République Algérienne Démocratique & Populaire Ministère

de l'Enseignement Supérieur & de la Recherche Scientifique

Université des sciences et de la technologie d’Alger

DIP
SOLDERING

Realized by :MIOURIGH DAOUD

1ière Année Master 2MI 2019/2020

Solder process
In an optimized process the metals to be joined are heated up with the soldering iron.
The improved hollow solder with a flux core is applied to the point of contact. The
melting point of the solder is around 180°C to 200°C. Resin and colophony are used as
flux in these cored solders. The purpose of the flux is to dissolve oxides and to prevent
further oxidization during the solder process.

manual soldering iron

solder roll

PCB solder tip

module

heat sink

manual soldering

There are different solder processes used in industry.

- Radiation soldering with the use of infrared heaters
-Convection soldering using hot gas
-Condensation soldering in a steam phase
These three concepts are melting processes and are referred to as reflow soldering.
To reflow solder the solder mixed with flux is applied to the points of connection. Once
the melting temperature of the solder used is exceeded, the connection points are
wetted with the aid of the flux

SOLDERING
Soldering is the process of joining two or more metals together at a temperature lower
than the melting points of the metals. In its molten state, solder chemically dissolves
part of the metal surfaces to be joined. However, most metals exposed to the
atmosphere acquire a thin film of tarnish or oxide , the longer the exposure the thicker
the film will become. This film is present even though it is not visible, and solder alone
cannot dissolve it. A soldering flux with a melting point lower than the solder must be
used to “wet” the metal and allow the solder to penetrate it and remove the film. The
flux melts first, removing the tarnish or metallic oxide, and also preventing further oxide
from forming while the metal is being heated to soldering temperature. The solder then
melts, floating the lighter flux and the impurities suspended in it to the outer surface and
edges of the molten fillet. The solder cools and forms an alloy with the metal. Most of
the flux is burned away during the soldering process , any residue is removed by
appropriate cleaning methods.
The soldering methods used for general aircraft wiring are essentially the same for both
production soldering and repair work. For printed circuit assemblies, production
methods and repair methods are different. In production, a dip soldering method is
used, where several connections are made at the same time. Soldering repairs, however,
are made individually, using techniques similar to those used for soldering general wiring
- with special precautions to prevent thermal damage to the heat-sensitive, closely
packed circuit elements.
Soft Solder
Soft solder is an alloy consisting of various combinations of tin and lead, with silver and
other additives, which melts at temperatures below 370ºC. It may be in bar form to be
melted for tinning or in the form of rosin cored wire for use with a soldering iron
Hard Solder
Hard solders should not be confused with high temperature soft solders. Hard solder is a
silver alloy and is used when greater mechanical strength or exposure to higher
temperatures, such as thermocouple connections, is required. When silver soldering
electrical equipment or fittings, use, Brazing Alloy-Silver which is a cadmium free, flux
coated brazing rod qualified to Federal Specification QQ-B-654.

Flux
The purpose of flux is to facilitate the soldering process. One of the obstacles to a
successful solder joint is an impurity at the site of the joint, for example, dirt, oil
or oxidation. The impurities can be removed by mechanical cleaning or by chemical
means, but the elevated temperatures required to melt the filler metal (the solder)
encourages the work piece (and the solder) to re-oxidize. This effect is accelerated as the
soldering temperatures increase and can completely prevent the solder from joining to
the workpiece. One of the earliest forms of flux was charcoal, which acts as a reducing
agent and helps prevent oxidation during the soldering process. Some fluxes go beyond
the simple prevention of oxidation and also provide some form of chemical cleaning
(corrosion). Many fluxes also act as a wetting agent in the soldering process, reducing
the surface tension of the molten solder and causing it to flow and wet the workpieces
more easily.
For many years, the most common type of flux used in electronics (soft soldering)
was rosin-based, using the rosin from selected pine trees. It was nearly ideal in that it was
non-corrosive and non-conductive at normal temperatures but became mildly reactive
(corrosive) at elevated soldering temperatures. Plumbing and automotive applications,
among others, typically use an acid-based (hydrochloric acid) flux which provides rather
aggressive cleaning of the joint. These fluxes cannot be used in electronics because their
residues are conductive leading to unintended electrical connections, and because they
will eventually dissolve small diameter wires. Citric acid is an excellent water-soluble acid-
type flux for copper and electronics [ but must be washed off afterwards.
Fluxes for soft solder are currently available in three basic formulations:
Water-soluble fluxes – higher activity fluxes which can be removed with water after
soldering (no VOCs required for removal).
No-clean fluxes – mild enough to not "require" removal due to their non-conductive and
non-corrosive residues. These fluxes are called "no-clean" because the residue left after
the solder operation is non-conductive and won't cause electrical shorts; nevertheless
they leave a plainly visible white residue that resembles diluted bird-droppings. No-clean
flux residue is acceptable on all 3 classes of PCBs as defined by IPC-610 provided it does
not inhibit visual inspection, access to test points, or have a wet, tacky or excessive
residue that may spread onto other areas. Connector mating surfaces must also be free of
flux residue. Fingerprints in no-clean residue are a class 3 defect
Traditional rosin fluxes – available in non-activated (R), mildly activated (RMA) and
activated (RA) formulations. RA and RMA fluxes contain rosin combined with an activating
agent, typically an acid, which increases the wettability of metals to which it is applied by
removing existing oxides. The residue resulting from the use of RA flux is corrosive and
must be cleaned. RMA flux is formulated to result in a residue which is less corrosive, so
that cleaning becomes optional,
though usually preferred. R flux is still
less active and even less corrosive.
Flux performance must be carefully
evaluated for best results; a very mild
'no-clean' flux might be perfectly
acceptable for production equipment,
but not give adequate performance for
more variable hand-soldering
operations

Electronic components ) board(

Currently, mass-production printed circuit boards (PCBs) are mostly 
wave soldered or reflow soldered, or dip soldring though hand soldering of production
electronics is also still widely used.
In wave soldering, components are prepped (trimmed or modified) and installed on the
PCB. Sometimes, to prevent movement they are temporarily kept in place with small dabs
of adhesive or secured with a fixture, then the assembly is passed over flowing solder in a
bulk container. This solder flow is forced to produce a standing wave so the whole PCB is
not submerged in solder, but rather just touched. The end result is that solder stays on
pins and pads, but not on the PCB itself.
Reflow soldering is a process in which a solder paste (a mixture of prealloyed solder
powder and a flux-vehicle that has a peanut butter-like consistency) is used to stick the
components to their attachment pads, after which the assembly is heated by an infrared
lamp, a hot air pencil, or, more commonly, by passing it through a carefully controlled
oven.
Since different components can be best assembled by different techniques, it is common
to use two or more processes for a given PCB. For example, surface mounted parts may
be reflow soldered first, with a wave soldering process for the through-hole mounted
components coming next, and bulkier parts hand-soldered last.
Dip soldering
Dip soldering is a manufacturing process where a technician dips objects into a bath of
molten solder to fix parts together. The most common application of this technique is in
the production of circuit boards, where it can be a fast and efficient method. The heat of
the solder can potentially damage parts of the project, and the technician has to make
sure all the components can take the heat before dipping; usually the project is all metal
to avoid this problem

With circuit board production, the solder will stick to the exposed mental components
and will not adhere to areas without metal or areas treated with a chemical to resist
solder. Dip soldering may be a hand operation, with a technician personally dipping the
product, and it is also possible to partially automate it. A machine can grip the circuit
board, dip it at the right angle, and keep it in the solder for the correct period of time
before pulling it out.
The dip soldering process is similar to wave soldering, a mass production process people
use to make chips. With wave soldering, it is all automated, and the chips pass under a
steady flow of melted solder material, rather than being dipped. This process costs more
money to implement and allows people to produce more projects per day, making it
suitable for large scale facilities where people need to cut down on manufacturing time.
For small-scale soldering, dip soldering can be a useful technique. People do not need
very much equipment to set it up, simply a container large enough to dip projects, with
appropriate tools for melting the solder so it will be usable. Many companies
manufacture the necessary supplies, and people can also make their own. For automated
setups, slightly larger investments are needed to purchase a machine capable of handling
the process.
People may learn this and other techniques on the job or while in a training program to
prepare for a professional career. There are a number of types of solder available, and
the technician has to be able to choose the correct mixture and make other decisions
during the process to make sure the final product will perform properly. People usually
inspect the project after dip soldering to see if any manual adjustments are necessary,
such as cleaning excess solder off a contact or discarding an item with damage like
pockmarks or distortions from the soldering process.
Dip soldering is accomplished by submerging parts to be joined into a molten solder bath.
Thus, all components surfaces are coated with filler metal. Solders have low surface
tension and high wetting capability. There are many types of solders, each used for
different applications:
- Lead–silver is used for strength at higher-than-room temperature.
- Tin–lead is used as a general-purpose solder
- Tin–zinc is used for aluminium
- Cadmium–silver is used for strength at high temperatures
- Zinc–aluminium is used for aluminium and corrosion resistance
- Tin–silver and tin–bismuth are used for electronics.
Because of the toxicity of lead, lead-free solders are being developed and more widely
used. The molten bath can be any suitable filler metal, but the selection is usually
confined to the lower melting point elements. The most common dip soldering
operations use zinc-aluminum and tin-lead solders.
- Solder pot metal: cast iron or steel, electrically heated.
- Bath temperature: 220 to 260 °C (for binary tin-lead alloys) or 350 to
400 °C (for lead-free alloys)
- Solder composition: 60% Sn, 40% Pb or eutectic allo
Resistance Soldering
Resistance soldering is frequently used in large volume production where the operation is
standardised. In this method, a low voltage transformer is used and the metal to be
soldered is heated by the resistance to a flow of electric current. The work is gripped
between two electrodes, completing the circuit and heating the metal for soldering. In
another application, a carbon pencil is used as one electrode and the metal to be
soldered forms the other electrode. When contact is established through the carbon
pencil, intense heat is generated at the point of contact. Resistance soldering is well
adapted to the soldering of small parts or for congested assemblies where it is desired to
restrict heat to a small part of the assembly.

Soldering Iron Maintenance

Prior to use, remove the tip from the iron and clean out the black scale from the inside of
the iron and from the tip with fine steel wool. When the iron or tip is new, coat the inside
of the shank with dry flake graphite or anti-seize material to prevent freezing, and to
ensure maximum heat transfer. When replacing the tip, make sure it is inserted to the full
depth of the casing and seated firmly against the heating element.
During use and just before each application, pass the soldering iron tip (with a rotary
motion) through the folds of a damp cleaning sponge or wipe on a wiping pad. This will
remove the surface dross and excess solder from the working surface.
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