals (AIB 3)

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1.12.4 Connection assignment

The following table shows the relationship between printed circuit board AIB 3 and the
terminals of the PIM.
The variable n for identification of the terminals (column 1) represents the slot of the PIM
used.
The configuration of the individual slots is shown in chap. 1.1.3.

Terminal Designation
n01 Analog channel 1: Output voltage 1 (+24 VDC)
n02 Analog channel 1: Current input 1
n03 Analog channel 2: Output voltage 2 (+24 VDC)
n04 Analog channel 2: Current input 2
n05 Analog channel 3: Output voltage 3 (+24 VDC)
n06 Analog channel 3: Current input 3
n07 Analog channel 4: Output voltage 4 (+24 VDC)
n08 Analog channel 4: Current input 4
n09 Analog channel 5: Output voltage 5 (+24 VDC)
n10 Analog channel 5: Current input 5
n11 Analog channel 6: Output voltage 6 (+24 VDC)
n12 Analog channel 6: Current input 6
n13 Analog channel 7: Output voltage 7 (+24 VDC)
n14 Analog channel 7: Current input 7
n15 Analog channel 8: Output voltage 8 (+24 VDC)
n16 Analog channel 8: Current input 8

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1.12.5 Technical data

General
Dimensions (L x W x H) 59 mm x 63 mm x 15 mm
Weight 0.030 kg
Supply voltages +5 VDC (5 %) from MPU 23
+24 VDC (–50 % to +30 %) via COB
Power consumption (5 VDC) Less than 50 mA
Power consumption (24 VDC) Less than 200 mA
Power dissipation Less than 660 mW

Analog channel
Power supply 24 VDC, internal
Signal monitoring
Signal: 4 mA … 20 mA Sensor fault at I < 2 mA and I > 22 mA
(configurable)
Signal: 0 mA … 20 mA Sensor fault at I > 22 mA (configurable)
Measuring range 0 mA … +25 mA
Input filter fL = 10 Hz (RC low-pass) with 6 dB/decade
Resolution 12 bit
Measuring error Less than 0.5 % absolute
Scanning rate fs > 20 Hz
Compliance voltage Less than 4 VDC
Input resistance Approx. 80 Ω
Overcurrent limitation Approx. 50 mA … 70 mA

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1.13 Printed circuit board AIB 4

1.13.1 Overview

Component side Conductor side

Side view

LED (red) “Combined alarm“

Fig. 50 : Views of printed circuit board AIB 4

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1.13.2 Performance characteristics

 Four independent electrically-isolated analog channels for the acquisition of


current signals (4 mA … 20 mA, two-wire connection)
 High resolution with 12-bit A/D converter
 Overcurrent protection for analog channels
 All inputs and outputs equipped with EMC protective filters
 +24 VDC power supply for current sources
 Fault indication by LED

1.13.3 Functional description

Printed circuit board AIB 4 is used for the acquisition of current signals ranging between
0 mA … 20 mA. The four input channels are electrically-isolated from each other and from
the evaluation electronics. Each input channel has an overcurrent protective circuit,
reverse-battery protection and an EMC protective filter.

The input signals are digitized by a 12-bit A/D converter. Data processing and evaluation
is realized by MPU 23.
Failure of an A/D converter or several A/D converters results in a fault message
(combined alarm) indicated by the red LED on printed circuit board AIB 4.

Electrical isolation of the four analog channels makes it possible to operate current
sources with an external power supply or the internal power supply.
A typical application involving the use of an external power supply is shown in fig. 51.
Two outputs are provided for internal power supply of AIB 4 (see fig. 52). Each output is
protected by a self-restoring fuse (200 mA) and has an EMC filter. Both outputs, however,
can only be loaded with a total maximum current of 250 mA. The current is otherwise
limited by the connection board COB.

+ UEXT Module housing with AIB 4

I (4 mA … 20 mA) COB

n0
n01 AIB 4
n02

Input channel 1

GNDEXT

Fig. 51 : Example for the acquisition of current signals (external power supply)

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Module housing with AIB 4

COB
n13
+24 VDC AIB 4
F1 (200 mA)
I (4 mA … 20 mA) (self-restoring)

n01

n02
n14
GND

Fig. 52 : Example for the acquisition of current signals (internal power supply)

1.13.4 Connection assignment

The following table shows the relationship between printed circuit board AIB 4 and the
terminals of the PIM.
The variable n for identification of the terminals (column 1) represents the slot of the PIM
used.
The configuration of the individual slots is shown in chap. 1.1.3.

Terminal Designation
n01 Input channel 1: Current input (4 mA … 20 mA)
n02 Input channel 1: Input channel 1 ground
n03 Input channel 2: Current input (4 mA … 20 mA)
n04 Input channel 2: Input channel 2 ground
n05 Not used
n06 Not used
n07 Input channel 3: Current input (4 mA … 20 mA)
n08 Input channel 3: Input channel 3 ground
n09 Input channel 4: Current input (4 mA … 20 mA)
n10 Input channel 4: Input channel 4 ground
n11 Not used
n12 Not used
n13 Positive output voltage (+ 24 VDC)
n14 Output voltage ground (GND)
n15 Positive output voltage (+ 24 VDC)
n16 Output voltage ground (GND)

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1.13.5 Technical data

General
Dimensions (L x W x H) 59 mm x 63 mm x 15 mm
Weight 0.034 kg
Supply voltages +5 VDC (5 %) from MPU 23
+24 VDC (–50 % to +30 %) via COB
Power consumption (5 VDC) Less than 80 mA
Power dissipation Less than 720 mW

Input channels
Electrical isolation Yes, between electronics and outputs
Yes, between the channel inputs
Input resistance Approx. 120 Ω
Compliance voltage Less than 4 VDC
Input filter fL = 70 Hz (RC low-pass) with 6 dB/decade
Measuring range 0 mA … +25 mA
A/D converter
Resolution 12 bit
Measuring error Less than 0.5 % absolute (without sensor)
Scanning rate fs > 20 Hz
Signal monitoring
Signal: 4 mA … 20 mA Sensor fault at I < 2 mA and I > 22 mA
(configurable)
Signal: 0 mA … 20 mA Sensor fault at I > 22 mA (configurable)

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1.14 Printed circuit board BIB 1

1.14.1 Overview

Component side Conductor side

LED (yellow) “Channel 1 active”


Side view LED (red) “Channel 1 line break”
LED (yellow) “Channel 2 active”
LED (red) “Channel 2 line break”

LED (yellow) “Channel 3 active”


LED (red) “Channel 3 line break”
LED (yellow) “Channel 4 active”
LED (red) “Channel 4 line break”

LED (yellow) “Channel 5 active”


LED (red) “Channel 5 line break”
LED (yellow) “Channel 6 active”
LED (red) “Channel 6 line break”

LED (yellow) “Channel 7 active”


LED (red) “Channel 7 line break”
LED (yellow) “Channel 8 active”
LED (red) “Channel 8 line break”

Fig. 53 : Views of printed circuit board BIB 1

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1.14.2 Performance characteristics

 8 electrically-isolated binary channels involving two-wire technology


 Binary channel status indication by LEDs (yellow)
 Binary channel connection line break monitoring
 Line break indication by LEDs (red)
 Wide input voltage range (36 VDC) of the binary channels
 Constant input current (approx. 4 mA) in the input voltage range of 8 VDC to
36 VDC
 RF filter, reverse-battery protection

1.14.3 Functional description

The function of one binary channel of printed circuit board BIB 1 is described. All other
binary channels are identical in structure.
Each binary channel has two inputs (two-wire technology).

Each binary channel has two inputs (two-wire technology) and is directly controlled by an
external voltage. A typical application is shown in fig. 54.
When the switch is closed, the optocouplers on BIB 1 are activated. The current which
flows is limited to approx. 4 mA irrespective of the external switching voltage used.

+24 VDC
Module housing with BIB 1
33 k
(Line break monitoring) COB

n01 1 BIB 1
n02 Ue 2

Binary channel 1

GND

Fig. 54 : Example for the connection of a binary channel

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The permissible input voltage range of the binary channel is 36 VDC.


The following applies to the input voltage (Ui ) of the binary channel:
 Ui  8 VDC is interpreted as an active binary channel (logic “1”).
 Ui  4 VDC is interpreted as an inactive binary channel (logic “0”).
 4 VDC  Ui  8 VDC must be avoided (forbidden zone).
The input signal of the corresponding binary channel is electrically isolated by an
optocoupler.
The channel is cyclically interrogated by MPU 23.
The status indicators (yellow LEDs) on BIB 1 indicate the momentary state of the binary
channels.
Each binary channel is assigned an LED (yellow). If a binary channel is activated (logic
“1”), the corresponding LED lights up.

A resistor (33 kOhm) must be connected in parallel to the switching contact to realize line
break monitoring. The quiescent current which flows is evaluated by a separate optocoupler
and cyclically interrogated by MPU 23. Each binary channel is assigned an LED (red). In
case of line break, the corresponding LED of the binary channel concerned flashes red.

1.14.4 Connection assignment

The following table shows the relationship between printed circuit board BIB 1 and the
terminals of the PIM.
The variable n for identification of the terminals (column 1) represents the slot of the PIM
used.
The configuration of the individual slots is shown in chap. 1.1.3.

Terminal Designation
n01 Binary channel 1: Positive binary input
n02 Binary channel 1: Negative binary input
n03 Binary channel 2: Positive binary input
n04 Binary channel 2: Negative binary input
n05 Binary channel 3: Positive binary input
n06 Binary channel 3: Negative binary input
n07 Binary channel 4: Positive binary input
n08 Binary channel 4: Negative binary input
n09 Binary channel 5: Positive binary input
n10 Binary channel 5: Negative binary input
n11 Binary channel 6: Positive binary input

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Terminal Designation
n12 Binary channel 6: Negative binary input
n13 Binary channel 7: Positive binary input
n14 Binary channel 7: Negative binary input
n15 Binary channel 8: Positive binary input
n16 Binary channel 8: Negative binary input

1.14.5 Technical data

General
Dimensions (L x W x H) 59 mm x 63 mm x 15 mm
Weight 0.026 kg
Supply voltages +5 VDC (5 %) from MPU 23
+24 VDC (–50 % to +30 %) via COB
Power consumption (5 VDC) Less than 30 mA
Power dissipation Less than 280 mW

Binary inputs
Input voltage range Less than 36 VDC
Input voltage for logic “1” Min. 8 VDC
Input voltage for logic “0” Max. 4 VDC
Input current for logic “1” Approx. 4 mA
Input current for logic “0” Max. 1 mA (for line break monitoring)
Sensor connection Two-pole
Electrical isolation By optocoupler
Input filter Low-pass (RC) with 6 dB/decade
Scanning cycle of the binary inputs Approx. 50 ms
Cable length for sensor connection Max. 5 m (unshielded) twisted
Max. 50 m (shielded) twisted

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1.15 Printed circuit board BIB 2

1.15.1 Overview

Component side Conductor side

LED (yellow) “Channel 1 active”


Side view LED (red) “Channel 1 line break”
LED (yellow) “Channel 2 active”
LED (red) “Channel 2 line break”

LED (yellow) “Channel 3 active”


LED (red) “Channel 3 line break”
LED (yellow) “Channel 4 active”
LED (red) “Channel 4 line break”

LED (yellow) “Channel 5 active”


LED (red) “Channel 5 line break”
LED (yellow) “Channel 6 active”
LED (red) “Channel 6 active”

LED (yellow) “Channel 7 active”


LED (red) “Channel 7 line break”
LED (yellow) “Channel 8 active”
LED (red) “Channel 8 line break”

Fig. 55 : Views of printed circuit board BIB 2

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1.15.2 Performance characteristics

 8 electrically-isolated binary channels


 Status indication of the binary channels by LEDs (yellow)
 Binary channel connection line break monitoring
 Line break indication by LEDs (red)
 Wide input voltage range (36 VDC) of the binary channels
 Constant input current (approx. 4 mA) in the input voltage range of 8 VDC to
36 VDC
 RF filter, reverse-battery protection
 +24 VDC (switching voltage) failure indicated by LED.

1.15.3 Functional description

The function of one binary channel of printed circuit board BIB 2 is described. All other
binary channels are identical in structure.
Each binary channel has a binary input and a voltage output (+24 VDC).
The switching voltage (+24 VDC) is supplied by the PIM and is protected by a fuse on the
COB (F2, F3 or F4). All red LEDs light up in case of switching voltage failure.
All binary inputs are electrically-isolated by optocouplers.

When the switching voltage (24 VDC) is applied to the binary input, an optocoupler on
BIB 2 is activated. The current which flows is limited to approx. 4 mA.

The following applies to the switching voltage:


 Ui  8 VDC is interpreted as an active binary input (logic “1”).
 Ui  4 VDC is interpreted as an inactive binary input (logic “0”).
 4 VDC  Ui  8 VDC must be avoided (forbidden zone).

MPU 23 interrogates the status, i.e. whether the switch is closed or open. Status indicators
(yellow LEDs) indicate the momentary state of the binary channels. If a binary input is
activated (logic “1”), the corresponding LED lights up.

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A resistor (33 kΩ) must be connected in parallel to the switching contact to realize line
break monitoring. The quiescent current which flows is evaluated by a separate optocoup-
ler.
Each binary channel is assigned an LED (red). In case of line break, the corresponding
LED of the binary input concerned flashes red.

A typical application is shown in fig. 56.

Module housing with BIB 2


COB
n01 1 BIB 2
+24 VDC (internal)
33 k
(Line break monitoring)
n02 2
Binary input 1
Binary channel 1

Fig. 56 : Example for the connection of a binary channel

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1.15.4 Connection assignment

The following table shows the relationship between printed circuit board BIB 2 and the
terminals of the PIM.
The variable n for identification of the terminals (column 1) represents the slot of the PIM
used.
The configuration of the individual slots is shown in chap. 1.1.3.

Terminal Designation
n01 Binary channel 1: Switching voltage (+24 VDC)
n02 Binary channel 1: Binary input 1
n03 Binary channel 2: Switching voltage (+24 VDC)
n04 Binary channel 2: Binary input 2
n05 Binary channel 3: Switching voltage (+24 VDC)
n06 Binary channel 3: Binary input 3
n07 Binary channel 4: Switching voltage (+24 VDC)
n08 Binary channel 4: Binary input 4
n09 Binary channel 5: Switching voltage (+24 VDC)
n10 Binary channel 5: Binary input 5
n11 Binary channel 6: Switching voltage (+24 VDC)
n12 Binary channel 6: Binary input 6
n13 Binary channel 7: Switching voltage (+24 VDC)
n14 Binary channel 7: Binary input 7
n15 Binary channel 8: Switching voltage (+24 VDC)
n16 Binary channel 8: Binary input 8

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1.15.5 Technical data

General
Dimensions (L x W x H) 59 mm x 63 mm x 15 mm
Weight 0.026 kg
Supply voltages +5 VDC (5 %) from MPU 23
+24 VDC (–50 % to +30 %) via COB
Power consumption (5 VDC) Less than 30 mA
Power consumption (24 VDC) Less than 32 mA
Power dissipation Less than 280 mW

Binary inputs
Input voltage range Max. 36 VDC
Input voltage for logic “1” Min. 8 VDC
Input voltage for logic “0” Max. 4 VDC
Input current for logic “1” Approx. 4 mA
Input current for logic “0” Max. 1 mA
Electrical isolation Yes, by optocoupler
Input filter Low-pass (RC) with 6 dB/decade
Scanning cycle of the binary inputs Approx. 50 ms
Cable length for sensor connection Max. 5 m (unshielded) twisted
Max. 50 m (shielded) twisted
Sensor connection Two-pole

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1.16 Printed circuit board BOB 1

1.16.1 Overview

Component side Conductor side

Fusible cutouts
LED (yellow) “Relay K1 activated”
Side view LED (yellow) “Relay K2 activated”
LED (yellow) “Relay K3 activated”
LED (yellow) “Relay K4 activated”

LED (red) “Fault”

Fig. 57 : Views of printed circuit board BOB 1

Note: There are no components for line break monitoring on printed circuit board
BOB 1-02/A. The same PCB is used, however, it is only partially equipped with
components compared with the variant depicted in fig. 57 (BOB 1-02).

This means that all features related to line break monitoring are not realized on
printed circuit board BOB 1-02/A.

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1.16.2 Performance characteristics

 Output of binary information by relays


 Separate activation of the four relays by MPU 23
 Four freely-available changeover contacts with overvoltage protective circuitry
whereby one changeover contact (K4) is a double contact (K4.1 and K4.2)
 Relay activation with pulse-width modulation (PWM) to reduce power loss
 Indication of relay activation by LEDs (yellow)
 Short-circuit protection for each relay by fusible cutout
 Relay switching state monitoring and fault indication by LED (red)
 Line break monitoring and fault indication by LED (red) (BOB 1-02 only, feature
not realized on BOB 1-02/A)
 High switching capacity (50 W)

1.16.3 Functional description

Four relays (K1, K2, K3 and K4) are provided on printed circuit board BOB 1 for the output
of binary information.

The relays are activated by printed circuit board MPU 23.


Relay activation is indicated by LEDs (yellow).

Five changeover contacts are available to the user at the terminals of the PIM.
 Relay K1 1 changeover contact with switching state and line break monitoring
 Relay K2 1 changeover contact with switching state and line break monitoring
 Relay K3 1 changeover contact with switching state and line break monitoring
 Relay K4 1 changeover contact with switching state and line break monitoring
(K4.1)
1 changeover contact without switching state monitoring (K4.2)

The changeover contacts are connected in parallel on relays K1 to K3 to reduce contact


loading.

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NC

NO
K1 (K2, K3)

F1 (F2, F3)
C
(Fusible cutout, 3.15 A)

Fig. 58 : Circuitry of relays K1, K2 and K3

Relays K1, K2, K3 and K4.1 are equipped with switching state and line break monitoring.
Monitoring is realized by loading the external switching voltage with a constant current
(typ. 1.5 mA). The current for monitoring also flows when the contact is open.
If the control signal is different from the switching state of the relay contacts or if no moni-
toring current is present, a fault message is generated (LED Fault lights up red, not on
BOB 1-02/A).

On relay K4, the connections of both changeover contacts are routed out. Switching state
and line break monitoring (not on BOB 1-02/A) is only realized at changeover contact K4.1
(terminals n13, n12 and n11).

NC
K4.2
NO

F5
C
(Fusible cutout, 3.15 A)

NC
K4.1
NO
K4

F4

C
(Fusible cutout, 3.15 A)

Fig. 59 : Circuitry of relay K4

The relays are activated with pulse-width modulation (PWM) to reduce relay power loss
and ensure a wide supply voltage range.

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1.16.4 Connection assignment

The following table shows the relationship between printed circuit board BOB 1 and the
terminals of the PIM.
The variable n for identification of the terminals (column 1) represents the slot of the PIM
used.
The configuration of the individual slots is shown in chap. 1.1.3.

Terminal Designation
n01 Relay K1: Normally-closed contact
n02 Relay K1: Normally-open contact
n03 Relay K1: Common connection
n04 Relay K2: Common connection
n05 Relay K2: Normally-open contact
n06 Relay K2: Normally-closed contact
n07 Relay K3: Normally-closed contact
n08 Relay K3: Normally-open contact
n09 Relay K3: Common connection
n10 Not used

n11 Relay K4: Normally-closed contact 1


n12 Relay K4: Normally-open contact 1
n13 Relay K4: Common connection 1
n14 Relay K4: Common connection 2
n15 Relay K4: Normally-open contact 2 (not monitored)
n16 Relay K4: Normally-closed contact 2 (not monitored)

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1.16.5 Technical data

General
Dimensions (L x W x H) 59 mm x 63 mm x 15 mm
Weight 0.042 kg
Supply voltages +5 VDC (5 %) from MPU 23
+24 VDC (–50 % to +30 %) via COB
Power consumption (+5 VDC) Less than 25 mA
Power consumption (+24 VDC) Less than 50 mA
Power dissipation Less than 925 mW

Binary outputs
Switching capacity per relay Max. 50 W (at 24 VDC)
Switching voltage (external) Max. 36 VDC
Switching current Max. 2 A
Current for monitoring Max. 2 mA (per relay)
Short-circuit protection Fusible cutout (3.15 A)
Relay switching time Max. 10 ms
Relay actuation cycle Max. 20/s

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1.17 Printed circuit board BOB 2

1.17.1 Overview

Component side Conductor side

Fusible cutout LED (yellow) “Transistor output 1 activated”


LED (yellow) “Transistor output 2 activated”
LED (yellow) “Transistor output 3 activated”
Side view LED (yellow) “Transistor output 4 activated”

LED (yellow) “Transistor output 5 activated”


LED (yellow) “Transistor output 6 activated”
LED (yellow) “Transistor output 7 activated”
LED (yellow) “Transistor output 8 activated”

LED (yellow) “Transistor output 9 activated”


LED (yellow) “Transistor output 10 activated”
LED (yellow) “Transistor output 11 activated”
LED (yellow) “Transistor output 12 activated”

LED (yellow) “Transistor output 13 activated”


LED (yellow) “Transistor output 14 activated“
LED (green) “Power supply (+24 V)”

Fig. 60 : Views of printed circuit board BOB 2

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1.17.2 Performance characteristics

 Output of binary information by transistor output stages


 Separate activation of 14 transistor output stages (positive switching) by
MPU 23
 Transistor switching state indication by LEDs (yellow)
 Output current monitoring and limitation
 Electrical isolation of the output stage circuit by optocouplers
 Output stage operating voltage (+10 VDC … +36 VDC) supplied separately
 All outputs equipped with EMC protective filters

1.17.3 Functional description


14 identical MOS transistor output stages are provided on printed circuit board BOB 2 for
the output of binary information.
The external operating voltage of the output stages must be connected to the PIM via ter-
minals n15 (+UEXT) and n16 (GNDEXT). It may range from +10 VDC to +36 VDC and can
be independent of the operating voltage of the PIMs.
The output stage circuit is protected by a fusible cutout (3.15 A) on printed circuit board
BOB 2.
MOS power transistors are used as output stages. Electrical isolation between the output
stages and the control logic is realized by optocouplers.
The MOS power transistors are equipped with the following protective circuits:
 Overvoltage protection
facilitates direct connection of inductive loads (e.g. relays etc.)
 Overcurrent protection
to switch off the corresponding output stage in case of short-circuit.
The switching states of the output transistors are indicated by LEDs (yellow).

COB
BOB 2 F1 n15
+UEXT
(Fusible cutout,
3.15 A)
n16

n01

GNDEXT
Module housing with BOB 2

Fig. 61 : Example of an output stage transistor circuit

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1.17.4 Connection assignment

The following table shows the relationship between printed circuit board BOB 2 and the
terminals of the PIM.
The variable n for identification of the terminals (column 1) represents the slot of the PIM
used.
The configuration of the individual slots is shown in chap. 1.1.3.

Terminal Designation
n01 Transistor output 1 (positive switching)
n02 Transistor output 2 (positive switching)
n03 Transistor output 3 (positive switching)
n04 Transistor output 4 (positive switching)
n05 Transistor output 5 (positive switching)
n06 Transistor output 6 (positive switching)
n07 Transistor output 7 (positive switching)
n08 Transistor output 8 (positive switching)
n09 Transistor output 9 (positive switching)
n10 Transistor output 10 (positive switching)
n11 Transistor output 11 (positive switching)
n12 Transistor output 12 (positive switching)
n13 Transistor output 13 (positive switching)
n14 Transistor output 14 (positive switching)
n15 Positive external operating voltage (+UEXT)
n16 Negative external operating voltage (GNDEXT)

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1.17.5 Technical data

General
Dimensions (L x W x H) 59 mm x 63 mm x 15 mm
Weight 0.030 kg
Supply voltages +5 VDC (5 %) from MPU 23
+24 VDC (–50 % to +30 %) via COB
Power consumption (5 VDC) Less than 10 mA
Power dissipation Less than 480 mW

Binary outputs
External operating voltage (+UEXT) +10 VDC … +36 VDC
Short-circuit protection (+UEXT) Fusible cutout (3.15 A)
Switching current per output Max. 250 mA
in total Max. 3 A
Short-circuit protection Electronic monitoring
Electrical isolation Yes, between output stage circuit and
control logic

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1.18 Printed circuit board BOB 3

1.18.1 Overview

Component side Conductor side

Fusible cutout LED (yellow) “Transistor output 1 activated”


LED (yellow) “Transistor output 2 activated”
LED (yellow) “Transistor output 3 activated”
Side view LED (yellow) “Transistor output 4 activated”

LED (yellow) “Transistor output 5 activated”


LED (yellow) “Transistor output 6 activated”
LED (yellow) “Transistor output 7 activated”
LED (yellow) “Transistor output 8 activated”

LED (yellow) “Transistor output 9 activated”


LED (yellow) “Transistor output 10 activated”
LED (yellow) “Transistor output 11 activated”
LED (yellow) “Transistor output 12 activated”

LED (yellow) “Transistor output 13 activated”


LED (yellow) “Transistor output 14 activated”

LED (green) “Power supply (+24 V)”

Fig. 62 : Views of printed circuit board BOB 3

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1.18.2 Performance characteristics

 Output of binary information by transistor output stages


 Separate activation of 14 transistor output stages (ground switching) by MPU 23
 Transistor switching state indication by LEDs (yellow)
 Output current monitoring and limitation
 Electrical isolation of the output stage circuit by optocouplers
 Output stage operating voltage supplied separately
 External operating voltage monitoring
 All outputs equipped with EMC protective filters

1.18.3 Functional description

14 identical MOS transistor output stages are provided on printed circuit board BOB 3 for
the output of binary information.

The external operating voltage of the output stages must be connected to the PIM via ter-
minals n15 (+UEXT) and n16 (GNDEXT). It may range from +10 VDC to +36 VDC and can
be independent of the operating voltage of the PIMs.
The external operating voltage can be monitored by printed circuit board BOB 3. The
external operating voltage is protected by a fusible cutout (F1).

MOS power transistors are used as output stages. Electrical isolation between the output
stages and the control logic is realized by optocouplers.

The MOS power transistors are equipped with the following protective circuits:
 Overvoltage protection
facilitates direct connection of inductive loads (e.g. relays etc.).
 Overcurrent protection
to switch off the corresponding output stage in case of short-circuit.
Switching off is stored and must be reset by the software.

The switching states of the output transistors are indicated by LEDs (yellow).

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COB
BOB 3 F1 n15
+UEXT
(Fusible cutout,
3.15 A)
n01

n16
GNDEXT

Module housing with BOB 3

Fig. 63 : Example of an output stage transistor circuit

1.18.4 Connection assignment

The following table shows the relationship between printed circuit board BOB 3 and the
terminals of the PIM.
The variable n for identification of the terminals (column 1) represents the slot of the PIM
used.
The configuration of the individual slots is shown in chap. 1.1.3.

Terminal Designation
n01 Transistor output 1 (ground switching)
n02 Transistor output 2 (ground switching)
n03 Transistor output 3 (ground switching)
n04 Transistor output 4 (ground switching)
n05 Transistor output 5 (ground switching)
n06 Transistor output 6 (ground switching)
n07 Transistor output 7 (ground switching)
n08 Transistor output 8 (ground switching)
n09 Transistor output 9 (ground switching)
n10 Transistor output 10 (ground switching)
n11 Transistor output 11 (ground switching)
n12 Transistor output 12 (ground switching)
n13 Transistor output 13 (ground switching)
n14 Transistor output 14 (ground switching)
n15 Positive external operating voltage (+UEXT)
n16 Negative external operating voltage (GNDEXT)

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1.18.5 Technical data

General
Dimensions (L x W x H) 59 mm x 63 mm x 15 mm
Weight 0.030 kg
Supply voltages +5 VDC (5 %) from MPU 23
+24 VDC (–50 % to +30 %) via COB
Power consumption (5 VDC) Less than 10 mA
Power dissipation Less than 480 mW

Binary outputs
External operating voltage (+UEXT) +10 VDC … +36 VDC
Short-circuit protection (+UEXT) Fusible cutout (3.15 A)
Switching current per output Max. 250 mA
in total Max. 3 A
Short-circuit protection Electronic monitoring
Electrical isolation Yes, between output stage circuit
and control logic

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1.19 Printed circuit board CCB 1

1.19.1 Overview

Component side Conductor side

Fig. 64 : Views of printed circuit board CCB 1

1.19.2 Performance characteristics

 Interface extension for printed circuit board MPU 23 in accordance with CAN
standard
 Directly pluggable on printed circuit board MPU 23
 Interface is electrically-isolated

1.19.3 Functional description

Printed circuit board CCB 1 is an interface extension for printed circuit board MPU 23. It
realizes an interface in accordance with CAN standard (ISO 11 898).
Electrical connection to printed circuit board MPU 23 is established via a connector.

Printed circuit board CCB 1 is used to convert signals with CAN level into signals with TTL
level. Signals are isolated by optocouplers.
The signals with TTL level are required for communication with the single-chip processor
of MPU 23.

Further processing of data and interface driver control is realized by MPU 23.

Note: The interface is connected by the terminal strip of the PIM.


Terminal assignment is shown in chap. 1.7.4.

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1.19.4 Technical data

General
Dimensions (L x W x H) 40 mm x 10 mm x 4 mm
Weight 0.002 kg
Supply voltages +5 VDC (5 %) from MPU 23
Power consumption Less than 50 mA
Connection Reserved slot on MPU 23

Data transmission
CAN bus system In accordance with ISO 11 898
Baud rate 3.78 kbd to 1 Mbd
Electrical isolation Yes, by optocouplers

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1.20 Printed circuit board EGB 1

1.20.1 Overview

Component side Conductor side

Side view

LED (yellow) “Spare”


LED (yellow) “Spare”
LED (green) “Operation”
LED (red) “Fault”

LED (green) “Power supply (+15 V)”


LED (green) “Power supply (–15 V)”

Fig. 65 : Views of printed circuit board EGB 1

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1.20.2 Performance characteristics

 8 analog channels for the acquisition of voltage signals (0 mV to 40 mV)


 Automatic measuring amplifier and A/D converter calibration
 Internal reference voltage sources
 Terminal temperature compensation for NiCr-Ni temperature sensors (integra-
ted on printed circuit board COB)
 High resolution with 12-bit A/D converter
 All inputs equipped with EMC protective filters
 Status indication by LEDs

1.20.3 Functional description

Printed circuit board EGB 1 is used for the acquisition of a maximum of eight voltage
signals ranging from 0 mV to 40 mV. The use of differential inputs makes the analog
channels suitable for measuring signals from NiCr-Ni thermocouples.
The function of one analog channel is described. All other analog channels are identical in
structure.

A total of eight analog channels are provided for the acquisition of voltage signals. Each
analog channel has a differential voltage input. A differential filter in the input circuit
provides optimum interference suppression and simultaneously realizes EMC protection.
The voltage signal is selected by a multiplexer and subsequently amplified. A 12-bit A/D
converter digitalizes the voltage signal. Further processing and evaluation of the data is
realized by MPU 23. Temperature compensation is realized by the software.

Module housing with EGB 1


Analog channel 1 COB

n01 EGB 1

n02

NiCr-Ni sensor

Fig. 66 : Example for the acquisition of voltage signals (EGB 1)

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1.20.4 Connection assignment

The following table shows the relationship between printed circuit board EGB 1 and the
terminals of the PIM.
The variable n for identification of the terminals (column 1) represents the slot of the PIM
used.
The configuration of the individual slots is shown in chap. 1.1.3.

Terminal Designation
n01 Analog channel 1: Differential voltage input (+)
n02 Analog channel 1: Differential voltage input (–)
n03 Analog channel 2: Differential voltage input (+)
n04 Analog channel 2: Differential voltage input (–)
n05 Analog channel 3: Differential voltage input (+)
n06 Analog channel 3: Differential voltage input (–)
n07 Analog channel 4: Differential voltage input (+)
n08 Analog channel 4: Differential voltage input (–)
n09 Analog channel 5: Differential voltage input (+)
n10 Analog channel 5: Differential voltage input (–)
n11 Analog channel 6: Differential voltage input (+)
n12 Analog channel 6: Differential voltage input (–)
n13 Analog channel 7: Differential voltage input (+)
n14 Analog channel 7: Differential voltage input (–)
n15 Analog channel 8: Differential voltage input (+)
n16 Analog channel 8: Differential voltage input (–)

Note: Unused channels must be shorted.

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1.20.5 Technical data

General
Dimensions (L x W x H) 59 mm x 63 mm x 15 mm
Weight 0.030 kg
Supply voltages +5 VDC (5 %) from MPU 23
+24 VDC (–50 % to +30 %) via COB
Power consumption (5 VDC) Less than 80 mA
Power consumption (24 VDC) Less than 50 mA
Power dissipation Less than 420 mW

Analog channel
Measuring range 0 mV … +40 mV
Sensor monitoring Interruption
Input filter fL = 22 Hz (RC low-pass) with 6 dB/decade
Resolution 12 bit
Measuring error Less than 0.5 % absolute (without sensor)
Scanning rate fs > 20 Hz
Terminal temperature Yes, by software (absolute temperature
compensation acquisition on printed circuit board COB)
Input resistance Greater than 50 kΩ

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1.21 Printed circuit board FCB 1

1.21.1 Overview

Component side Conductor side

Fusible cutouts
Side view

Four-digit 7-segment display

LED (yellow) “Relay K2 activated”


LED (yellow) “Relay K1 activated”

Fig. 67 : Views of printed circuit board FCB 1

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1.21.2 Performance characteristics

 Display of alarms and/or fault codes


 Output of binary information by transistor output stages
– Separate control of two positive switching and two ground switching
transistor output stages by MPU 23
– Output current monitoring and short-circuit protection
– Electrical isolation of the output stage circuits by optocouplers
– Operating voltage of the output stages (+10 VDC … +36 VDC) is supplied
separately (protected by self-restoring fuse F3)
 Output of binary information by relays
– Separate activation of the two relays by MPU 23
– Relay activation with pulse width modulation (PWM) to reduce power
dissipation
– Indication of relay activation by LEDs (yellow)
– Short-circuit protection for each relay by fusible cutout (F1 and F2)
– High switching capacity (50 W)
 All outputs equipped with EMC protective filters

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1.21.3 Functional description

Printed circuit board FCB 1 is used to indicate alarms and/or fault codes and to output
binary information.

Alarm indication and storage

Alarm messages (fault codes) of a higher-order system are transmitted to MPU 23 via a
serial bus (RS422, RS232 or CAN). MPU 23 processes and stores the alarm messages.
The alarm messages are indicated by the four-digit 7-segment display on FCB 1.
Communication between MPU 23 and FCB 1 is realized via the internal module bus.

The alarms are recorded over a period of 12 hours. They are divided into four groups
depending on their chronological occurrance:

Group Alarms
1 Current alarms
2 Alarms which have occurred in the last hour
3 Alarms which have occurred in the last 1 to 4 hours
4 Alarms which have occurred in the last 4 to 12 hours

The first digit of the 7-segment display indicates the alarm group.
The alarm messages (second to fourth digit of the 7-segment display) of a group are
displayed for 3 seconds in ascending order.
The display pauses for 5 seconds on changing the group.

Output of binary information by MOS transistor output stages

The external operating voltage of the output stages must be connected to the PIM via
terminals n09 (+UEXT) and n10 (GNDEXT).
It may range from +10 VDC to +36 VDC and can be independent of the operating voltage
of the PIMs. The output stage circuit is protected by a self-restoring fuse F3 (1.1 A) on
printed circuit board FCB 1.

Two positive switching and two ground switching MOS power transistors (fig. 68 and fig.
69) are located on printed circuit board FCB 1. Electrical isolation between the output
stages and the control logic is realized by optocouplers.

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The MOS power transistors have the following protective circuits:


 Overvoltage protection
facilitates direct connection of inductive loads (relays etc.)
 Overcurrent protection
to switch off the corresponding output stage in case of short-circuit

COB
FCB 1 F3 n09
+UEXT
(self-restoring,
1.1 A)
n15
(n16)

n10

GNDEXT

Module housing with FCB 1

Fig. 68 : Example of a ground switching output stage transistor circuit

COB
FCB 1 F3 n09
+UEXT
(self-restoring,
1.1 A)

n08
(n12)

n10

GNDEXT

Module housing with FCB 1

Fig. 69 : Example of a positive switching output stage transistor circuit

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Output of binary information by relays


Two relays are located on printed circuit board FCB 1. The relays are activated by printed
circuit board MPU 23. Relay activation is indicated by LEDs.
Two changeover contacts are available to the user at the terminals of the PIM. The
changeover contacts of the relays are connected in parallel to increase the switching
capacity.
The relays are activated with pulse width modulation (PWM) to reduce relay power
dissipation and to ensure a wide supply voltage range.

NC

NO
K1 (K2)

F1 (F2)
C
(Fusible cutout, 3.15 A)

Fig. 70 : Circuitry of relays K1 and K2

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1.21.4 Connection assignment

The following table shows the relationship between printed circuit board FCB 1 and the
terminals of the PIM.
The variable n for identification of the terminals (column 1) represents the slot of the PIM
used.
The configuration of the individual slots is shown in chap. 1.1.3.

Terminal Designation
n01 Relay K1: Normally-closed contact
n02 Relay K1: Normally-open contact
n03 Relay K1: Common connection
n04 Relay K2: Common connection
n05 Relay K2: Normally-open contact
n06 Relay K2: Normally-closed contact
n07 Not used
n08 Transistor output 1 (positive switching)
n09 External switching voltage (+UEXT)
n10 External switching voltage ground (GNDEXT)
n11 Not used
n12 Transistor output 2 (positive switching)
n13 Not used
n14 Not used
n15 Transistor output 3 (ground switching)
n16 Transistor output 4 (ground switching)

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1.21.5 Technical data

General
Dimensions (L x W x H) 59 mm x 63 mm x 15 mm
Weight 0.040 kg
Supply voltages +5 VDC (5 %) from MPU 23
+24 VDC (–50 % to +30 %) via COB
Power consumption (5 VDC) Less than 75 mA
Power consumption (24 VDC) Less than 25 mA
Power dissipation Less than 875 mW

Display
Type 7-segment display (LED)

Binary outputs (relays)


Switching capacity per relay Max. 50 W (at 24 V)
Switching voltage Max. 36 VDC
Switching current Max. 2 A
Short-circuit protection Fusible cutout (3.15 A) per relay
Relay switching time Max. 10 ms
Relay actuation cycle Max. 20 mal per second

Binary outputs (MOS transistor)


External operating voltage (+UEXT) +10 VDC … +36 VDC
Switching current per output Max. 250 mA
Short-circuit protection Self-restoring fuse (1.1 A) and
electronic monitoring with shutdown
Electrical isolation Yes, between output stage circuit
and control logic

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1.22 Printed circuit board IIB 1

1.22.1 Overview

Component side Conductor side

Side view

LED (green) “Ready”


LED (red) “Fault”

LED (yellow) “Channel 1 activated”


LED (yellow) “Channel 2 activated”
LED (yellow) “Channel 3 activated”
LED (yellow) “Channel 4 activated”

Fig. 71 : Views of printed circuit board IIB 1

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1.22.2 Performance characteristics

 Instrument outputs
– 4 analog voltage outputs for instrument control
– Output voltage ranging from 0 VDC to +10 VDC
– Voltage decoupling by isolation amplifiers
 Binary inputs
– 4 electrically-isolated binary channels involving two-wire technology
– Status indication of the binary channels by LEDs (yellow)
– Wide input voltage range (36 VDC) of the binary channels
– Constant input current (approx. 4 mA) in the input voltage range of 8 VDC to
36 VDC
– RF filter, reverse-battery protection

1.22.3 Functional description

The instrument outputs are used to control analog display instruments. As all instrument
outputs are identical in structure only one instrument output is described here.

The output voltage (0 VDC to +10 VDC) is created by an 8-bit D/A converter from a data
word and routed to the terminals of the PIM via an isolation amplifier (buffer).

COB
IIB 1
n09

V 0 VDC … 10 VDC

n10

Fig. 72 : Examples for instrument connection

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The binary inputs are used to acquire binary signals (state).


Fig. 73 shows a typical application.
As all binary channels are identical in structure, only one binary channel is described here.

Each binary channel has two inputs (two-wire technology) activated by an external
voltage. The current which flows is limited to approx. 4 mA irrespective of the external
switching voltage used.

The permissible input voltage range of the binary channel is 36 VDC.


The following definitions apply to the input voltage (Ui ) of the binary channel:
 Ui  8 VDC is interpreted as an activated binary channel (logic “1”).
 Ui  4 VDC is interpreted as a deactivated binary channel (logic “0”).
 4 VDC  Ui  8 VDC is to be avoided (forbidden range).

The input signal of the corresponding binary channel is electrically-isolated by an


optocoupler. Channel interrogation is cyclical by MPU 23.

An LED (yellow) is assigned to each binary channel. The appropriate LED lights up when
a binary channel is activated (logic “1”).

+24 VDC

COB

n01 1 IIB 1
n02 Ui 2

Binary channel 1

GND

Fig. 73 : Example of a binary channel circuit

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1.22.4 Connection assignment

The following table shows the relationship between printed circuit board IIB 1 and the
terminals of the PIM.
The variable n for identification of the terminals (column 1) represents the slot of the PIM
used.
The configuration of the individual slots is shown in chap. 1.1.3.

Terminal Designation
n01 Binary channel 1: Positive binary input
n02 Binary channel 1: Negative binary input
n03 Binary channel 2: Positive binary input
n04 Binary channel 2: Negative binary input
n05 Binary channel 3: Positive binary input
n06 Binary channel 3: Negative binary input
n07 Binary channel 4: Positive binary input
n08 Binary channel 4: Negative binary input
n09 Positive output voltage for instrument 1
n10 Ground (GND) for instrument 1
n11 Positive output voltage for instrument 2
n12 Ground (GND) for instrument 2
n13 Positive output voltage for instrument 3
n14 Ground (GND) for instrument 3
n15 Positive output voltage for instrument 4
n16 Ground (GND) for instrument 4

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1.22.5 Technical data

General
Dimensions (L x W x H) 59 mm x 63 mm x 15 mm
Weight 0.024 kg
Supply voltages +5 VDC (5 %) from MPU 23
+24 VDC (–50 % to +30 %) via COB
Power consumption (5 VDC) Less than 15 mA
Power consumption (24 VDC) Less than 50 mA
Power dissipation Less than 440 mW

Instrument outputs
Output voltage range +0 VDC … +10 VDC (0.5 %)
Output current Max. 5 mA
Isolation amplifier Yes
Electrical isolation No

Binary inputs
Input voltage range Less than 36 VDC
Input voltage for logic “1” Min. 8 VDC
Input voltage for logic “0” Max. 4 VDC
Input current for logic “1” Approx. 4 mA
Input current for logic “0” Max. 1 mA
Sensor connection Two-pole
Electrical isolation Yes, between inputs themselves and between
inputs and electronics
Input filter Low-pass (RC) with 6 dB/decade
Binary input scanning cycle Approx. 50 ms
Cable length for sensor connection Max. 5 m (unshielded) twisted
Max. 50 m (shielded) twisted

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1.23 Printed circuit board INB 1

1.23.1 Overview

Component side Conductor side

Side view

LED (yellow) “Spare”


LED (red) “Fault”
LED (green) “Spare”

Fig. 74 : Views of printed circuit board INB 1

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1.23.2 Performance characteristics

 Instrument outputs
– 4 outputs to control display instruments
– Each instrument output can be used as a voltage or current output
– 2 outputs supply positive output signals
– 2 outputs supply positive and negative output signals
– All instrument outputs are short-circuit proof
– High resolution with 12-bit D/A converter
 Dimmer
– Wide dimming range (0 % … 100 %) by PWM
– Output current monitoring and limitation
– RF filter, reverse-battery protection
 Status indication by LEDs

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1.23.3 Functional description


The instrument outputs are used to control display instruments.
The output signals are created by a 12-bit D/A converter and routed to the terminals of the
PIM via isolation amplifiers (buffers).
Each instrument output can be used as a voltage or current output. Connection
assignment is shown in fig. 75.
Two outputs can be used to output positive output signals.
 Available voltage ranges:
– 0 VDC … +2.5 VDC
– 0 VDC … +5.0 VDC
– 0 VDC … +10.0 VDC
 Available current range:
– 0 mA … +1.0 mA
Two outputs may be used to output positive and negative output signals.
 Available voltage ranges:
– –2.5 VDC … 0 VDC … +2.5 VDC
– –5.0 VDC … 0 VDC … +5.0 VDC
– –10.0 VDC … 0 VDC … +10.0 VDC
 Available current range:
– –1.0 mA … 0 mA … +1.0 mA

INB 1 n03 INB 1 n03

n01 n01
V
A
n02 n02

Fig. 75 : Examples for instrument connection

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The dimmer is used to regulate instrument illumination.

The operating voltage for adjustable instrument illumination must be provided from an
external power source.
This voltage is smoothed on INB 1 and protected by an RF and reverse-battery protection
circuit.

The dim voltage is generated by a PWM circuit and has an overcurrent monitoring circuit.
A maximum of 0.4 A is allowed to flow at a dim voltage of 24 VDC. The dim voltage range
is between 0 % … 100 %.

Module housing with INB 1


+24 VDC
INB 1 F1
n15
(self-restoring,
1.1A)
n16
GND
n13

n14

Fig. 76 : Example for dimmer circuit

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1.23.4 Connection assignment

The following table shows the relationship between printed circuit board INB 1 and the
terminals of the PIM.
The variable n for identification of the terminals (column 1) represents the slot of the PIM
used.
The configuration of the individual slots is shown in chap. 1.1.3.

Terminal Designation
n01 Output 1: Current output (0 mA … +1 mA)
n02 Output 1: Ground (GND)
n03 Output 1: Voltage output (0 VDC … +2.5 VDC,
0 VDC … +5 VDC or 0 VDC … +10 VDC)
n04 Output 2: Voltage output(0 VDC … +2.5 VDC,
0 VDC … +5 VDC or 0 VDC … +10 VDC)
n05 Output 2: Current output (0 mA … +1 mA)
n06 Output 2: Ground (GND)
n07 Output 3: Current output (–1 mA … 0 mA … +1 mA)
n08 Output 3: Ground (GND)
n09 Output 3: Voltage output
(–2.5 VDC … 0 VDC … +2.5 VDC,
–5 VDC … 0 VDC … +5 VDC or
–10 VDC … 0 VDC … +10 VDC)
n10 Output 4: Voltage output
(–2.5 VDC … 0 VDC … +2.5 VDC,
–5 VDC … 0 VDC … +5 VDC or
–10 VDC … 0 VDC … +10 VDC)
n11 Output 4: Current output (–1 mA … 0 mA … +1 mA)
n12 Output 4: Ground (GND)
n13 Output: +UDIM
n14 Output: GNDDIM
n15 Input: +UEXT
n16 Input: GNDEXT

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1.23.5 Technical data

General
Dimensions (L x W x H) 59 mm x 63 mm x 15 mm
Weight 0.030 kg
Supply voltages +5 VDC (5 %) from MPU 23
+24 VDC (–50 % to +30 %) via COB
Current consumption (5 VDC) Less than 10 mA
Current consumption (24 VDC) Less than 25 mA
Power dissipation Less than 650 mW

Instrument outputs
Resolution 12 bit internal
Isolation amplifier Yes
Electrical isolation No
Positive output voltages
Voltage ranges 0 VDC … +2.5 VDC (0.5 %)
0 VDC … +5.0 VDC (0.5 %)
0 VDC … +10.0 VDC (0.5 %)
Output current Max. 5 mA
Positive and negative output voltages
Voltage ranges –2.5 VDC … 0 VDC … +2.5 VDC (0.5 %)
–5.0 VDC … 0 VDC … +5.0 VDC (0.5 %)
–10.0 VDC … 0 VDC … +10.0 VDC (0.5 %)
Output current Max. 5 mA
Positive output current
Output current range 0 mA … +1.0 mA (1 %)
Compliance voltage Max. 5 VDC
Positive and negative output current
Output current range –1.0 mA … 0 mA … +1.0 mA (1 %)
Compliance voltage Max. 5 VDC

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Dimmer
Input voltage range Less than 36 VDC
Input filter Yes
Reverse-battery protection Yes
Input fuse Self-restoring fuse (1.1 A)
Output voltage 0 Veff … 30 Veff (2 %)
Output current Less than 0.4 A
Short-circuit protection Yes, electronic
Clock frequency for PWM 1.84 kHz

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1.24 Printed circuit board INB 2

1.24.1 Overview

Component side Conductor side

Side view

LED (green) “Power supply (±15 V)”

LED (yellow) “Instrument outputs active”


LED (yellow) “Dim voltage output active”

Fig. 77 : Views of printed circuit board INB 2

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1.24.2 Performance characteristics

 Instrument outputs
– 4 outputs to control display instruments
– Each instrument output can be used as a voltage or current output
– Output signals can be bipolar or unipolar
– All instrument outputs are short-circuit proof
– High resolution with 12-bit D/A converter
 Dimmer
– Wide dimming range (0 % … 100 %) by PWM
– Output current monitoring and limitation
 Status indication by LEDs

1.24.3 Functional description


The instrument outputs are used to control four display instruments.
The output signals are created by a 12-bit D/A converter and routed to the terminals of the
PIM via amplifiers.
Each instrument output can be used as a voltage or current output (see fig. 78).
The range and type of output signal can be configured by the software.
 Unipolar output signals
– Voltage ranges: 0 VDC … +2.5 VDC
0 VDC … +5.0 VDC
0 VDC … +10.0 VDC
– Current range: 0 mA … +1.0 mA
 Bipolar output signals
– Voltage ranges: –2.5 VDC … 0 VDC … +2.5 VDC
–5.0 VDC … 0 VDC … +5.0 VDC
–10.0 VDC … 0 VDC … +10.0 VDC
– Current range: –1.0 mA… 0 mA … +1.0 mA

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INB 2 n03 INB 2 n03

n01 n01
V
A
n02 n02

Fig. 78 : Examples for instrument connection

The dimmer is used to regulate instrument illumination.

The internal power supply of the PIM is used as the operating voltage for adjustable
instrument illumination. This voltage is protected by a self-restoring fuse on connection
board COB.

The dim voltage is generated by a PWM circuit and has an overcurrent monitoring circuit.
A maximum of 0.15 A is allowed to flow at a dim voltage of 24 VDC. The dim voltage
range is between 0 % … 100 %.

COB
INB 2
+24 VDC

n13

n14

Module housing with INB 2

Fig. 79 : Example for dimmer circuit

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1.24.4 Connection assignment

The following table shows the relationship between printed circuit board INB 2 and the
terminals of the PIM.
The variable n for identification of the terminals (column 1) represents the slot of the PIM
used.
The configuration of the individual slots is shown in chap. 1.1.3.

Terminal Designation
n01 Output 1: Current output (–1 mA … 0 mA … +1 mA)
n02 Output 1: Ground (GND)
n03 Output 1: Voltage output
(–2.5 VDC … 0 VDC … +2.5 VDC,
–5 VDC … 0 VDC … +5 VDC or
–10 VDC … 0 VDC … +10 VDC)
n04 Output 2: Voltage output
(–2.5 VDC … 0 VDC … +2.5 VDC,
–5 VDC … 0 VDC … +5 VDC or
–10 VDC … 0 VDC … +10 VDC)
n05 Output 2: Current output (–1 mA … 0 mA … +1 mA)
n06 Output 2: Ground (GND)
n07 Output 3: Current output (–1 mA … 0 mA … +1 mA)
n08 Output 3: Ground (GND)
n09 Output 3: Voltage output
(–2.5 VDC … 0 VDC … +2.5 VDC,
–5 VDC … 0 VDC … +5 VDC or
–10 VDC … 0 VDC … +10 VDC)
n10 Output 4: Voltage output
(–2.5 VDC … 0 VDC … +2.5 VDC,
–5 VDC … 0 VDC … +5 VDC or
–10 VDC … 0 VDC … +10 VDC)
n11 Output 4: Current output (–1 mA … 0 mA … +1 mA)
n12 Output 4: Ground (GND)
n13 Output: +UDIM
n14 Output GNDDIM
n15 Not used
n16 Not used

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1.24.5 Technical data

General
Dimensions (L x W x H) 59 mm x 63 mm x 15 mm
Weight 0.032 kg
Supply voltages +5 VDC (5 %) from MPU 23
+24 VDC (–50 % to +30 %) via COB
Current consumption (5 VDC) Less than 10 mA
Current consumption (24 VDC) Less than 200 mA
Power dissipation Less than 1200 mW

Instrument outputs
Resolution 12 bit internal
Electrical isolation No
Output voltages
Voltage ranges –2.5 VDC … 0 VDC … +2.5 VDC (0.5 %)
–5.0 VDC … 0 VDC … +5.0 VDC (0.5 %)
–10.0 VDC … 0 VDC … +10.0 VDC (0.5 %)
Output current Max. 4 mA
Positive and negative output current
Output current range –1.0 mA … 0 mA … +1.0 mA (1 %)
Compliance voltage Max. 5 VDC

Dimmer output
Output voltage 0 Veff … 24 Veff (2 %), pulse width-modulated
Output current Less than 0.15 A
Short-circuit protection Yes, electronic
Clock frequency for PWM 1.84 kHz
Dimming range 0 % … 100 %

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1.25 Printed circuit board INB 3

1.25.1 Overview

Component side Conductor side

Side view

LED (yellow) “Current output 1 active”


LED (yellow) “Current output 2 active”
LED (yellow) “Current output 3 active”
LED (yellow) “Current output 4 active”

LED (yellow) “Current output 5 active”


LED (yellow) “Current output 6 active”
LED (yellow) “Current output 7 active”

LED (yellow) “Frequency output active”

LED (green) “Power supply (+15 V) ok”


LED (red) “Printed circuit board RESET”

Fig. 80 : Views of printed circuit board INB 3

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1.25.2 Performance characteristics

 Instrument outputs
– 7 current outputs (4 mA … 20 mA) to control display instruments
– High resolution with 10-bit D/A converter
– 1 frequency output (0 Hz … 1500 Hz) to control a display instrument
– All instrument outputs are short-circuit proof
 Status indication by LEDs

Note: Printed circuit board INB 3 is used in conjunction with the new higher-perfor-
mance MPU 29 microprocessor unit. It is not possible to operate with the
MPU 23 microprocessor unit.

1.25.3 Functional description


Up to seven display instruments with current inputs (4 mA … 20 mA) and one display
instrument with a frequency input (0 Hz … 1500 Hz) can be controlled simultaneously by
printed circuit board INB 3.
The current outputs are realized by seven independent current sources. The current
sources are controlled by a 10–bit D/A converter on INB 3.
The current outputs are assigned to yellow status LEDs. The LEDs signal the flow of cur-
rent at the corresponding current output.
Each current source has its own overcurrent protective circuit and is short-circuit proof
(current limited to max. 25 mA per output).

INB 3 +24 VDC

D I
A Imax  25 mA
ST1-01

4 mA … 20 mA
ST1-02

Fig. 81 : Example of current output circuitry

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The frequency output is used to control a display instrument.


The frequency output supplies a binary output signal with a 1:1 sampling rate. The output
voltage of the signal depends on the operating voltage and is nom. +24 VDC
(20.5 VDC  Uhigh  +23.7 VDC and Ulow  0 VDC).
Operation of the frequency output is indicated by a yellow status LED.
The frequency output incorporates overcurrent protective circuitry and is short-circuit
proof.

INB 3
+24 VDC

ST1-15

0 Hz … 1500 Hz
ST1-16

Fig. 82 : Example of frequency output circuitry

Note: The frequency output of printed circuit board INB 3 is especially designed for
connection of a frequency-dependent speed instrument (“VDO Ocean Line”
series).

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1.25.4 Connection assignment

The table below shows the signal assignment of connector ST1 on printed circuit board
INB 3. The electrical connections to the motherboard are established via this connector.

Connection to the signal inputs and outputs on INB 3 is established via the terminals provi-
ded on the appropriate motherboard (e.g. LMB 2). Refer to the description of the mother-
board or device concerned for details of connector pin assignment.

Pin assignment Designation


ST1-01 Current output 1 (0 mA … 20 mA)
ST1-02 Ground (GND)
ST1-03 Current output 2 (0 mA … 20 mA)
ST1-04 Ground (GND)
ST1-05 Current output 3 (0 mA … 20 mA)
ST1-06 Ground (GND)
ST1-07 Current output 4 (0 mA … 20 mA)
ST1-08 Ground (GND)
ST1-09 Current output 5 (0 mA … 20 mA)
ST1-10 Ground (GND)
ST1-11 Current output 6 (0 mA … 20 mA)
ST1-12 Ground (GND)
ST1-13 Current output 7 (0 mA … 20 mA)
ST1-14 Ground (GND)
ST1-15 Frequency output (0 Hz … 1500 Hz)
ST1-16 Ground (GND)

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1.25.5 Technical data

General
Dimensions (L x W x H) 59 mm x 63 mm x 15 mm
Weight 0.026 kg
Supply voltages +UIN = +24 VDC (–50 % to +30 %) via LMB
and +5 VDC (5 %) from MPU 29
Current consumption (5 VDC) Less than 20 mA
Current consumption (24 VDC) Less than 10 mA (unloaded)
Less than 200 mA (loaded with 7 x 25 mA)
Power dissipation Less than 340 mW (unloaded)
Less than 3.0 W (loaded with 7 x 25 mA)

Instrument outputs
Power supply Internal
D/A converter resolution 10 bits
Electrical isolation No
Current outputs
Output current range 4 mA … 20 mA (1 %)
Short-circuit proof Yes
Frequency output
Frequency range 0 Hz … 1500 Hz
Sampling rate 1:1
Output voltage 20.5 VDC  Uhigh  +23.7 VDC
Ulow  0 VDC
Short-circuit proof Yes

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1.26 Printed circuit board MFB 1

1.26.1 Overview

Component side Conductor side

LED (yellow) “Analog speed signal 1”


Fusible cutouts LED (yellow) “Binary speed signal 1”
Side view LED (yellow) “Analog speed signal 2”
LED (yellow) “Binary speed signal 2”

LED (yellow) “Relay K2 activated”


LED (yellow) “Relay K1 activated”

LED (green) “+24 V output”


LED (green) “Ready for operation”

Fig. 83 : Views of printed circuit board MFB 1

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1.26.2 Performance characteristics

 Status indication by LEDs


 Electrically-isolated power supply for the channels by DC/DC converter
(12 VDC)
 All inputs equipped with EMC protective filters
 Inputs for analog speed signals (input voltage up to 80 VAC)
– Electrically-isolated, symmetrical and non-earthed inputs
– Separate control of switching sensitivity (hysteresis) of the inputs
– The inputs are suitable for speed acquisition of:
– Inductive speed sensors or
– Tachogenerators
 Inputs for binary speed signals
– Electrically-isolated inputs
– Reverse-battery protection and constant input current
– The inputs are suitable:
– For speed acquisition of binary sensors or
– As a binary channel (status interrogation)
 Binary outputs
– Output of binary information by two relays
– Separate activation of the two relays by MPU 23
– Two freely-available changeover contacts with overvoltage protection circuit
– Relay activation with pulse-width modulation (PWM) to reduce power loss
– Relay activation indication by LEDs
– Short-circuit protection for each relay by fusible cutout
– High switching capacity (50 W)
 24 VDC output for electronic transmitters or sensors

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1.26.3 Functional description

Two independent speed acquisition channels are available to the user. Each of the two
channels comprises an input for analog speed signals (tachogenerator or inductive
sensor) and an input for binary speed signals (electronic transmitter or status
interrogation).
If a speed channel is used to acquire an analog speed signal, the speed input for binary
speed signals may only be used for binary status interrogation.

The pulses are switched to the connector of printed circuit board MFB 1 directly via a
multiplexer or via a 10:1 divider. This signal routing method facilitates real-time processing
of the speed signal by MPU 23.

The inputs for analog speed signals are used for signal acquisition of a tachogenerator
or an inductive speed sensor.

The analog speed signal is routed to an adapter network via the input terminals. The
network realizes the following tasks:
 Input filter (symmetrical, non-earthed)
 Ensuring a wide input voltage range (up to 80 VAC)
 EMC protection
A series-connected comparator converts the analog signals (e.g. sinusoidal) into
square-wave pulses with TTL level. An additional hysteresis control makes it possible to
set various comparator switching thresholds.

Electrical isolation is realized by optocouplers and a separate DC/DC converter for


comparator power supply.

The inputs for binary speed signals are used for acquisition of the signals from an
electronic transmitter (pulses) or a binary signal (state).

The binary channel is directly controlled by an external voltage.


The current which flows is limited to approx. 4 mA irrespective of the external switching
voltage used.

The permissible input voltage range for the binary signal is 36 VDC.
The following applies to the input voltage (Ui ) of the signal:
 Ui  8 VDC is interpreted as an active binary channel (logic “1”).
 Ui  4 VDC is interpreted as an inactive binary channel (logic “0”).
 4 VDC  Ui  8 VDC should be avoided (forbidden range).
The binary input signal is electrically-isolated by an optocoupler. An active signal (logic “1”)
at the input terminals is indicated by illumination of the corresponding LED (“Binary speed
signal 1” and/or “Binary speed signal 2”).

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If the binary speed input is used for the acquisition of a binary state, MPU 23 interrogates
the state cyclically.
A typical application is shown in fig. 84.

+24 VDC COB


MFB 1
n07
n08 UI

GND

Fig. 84 : Example for the acquisition of a binary state

Two relays (K1 and K2) are provided on printed circuit board MFB 1 for the output of
binary information.
The relay is controlled by printed circuit board MPU 23.
Relay activation is indicated by LEDs.
Two changeover contacts are provided at the terminals of the PIM.

NC

NO
K1 (K2)

F1 (F2)
C
(Fusible cutout, 3.15 A)

Fig. 85 : Circuitry of relays K1 and K2

The relays are controlled with pulse-width modulation (PWM) to reduce relay power loss
and ensure a wide supply voltage range.
The 24 VDC output may be used to supply electronic transmitters or sensors.

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1.26.4 Connection assignment

The following table shows the relationship between printed circuit board MFB 1 and the
terminals of the PIM.
The variable n for identification of the terminals (column 1) represents the slot of the PIM
used.
The configuration of the individual slots is shown in chap. 1.1.3.

Terminal Designation
n01 Input for analog speed signal 1
n02 Input for analog speed signal 1
n03 Positive input of binary speed signal 1
n04 Negative input of binary speed signal 1
n05 Input for analog speed signal 2
n06 Input for analog speed signal 2
n07 Positive input of binary speed signal 2
n08 Negative input of binary speed signal 2
n09 +24 VDC output
n10 Ground for +24 VDC output
n11 Relay K1: Normally-closed contact
n12 Relay K1: Normally-open contact
n13 Relay K1: Common connection
n14 Relay K2: Common connection
n15 Relay K2: Normally-open contact
n16 Relay K2: Normally-closed contact

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1.26.5 Technical data

General
Dimensions (L x W x H) 59 mm x 63 mm x 15 mm
Weight 0.040 kg
Supply voltages +5 VDC (5 %) from MPU 23
+24 VDC (–50 % to +30 %) via COB
Power consumption (5 VDC) Less than 70 mA
Power consumption (24 VDC) Less than 35 mA
and output current for the 24 VDC output
(configuration-dependent)
Power dissipation Less than 750 mW

Analog inputs
Input voltage range
Tachogenerator Ueff < 80 VAC
Inductive sensor –36 VDC < U < +36 VDC
Input sensitivity 1 1 Vpp
Input sensitivity 2 4 Vpp (configurable by MPU 23)
Input resistance Min. 24 k
Measuring range 0.1 Hz … 12 kHz
(frequencies exceeding 750 Hz are acquired by
a 10:1 divider)
Electrical isolation Yes, by optocoupler
Input filter fL = 7.3 kHz, low-pass (RC) with 6 dB/decade

Binary inputs
Input voltage range Less than 36 VDC
Input voltage for logic “1” Min. 8 VDC
Input voltage for logic “0” Max. 4 VDC
Input current for logic “1” Approx. 4 mA
Input current for logic “0” Max. 1 mA
Sensor connection Two-pole
Electrical isolation Yes, by optocoupler
Input filter fL = 16 kHz, low-pass (RC) with 6 dB/decade
Frequency measuring range 0.1 Hz … 12 kHz
Binary input scanning cycle Approx. 50 ms

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Cable length for sensor connection Max. 5 m (unshielded)


Max. 50 m (shielded)

Binary outputs
Switching capacity per relay Max. 50 W (at 24 V)
Switching current Max. 2 A
Short-circuit protection Fusible cutout (3.15 A)
Relay actuation cycle Max. 10 ms

24 VDC output
Output voltage +24 VDC (–50 % to +30 %),
depending on supply voltage (+24 VDC)
Output current Max. 0.1 A
Short-circuit protection Self-restoring fuse (0.2 A)

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1.27 Printed circuit board MFB 2

1.27.1 Overview

Component side Conductor side

LED (yellow) “Transistor output 5 activated”


LED (yellow) “Transistor output 4 activated”
Side view LED (yellow) “Transistor output 3 activated”
LED (yellow) “Transistor output 2 activated”
LED (yellow) “Transistor output 1 activated”

LED (green) “UBATT (+24 VDC) ok”

LED (yellow) “Binary input 3 activated”


LED (yellow) “Binary input 2 activated”
LED (yellow) “Binary input 1 activated”

LED (red) “Printed circuit board RESET”

Fig. 86 : Views of printed circuit board MFB 2

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1.27.2 Performance characteristics

 Analog inputs
– Two independent analog channels for DC voltage signal acquisition
– Reference voltage routed out for direct potentiometer connection
– Line break and sensor monitoring
– High resolution with 12-bit A/D converter
– All inputs equipped with EMC protective filters
 Binary inputs
– Three electrically-isolated binary inputs
– Wide input voltage range (8 VDC to 36 VDC)
– Constant input current over the entire input voltage range
– Reverse-battery protection
– Status indication for each binary channel by LEDs (yellow)
– All inputs equipped with EMC protective filters
 Binary outputs
– Output of binary information by five transistor output stages (positive
switching)
– Output current monitoring and limitation
– Electrical isolation of the output stage circuit by optocoupler
– Indication of transistor switching states by LEDs (yellow)
– All outputs equipped with EMC protective filters
 Providing a voltage +UBATT (+24 VDC) to supply external assemblies (e.g.
sensors)

Note: Printed circuit board MFB 2 is used in conjunction with the new higher-perfor-
mance MPU 29 microprocessor unit. It is not possible to operate with the
MPU 23 microprocessor unit.

1.27.3 Functional description

Printed circuit board MFB 2 is used to:


 Acquire two analog signals
 Acquire three binary signals
 Output five binary signals
 Provide a supply voltage (+24 VDC)

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The analog inputs on printed circuit board MFB 2 are especially designed to acquire
potentiometer signals (voltage divider). Fig. 87 shows a typical application.

Each analog channel has the following connections:


 Reference voltage output
A short-circuit proof reference voltage (UREF = 4.096 VDC, no-load voltage) is
available for potentiometer connection at this output.
 Voltage input
The potentiometer (slider) voltage is tapped at this input. The divider voltage
UIN is in the following range:
0 V  UIN  4.096 V
 Reference potential/base point
The base point of the potentiometer is connected here.

The voltages of all three connections of each analog channel are acquired and digitalized
by the multiplexer of the A/D converter on MFB 2.
By continuously sampling the reference voltage (UREF ), the divider voltage (UIN ) and the
voltage at the potentiometer base point (UBP ), it is possible to determine the precise divi-
der voltage and thus the exact position of the potentiometer regardless of the resistance
value of the potentiometer used.
Line break and sensor monitoring are also realized by means of this measuring method
(evaluating individual voltages).

MFB 2
ST1-01
UREF (4.096 V)

ST1-02
1 k … 10 k UIN

ST1-03
UBP

Analog channel 1

Fig. 87 : Example of voltage signal acquisition

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The binary inputs are used to acquire binary signals.

Each binary acquisition channel has an input (single-wire technology).

An external power supply (see fig. 88) or the power supply of printed circuit board MFB 2
which is routed out (see fig. 89) can be used to control the binary inputs.

The maximum input voltage of a binary input is 36 VDC. The current which flows is limited
to approx. 4 mA regardless of the external input voltage used.

The following apply to the input voltage (Ui ) of the binary channel:
 Ui  8 VDC is interpreted as an active binary channel (logic “1”)
 Ui  4 VDC is interpreted as an inactive binary channel (logic “0”)
 4 VDC  Ui  8 VDC should be avoided (inadmissible range)

The input signal of each binary channel is electrically isolated by an optocoupler. The
binary input signals are interrogated cyclically by MPU 29.

Each binary input is assigned an LED (yellow) which indicates the respective switching
state. The corresponding LED lights up when a binary channel is active (logic “1”).

+UEXT (+24 VDC) MFB 2

ST1-15
+UBATT (+24 VDC)
ST1-12
Binary input 1
ST1-13
Binary input 2
ST1-14
Binary input 3
ST1-16
GNDBATT

GNDEXT

Fig. 88 : Example for the acquisition of three binary signals (external supply)

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MFB 2

ST1-15
+UBATT (+24 VDC)

ST1-12
Binary input 1
ST1-13
Binary input 2
ST1-14
Binary input 3
ST1-16
GNDBATT

Fig. 89 : Example for the acquisition of three binary signals (internal supply)

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Binary outputs

Printed circuit board MFB 2 incorporates 5 identical MOS transistor output stages to out-
put binary information.

The MOS transistor output stages are supplied by the internal power supply (+24 VDC) of
MFB 2. The maximum switching current per binary output must not exceed 100 mA.

The MOS transistor output stages are electrically isolated from the control logic by opto-
couplers.

The MOS power transistors incorporate overcurrent protective circuitry. The corresponding
output stage is switched off in case of a short-circuit at the transistor output.

The switching states of the output stage transistors are indicated by LEDs (yellow).

MFB 2
+UBATT (+24 VDC)

Imax  100 mA

ST1-07

Signal lamp

ST1-16
GNDBATT

Fig. 90 : Example of transistor output circuitry

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1.27.4 Connection assignment

The table below shows the signal assignment of connector ST1 on printed circuit board
MFB 2. The electrical connections to the motherboard are established via this connector.

Connection to the signal inputs and outputs on MFB 2 is established via the terminals pro-
vided on the appropriate motherboard (e.g. LMB 2). Refer to the description of the mother-
board or device concerned for details of connector pin assignment.

Pin assignment Designation


ST1-01 Output reference voltage 1 (UREF1 )
ST1-02 Input for analog voltage 1 (UIN1 )
ST1-03 Reference potential 1/base point 1 (UBP1 )
ST1-04 Output reference voltage 2 (UREF2 )
ST1-05 Input for analog voltage 2 (UIN2 )
ST1-06 Reference potential 2/base point 2 (UBP2 )
ST1-07 Transistor output 1 (positive switching)
ST1-08 Transistor output 2 (positive switching)
ST1-09 Transistor output 3 (positive switching)
ST1-10 Transistor output 4 (positive switching)
ST1-11 Transistor output 5 (positive switching)
ST1-12 Binary input 1
ST1-13 Binary input 2
ST1-14 Binary input 3
ST1-15 Positive internal operating voltage (+UBATT)
ST1-16 Ground for internal operating voltage (GNDBATT)

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1.27.5 Technical data

General
Dimensions (L x W x H) 59 mm x 63 mm x 15 mm
Weight 0.030 kg
Supply voltages +5 VDC (5 %) from MPU 29
+24 VDC (–50 % to +30 %) via LMB
Current consumption (5 VDC) Less than 20 mA
Current consumption (24 VDC) Less than 12 mA
plus output current for the 24 VDC output
(depending on configuration)
Power dissipation Less than 400 mW (without transistor outputs)

Analog inputs/potentiometer inputs


A/D converter
Resolution 12 bits
Measuring error Less than 0.5 % absolute (without sensor)
Measuring range UIN 0 VDC  UIN  4.096 VDC
Source resistance 1 k  R  10 k
Input filter (MUX inputs) fg = 220 Hz, RC low-pass with 6 dB/decade
Sampling rate fg > 10 Hz
Electrical isolation No
Internal reference voltage source
Reference voltage UREF = 4.096 VDC (no-load), short-circuit proof
Maximum output current per channel IREF  5 mA
Monitoring
Sensor monitoring Yes
Line break monitoring Yes

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Binary inputs
Input voltage range Less than 36 VDC
Input voltage for logic “1” Min. 8 VDC
Input voltage for logic “0” Max. 4 VDC
Input current for logic “1” Approx. 4 mA
Input current for logic “0” Max. 1 mA
Sensor connection Single-pole (referenced to GNDBATT)
Electrical isolation Yes, by optocoupler
Input filter fg = 16 kHz low-pass (RC) with 6 dB/decade
Cable length for sensor connection Max. 5 m (unshielded)
Max. 50 m (shielded)

Binary outputs
Switching voltage (+UBATT) Nominal +24 VDC (depending on the power
supply of motherboard LMB)
Switching current per output Max. 100 mA
Short-circuit protection Electronic monitoring
Electrical isolation Yes, between output stage circuit and
control logic

Power supply output


Output voltage (+UBATT) Nominal +24 VDC (depending on the power
supply of motherboard LMB)
Output current Max. 200 mA

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1.28 Printed circuit board MOB 1

1.28.1 Overview

Component side Conductor side

Side view

LED (yellow) “Output stage D active”


LED (yellow) “Output stage C active”
LED (yellow) “Output stage B active”
LED (yellow) “Output stage A active”
LED (green) “Current regulation stage C/D active”
LED (green) “Current regulation stage A/B active”

Fig. 91 : Views of printed circuit board MOB 1

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1.28.2 Performance characteristics

 Transistor output stages for inductive loads, e.g.:


– Stepping motor control (unipolar or bipolar)
– DC motor control in full bridge operation
– DC motor control in half bridge operation
– Dynamic control of solenoid valves
– Static control of solenoid valves (positive and ground switching)
 Control and monitoring of output stage transistors by a single-chip processor
(68HC711) involving HCMOS technology
 Electrical isolation between control electronics and output stage transistors
 All outputs equipped with protective circuitry against inductive voltage peaks
 Output current monitoring and limitation of the transistor output stages
 Output stage operating voltage supplied separately
 Status indication by LEDs
 All LEDs equipped with EMC protective filters

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1.28.3 Functional description

MOB 1 has four complimentary transistor output stages (A, B, C and D).
A microcontroller (type 68HC711) controls and monitors the output stages.

All transistor output stages are equipped with overvoltage and overcurrent protective
circuitry.
Overvoltage protection makes it possible to connect inductive loads directly (e.g. electric
motors, relays, solenoid valves etc.).
The overcurrent protective circuit switches off the output stage concerned for the duration
of a short-circuit.

Current regulation (max. 2 A) of inductive loads (see fig. 95) is only possible when connec-
ted at terminals 1 and 3 or 15 and 13.

The operating voltages for transistor output stages A/B and C/D can be supplied
separately for each pair of output stages (+UAB and +UCD). The consumers can be
operated on different supply networks due to separate operating voltage supply and
electrical isolation of the power circuit from the control electronics.
The operating voltage for the associated transistor output stage must always be filtered by
filter module FIM 1 (see page 11).

Various applications can be set by the software due to the integration of a microcontroller
on printed circuit board MOB 1.

The transistor output stages can be configured by the software as full bridges, half bridges
or as static transistor outputs.

The following applications are possible:


 Control of a bipolar stepping motor (see fig. 92)
 Control of a unipolar stepping motor (see fig. 93)
 Control of two DC motors by full bridges (see fig. 94)
 Dynamic control of two solenoid valves by half bridges and static control of two
loads by positive or ground switching transistor output stages (see fig. 95)

Note: The operating voltage of the output stage transistors must be filtered before
feeding in via filter module FIM 1.

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+UEXT

n07 n09

Output stage C

Output stage D
Output stage B
Output stage A

n02 L1 n01 n16 L2 n15

n05 n04 n11 n14

n06 n03 n12 n13

n08 n10 MOB 1

External wiring GNDEXT

Fig. 92 : Control of a bipolar stepping motor

+UEXT

n07 n09
Output stage C

Output stage D
Output stage B
Output stage A

n02 n01 n16 n15

L1.1 L1.2 L2.1 L2.2


n05 n04 n11 n14

n06 n03 n12 n13

n08 n10 MOB 1

External wiring GNDEXT

Fig. 93 : Control of a unipolar stepping motor

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+UEXT

n07 n09

Output stage C

Output stage D
Output stage B
Output stage A

n02 M1 n01 n16 M2 n15

n05 n04 n11 n14

n06 n03 n12 n13

n08 n10 MOB 1

External wiring GNDEXT

Fig. 94 : Control of two DC motors

+UAB +UCD

n07 n09
Output stage C

Output stage D
Output stage B
Output stage A

n02 Y n01 n16 n15

Y Y
n05 n04 n11 n14
M

n06 n03 n12 n13

n08 n10 MOB 1

External wiring GNDAB GNDCD

Fig. 95 : Dynamic and static control of inductive loads

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1.28.4 Connection assignment

The following table shows the relationship between printed circuit board MOB 1 and the
terminals of the PIM.
The variable n for identification of the terminals (column 1) represents the slot of the PIM
used.
The configuration of the individual slots is shown in chap. 1.1.3.

Terminal Designation
n01 Power output output stage B
n02 Power output output stage A
n03 Current control feedback output stages A and B
n04 Low output output stage B
n05 Low output output stage A
n06 Negative operating voltage (GNDAB) for output stages
A and B (connected internally to terminal n08!)
n07 Positive operating voltage supply (+UAB)
for output stages A and B
n08 Negative operating voltage supply (GNDAB)
for output stages A and B
n09 Positive operating voltage supply (+UCD)
for output stages C and D
n10 Negative operating voltage supply (GNDCD)
for output stages C and C
n11 Low output output stage C
n12 Negative operating voltage (GNDCD) for output stages
C and D (connected internally to terminal n10!)
n13 Current control feedback output stages C and D
n14 Low output output stage D
n15 Power output output stage D
n16 Power output output stage C

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1.28.5 Technical data

General
Dimensions (L x W x H) 59 mm x 63 mm x 12 mm
Weight 0.034 kg
Supply voltages +5 VDC (5 %) from MPU 23
+24 VDC (–50 % to +30 %) via COB
Current consumption (5 VDC) Less than 80 mA
Power dissipation Less than 1000 mW (load-dependent)
Microcontroller 68HC711 E9 (8 MHz)
with 512 byte EEPROM 768 byte RAM
Memory 12 Kbyte EPROM

Power section
External operating voltage (+UEXT) +16 VDC … +32 VDC (via filter module FIM 1)
Output current (IEXT) per output stage Max. 2 A (sum of all output stages max. 4 A)
Current control tolerance 20 mA
Short-circuit protection Yes, electronic monitoring
Electrical isolation Yes,
between output stage circuit and control logic,
between output stage pairs A/B and C/D
PWM adjusting range 0 % … 100 %
PWM resolution 16 bit
PWM frequency range 100 Hz … 2000 Hz

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1.29 Printed circuit board PAB 2

1.29.1 Overview

Component side Conductor side

Side view

Fig. 96 : Views of printed circuit board PAB 2

1.29.2 Performance characteristics

 Programming adapter for adjusting the CAN bus baud rate and node address of
a PIM

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1.29.3 Functional description

Printed circuit board PAB 2 is used to adjust the node address and set the CAN interface
baud rate of a PIM.

Note: Node address and baud rate should only be programmed using programming
cassette SST 2-01 (comprising MPU 23 and PAB 2) in practice. The program-
ming procedure is described in MTU document E 531 658.

The node address (00 … 31) of the corresponding PIM is set with the rotary switch on the
left (see fig. 97).

The rotary switch on the right (see fig. 97) is used for selecting the baud rate at which data
is transmitted to the PIM on the CAN bus. Two CAN buses can be connected to one PIM
(MPU 23 with CCB 1) with the result that the switch on the left is used for setting the baud
rate of the CAN1 bus (MPU 23, always fitted) and the rotary switch on the right is used to
set the baud rate of the CAN2 bus (CCB 1, option). If the PIM has one CAN1 bus only, one
of the two rotary switches must be set to “0”, the setting is then made with the remaining
rotary switch.

The following baud rate values can be set:

Rotary switch Baud rate Rotary switch Baud rate


setting setting

0 No baud rate, the value set at the 5 200 kilobaud


other switch applies to both
interfaces

1 50 kilobaud 6 250 kilobaud

2 100 kilobaud 7 400 kilobaud

3 125 kilobaud 8 500 kilobaud

4 160 kilobaud 9 1000 kilobaud

The set values are accepted on pressing the “Start programming” key.

1 Rotary switch node address 1st digit (tens)


2 Rotary switch node address 2nd digit (ones)
3 “Start programming” key
4 Rotary switch baud rate CAN1 interface
5 Rotary switch baud rate CAN2 interface
1 2 3 4 5

Fig. 97 : Controls on PAB 2

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1.29.4 Technical data

General
Dimensions (L x W x H) 59 mm x 63 mm x 14 mm
Weight 0.024 kg
Supply voltages +5 VDC (5 %) from MPU 23
+24 VDC (–50 % to +30 %) via COB
Current consumption (5 VDC) Less than 10 mA
Power dissipation Less than 50 mW

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1.30 Printed circuit board SAB 1

1.30.1 Overview

Component side Conductor side

Fusible cutouts

Side view

LED (red) “Line break binary input“


LED (yellow) “Binary channel active”

LED (yellow) “Transistor output active”


LED (yellow) “Relay K1 active”
LED (yellow) “Relay K2 active”
LED (yellow) “Relay K3 active”

Fig. 98 : Views of printed circuit board SAB 1

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1.30.2 Performance characteristics

 CAN interface in accordance with ISO 11 898, electrically-isolated


 Output of binary information by three relays
– Separate relay control
– Relay control status indication by LED (yellow)
– Short-circuit protection for each relay with fusible cutouts (F2 to F5)
– High switching capacity (50 W)
 Output of binary information by transistor output stage
– Electrical isolation of the output stage circuit by optocouplers
– Separate operating voltage supply for the transistor output stage
– Output current monitoring and limitation
– Transistor control status indication by LED (yellow)
 Binary input
– Electrically isolated binary input
– Binary input status display by LED (yellow)
– Line break monitoring and binary channel connecting lines
– Line break indication by LED (red)
– Wide input voltage range (36 VDC)
– Constant input current (approx. 4 mA) over an input voltage range of 8 VDC
to 36 VDC
 All inputs and outputs equipped with EMC protective filters

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1.30.3 Functional description

The binary input is used to acquire a binary signal. It has two inputs (two-wire
technology) and is directly controlled by an external voltage. A typical application is shown
in fig. 99.

The maximum input voltage of the binary channel is 36 VDC.


The following apply to the input voltage (Ui) of the binary channel:
 Ui  8 VDC is interpreted as an active binary channel (logic “1”).
 Ui  4 VDC is interpreted as an inactive binary channel (logic “0”).
 4 VDC  Ui  8 VDC is inadmissible (forbidden range).

The input signal of the binary channel is electrically-isolated by an optocoupler.


The current which flows is limited to approx. 4 mA irrespective of the external switching
voltage used.
The current state of the binary channel is indicated by a status LED (yellow) on SAB 1.
The LED lights up when the binary channel is active (logic “1”).

A resistor (33 kohm) must be connected in parallel to the switching contact to realize line
break monitoring. The quiescent current which results is evaluated by a separate
optocoupler. The red LED “Line break binary input” flashes in case of line break.

+24 VDC
Module housing with SAB 1
33 k
(Line break monitoring) COB

n15 SAB 1
n16 Ui

Binary channel

GND

Fig. 99 : Example of a binary channel circuit

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An MOS transistor output stage for the output of binary information is located on
printed circuit board SAB 1.

The external operating voltage for the transistor output stage is connected to the PIM via
terminals n12 (+UEXT) and n14 (GNDEXT) and may range from +10 VDC to +36 VDC. The
external operating voltage can be independent of the operating voltage of the PIMs and is
protected by a self-restoring fuse (1.1 A) on printed circuit board SAB 1.
The control electronics are electrically isolated from the output stage circuit by an opto-
coupler.

A yellow LED indicates the switching state of the transistor output stage.

The MOS transistor output stage is equipped with the following protective circuits:
 Overvoltage protection
facilitating direct connection of inductive loads (e.g. relays etc.).
 Overcurrent protection
switches off the transistor output stage in case of short-circuit.

COB
SAB 1 F1 n12
+UEXT
(self-restoring, 1.1 A)

n13

n14

GNDEXT

Module housing with SAB 1

Fig.100 : Example of a transistor output stage circuit

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Printed circuit board SAB 1 has three relays to output binary information.

Relay activation is indicated by one yellow LED respectively. The working current circuits
of all the relays are protected by fusible cutouts (3.15 A).

The following connection possibilities are available:

F2
(Fusible cutout, 3.15 A)
n06

n05
F3
K1 (Fusible cutout, 3.15 A)

n04

Fig.101 : Relay K1 circuitry

n07

n08

K2

n09
F4
(Fusible cutout, 3.15 A)

Fig.102 : Relay K2 circuitry

n10

K3

n11
F5
(Fusible cutout, 3.15 A)

Fig.103 : Relay K3 circuitry

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1.30.4 Connection assignment

The following table shows the relationship between printed circuit board SAB 1 and the
terminals of the PIM.
The variable n for identification of the terminals (column 1) represents the slot of the PIM
used.
The configuration of the individual slots is shown in chap. 1.1.3.

Terminal Designation
n01 CAN interface: Positive input CAN(H)
n02 CAN interface: Negative input CAN(L)
n03 CAN controller ground (GND(CAN))
n04 Relay K1: Common
n05 Relay K1: NO contact K1.2
n06 Relay K1: NO contact K1.1
n07 Relay K2: NC contact
n08 Relay K2: NO contact
n09 Relay K2: Common
n10 Relay K3: NO contact
n11 Relay K3: Common
n12 Positive external operating voltage (+UEXT)
n13 Transistor output (positive switching)
n14 Negative external operating voltage (GNDEXT)
n15 Binary channel: Positive binary input
n16 Binary channel: Negative binary input

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1.30.5 Technical data

General
Dimensions (L x W x H) 59 mm x 63 mm x 15 mm
Weight 0.044 kg
Supply voltages +5 VDC (5 %) from MPU 23
+24 VDC (–50 % to +30 %) via COB
Current consumption (5 VDC) Less than 60 mA
Current consumption (24 VDC) Less than 15 mA
Power dissipation Less than 660 mW

CAN interface
CAN bus system In accordance with ISO 11 898
Baud rate 3.78 kBd to 1 MBd
Electrical isolation Yes, by optocoupler

Transistor output
External operating voltage (+UEXT) +10 VDC … +36 VDC
Short-circuit protection (+UEXT) Self-restoring fuse (1.1 A)
Switching current Max. 250 mA
Short-circuit protection Electronic monitoring
Electrical isolation Yes, between output stage circuit
and control logics

Relay outputs
Switching power per relay Max. 50 W (at 24 VDC)
Switching voltage (external) Max. 36 VDC
Switching current Max. 2 A
Short-circuit protection Fusible cutout (3.15 A)
Relay switching time Max. 10 ms
Relay changeover time Max. 20/s

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Binary input
Input voltage range Less than 36 VDC
Input voltage for logic “1” Min. 8 VDC
Input voltage for logic “0” Max. 4 VDC
Input current for logic “1” Approx. 4 mA
Input current for logic “0” Max. 1 mA (for line break monitoring)
Sensor connection Two pole
Electrical isolation Yes, by optocoupler
Input filter Low-pass (RC) with 6 dB/decade
Binary input scanning cycle Approx. 50 ms
Cable length for sensor connection Max. 5 m (unshielded) twisted
Max. 50 m (shielded) twisted

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1.31 Printed circuit board SCB 2

1.31.1 Overview

Component side Conductor side

Fig.104 : Views of printed circuit board SCB 2

1.31.2 Performance characteristics

 Interface extension in accordance with RS 422 standard for printed circuit board
MPU 23
 Directly pluggable on printed circuit board MPU 23
 Electrically-isolated interface

1.31.3 Functional description

Printed circuit board SCB 2 is an interface extension for printed circuit board MPU 23. It
realizes an interface in accordance with RS422 standard.
Electrical connection to printed circuit board MPU 23 is established via a connector.

Printed circuit board SCB 2 is used to convert signals with RS422 level into signals with
TTL level. The signals are isolated by optocouplers.
The signals with TTL level are required for communication with the single-chip processor
of MPU 23.

MPU 23 processes the data and controls the interface drivers.

Note: The interface is connected by the terminal strip of the PIM.


Connection assignment is shown in chap. 1.7.4.

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1.31.4 Technical data

General
Dimensions (L x W x H) 40 mm x 10 mm x 4 mm
Weight 0.002 kg
Supply voltages +5 VDC (5 %) from MPU 23
Power consumption (5 VDC) Less than 50 mA, via MPU 23
Connection Reserved slot on MPU 23

Data transmission
Bit-serial In accordance with RS422 standard
Baud rate 1.2 kbd to 19.2 kbd
Electrical isolation Yes, by optocoupler

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1.32 Printed circuit board SCB 3

1.32.1 Overview

Component side Conductor side

LED (red) “Reset or not ready”


LED (green) “Initializing”
Side view LED (yellow) “Interface 1: Receiving or transmitting line active”
LED (yellow) “Interface 2: Receiving or transmitting line active”

RS232 interface connector

Fig.105 : Views of printed circuit board SCB 3

1.32.2 Performance characteristics

 2 interfaces in accordance with RS422 or RS232 standard


 All interfaces are electrically-isolated

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1.32.3 Functional description

Printed circuit board SCB 3 is used as an interface extension (additional serial interfaces),
as an interface converter or as an amplifier.

Printed circuit board SCB 3 has two serial transmission channels which are routed to the
terminal strip of the PIM.
The software of MPU 23 determines which interface is active on which transmission
channel. Only one interface may be active for each transmission channel.
 Transmission channel 1 has a connection for a serial interface in accordance
with RS422 standard and a serial interface in accordance with RS232 standard.
The RS232 interface may be connected via the terminals of the PIM or via a
connector located on printed circuit board SCB 3. If connection is established
via the connector, the terminals of the RS232 interface are automatically
switched off.
 Transmission channel 2 has a connection for a serial interface in accordance
with RS422 standard and a serial interface in accordance with RS232 standard.

MPU 23 processes the data and controls the interface drivers.

Module housing with SCB 3


Transmission channel 1 COB
Connector SCB 3

n11
TX
n15
RX
n13

n07
E1
n09
E2
n05

n01
A1
n03
A2

Fig.106 : Example of a transmission channel

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1.32.4 Connection assignment

The following table shows the relationship between printed circuit board SCB 3 and the
terminals of the PIM.
The variable n for identification of the terminals (column 1) represents the slot of the PIM
used.
The configuration of the individual slots is shown in chap. 1.1.3.

Terminal Designation
n01 Channel 1: O1 of RS 422 interface
n02 Channel 2: O1 of RS 422 interface
n03 Channel 1: O2 of RS 422 interface
n04 Channel 2: O2 of RS 422 interface
n05 Channel 1: Ground (shield) of RS 422 interface
n06 Channel 2: Ground (shield) of RS 422 interface
n07 Channel 1: I1 of RS 422 interface
n08 Channel 2: I1 of RS 422 interface
n09 Channel 1: I2 of RS 422 interface
n10 Channel 2: I2 of RS 422 interface
n11 Channel 1: TX of RS 232 interface
n12 Channel 2: TX of RS 232 interface
n13 Channel 1: Ground (shield) of RS 232 interface
n14 Channel 2: Ground (shield) of RS 232 interface
n15 Channel 1: RX of RS 232 interface
n16 Channel 2: RX of RS 232 interface

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1.32.5 Technical data

General
Dimensions (L x W x H) 59 mm x 63 mm x 15 mm
Weight 0.036 kg
Supply voltages +5 VDC (5 %) from MPU 23
Power consumption Less than 100 mA
Power dissipation Less than 425 mW

Data transmission
Bit-serial In accordance with RS422 standard
Baud rate 1.2 kbd to 19.2 kbd
Electrical isolation By optocoupler
Bit-serial In accordance with RS232 standard
Baud rate 1.2 kbd to 19.2 kbd
Electrical isolation By optocoupler

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1.33 Printed circuit board SCB 4

1.33.1 Overview

Component side Conductor side

Fig.107 : Views of printed circuit board SCB 4

1.33.2 Performance characteristics

 Interface extension in accordance with RS232 standard for printed circuit board
MPU 23
 Directly pluggable on printed circuit board MPU 23
 Interface is electrically-isolated

1.33.3 Functional description

Printed circuit board SCB 4 is an interface extension for printed circuit board MPU 23. It
realizes an interface in accordance with RS 232 standard.
Electrical connection to printed circuit board MPU 23 is established via a connector.

Printed circuit board SCB 4 is used to convert signals with RS 232 level into signals with
TTL level. The signals are isolated by optocouplers.
The signals with TTL level are required for communication with the single-chip processor
of MPU 23.

MPU 23 processes the data and controls the interface drivers.

Note: The interface is connected by the terminal strip of the PIM.


Connection assignment is shown in chap. 1.7.4.

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1.33.4 Technical data

General
Dimensions (L x W x H) 40 mm x 10 mm x 4 mm
Weight 0.002 kg
Supply voltages +5 VDC (5 %) from MPU 23
Power consumption (5 VDC) Less than 50 mA, via MPU 23
Connection Reserved slot on MPU 23

Data transmission
Bit-serial In accordance with RS232 standard
Baud rate 1.2 kBd to 19.2 kBd
Electrical isolation Yes, by optocoupler

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Part 2

Operation

Not applicable

2 Not applicable

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Part 3

Maintenance and repair


(Plant personnel)

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3 Maintenance and repair (Plant personnel)

3.1 Safety requirements

IMPORTANT
These safety requirements shall be read and observed by all
personnel involved in operation, care, maintenance or repair of the
products concerned.

Furthermore, the following shall be observed:


 The safety requirements (if provided) in other relevant MTU manuals
 Warning and safety notes and operating and limit values attached to the
products as required
 National accident prevention and safety standards
 Appropriate regulations usual in the industry
 The safety notes (if provided) in the text of this manual

Conventions for safety notes in the text


Where necessary, this manual includes highlighted safety notes marked with a signal
word. These safety notes shall be observed to avoid injury or damage.

This type of note indicates a danger which may lead to injury or


death.

DANGER

This type of note indicates a danger which may lead to damage


or destruction of the product described or another part of the
system.

CAUTION

Intended use and user qualifications


All devices and system components may only be put to their intended use.
Operation, maintenance and repair shall only be performed by qualified and authorized
personnel.

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Safety requirements for maintenance and repair


Maintenance and repair work shall be performed exactly and on schedule to ensure
constant readiness and reliability of the product.
Authorization must be obtained from the commanding officer prior to commencing mainte-
nance and repair work and switching off parts of the electronic system required for this.
Prior to working on assemblies, the power supply of the appropriate areas must be
switched off and secured against unauthorized switching on.
Any measures requiring power supply are expressly defined as such at the appropriate
place in the manual.
Maintenance and repair work shall be performed in accordance with the instructions in the
manual by authorized personnel.
Suitable tools, special MTU tools if necessary, shall be used for maintenance and repair
work.
Genuine spare parts only may be used to replace defective components or assemblies.
The manufacturer is in no way responsible for damage caused by using other spare parts.
The manufacturer’s guarantee is also voided in such cases.
The manufacturer shall not be held responsible if unauthorized changes or modifications
are made to the product and the guarantee shall be voided.
Spare parts shall be properly stored prior to replacement, i.e. particularly protected
against moisture. Defective electronic components and assemblies must be suitably
packed when despatched for repair, i.e. particularly protected against moisture and impact
and wrapped in antistatic foil if necessary.
Inform the MTU service department or its representative in case of damage which cannot
be rectified by plant personnel.
On completion of maintenance and repair work, ensure that no superfluous parts (tools
etc.) remain inside the device or system.
On completion of all repair work, the system must be subjected to a function check. Sepa-
rate testing of the repaired component without system integration is insufficient.
When working on the engine, suitable measures shall be taken to prevent accidental start-
ing.

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3.2 Maintenance

The Peripheral Interface Modules (PIM) and the printed circuit boards therein are
maintenance-free.

However, we recommend inspecting the PIMs visually at regular intervals.

Pay particular attention to any mechanical damage, check for firm seating and ensure that
wires are properly connected.

Replace damaged or faulty assemblies immediately or have them repaired by the MTU
service department.

Peripheral Interface Modules (PIM) may suffer damage if


subjected to inappropriate handling.
Never clean these modules with water, high-pressure steam jets
or aggressive cleaning agents/methods.
CAUTION

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3.3 Troubleshooting

3.3.1 General information

This chapter describes only such measures as can be carried out by plant personnel
without the use of measuring instruments or test equipment, without special tools and
without special training.

Note: Always consult the documents describing the overall system (e.g. MCS-5) in
addition to pinpoint malfunctions.
Status and fault messages indicated by the LEDs on the printed circuit boards
are configured to meet system and order-specific requirements.
Furthermore, other fault messages (e.g. system display) may simplify trouble-
shooting.

Refer to other order-related documents (e.g. publications, drawings etc.) for


details of any order-specific deviations from the information in this manual.

3.3.2 Malfunctions caused by faulty wiring and terminal connections

Malfunctions may result from damaged wiring or faulty plug and terminal connections.
Inspect closely to eliminate such sources of malfunction right at the start.

3.3.3 LED indicators on the printed circuit boards

Most of the printed circuit boards used in the PIMs feature LED indicators providing status
information and fault messages.

Order-specific configuration of the printed circuit boards determines which states/malfunc-


tions cause an LED to light up or flash.

For this reason, only those LEDs with functions which are neither order nor system-
specific are described in the subsequent chapters of this manual.

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3.3.3.1 LED indicators on MPU 23

LED (green) “Power supply (+5 V)”


LED (red) “Processor reset/fault”
LED (yellow) “Communication CAN interface”
LED (yellow) “Communication 2nd interface”

Fig.108 : LEDs of MPU 23

Fault description Possible cause Countermeasures See chap.


• LED “Power supply ♦ PIM power supply (+24 V)  Check supply 3.4.1
(+5 V)
V)” not lit missing
♦ Self-restoring fuse on  Switch off power supply –
COB 1 or COB 3 tripped  Wait 30 seconds
 Switch on power supply
♦ COB 1 or COB 3 faulty  Replace PIM 3.4.4
♦ Mechanical fault in basic
module of PIM
• LED “Power supply ♦ Power supply of MPU 23  Replace MPU 23 3.4.2
(+5 V)” not lit (+5 V) faulty

• LED “Processor reset/ ♦ Program/processor fault  Switch power supply off/ –


fault” lit on
 Replace MPU 23 3.4.2
 Inform MTU service
department

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3.3.3.2 LED indicators on AIB 1-02

LED (green) “Power supply (+5 V)”


LED (red) “Processor reset/fault”

Fig.109 : LEDs on AIB 1-02

Fault description Possible cause Countermeasures See chap.


• LED “Power supply ♦ PIM power supply (+24 V)  Check supply 3.4.1
(+5 V)
V)” not lit missing
♦ Self-restoring fuse on  Switch off power supply –
COB 1 or COB 3 tripped  Wait 30 seconds
 Switch on power supply
♦ COB 1 or COB 3 faulty  Replace PIM 3.4.4
♦ Mechanical fault in basic
module of PIM
♦ MPU 23 power supply  Replace MPU 23 3.4.2
(+5 V) faulty
• LED “Processor reset/ ♦ Program/processor fault  Switch power supply –
fault” lit off/on
 Replace MPU 23 3.4.2
 Inform MTU service
department

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3.3.3.3 LED indicators on AIB 3

LED (yellow) Order-specific configuration


LED (yellow) Order-specific configuration
LED (red) “Fault”
LED (green) Order-specific configuration

LED (green) “Power supply (+15 V)”


LED (green) “Power supply (–15 V)”

Fig. 110 : LEDs on AIB 3

Fault description Possible cause Countermeasures See chap.


• LED “Power supply ♦ PIM power supply (+24 V)  Check supply 3.4.1
(+15 V)”
V) not lit missing
• LED “Power supply ♦ Self-restoring fuse on  Switch off power supply –
(–15 V)” not lit COB 1 or COB 3 tripped  Wait 30 seconds
 Switch on power supply
♦ AIB 3 faulty  Replace AIB 3 3.4.2
♦ COB 1 or COB 3 faulty  Replace PIM 3.4.4
♦ Mechanical fault in basic
module of PIM
• LED “Fault” lit ♦ Sensor or sensor wiring  Check sensor and sensor –
faulty wiring
♦ AIB 3 faulty  Replace AIB 3 3.4.2

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3.3.3.4 LED indicators on BIB 1

LED (yellow) “Channel 1 active”


LED (red) “Channel 1 line break”
LED (yellow) “Channel 2 active”
LED (red) “Channel 2 line break”

LED (yellow) “Channel 3 active”


LED (red) “Channel 3 line break”
LED (yellow) “Channel 4 active”
LED (red) “Channel 4 line break”

LED (yellow) “Channel 5 active”


LED (red) “Channel 5 line break”
LED (yellow) “Channel 6 active”
LED (red) “Channel 6 line break”

LED (yellow) “Channel 7 active”


LED (red) “Channel 7 line break”
LED (yellow) “Channel 8 active”
LED (red) “Channel 8 line break”

Fig. 111 : LEDs of BIB 1

Fault description Possible cause Countermeasures See chap.


• LED “Channel … active” ♦ PIM power supply (+24 V)  Check supply 3.4.1
not lit although corres
correspon-
on missing
ding binary input is activa- ♦ Self-restoring fuse on  Switch off power supply –
ted correctly COB 1 or COB 3 tripped  Wait 30 seconds
 Switch on power supply
♦ BIB 1 faulty  Replace BIB 1 3.4.2
♦ COB 1 or COB 3 faulty  Replace PIM 3.4.4
♦ Mechanical fault in basic
module of PIM
• LED “Channel … line ♦ External power supply for  Check supply –
break
break” lit switching contact missing
(applicable only when the ♦ Switching contact wiring  Check switching contact –
external switching contact faulty wiring
is bridged by a resistor ♦ Switching contact faulty  Check switching contact
(33 k))
♦ BIB 1 faulty  Replace BIB 1 3.4.2

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3.3.3.5 LED indicators on BIB 2

LED (yellow) “Channel 1 active”


LED (red) “Channel 1 line break”
LED (yellow) “Channel 2 active”
LED (red) “Channel 2 line break”

LED (yellow) “Channel 3 active”


LED (red) “Channel 3 line break”
LED (yellow) “Channel 4 active”
LED (red) “Channel 4 line break”

LED (yellow) “Channel 5 active”


LED (red) “Channel 5 line break”
LED (yellow) “Channel 6 active”
LED (red) “Channel 6 line break”

LED (yellow) “Channel 7 active”


LED (red) “Channel 7 line break”
LED (yellow) “Channel 8 active”
LED (red) “Channel 8 line break”

Fig. 112 : LEDs on BIB 2

Fault description Possible cause Countermeasures See chap.


• LED “Channel … active” ♦ PIM power supply (+24 V)  Check supply 3.4.1
correspon-
not lit although corres on missing
ding binary input is activa- ♦ Self-restoring fuse on  Switch off power supply –
ted correctly COB 1 or COB 3 tripped  Wait 30 seconds
 Switch on power supply
♦ BIB 2 faulty  Replace BIB 2 3.4.2
♦ COB 1 or COB 3 faulty  Replace PIM 3.4.4
♦ Mechanical fault in basic
module of PIM
• LED “Channel … line ♦ External power supply for  Check supply –
break
break” lit switching contact missing
(applicable only when the ♦ Switching contact wiring  Check switching contact –
external switching contact faulty wiring
is bridged by a resistor ♦ Switching contact does  Check switching contact
(33 k)) not switch
♦ BIB 2 faulty  Replace BIB 2 3.4.2
• All red LEDs (“Channel … ♦ Power supply (+24 V) for  Switch off power supply –
line break”) lit the switching contacts  Wait 30 seconds
missing as the self-  Switch on power supply
restoring fuse on COB 1
or COB 3 has tripped
♦ BIB 2 faulty  Replace BIB 2 3.4.2

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3.3.3.6 LED indicators on BOB 1

Component side
LED (yellow) “Relay K1 activated”
LED (yellow) “Relay K2 activated”
LED (yellow) “Relay K3 activated”
LED (yellow) “Relay K4 activated”

LED (red) Order-specific configuration

Fusible cutouts

Fig. 113 : Fusible cutouts and LEDs on BOB 1

Fault description Possible cause Countermeasures See chap.


• I/O channels on BOB 1 ♦ PIM power supply (+24 V)  Check supply 3.4.1
out of order missing
• No LED lit although the ♦ Self-restoring fuse on  Switch off power supply –
appropriate channels are COB 1 or COB 3 tripped  Wait 30 seconds
activated  Switch on power supply
♦ BOB 1 faulty  Replace BOB 1 3.4.2
♦ COB 1 or COB 3 faulty  Replace PIM 3.4.4
♦ Mechanical fault in basic
module of PIM
• Signal to the make con- ♦ Fuse tripped:  Replace fuse 3.4.3
tacts of the relay (K1, K2, F1 for relay K1
K3 or K4) not switched F2 for relay K2
through although the ap- F3 for relay K3
propriate “Relay activa- F4 for relay K4.1
ted” LED is lit F5 for relay K4.2
♦ BOB 1 faulty  Replace BOB 1 3.4.2

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3.3.3.7 LED indicators on BOB 2

Component side
LED (yellow) “Transistor output 1 activated”
LED (yellow) “Transistor output 2 activated”
LED (yellow) “Transistor output 3 activated”
LED (yellow) “Transistor output 4 activated”

LED (yellow) “Transistor output 5 activated”


LED (yellow) “Transistor output 6 activated”
LED (yellow) “Transistor output 7 activated”
LED (yellow) “Transistor output 8 activated”

LED (yellow) “Transistor output 9 activated”


LED (yellow) “Transistor output 10 activated”
LED (yellow) “Transistor output 11 activated”
LED (yellow) “Transistor output 12 activated”

LED (yellow) “Transistor output 13 activated”


LED (yellow) “Transistor output 14 activated”
LED (green) “Power supply (+24 V)”

Fusible cutout

Fig. 114 : Fusible cutout and LEDs on BOB 2

Fault description Possible cause Countermeasures See chap.


• I/O channels of BOB 2 out ♦ PIM power supply (+24 V)  Check supply 3.4.1
of order missing
• No LED lit although the ♦ Self-restoring fuse on  Switch off power supply –
appropriate channels are COB 1 or COB 3 tripped  Wait 30 seconds
activated  Switch on power supply
♦ BOB 2 faulty  Replace BOB 2 3.4.2
♦ COB 1 or COB 3 faulty  Replace PIM 3.4.4
♦ Mechanical fault in basic
module of PIM
• LED “Power supply ♦ External power supply for  Check supply 3.4.1
(+24 V)” not lit transistor output (+24 V)
missing
♦ Fuse F1 tripped  Replace fuse 3.4.3
♦ BOB 2 faulty  Replace BOB 2 3.4.2
• LED “Power supply ♦ External power supply for  Check supply 3.4.1
(+24 V)” not lit transistor output (+24 V)
• Transistor output does not missing
switch although the ap- ♦ Fuse F1 tripped  Replace fuse 3.4.3
propriate
ro riate “Transistor
Transistor acti-
vated” LED is lit ♦ BOB 2 faulty  Replace BOB 2 3.4.2

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3.3.3.8 LED indicators on BOB 3

Component side
LED (yellow) “Transistor output 1 activated”
LED (yellow) “Transistor output 2 activated”
LED (yellow) “Transistor output 3 activated”
LED (yellow) “Transistor output 4 activated”

LED (yellow) “Transistor output 5 activated”


LED (yellow) “Transistor output 6 activated”
LED (yellow) “Transistor output 7 activated”
LED (yellow) “Transistor output 8 activated”

LED (yellow) “Transistor output 9 activated”


LED (yellow) “Transistor output 10 activated”
LED (yellow) “Transistor output 11 activated”
LED (yellow) “Transistor output 12 activated”

LED (yellow) “Transistor output 13 activated”


LED (yellow) “Transistor output 14 activated”

LED (green) “Power supply (+24 V)”

Fusible cutout

Fig. 115 : Fusible cutout and LEDs on BOB 3

Fault description Possible cause Countermeasures See chap.


• I/O channels of BOB 3 out ♦ PIM power supply (+24 V)  Check supply 3.4.1
of order missing
• No LED lit although the ♦ Self-restoring fuse on  Switch off power supply –
appropriate channels are COB 1 or COB 3 tripped  Wait 30 seconds
activated  Switch on power supply
♦ BOB 3 faulty  Replace BOB 3 3.4.2
♦ COB 1 or COB 3 faulty  Replace PIM 3.4.4
♦ Mechanical fault in basic
module of PIM
• LED “Power supply ♦ External power supply for  Check supply 3.4.1
(+24 V)” not lit transistor output (+24 V)
missing
♦ Fuse F1 tripped  Replace fuse 3.4.3
♦ BOB 3 faulty  Replace BOB 3 3.4.2
• LED “Power supply ♦ External power supply for  Check supply 3.4.1
(+24 V)” not lit transistor output (+24 V)
• Transistor output does not missing
switch although the ♦ Fuse F1 tripped  Replace fuse 3.4.3
appropriate
a ro riate “Transistor
Transistor
activated” LED is lit ♦ BOB 3 faulty  Replace BOB 3 3.4.2

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3.3.3.9 LED indicators on EGB 1

LED (yellow) Order-specific configuration


LED (yellow) Order-specific configuration
LED (green) Order-specific configuration
LED (red) “Fault”

LED (green) “Power supply (+15 V)”


LED (green) “Power supply (–15 V)”

Fig. 116 : LEDs on EGB 1

Fault description Possible cause Countermeasures See chap.


• LED “Power supply ♦ PIM power supply (+24 V)  Check supply 3.4.1
(+15 V)”
V) not lit missing
• LED “Power supply ♦ Self-restoring fuse on  Switch off power supply –
(–15 V)” not lit COB 1 or COB 3 tripped  Wait 30 seconds
 Switch on power supply
♦ EGB 1 faulty  Replace EGB 1 3.4.2
♦ COB 1 or COB 3 faulty  Replace PIM 3.4.4
♦ Mechanical fault in basic
module of PIM
• LED “Fault” lit ♦ Sensor or sensor wiring  Check sensor and sensor –
faulty wiring
♦ EGB 1 faulty  Replace EGB 1 3.4.2

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3.3.3.10 LED indicators on FCB 1

Component side

LED (yellow) “Relay K2 activated”


LED (yellow) “Relay K1 activated”

Fusible cutouts

Fig. 117 : Fusible cutouts and LEDs on FCB 1

Fault description Possible cause Countermeasures See chap.


• I/O channels on FCB 1 ♦ PIM power supply (+24 V)  Check supply 3.4.1
out of order missing
• No LED lit although the ♦ Self-restoring fuse on  Switch off power supply –
appropriate channels are COB 1 or COB 3 tripped  Wait 30 seconds
activated  Switch on power supply
♦ FCB 1 faulty  Replace FCB 1 3.4.2
♦ COB 1 or COB 3 faulty  Replace PIM 3.4.4
♦ Mechanical fault in basic
module of PIM
• Transistor output (T1, T2, ♦ External power supply for  Check supply 3.4.1
T3 or T4) does not switch transistor output (+24 V)
missing
♦ Self-restoring fuse on  Switch off power supply –
FCB 1 tripped  Wait 30 seconds
 Switch on power supply
♦ FCB 1 faulty  Replace FCB 1 3.4.2
>>

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Fault description Possible cause Countermeasures See chap.


>>
• Signal to make contact of ♦ Fuse tripped:  Replace fuse 3.4.3
relay (K1 or K2) not F1 for relay K1
switched through although F2 for relay K2
appropriate LED “Relay
♦ FCB 1 faulty  Replace FCB 1 3.4.2
activated” lit

3.3.3.11 LED indicators on INB 2

LED (green) “Power supply (15 V)”

LED (yellow) “Instrument outputs active”


LED (yellow) Order-specific configuration

Fig. 118 : LEDs on INB 2

Fault description Possible cause Countermeasures See chap.


• LED “Power supply ♦ PIM power supply (+24 V)  Check supply 3.4.1
(15 V)
V)” not lit missing
♦ Self-restoring fuse on  Switch off power supply –
COB 1 or COB 3 tripped  Wait 30 seconds
 Switch on power supply
♦ INB 2 faulty  Replace INB 2 3.4.2
♦ COB 1 or COB 3 faulty  Replace PIM 3.4.4
♦ Mechanical fault in basic
module of PIM
• LED “Instrument outputs ♦ INB 2 faulty  Replace INB 2 3.4.2
active” not lit

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3.3.3.12 LED indicators on MFB 1

Component side
LED (yellow) “Analog speed signal 1”
LED (yellow) “Binary speed signal 1”
LED (yellow) “Analog speed signal 2”
LED (yellow) “Binary speed signal 2”

LED (yellow) “Relay K2 activated”


LED (yellow) “Relay K1 activated”

LED (green) “+24 V output”


LED (green) “Ready for operation”

Fusible cutouts

Fig. 119 : Fusible cutouts and LEDs on MFB 1

Fault description Possible cause Countermeasures See chap.


• Speed acquisition chan- ♦ PIM power supply (+24 V)  Check supply 3.4.1
nels on MFB 1 out of missing
order ♦ Self-restoring fuse on  Switch off power supply –
• No LED lit although the COB 1 or COB 3 tripped  Wait 30 seconds
appropriate channels are  Switch on power supply
activated
♦ MFB 1 faulty  Replace MFB 1 3.4.2
♦ COB 1 or COB 3 faulty  Replace PIM 3.4.4
♦ Mechanical fault in basic
module of PIM
• LED “+24 V output” not lit ♦ PIM power supply (+24 V)  Check supply 3.4.1
missing
♦ Self-restoring fuse (F1) on  Switch off power supply 3.4.3
MFB 1 tripped  Wait 30 seconds
 Switch on power supply
♦ MFB 1 faulty  Replace MFB 1 3.4.2
• Signal to the make con- ♦ Fuse tripped:  Replace fuse 3.4.3
tacts of the relay (K1 or F1 for relay K1
K2) not switched through F2 for relay K2
although the appropriate
a ro riate
LED “Relay activated” is ♦ MFB 1 faulty  Replace MFB 1 3.4.2
lit

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3.3.3.13 LED indicators on SAB 1

Component side

LED (red) “Line break binary input“


LED (yellow) “Binary channel active”

LED (yellow) “Transistor output activated”


LED (yellow) “Relay K1 activated”
LED (yellow) “Relay K2 activated”
LED (yellow) “Relay K3 activated”

Fusible cutouts

Fig.120 : Fusible cutouts and LEDs on SAB 1

Fault description Possible cause Countermeasures See chap.


• I/O channels on SAB 1 ♦ PIM power supply (+24 V)  Check supply 3.4.1
out of order missing
• No LED lit although the ♦ Self-restoring fuse on  Switch off power supply –
appropriate channels are COB 1 or COB 3 tripped  Wait 30 seconds
activated  Switch on power supply
♦ COB 1 or COB 3 faulty  Replace PIM 3.4.4
♦ Mechanical fault in basic
module of PIM
♦ SAB 1 faulty  Replace SAB 1 3.4.2
• LED “Binary channel ♦ SAB 1 faulty  Replace SAB 1 3.4.2
active” not lit although the
appropriate binary input is
activated correctly
• LED “Line break binary ♦ External power supply for  Check supply –
in ut lit
input” switching contact missing
(applicable only when the ♦ Switching contact wiring  Check switching contact –
external switching contact faulty wiring
is bridged by a resistor ♦ Switching contact does  Check switching contact
(33 k)) not switch
♦ SAB 1 faulty  Replace SAB 1 3.4.2
>>

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Fault description Possible cause Countermeasures See chap.


>>
• Transistor output does not ♦ External power supply for  Check supply 3.4.1
switch although the transistor output (+24 V)
appropriate LED missing
“T
“Transistor
i output ♦ Self-restoring fuse on  Switch off power supply –
activated” is lit SAB 1 tripped  Wait 30 seconds
 Switch on power supply
♦ SAB 1 faulty  Replace SAB 1 3.4.2
• Signal to the make con- ♦ PIM power supply (+24 V)  Check supply 3.4.1
tacts of the relay (K2 or missing
K3) not switched through ♦ Fuse tripped:  Replace fuse 3.4.3
although the appropriate F4 for relay K2
LED “Relay activated” is F5 for relay K3
lit
♦ SAB 1 faulty  Replace SAB 1 3.4.2
• NO contact 1 of relay K1 ♦ PIM power supply (+24 V)  Check supply 3.4.1
or NO contact 2 of relay missing
K1 does not switch signal
through although the ♦ Fuse tripped:  Replace fuse 3.4.3
appropriate LED “Relay F2 for relay K1
activated” is lit (NO contact 1)
F3 for relay K1
(NO contact 2)
♦ SAB 1 faulty  Replace SAB 1 3.4.2

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3.4 Repair

Pay attention to the following points before commencing work on


electronic or electrical assemblies:
 The power supply must be switched off and locked out to
prevent unauthorized switching on.
CAUTION
 Check that all assemblies are de-energized.
 If assemblies must be operational to allow testing, the power
supply may be switched on providing that safety regulations
are strictly adhered to.

Avoid short-circuits when testing with the power supply


switched on!
Assemblies may otherwise be damaged or destroyed.
CAUTION

3.4.1 Power supply (+24 V)

The following may lead to faults and malfunctions in the power supply:
 The main circuit breaker in the power supply line must be in proper working
order and must be switched on.
Switch on or repair the main circuit breaker as necessary.
 The power supply must meet the technical requirements of the PIM/FIM. Refer
to chapter 1.1.5 (technical data of PIMs) and chapter 1.2.4 (technical data of
FIMs) for details.
 Cabling must be in perfect condition.
Check particularly for kinking/abrasion or other damage to cable insulation.
Repair cabling as necessary.
 Individual wires must be correctly applied to the screw terminals on the
PIMs/FIMs.
Tighten any loose screw terminals. Strip wire ends once more and crimp on
wire end ferrules if necessary.

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3.4.2 Replacing printed circuit boards

Never extract or insert the module cassette(s) when the power


supply is switched on!

CAUTION

1. Switch off the power supply.


2. Insert a screwdriver into the notch
1 2
(121/1) on the module cassette
(121/2) and turn it until the module
cassette is released.
3. Pull the module cassette (122/1) out of
the basic module (122/2).
4. Insert a screwdriver into the notch
(123/1) on the cover (123/2) and lever
open the cover.
Fig.121 : PIM: Releasing a module cassette
5. Push the printed circuit board(s)
(124/1) out of the module cassette
1
(124/3) by exerting gentle pressure on
the connectors (124/2).
6. Re-assemble in reverse order of steps
5. through 3. Ensure that the module
cassette is properly clipped into the
basic module.

Fig.122 : PIM: Extracting a module cassette

1 1

Fig.123 : PIM: Opening a module cassette Fig.124 : PIM: Extracting printed circuit boards

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3.4.3 Replacing fuses

Replace faulty fuses by ones of the same rating and tripping


characteristics only.
Printed circuit boards and connected electrical assemblies may
otherwise be damaged.
CAUTION

Note: The printed circuit boards listed in the table below incorporate replaceable
fusible cutouts. These fusible cutouts are all of the same type, rating (3.15 A)
and tripping characteristics.

Number of Arrangement of
Name
fusible cutouts fusible cutouts
BOB 1 5 See chap. 3.3.3.6 on p. 192
BOB 2 1 See chap. 3.3.3.7 on p. 193
BOB 3 1 See chap. 3.3.3.8 on p. 194
FCB 1 2 See chap. 3.3.3.10 on p.
196
MFB 1 See chap. 3.3.3.12 on p.
2
198
SAB 1 4 See chap. 3.3.3.13 on p. 199

Procedure:
1. Switch off the power supply.
2. Extract the module cassette with the affected printed circuit board from the
basic module (see chap. 3.4.2).
3. Pull the faulty fuse off the printed circuit board (use a pair of pointed pliers if
necessary).
4. Insert a new fuse into the printed circuit board.
5. Insert the printed circuit board into the module cassette and insert the module
cassette into the basic module (see chap. 3.4.2).

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3.4.4 Replacing a PIM

Never replace a PIM with the power supply switched on!


Never extract or insert the module cassette(s) with the power
supply switched on!
CAUTION

There are two methods of attaching the module:


 Rail mounting (see chap. 3.4.4.1)
 Screw mounting (see chap. 3.4.4.2)

Note: The examples below describe replacement of a type PIM 2 module. The proce-
dure is similar for replacing a type PIM 1 module.

3.4.4.1 Rail mounting


Dismounting the PIM
1. Switch off the power supply.
6 5 2. Make a note of the position and termi-
nal numbers of the connecting wires to
1 avoid confusion on reconnecting.
3. Undo the screw terminals and pull out
the wires.
4. Insert a screwdriver into the notches in
the retaining clips (125/2, 125/3 and
125/5) consecutively and lever the
2 retaining clips away from the rail until
disengaged.
5. When all retaining clips have been
3
released, the PIM (125/1) can be pul-
4 led off the rail (125/4).
6
Note:
Fig. 125 : PIM for rail mounting It is not necessary to undo the termi-
nator clips (125/6) on the rail (if fitted).

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Transferring module cassettes and


stickers
6. Extract the module cassettes (see
fig. 126) from the old PIM and insert in
the new PIM (see chap. 3.4.2).
7. Transfer the EEPROM from the COB
of the old PIM to the new PIM. Ensure
that the EEPROM is correctly
positioned (see fig. 127).
Note:
Fig. 126 : Module cassette Do not remove the sticker from the
serial EEPROM of the old PIM!
Mounting the PIM
8-pole socket for 8. Fit the new PIM (128/1) on the rail and
EEPROM press it on.
9. Push the retaining clips (128/2, 128/3
and 128/5) towards the rail until they
click into place.
Note:
Check that the new PIM is firmly
Pin 1 seated!
10. Connect up the wires and tighten the
screw terminals.
Note:
Fig. 127 : Slot for the EEPROM Ensure that connecting wires are cor-
rectly assigned to the respective termi-
nals! Connected assemblies may
otherwise fail or malfunction.
5

2
4
3

Fig. 128 : PIM for rail mounting

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3.4.4.2 Screw mounting

Dismounting the PIM


1. Switch off the power supply.
2. Make a note of the position and termi-
4 nal numbers of the connecting wires to
avoid confusion on reconnecting.
1 3. Undo the screw terminals and pull out
the wires.
4. Undo the fixing screws (129/2, 129/3
and 129/4) of the PIM and remove the
PIM (129/1).
Note:
It may prove necessary to undo or
2 counter any nuts used to secure the
3 screws.
Transferring module cassettes and
stickers
Fig. 129 : PIM for screw mounting
5. Extract the module cassettes (see
fig. 130) from the old PIM and insert in
the new PIM (see chap. 3.4.2).
6. Transfer the EEPROM from the COB
of the old PIM to the new PIM. Ensure
that the EEPROM is correctly
positioned (see fig. 127).
Note:
Do not remove the sticker from the
serial EEPROM of the old PIM!

Fig. 130 : Module cassette

Mounting the PIM


7. Align the new PIM (128/1) with the existing holes/threaded bores and secure
with the screws.
Note:
Check that the new PIM is firmly seated!
8. Connect up the wires and tighten the screw terminals.
Note:
Ensure that connecting wires are correctly assigned to the respective terminals!
Connected assemblies may otherwise fail or malfunction.

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3.5 Storage, packaging, transport

Store faulty assemblies which are to be repaired in a dry place and protect them against
the ingress of moisture after their removal.

Pack the assemblies in suitable shock-proof containers for transportation (foam in a box
etc.). Despatch (C)MOS components and assemblies incorporating (C)MOS components
in their original packaging.

Damage by electrostatic charging.


(C)MOS components and assemblies equipped with (C)MOS
components may be damaged by electrostatic charging.
Therefore:
CAUTION  Avoid contact of electronic components or assemblies with
non-conductive materials.
 For storing and transporting, electronic components or assem-
blies should be packed in conductive materials (e.g. antistatic
foil or conductive foam).

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Maintenance and repair
FRIEDRICHSHAFEN Page 209

Part 4

Maintenance and repair


(Specialist personnel)

Not applicable

4 Not applicable

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Part 5

Illustrated parts catalog

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Illustrated parts catalog
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5 Illustrated parts catalog

5.1 Introduction

This illustrated parts catalog forms the basis for spare parts orders.

The drawings and tables in the parts catalog are also useful when dismantling and
re-assembling individual assemblies. For this reason, the catalog also includes parts for
which no spare parts provision has been made.

This parts catalog consists of drawings and corresponding tables as well as a cross-
reference list.

Drawings and tables

The headers of the pages with drawings and tables contain the following information:
 CATALOG (parts catalog number)
 ILL. TABLE (four-figure drawing number)
 REG. NO. (six-figure registration number)
 GAPL (name of the corresponding group in German) and
EGC (name in the corresponding foreign language)
 PROJECT
 PAGE
 EDITION
 REFERENCE (superordinate parts list)

The contents of the headers on the drawing and table pages differ only in their page num-
bers (PAGE). All other information is identical.

The table title row contains the following information:


 C/N Location numbers provide a connection between the
components in the drawings and the parts numbers and
designations in the corresponding table.
The location numbers are sorted in a rising numerical
sequence.
 PART NO. The part number of the component to be used when
ordering spare parts

– 07.2001 – E 531 439 / 04 E


Part 5
Illustrated parts catalog
FRIEDRICHSHAFEN Page 213

 DESIGNATION This cell contains the exact parts name.


A part whose designation is indented to the right in this
column (indicated by preceding dots) is included in a
previous part (which is either not indented or is less
indented).
 Q/U Quantity in location. This number applies to the installation
location.
 U/M Unit of measurement for the named part
EA = Each KG = Kilogram MR = Meter
RL = Roll SE = Set

 FN Footnote with references for spare parts queries


The following footnotes may be used:
AB Only available as a complete assembly, repairs only possible in the
manufacturer’s plant
KE Individual part not intended for delivery as a spare part
KF Volume production part only available as a spare part with this part
number in uncalibrated condition. If this spare part is required ready-
calibrated for a specific application, such a part will be delivered under
a different part number. (Please refer to “Ordering spare parts” when
ordering a spare part marked with KF.)
NB As required

 SUPPLEM. DES./ This column contains standard part designations or


REMARKS manufacturer’s designations for bought-out parts.
 ILL.-REG. This column gives the cross-reference to a drawing if
this component is illustrated in its own drawing.
 ITEM For internal use only

Cross-reference list

The cross-reference list includes all part numbers contained in the spare parts catalog.
The part numbers are sorted in a rising numerical sequence in the part number column. In
addition, the DESIGNATION, ILL.-REG., ITEM, C/N and, in some cases, the STOCK NO.
and PART NO. NEW are listed for each part number.

Modification service

No modification service is provided to take account of conversions and modifications to


part numbers subsequent to the completion of the spare parts catalog. We therefore
recommend that you mark information about changes to part numbers in the spare parts
catalog. This information is included in the order confirmation and appears on spare parts
labels.

E 531 439 / 04 E – 07.2001 –


Part 5
Illustrated parts catalog
Page 214 FRIEDRICHSHAFEN

Ordering spare parts

The following information is required in order to process a spare parts order:


 Job number
 Engine type (see rating plate)
 Engine number (see rating plate)
 Part number
 Designation
 Production number and unit of measurement
 Device name (e. g. A 056)

The following additional information is required in an order for a calibrated part (marked by
“KF” in the “FN” column):

Either
 Add additional text “ /xxxxx” to the part number
(e. g.: 002 536 28 10/E1234; E1234 corresponds to the calibration number of
the device on the marking plate)

or
 Detailed description of the application location for the required spare part and
“/77” or “/78” after the part number (if the calibration number is not known)

Note: A calibrated spare part is delivered under a different part number!

The following additional information is needed when ordering a non-calibrated adjustable


part which should not be calibrated by the factory (marked by “KF” in the “FN” column):
 Add “/76” to the part number
(e. g.: 002 536 28 10/76)

To avoid errors, please confirm all telephone orders in writing.

Delivery of repaired parts

Parts sent to MTU Friedrichshafen for repair must be clearly marked with the MTU order
number and engine number.

– 07.2001 – E 531 439 / 04 E


EDITION: 10.2000 GAPL: 84 Überwachungseinrichtung CATALOG: E 531 439 / 04 ED
PAGE: 215 EGC: 84 Monitoring equipment ILL. TABLE: 84 01
FRIEDRICHSHAFEN
PROJECT: M045 REFERENCE: 069.700063/92 REG. NO.: E00241

5.2 Illustrations and tables


EDITION: 10.2000 GAPL: 84 Überwachungseinrichtung CATALOG: E 531 439 / 04 ED
PAGE: 216 EGC: 84 Monitoring equipment ILL. TABLE: 84 01
FRIEDRICHSHAFEN
PROJECT: M045 REFERENCE: 069.700063/92 REG. NO.: E00241

1 2 3

84 01
22 E00137

84 01
4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 23 E00080
15, 16, 17, 18, 19, 20, 21, 28, 29

84 01
24 E00089

84 01
25 E00079

27 01
26 E00171

27 01
27 E00158
EDITION: 03.99 GAPL: 84 Überwachungseinrichtung CATALOG: E531439/03ED
PAGE: 217 EGC: 84 Monitoring equipment ILL. TABLE: 84 01
FRIEDRICHSHAFEN PROJECT: M045 REFERENCE: 069.700063/92 REG. NO.: E00241

ORTZ SACHNUMMER BENENNUNG STO BZEH FN ZUSATZBEZ. / SUPPLEMENTARY DESIGNATION BILD–REG. POS.–NR.
C/N PART NO. DESIGNATION Q/U U/M FN BEMERKUNG / REMARKS ILL.–REG. ITEM

01 528 530 05 83 ZB FILTERMODUL 001 EA 840018


MODULAR SYSTEM
02 528 530 00 83 ZB MODUL MCS–5/PIM 1 001 EA KF 840020
MODULAR SYSTEM
03 528 530 01 83 ZB MODUL MCS–5/PIM 2 001 EA KF 840022
MODULAR SYSTEM
04 504 530 75 92 ZB STECKK. AIB 1–01 001 EA 840024
PLUG–IN BOARD
05 529 530 39 12 ZB STECKK. AIB 2–02 001 EA 840026
PLUG–IN BOARD
06 529 530 38 12 ZB STECKK. AIB 3–02 001 EA 840028
PLUG–IN BOARD
07 529 530 49 12 ZB STECKK. AIB 4–01 001 EA 840030
PLUG–IN BOARD
08 504 530 73 92 ZB STECKK. BIB 1–01 001 EA 840032
PLUG–IN BOARD
09 504 530 08 97 ZB STECKK. BIB 2–01 001 EA 840034
PLUG–IN BOARD
10 504 530 78 92 ZB STECKK. CCB 1–01 001 EA 840036
PLUG–IN BOARD
11 504 530 74 92 ZB STECKK. EGB 1–01 001 EA 840038
PLUG–IN BOARD
12 504 530 98 92 ZB STECKK. IIB 1–01 001 EA 840040
PLUG–IN BOARD
13 504 530 32 97 ZB STECKK. INB 1–01 001 EA 840042
PLUG–IN BOARD
14 504 530 54 97 ZB STECKK. INB 2–01 001 EA 840044
PLUG–IN BOARD
15 504 530 87 97 ZB STECKK. MPU 23–02 001 EA KF 840046
PLUG–IN BOARD
EDITION: 03.99 GAPL: 84 Überwachungseinrichtung CATALOG: E531439/03ED
PAGE: 218 EGC: 84 Monitoring equipment ILL. TABLE: 84 01
FRIEDRICHSHAFEN PROJECT: M045 REFERENCE: 069.700063/92 REG. NO.: E00241

Notizen / Notes
EDITION: 03.99 GAPL: 84 Überwachungseinrichtung CATALOG: E531439/03ED
PAGE: 219 EGC: 84 Monitoring equipment ILL. TABLE: 84 01
FRIEDRICHSHAFEN PROJECT: M045 REFERENCE: 069.700063/92 REG. NO.: E00241

ORTZ SACHNUMMER BENENNUNG STO BZEH FN ZUSATZBEZ. / SUPPLEMENTARY DESIGNATION BILD–REG. POS.–NR.
C/N PART NO. DESIGNATION Q/U U/M FN BEMERKUNG / REMARKS ILL.–REG. ITEM

16 5045308797/S0013 ZB STECKK.MPU 23–02 001 EA 840048


PLUG–IN BOARD
17 529 530 59 12 ZB STECKK. MOB 1–02 001 EA 840050
PLUG–IN BOARD
18 504 530 68 97 ZB STECKK. PAB 2–01 001 EA 840052
PLUG–IN BOARD
19 504 530 77 92 ZB STECKK. SCB 2–01 001 EA 840054
PLUG–IN BOARD
20 504 530 89 92 ZB STECKK. SCB 3–01 001 EA 840056
PLUG–IN BOARD
21 504 530 56 97 ZB STECKK. SCB 4–01 001 EA 840058
PLUG–IN BOARD
22 504 530 72 92 ZB STECKK. BOB 1–01 001 EA 84 01 840060
PLUG–IN BOARD E00137
23 504 530 05 97 ZB STECKK. BOB 2–01 001 EA 84 01 840062
PLUG–IN BOARD E00080
24 504 530 39 97 ZB STECKK. BOB 3–01 001 EA 84 01 840064
PLUG–IN BOARD E00089
25 504 530 58 97 ZB STECKK. FCB 1–01 001 EA 84 01 840066
PLUG–IN BOARD E00079
26 504 530 76 92 ZB STECKK. MFB 1–01 001 EA 27 01 840068
PLUG–IN BOARD E00171
27 529 530 47 12 ZB STECKK. SAB 1–01 001 EA 27 01 840070
PLUG–IN BOARD E00158
28 529 530 90 12 ZB STECKK. INB 3–01 001 EA 840072
PLUG–IN BOARD
29 529 530 91 12 ZB STECKK. MFB 2–01 001 EA 840074
PLUG–IN BOARD
EDITION: 10.2000 GAPL: 84 Überwachungseinrichtung CATALOG: E 531 439 / 04 ED
PAGE: 220 EGC: 84 Monitoring equipment ILL. TABLE: 84 01
FRIEDRICHSHAFEN
PROJECT: M045 REFERENCE: 504 530 72 92 REG. NO.: E00137

1
EDITION: 03.99 GAPL: 84 Überwachungseinrichtung CATALOG: E531439/03ED
PAGE: 221 EGC: 84 Monitoring equipment ILL. TABLE: 84 01
FRIEDRICHSHAFEN PROJECT: M045 REFERENCE: 504 530 72 92 REG. NO.: E00137

ORTZ SACHNUMMER BENENNUNG STO BZEH FN ZUSATZBEZ. / SUPPLEMENTARY DESIGNATION BILD–REG. POS.–NR.
C/N PART NO. DESIGNATION Q/U U/M FN BEMERKUNG / REMARKS ILL.–REG. ITEM

000 504 530 72 92 ZB STECKK. BOB 1–01 001 EA 840014


PLUG–IN BOARD
01 001 531 76 86 .SICHERUNG 3,15A/F 005 EA 840016
.FUSE
EDITION: 10.2000 GAPL: 84 Überwachungseinrichtung CATALOG: E 531 439 / 04 ED
PAGE: 222 EGC: 84 Monitoring equipment ILL. TABLE: 84 01
FRIEDRICHSHAFEN
PROJECT: M045 REFERENCE: 504 530 05 97 REG. NO.: E00080

1
EDITION: 03.99 GAPL: 84 Überwachungseinrichtung CATALOG: E531439/03ED
PAGE: 223 EGC: 84 Monitoring equipment ILL. TABLE: 84 01
FRIEDRICHSHAFEN PROJECT: M045 REFERENCE: 504 530 05 97 REG. NO.: E00080

ORTZ SACHNUMMER BENENNUNG STO BZEH FN ZUSATZBEZ. / SUPPLEMENTARY DESIGNATION BILD–REG. POS.–NR.
C/N PART NO. DESIGNATION Q/U U/M FN BEMERKUNG / REMARKS ILL.–REG. ITEM

000 504 530 05 97 ZB STECKK. BOB 2–01 001 EA 840006


PLUG–IN BOARD
01 001 531 76 86 .SICHERUNG 3,15A/F 001 EA 840008
.FUSE
EDITION: 10.2000 GAPL: 84 Überwachungseinrichtung CATALOG: E 531 439 / 04 ED
PAGE: 224 EGC: 84 Monitoring equipment ILL. TABLE: 84 01
FRIEDRICHSHAFEN
PROJECT: M045 REFERENCE: 504 530 39 97 REG. NO.: E00089

1
EDITION: 03.99 GAPL: 84 Überwachungseinrichtung CATALOG: E531439/03ED
PAGE: 225 EGC: 84 Monitoring equipment ILL. TABLE: 84 01
FRIEDRICHSHAFEN PROJECT: M045 REFERENCE: 504 530 39 97 REG. NO.: E00089

ORTZ SACHNUMMER BENENNUNG STO BZEH FN ZUSATZBEZ. / SUPPLEMENTARY DESIGNATION BILD–REG. POS.–NR.
C/N PART NO. DESIGNATION Q/U U/M FN BEMERKUNG / REMARKS ILL.–REG. ITEM

000 504 530 39 97 ZB STECKK. BOB 3–01 001 EA 840010


PLUG–IN BOARD
01 001 531 76 86 .SICHERUNG 3,15A/F 001 EA 840012
.FUSE
EDITION: 10.2000 GAPL: 84 Überwachungseinrichtung CATALOG: E 531 439 / 04 ED
PAGE: 226 EGC: 84 Monitoring equipment ILL. TABLE: 84 01
FRIEDRICHSHAFEN
PROJECT: M045 REFERENCE: 504 530 58 97 REG. NO.: E00079

1
EDITION: 03.99 GAPL: 84 Überwachungseinrichtung CATALOG: E531439/03ED
PAGE: 227 EGC: 84 Monitoring equipment ILL. TABLE: 84 01
FRIEDRICHSHAFEN PROJECT: M045 REFERENCE: 504 530 58 97 REG. NO.: E00079

ORTZ SACHNUMMER BENENNUNG STO BZEH FN ZUSATZBEZ. / SUPPLEMENTARY DESIGNATION BILD–REG. POS.–NR.
C/N PART NO. DESIGNATION Q/U U/M FN BEMERKUNG / REMARKS ILL.–REG. ITEM

000 504 530 58 97 ZB STECKK. FCB 1–01 001 EA 840002


PLUG–IN BOARD
01 001 531 76 86 .SICHERUNG 3,15A/F 002 EA 840004
.FUSE
EDITION: 10.2000 GAPL: 27 Zusätzliche Regel- und Steuergeräte CATALOG: E 531 439 / 04 ED
PAGE: 228 EGC: 27 Additional Controls ILL. TABLE: 27 01
FRIEDRICHSHAFEN
PROJECT: M045 REFERENCE: 504 530 76 92 REG. NO.: E00171

1
EDITION: 03.99 GAPL: 27 Zusätzliche Regel– und Steuergeräte CATALOG: E531439/03ED
PAGE: 229 EGC: 27 Additional controls ILL. TABLE: 27 01
FRIEDRICHSHAFEN PROJECT: M045 REFERENCE: 504 530 76 92 REG. NO.: E00171

ORTZ SACHNUMMER BENENNUNG STO BZEH FN ZUSATZBEZ. / SUPPLEMENTARY DESIGNATION BILD–REG. POS.–NR.
C/N PART NO. DESIGNATION Q/U U/M FN BEMERKUNG / REMARKS ILL.–REG. ITEM

000 504 530 76 92 ZB STECKK. MFB 1–01 001 EA 270006


PLUG–IN BOARD
01 001 531 76 86 .SICHERUNG 3,15A/F 002 EA 270008
.FUSE
EDITION: 10.2000 GAPL: 27 Zusätzliche Regel- und Steuergeräte CATALOG: E 531 439 / 04 ED
PAGE: 230 EGC: 27 Additional Controls ILL. TABLE: 27 01
FRIEDRICHSHAFEN
PROJECT: M045 REFERENCE: 529 530 47 12 REG. NO.: E00158

1
EDITION: 03.99 GAPL: 27 Zusätzliche Regel– und Steuergeräte CATALOG: E531439/03ED
PAGE: 231 EGC: 27 Additional controls ILL. TABLE: 27 01
FRIEDRICHSHAFEN PROJECT: M045 REFERENCE: 529 530 47 12 REG. NO.: E00158

ORTZ SACHNUMMER BENENNUNG STO BZEH FN ZUSATZBEZ. / SUPPLEMENTARY DESIGNATION BILD–REG. POS.–NR.
C/N PART NO. DESIGNATION Q/U U/M FN BEMERKUNG / REMARKS ILL.–REG. ITEM

000 529 530 47 12 ZB STECKK. SAB1–01 001 EA 270002


PLUG–IN BOARD
01 001 531 76 86 .SICHERUNG 3,15A/F 004 EA 270004
.FUSE
EDITION: 03.99 GAPL: 27 Zusätzliche Regel– und Steuergeräte CATALOG: E531439/03ED
PAGE: 232 EGC: 27 Additional controls ILL. TABLE: 27 01
FRIEDRICHSHAFEN PROJECT: M045 REFERENCE: 529 530 47 12 REG. NO.: E00158

Notizen / Notes
5.3 Cross-reference list
PROJECT: M045 CATALOG: E 531 439 / 04 ED
FRIEDRICHSHAFEN
EDITION: 10.2000 PAGE: 233

SACHNUMMER BENENNUNG BILDTAF. REG.NR. ORTZ VERSORGUNGSNR. SACHNR. NEU


PART NO. DESIGNATION ILL. TAB. REG.NO. C/N STOCK NO. PART NO. NEW
001 531 76 86 SICHERUNG 3,15A/F 84 01 E00079 01
FUSE 84 01 E00080 01
84 01 E00089 01
84 01 E00137 01
27 01 E00158 01
27 01 E00171 01
504 530 05 97 ZB STECKK. BOB 2–01 84 01 E00080 000
PLUG–IN BOARD 84 01 E00241 23
504 530 08 97 ZB STECKK. BIB 2–01 84 01 E00241 09
PLUG–IN BOARD
504 530 32 97 ZB STECKK. INB 1–01 84 01 E00241 13
PLUG–IN BOARD
504 530 39 97 ZB STECKK. BOB 3–01 84 01 E00089 000
PLUG–IN BOARD 84 01 E00241 24
504 530 54 97 ZB STECKK. INB 2–01 84 01 E00241 14
PLUG–IN BOARD
504 530 56 97 ZB STECKK. SCB 4–01 84 01 E00241 21
PLUG–IN BOARD
504 530 58 97 ZB STECKK. FCB 1–01 84 01 E00079 000
PLUG–IN BOARD 84 01 E00241 25
504 530 68 97 ZB STECKK. PAB 2–01 84 01 E00241 18
PLUG–IN BOARD
504 530 72 92 ZB STECKK. BOB 1–01 84 01 E00137 000
PLUG–IN BOARD 84 01 E00241 22
504 530 73 92 ZB STECKK. BIB 1–01 84 01 E00241 08
PLUG–IN BOARD
504 530 74 92 ZB STECKK. EGB 1–01 84 01 E00241 11
PLUG–IN BOARD
504 530 75 92 ZB STECKK. AIB 1–01 84 01 E00241 04
PLUG–IN BOARD
504 530 76 92 ZB STECKK. MFB 1–01 27 01 E00171 000
PLUG–IN BOARD 84 01 E00241 26
504 530 77 92 ZB STECKK. SCB 2–01 84 01 E00241 19
PLUG–IN BOARD
504 530 78 92 ZB STECKK. CCB 1–01 84 01 E00241 10
PLUG–IN BOARD
504 530 87 97 ZB STECKK. MPU 23–02 84 01 E00241 15
PLUG–IN BOARD
5045308797/S0013 ZB STECKK.MPU 23–02 84 01 E00241 16
PLUG–IN BOARD
504 530 89 92 ZB STECKK. SCB 3–01 84 01 E00241 20
PLUG–IN BOARD
504 530 98 92 ZB STECKK. IIB 1–01 84 01 E00241 12
PLUG–IN BOARD
528 530 00 83 ZB MODUL MCS–5/PIM 1 84 01 E00241 02
MODULAR SYSTEM
528 530 01 83 ZB MODUL MCS–5/PIM 2 84 01 E00241 03
MODULAR SYSTEM
528 530 05 83 ZB FILTERMODUL 84 01 E00241 01
MODULAR SYSTEM
Cross-reference list
PROJECT: M045 CATALOG: E 531 439 / 04 ED
FRIEDRICHSHAFEN
EDITION: 10.2000 PAGE: 234

SACHNUMMER BENENNUNG BILDTAF. REG.NR. ORTZ VERSORGUNGSNR. SACHNR. NEU


PART NO. DESIGNATION ILL. TAB. REG.NO. C/N STOCK NO. PART NO. NEW
529 530 38 12 ZB STECKK. AIB 3–02 84 01 E00241 06
PLUG–IN BOARD
529 530 39 12 ZB STECKK. AIB 2–02 84 01 E00241 05
PLUG–IN BOARD
529 530 47 12 ZB STECKK. SAB1–01 27 01 E00158 000
PLUG–IN BOARD 84 01 E00241 27
529 530 49 12 ZB STECKK. AIB 4–01 84 01 E00241 07
PLUG–IN BOARD
529 530 59 12 ZB STECKK. MOB 1–02 84 01 E00241 17
PLUG–IN BOARD
529 530 90 12 ZB STECKK. INB 3–01 84 01 E00241 28
PLUG–IN BOARD
529 530 91 12 ZB STECKK. MFB 2–01 84 01 E00241 29
PLUG–IN BOARD
Das Handbuch ist zur Vermeidung von Störungen oder Schäden beim Betrieb zu beachten und daher vom Betreiber dem jeweiligen
Wartungs- und Bedienungspersonal zur Verfügung zu stellen. Außerhalb dieses Verwendungszwecks darf das Handbuch ohne unsere
vorherige Zustimmung nicht benutzt, vervielfältigt oder Dritten sonstwie zugänglich gemacht werden.
Änderungen bleiben vorbehalten.

This handbook is provided for use by maintenance and operating personnel in order to avoid malfunctions or damage during operation.
Other than for this purpose, the handbook shall not be reproduced, used or disclosed to others without our prior consent.
Subject to alterations and amendments.

Le manuel devra être observé en vue d’éviter des incidents ou des endommagements pendant le service. Aussi recommandons-nous à
l’exploitant de le mettre à la disposition du personnel chargé de l’entretien et de la conduite. En dehors de cet usage, le manuel ne pourra
être utilisé ni reproduit ou rendu accessible de quelque autre manière à des tiers, sans notre consentement préalable.
Nous nous réservons le droit d’entreprendre toute modification.

El Manual debe tenerse presente para evitar anomalias o daños durante el servicio, y, por dicho motivo, el usuario debe ponerlo a
disposición del personal de mantenimiento y de servicio. Fuera de este fin de aplicación, el Manual no se debe utilizar, copiar ni poner
en manos de terceros, sin nuestro consentimiento previo.
Nos reservamos el derecho de introducir modificaciones.

No sentido de evitar falhas ou danos durante o servicio, o usuário deberá cuidar de que o Manual esteja sempre à disposição do pessoal
encarregado com a manutenção e operação. Além desta sua finalidade, o Manual não deverá, sob qualquer pretexto, ser reproduzido
parcial ou totalmente ou franqueado a terceiros sem prévia e expressa autorização de nossa parte.
Reservamo-nos o direito de proceder modificações.

Il manuale va consultato per evitare anomalie o guasti durante il servizio, per cui va messo a disposizione dall’ utente al personale addetto
alla manutenzione e alla condotta. Senza nostra approvazione preventiva non è ammesso impiegare il manuale per scopi diversi, riprodurlo
o metterlo a disposizione di terzi.
Con riserva di modifiche.

Käyttöhäiriöiden ja teknisten vaurioiden välttämiseksi on noudatettava käsikirjassa annettuja ohjeita, joten kirja on luovutettava huoltoja
käyttöhenkilökunnan käyttöön. Käsikirjaa ei saa ilman sen laatijan lupaa käyttää muuhun tarkoitukseen, monistaa tai luovuttaa
ulkopuolisille.
Oikeudet muutoksiin pidätetään.
 2001
MTU Motoren- und Turbinen-Union Friedrichshafen GmbH
88040 Friedrichshafen / Germany
Phone (0 75 41) 90 - 0 Telex 7 34 280 – 50 mt d Telefax (0 75 41) 90 - 61 23

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