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2A, 1MHz/2MHz
Synchronous Step-Up
DC/DC Converters
FEATURES DESCRIPTION
n Delivers 3.3V at 900mA From 2 Alkaline/NiMH Cells The LTC®3539/LTC3539-2 are synchronous, 2A step-up
n Delivers 5V at 900mA From a Lithium-Polymer DC/DC converters with output disconnect. Synchronous
Battery rectification enables high efficiency in the low profile
n V Start-Up Voltage: 700mV 2mm × 3mm DFN package. Battery life is extended with
IN
n 1.5V to 5.25V V
OUT Range a 700mV start-up voltage and operation down to 500mV
n Up to 94% Efficiency once started.
n V > V
IN OUT Operation A switching frequency of 1MHz (LTC3539) or 2MHz
n ±1.5% Feedback Voltage Tolerance
n 1MHz (LTC3539) or 2MHz (LTC3539-2) Fixed
(LTC3539-2) minimizes solution footprint by allowing the
use of tiny, low profile inductors and ceramic capacitors.
Frequency Operation
n Output Disconnect
The current mode PWM design is internally compensated,
n Selectable Burst Mode® or PWM Operation
reducing external parts count. The LTC3539/LTC3539-2
n 10µA Quiescent Current
feature a pin-enabled automatic Burst Mode operation at
n Logic Controlled Shutdown: <1µA
light load conditions. Anti-ring circuitry reduces EMI by
n Requires Only 6 External Components
damping the inductor in discontinuous mode. Additional
n Low Profile (2mm × 3mm × 0.75mm) DFN Package
features include a low shutdown current of under 1µA and
thermal overload protection.
APPLICATIONS The LTC3539/LTC3539-2 are offered in a 2mm × 3mm ×
n Medical Instruments 0.75mm DFN package.
n Portable Bar Code Scanners L, LT, LTC, LTM and Burst Mode are registered trademarks and ThinSOT is a trademark of
Linear Technology Corporation. All other trademarks are the property of their respective owners.
n Noise Canceling Headphones
n Portable GPS Navigation
n Handheld PCs
TYPICAL APPLICATION
Wide VIN, High Power 3.3V Regulator Efficiency and Power Loss vs Load Current
100 1000
4.7µH
VIN 90
1.8V TO 3.6V 2.2µF EFFICIENCY
80
100
VIN SW 70
POWER LOSS (mW)
EFFICIENCY (%)
LTC3539 60
VOUT V = 2.4V
PWM BURST MODE VOUT 50 VIN = 3.3V 10
3.3V OUT
1M 33pF 600mA 40 POWER LOSS
OFF ON SHDN FB 30
22µF 1
×2 20
GND PGND 562k
10 FREQUENCY = 1MHz
FREQUENCY = 2MHz
3539 TA01a 0 0.1
0.1 1 10 100 1000
ILOAD AVERAGE (mA) 3539 TA01b
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ORDER INFORMATION
LEAD FREE FINISH TAPE AND REEL PART MARKING PACKAGE DESCRIPTION TEMPERATURE RANGE
LTC3539EDCB#PBF LTC3539EDCB#TRPBF LDCS 8-Lead (2mm × 3mm) Plastic DFN –40°C to 85°C
LTC3539EDCB-2#PBF LTC3539EDCB-2#TRPBF LDPH 8-Lead (2mm × 3mm) Plastic DFN –40°C to 85°C
Consult LTC Marketing for parts specified with wider operating temperature ranges.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
ELECTRICAL
CHARACTERISTICS The l denotes the specifications which apply over the specified
temperature range of –40°C to 85°C, otherwise specifications are at TA = 25°C. VIN = 1.2V, VOUT = 3.3V, unless otherwise noted.
PARAMETER CONDITIONS MIN TYP MAX UNITS
Input Voltage Range After Start-Up 0.5 5 V
Minimum Start-Up Voltage ILOAD = 1mA, VOUT = 0V 0.7 0.88 V
Output Voltage Adjust Range l 1.5 5.25 V
Feedback Voltage l 1.182 1.200 1.218 V
Feedback Input Current VFB = 1.2V 1 50 nA
Quiescent Current - Shutdown VSHDN = 0V, Not Including Switch Leakage, VOUT = 0V 0.01 1 µA
Quiescent Current - Active Measured on VOUT, Non-Switching 300 500 µA
Quiescent Current - Burst Measured on VOUT, FB > 1.230V 10 18 µA
N-Channel MOSFET Switch Leakage Current VSW = 5V 0.1 10 µA
P-Channel MOSFET Switch Leakage Current VSW = 5V, VOUT = 0V 0.1 20 µA
N-Channel MOSFET Switch On Resistance VOUT = 3.3V 0.09 Ω
P-Channel MOSFET Switch On Resistance VOUT = 3.3V 0.125 Ω
N-Channel MOSFET Current Limit l 2 2.6 A
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Note 1: Stresses beyond those listed under Absolute Maximum Ratings Note 4: Current measurements are made when the output is not switching.
may cause permanent damage to the device. Exposure to any Absolute Note 5: This IC includes overtemperature protection that is intended
Maximum Rating condition for extended periods may affect device to protect the device during momentary overload conditions. Junction
reliability and lifetime. temperature will exceed 125°C when overtemperature protection is active.
Note 2: The LTC3539E/LTC3539E-2 is guaranteed to meet performance Continuous operation above the specified maximum operating junction
specifications from 0°C to 85°C. Specifications over –40°C to 85°C temperature may result in device degradation or failure.
operating temperature range are assured by design, characterization and Note 6: Failure to solder the exposed backside of the package to the PC
correlation with statistical process controls. board ground plane will result in a thermal resistance much higher than
Note 3: Specification is guaranteed by design and not 100% tested in 64°C/W.
production.
80 100 80
EFFICIENCY 100
70 70 EFFICIENCY
POWER LOSS (mW)
POWER LOSS (mW)
EFFICIENCY (%)
EFFICIENCY (%)
60 10 60
50 50 10
POWER LOSS
40 1 40
POWER LOSS
30 30
1
20 0.1 20
VIN = 1V VIN = 1.2V
10 VIN = 1.2V 10 VIN = 1.8V
VIN = 1.5V VIN = 3V
0 0.01 0 0.1
0.1 1 10 100 1000 0.1 1 10 100 1000
LOAD CURRENT (mA) LOAD CURRENT (mA)
3539 G01 3539 G02
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60 120 1200
IOUT (mA)
50 10 100 1000
40 POWER LOSS 80 800
30 60 600
1 VOUT = 1.8V
20 40 400 VOUT = 2.5V
VIN = 2.4V
10 VIN = 3.6V 20 200 VOUT = 3.3V
VIN = 4.2V VOUT = 5V
0 0.1 0 0
0.1 1 10 100 1000 0 1 2 3 4 5 0.7 1.1 1.5 1.9 2.3 2.7 3.1 3.5 3.9 4.3 4.7 5.1
LOAD CURRENT (mA) VIN (V) VIN (V)
3539 G03 3539 G04 3539 G05
Minimum Load Resistance During Burst Mode Threshold Current Burst Mode Threshold Current
Start-Up vs VIN vs VIN; VOUT = 1.8V vs VIN; VOUT = 2.5V
10000 50 50
VOUT = 3.3V COUT = 44µF fSW = 1MHz COUT = 44µF
45 45
40 40
1000
LOAD RESISTANCE (Ω)
35 35
LOAD CURRENT (mA)
50 1.05
80
70
LOAD CURRENT (mA)
LOAD CURRENT (mA)
40 1.00
LEAVE BURST 60 fSW = 1MHz
30 50 0.95
fSW = 1MHz fSW = 2MHz LEAVE BURST
40
20 0.90
30
ENTER BURST
20 fSW = 2MHz
10 0.85
10 ENTER BURST
0 0 0.80
0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 2.5 2.7 0.7 1.1 1.5 1.9 2.3 2.7 3.1 3.5 3.9 4.3 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
VIN (V) VIN (V) VOUT (V)
3539 G07c 3539 G07d 3539 G08
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0 0.7 –1.00
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 –50 –30 –10 10 30 50 70 90 –60 –40 –20 0 20 40 60 80 100
VOUT (V) TEMPERATURE (°C) TEMPERATURE (°C)
3539 G09 3539 G10 3539 G11
Start-Up Voltage vs Temperature Fixed Frequency SW and IL(AC) Burst Mode SW and IL(AC)
0.80
SW PIN SW PIN
0.75 2V/DIV 5V/DIV
1mA LOAD VOUT VOUT
0.70 20mV/DIV 20mV/DIV
AC-COUPLED AC-COUPLED
VIN (V)
INDUCTOR INDUCTOR
0.65
CURRENT CURRENT
NO LOAD 500mA/DIV 3539 G13 200mA/DIV 3539 G14
500ns/DIV 5µs/DIV
0.60
VIN = 2.4V VIN = 3.3V
VOUT = 3.3V AT 400mA VOUT = 5V
0.55 COUT = 22µF COUT = 22µF
0.50
–50 –25 0 25 50 75 100
TEMPERATURE (°C)
3539 G12
VOUT VOUT
50mV/DIV 50mV/DIV
AC-COUPLED AC-COUPLED
LOAD LOAD
CURRENT CURRENT
200mA/DIV 200mA/DIV
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BLOCK DIAGRAM
VIN
1 4
VOUT SW VIN
VSEL
WELL
VBEST
VB SWITCH
8 VOUT
VOUT
R2
GATE DRIVERS
AND
ANTI-CROSS 6
–
CONDUCTION IZERO FB
OFF ON 5 SHUTDOWN SHUTDOWN
COMPARATOR R1
SHDN
IPK
COMPARATOR
Σ
VREF VREF
– SLOPE +
VREF
UVLO IPK COMPARATOR
UVLO
+ – FB
START-UP IZERO
LOGIC AND ERROR
BURST MODE AMPLIFIER/SLEEP
1MHz/2MHz CLK COMPARATOR
CONTROL
OSC
BURST
PWM BURST 7 CLAMP
MODE THERMAL TSD WAKE
SHUTDOWN
SOFT-START
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2.2µH
VIN
1V TO 1.6V 2.2µF
VIN SW
LTC3539
VOUT
PWM BURST MODE VOUT
1.8V
1M 33pF 500mA
1 Cell to 3.3V
2.2µH
VIN
0.9V TO 1.6V 2.2µF
VIN SW
LTC3539
VOUT
PWM BURST MODE VOUT
3.3V
1M 33pF 350mA
3539 TA03
Li-Ion Cell to 5V
2.2µH
VIN
3V TO 4.5V 2.2µF
VIN SW
LTC3539-2
VOUT
PWM BURST MODE VOUT
5V
1M 33pF 750mA
3539 TA04
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DCB Package
8-Lead Plastic DFN (2mm × 3mm)
(Reference LTC DWG # 05-08-1718 Rev A)
0.70 ±0.05
PACKAGE
OUTLINE
0.25 ±0.05
0.45 BSC
1.35 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
1.35 ±0.10
4 1
0.23 ±0.05
0.200 REF 0.75 ±0.05 0.45 BSC
1.35 REF
BOTTOM VIEW—EXPOSED PAD
0.00 – 0.05
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
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