Study & Evaluation Scheme

of

Master of Technology
(Electronics)
[Applicable w.e.f. Academic Session 2010-11 till revised]

TEERTHANKER MAHAVEER UNIVERSITY

N.H.-24, Delhi Road, Moradabad, Uttar Pradesh-244001
Website: www.tmu.ac.in
 TEERTHANKER MAHAVEER UNIVERSITY
(Es
(Estab
tablish
lished
ed under
der Govt. of U. P. Act No. 30,
30, 200
2008)
Delhi Road, Bagarpur, Moradabad (U.P)

Study & Evaluation Scheme

Master of Technology
SUMMARY
Programme : M.Tech. ( Electronics)
Duration : Two year full time (Four Semesters)
Medium : English
Minimum Required Attendance : 75 percent
Credit :
:
Maximum Credit 114
:
Minimum credit required for the degree : 108
Internal External Total
Assessment :
25% 75% 100%
Class Class Assignment(s) Other Total
Test Test Activity
I II (including
Internal Evaluation (Theory Papers)
attendance)
7.5 7.5 5 5 25
Marks Marks Marks Marks Marks

Evaluation of Practical/Dissertations & : Internal External Total

Project Reports 50% 50% 100%
External Internal
Duration of Examination :
3 hrs. 1 ½ hrs
To qualify the course a student is required to secure a minimum of 40 % marks in aggregate including the
semester end examination and teachers continuous evaluation.(i.e. both internal and external).
A candidate who secures less than of 40% of marks in a course shall be deemed to have failed in that
course. The student should have at least 50% marks in aggregate to clear the semester. In case a student
has more than 40% in each course, but less than 50% overall in a semester , he/she shall re-appear in
courses where the marks are less than 50% to achieve the required aggregate percentage of 50% in the
semester.
Question Paper Structure
1. The question paper shall consist of eight questions. Out of which first question shall be of short
answer type (not exceeding 50 words) and will be compulsory. Question No. 1 shall contain 8 parts
representing all units of the syllabus and students shall have to answer any five (weight age 3
marks each).
2. Out of the rest seven questions, student shall be required to attempt any five questions. There will be
minimum one and maximum two questions from each unit of the syllabus. The weight age of Question
No. 2 to 8 shall be 12 marks each.
 Study & Evaluation Scheme
Programme: M.Tech. (Electronics)
Semester 1

S. Course Subject Periods Credit Evaluation Scheme

No. Code L T P Internal External Total
1 MEC101 MOS Circuit Design 3 2 - 4 25 75 100

2 MEC102 VLSI Technology 3 2 - 4 25 75 100

3 MEC103 Digital Systems Design 3 2 - 4 25 75 100

4 MEC104 Solid State Device Mod-ling 3 2 - 4 25 75 100

and Simulation
5 MEC105 Digital Signal Processing 3 2 - 4 25 75 100
and Applications
6 MEC151 Lab ( HDL tools) - - 4 2 50 50 100

7 MEC152 Matlab (Lab) - - 4 2 50 50 100

8 MEC153 Seminar - - 4 2 50 50 100

9 MEC171 Discipline & General - - - 2 100 - 100

Proficiency
Total 15 10 12 28 375 525 900

Semester 2

S. Course Subject Periods Credit Evaluation Scheme

No. Code L T P Internal External Total
1 MEC201 Digital Systems Testing 3 2 - 4 25 75 100
and Simulation with VHDL

2 MEC202 High Speed Analog 3 2 - 4 25 75 100

Design Techniques
3 MEC203 Optimization with Numerical 3 2 - 4 25 75 100
Techniques
4 Elective 1 -Select any one
MEC204 CMOS RF Circuit Design 3 2 - 4 25 75 100

MEC205 Design of Semiconductor

Memories
5 Elective 2 -Select any one
MEC206 Analog and low power digital 3 2 - 4 25 75 100
VLSI design

MEC207 Microcontroller and

Applications

6 MEC251 EDA-1 (Lab) - - 4 2 50 50 100

7 MEC252 EDA-2 (Lab) - - 4 2 50 50 100

8 MEC253 Seminar - - 4 2 50 50 100

9 MEC271 Discipline &General - - 2 100 - 100

Proficiency
Total 15 10 12 28 375 525 900

Semester 3

S. Course Subject Periods Credit Evaluation Scheme

No. Code L T P Internal External Total

1 MEC301 Advance Optical 3 2 - 4 25 75 100

Communication
2 MEC302 Nano-Electronics 3 2 - 4 25 75 100

3 MEC303 Minor Project 3 2 - 4 25 75 100

4 Elective 3 (Select any one)
MEC304 FPGA/CPLD Based Systems
3 2 - 4 25 75 100

MEC305 Computer Aids for VLSI

Design

5 Elective 4 (Select any one)

MEC306 MEMS and IC Integration
3 2 - 4 25 75 100
MEC307 Compound Semiconductor
Material and Devices

6 MEC351 Microcontroller (Lab) - - 4 2 50 50 100

7 MEC352 Seminar - - 4 2 50 50 100

8 MEC371 Discipline & General - - - 2 100 - 100
Proficiency
Total 15 10 8 26 325 475 800

Semester 4

S. Subject Subject Periods Credits Evaluation Scheme

No. Code L T P Internal External Total
1 MEC401 Dissertation/Thesis - - - 30 100 100 200
2 MEC471 Discipline & General Proficiency - - - 2 100 - 100
Total - - - 32 200 100 300

Note:
L – Lecture T- Tutorial P- Practical C-Credits
1L = 1Hr 1T= 1Hr 1P= 1Hr 1C = 1Hr of Theory Paper
=2 Hrs of Practical/Tutorial
DETAILED SYLLABUS

MEC101: MOS Circuit Design

Unit-1

Basic principle of MOS transistor, Introduction to large signal MOS models (long channel) for digital design.

Unit-2

Inverter principle, Depletion and enhancement load inverters, the basic CMOS inverter, transfer
characteristics, logic threshold, Noise margins, and Dynamic behavior, Propagation Delay, Power
Consumption.

Unit-3

MOS SPICE model, device characterization, Circuit characterization, interconnects simulation. MOS
device layout: Transistor layout, Inverter layout, CMOS digital circuits layout & simulation,
Complementary MOS, Ratioed logic, Pass Transistor logic, complex logic circuits, Dynamic logic
families and performances.

Unit-4

Static latches, Flip flops & Registers, Dynamic Latches & Registers, CMOS Schmitt trigger, Monostable
sequential Circuits, Astable Circuits. Memory Design: ROM & RAM cells design, Interconnect delays,
Cross Talks, Clock Distribution. Introduction to low power design, Input and Output Interface circuits.

Unit-5

Introduction of BJT Structure & operation, Basic BiCMOS Circuit behavior, Switching Delay in
BiCMOS Logic circuits, BiCMOS Applications

Text Books:

1. Kang & Leblebigi “CMOS Digital IC Circuit Analysis & Design”- McGraw Hill, 2003

2. Rabey, “Digital Integrated Circuits Design”, Pearson Education, Second Edition, 2003

Reference Book:

1. Weste and Eshraghian, “Principles of CMOS VLSI design” Addison-Wesley, 2002

MEC102: VLSI Technology

Unit-1
Electronic Grade Silicon, Czochralski crystal growing, Silicon Shaping, processing considerations, Vapor
phase Epitaxy, Molecular Beam Epitaxy, Silicon on Insulators, Epitaxial Evaluation, Growth Mechanism
and kinetics, Thin Oxides, Oxidation Techniques and Systems, Oxide properties, Redistribution of
Dopants at interface, Oxidation of Poly Silicon, Oxidation inducted Defects.
Unit-2
Optical Lithography, Electron Lithography, X-Ray Lithography, Ion Lithography, Plasma properties,
Feature Size control and Anisotropic Etch mechanism, reactive Plasma Etching techniques and
Equipment.
Unit-3
Deposition process, Poly silicon, plasma assisted Deposition, Models of Diffusion in Solids, Fick's one
dimensional Diffusion Equations - Atomic Diffusion Mechanism - Measurement techniques - Range
theory- Implant equipment. Annealing Shallow junctions - High energy implantation - Physical vapor
deposition - Patterning.
Unit-4
Ion implantation - Diffusion and oxidation - Epitaxy - Lithography - Etching and Deposition- NMOS IC
Technology - CMOS IC Technology - MOS Memory IC technology - Bipolar IC Technology - IC
Fabrication.
Unit-5
Analytical Beams - Beam Specimen interactions - Chemical methods - Package types - packaging design
considerations - VLSI assembly technology - Package fabrication technology.
TEXT BOOKS
• S.M.Sze, "VLSI Technology", McGraw Hill Second Edition. 1998
• James D Plummer, Michael D. Deal, Peter B.Griffin, "Silicon VLSI Technology: fundamentals
practice and Modeling", Prentice Hall India.2000
• Wai Kai Chen, "VLSI Technology" CRC press, 2003
MEC103: Digital Systems Design

Unit-1

Specification of combinational systems using VHDL, Introduction to VHDL, Basic language element of
VHDL, Behavioral Modeling, Data flow modeling, Structural modeling, Subprograms and overloading,
VHDL description of gates.

Unit-2

Description and design of sequential circuits using VHDL, Standard combinational modules, Design of a
Serial Adder with Accumulator, State Graph for Control Network, design of a Binary Multiplier,
Multiplication of a Signed Binary Number, Design of a Binary Divider.

Unit-3

Register- transfer level systems, Execution Graph, Organization of System, Implementation of RTL
Systems, Analysis of RTL Systems, Design of RTL Systems.

Unit-4

Data Subsystems, Storage Modules, Functional Modules, Data paths, Control Subsystems, Micro
programmed Controller, Structure of a micro programmed controller, Micro instruction Format, Micro
instruction sequencing, Micro instruction Timing, Basic component of a micro system, memory
subsystem. I/O subsystem, Processors, Operation of the computer and cycle time.

Unit-5

Encoder, Multiplexers and Demultiplexers, Floating Point Arithmetic-Representation of Floating Point

Number, Floating Point Multiplication.

Text Books:

• J. Bhaskar, “ A VHDL Primer”, Addison Wesley, 1999.

• M. Ercegovac, T. Lang and L.J. Moreno, ”Introduction to Digital Systems”, Wiley,2000
• C. H. Roth, “Digital System Design using VHDL”, PWS Publishing
References Books:

• J.F. Wakerly, “Digital Design-Principles and Practices”, PHL

• Douglas Perry, “VHDL”, MGH
• Michae John Sebastian Smith, “Application-Specific Integrated Circuits”, Addison-Wesley.
• Z. Navabi, “ VHDL-Analysis and Modeling of Digital Systems”, MGH
MEC104: Solid State Device Modeling and Simulation

Unit-1
Quantum Mechanical Concepts, Carrier Concentration, Transport Equation, Band gap, Mobility and
Resistivity, Carrier Generation and Recombination, Avalanche Process, Noise Sources.
Unit-2
Injection and Transport Model, Continuity Equation, Diode Small Signal and Large Signal (Change
Control Model), Transistor Models: Ebber - Molls and Gummel Port Model, SPICE modeling
temperature and area effects.
Unit-3
Introduction Interior Layer, MOS Transistor Current, Threshold Voltage, Temperature Short Channel and
Narrow Width Effect, Models for Enhancement, Depletion Type MOSFET, CMOS Models in SPICE.
Unit-4
General Methods, Specific Bipolar Measurement, Depletion Capacitance, Series Resistances, Early
Effect, Gummel Plots, MOSFET: Long and Short Channel Parameters, Statistical Modeling of Bipolar
and MOS Transistors.
Unit-5
Static and Dynamic Models, Rate Equations, Numerical Technique, Equivalent Circuits, Modeling of
LEDs, Laser Diode and Photo-detectors.
Text Books:

• Philip E. Allen, Douglas R. Hoberg, "CMOS Analog Circuit Design", Second Edition, Oxford
Press - 2002

• S.M.Sze "Semiconductor Devices - Physics and Technology", John Wiley and sons, 1985
• Kiat Seng Yeo, Samir S.Rofail, Wang-Ling Gob, "CMOS / BiCMOS ULSI - Low Voltage, low
Power", Person education, Low price edition, 2003
MEC105: Digital Signal Processing and Applications

Unit-1

Representation of signals on orthogonal basis; Sampling and Reconstruction of signals;

Z-Transform, Analysis of LSI systems, Frequency analysis, Inverse systems, Discrete Fourier Transform
(DFT), Fast Fourier Transform algorithm, Implementation of Discrete time systems.

Unit-2

Design of FIR Digital filters: Window method, Park-McClellan’s method.

Unit-3

Butterworth Chebyshev and Elliptic Approximations lowpass, Bandpass, Bandstop and High pass
filters.Effect of finite register length in FIR filter design Parametric and non-parametric spectra
estimation. Introduction to multirate signal processing. Application of DSP to Speech and Radar signal
processing.

Unit-4

Block diagram of real time system, Sampling of low pass & band pass signals, Uniform & non-uniform
quantization and encoding , over sampling in A/D conversion, D/A conversion process, Anti imaging
filtering, over sampling in D/ A conversion, limitations of real time signal processing with analog
input/output signals application.

Unit-5

Digital audio Mixing, Speech synthesis and recognition, Compact Disk Audio system, Digital Cellular
Mobile Telephone, Set-top Box for Digital Television Reception, Fetal EGC monitoring, DSP base closed
loop controlled anesthesia.

Text/Reference Books:

• Discrete Time signal Processing, A.V. Oppenheim and Schafer, Prentice Hall, 1989
• Digital Signal Processing : Principle, Algorithms and Applications, John G. Proakis and D.G.
Manolakis, Prentice Hall, 1997
• Theory and Application of Digital Signal Processing: L.R. Rabiner and B. Gold, Prentice Hall,
1992
• Introduction to Digital Signal Processing: J.R. Johnson, Prentice Hall, 1992
• Digital Signal Processing: D. J. DeFatta, J. G. Lucas and W. S. Hodgkiss, J Wile and sons,
Singapore, 1988.
MEC151: Lab ( HDL tools)

Exposure to high-level design tools including high-level synthesis, logic synthesis and
simulation. Hardware Description Languages; Verifying behaviour prior to system construction -
simulation and logic verification; Logic Synthesis - PLA based synthesis and multilevel logic synthesis;
Logic optimization; Logic Simulation - Compiled and event simulators; Relative advantages and
disadvantages; Modelling and design using VHDL, verilog.

MEC152: MatLab

Introduction of Matlab basics. Implement the various circuits.

MEC153: SEMINAR

Seminar presentation-cum-report should be on a recent topic in various aspects of Electronics

MEC201: Digital Systems Testing and Simulation with VHDL

Unit-1

Testing definitions and areas within testing. Logic and Fault Modeling. Mechanics Definitions:
Abstractions level, Faults and errors, Modeling, Test Evaluation,
Test Generation, Diagnostics. System life, Sources of defects?
Unit-2

Representation and models of digital systems across abstraction levels.

Fault Models: logical versus physical; SSL model, opens and shorts, bridging faults; Basic assumptions.
Unit-3

Review of minimization tools and asynchronous machines, Test Pattern Generation basics. (activate and
drive.), Algebraic approaches, Fault Equivalence and Dominance.
Unit-4

Algebraic Approaches and Structural Approaches, Logic Simulation. Algebraic Approaches: Boolean
difference, Literal position, Effect of fan-out on circuits, Checkpoint faults. Structural Approaches to test
generation. Path sensitization methods.

Unit-5
compiler, event driven. Representation of value, circuit, etc. Logic and Fault Simulation: Delay models
for circuit simulation, Fault Simulation Purpose of Serial and Parallel
Fault Simulation, Deductive fault simulation. Concurrent Fault Simulation, Critical Path tracing, Statistic
al Fault Analysis.

Text/Reference Books:

1. "Digital Systems Testing and Testable Design" by Miron Abramovici, Melvin Breuer
and Arthur Friedman, IEEE press, NY.

2. A Guide to VHDL'' by Stanley Mazor, Kluwer Academic Press

3. "HDL Chip Design" by Douglas Smith, Doone Publications, AL.

4. "Rapid Prototyping of Digital Systems", by J. O. Hamblen and M. Furman, Kluwer Academic

Publishers.
MEC202: High Speed Analog Design Techniques

Unit 1

High Speed Operational Amplifiers Folded Cascode Voltage Feedback Op-Amps, Case study of AD847,
Current Feedback Op-Amps (CFB), CFB model and Bode plot, study of AD8011, Comparison of
specifications of Current feedback Op-amp family AD8001,
AD8002, Noise comparisons between VFB and CFB Op Amps, PSRR Characteristics.

Unit 2

High-Speed applications based on Op-amps Optimizing feedback network for maximum bandwidth
fitness, Driving Capacitive load, Cable drivers and receivers, High performance video line driver,
Differential line drivers and receivers, High speed clamping amplifiers.

Unit 3

High speed amplifiers for communication applications Low noise amplifiers for communication systems,
Mixers, Power amplifiers, Liner drivers, Automatic gain control amplifiers

Unit 4

High speed system for video applications High speed video multiplexing with Opamps using disable
function, Video programmable gain amplifier, Video multiplexers and Cross Point switches, High power
line drivers and ADSL, High speed photodiode Pre amps, Case studies of AD830, AD9002.

Unit 5

High speed RF/IF Subsystems Dynamic range compression, Linear VCAs, Log/Limiting Amplifiers,
Receiver overview, Multipliers, modulators and mixers, Case study of AD600 Dual Channel X-
amp, AD641 monolithic log amplifier.

Reference Books:
1. Intuitive Operational Amplifiers, Thomas M. Frederiksen, Mc Graw Hill, 1988.

2. B Razavi, "RF Microelectronics", Prentice Hall, 1998

3. T.H. Lee, "The Design of CMOS Radio-Frequency Integrated Circuits"Cambridge University Press,
1998.

4. High Speed Design Techniques, Manual by analog Devices, October 1996

5. Modular Low-Power, High Speed CMOS Analog-to-Digital Converter for Embedded Systems, Lin,
Dr. Ing. Keh-La Kemma, Armin Hosticka, Prof. Bedrich J. Publisher, Kluwer Academic Publishers
MEC203: Optimization with Numerical Techniques

Unit-1

Introduction: Algebraic Structures: Properties, Semi group, Monoid, Group, Abelian group, properties
of group, Subgroup, Cyclic group, Cosets, Permutation groups, Homomorphism, Isomorphism and
Automorphism of groups.

Solution of Algebraic and Transcendental Equation:

Bisection Method, Iteration method, Method of false position, Newton-Raphson method, Methods of
finding complex roots, Muller’s method, Rate of convergence of Iterative methods, Polynomial
Equations.

Unit 2

Simultaneous Linear Equations: Solutions of system of Linear equations, Gauss Elimination direct
method and pivoting, Ill Conditioned system of equations, Gauss Seidal iterative method, Rate of
Convergence

Solution of differential Equations: Picard’s Method, Euler’s Method, Taylor’s Method, Runge-Kutta
Methods, Predictor Corrector Methods.

Unit 3

Graphs, sub-graphs, some basic properties, Walks, Path & circuits, Connected graphs, Disconnected
graphs and component, Eular and Hamiltonian graphs, Various operation on graphs, Tree and
fundamental circuits, Distance diameters, Radius and pendent vertices, Rooted and binary trees, Counting
trees, Spanning trees, Finding all spanning trees of a graph and a weighted graph.

Unit 4

Cut-sets and cut vertices, some properties, All cut sets in a graph, Fundamental circuit and cut sets,
Connectivity and seperatability, Network flows, min cut theorem, Planar graphs, Combinatorial and
geometric dual, Kuratowski to graph detection of planarity, Geometric dual, Some more criterion of
planarity, Thickness and Crossings, Vector space of a graph and vectors, basis vectors, cut set vector,
circuit vector, circuit and cut set verses sub spaces, orthogonal vector and sub space.

Unit 5

Network Models: Network definitions, CPM and PERT, Game Theory, Decision Making, Simulation:
The Essence of Simulation, Some Common Types of Applications of Simulation, Generation of Random
Numbers, Performing Simulations, Optimal solution of two persons zero sum games, Solution of mixed
strategy games.

REFERENCE BOOKS:

1. Optimization Theory and Application : S.S.Rao.

2. Operations Research – S.D.Sarma.
TEXT BOOK
1.Introduction to operation Research TMHFREDERICK S. HILLIER,Stanford University GERALD J.
LIEBERMAN

MEC204: CMOS RF Circuit Design

Unit-1

Design and Applications, Complexity and Choice of Technology. Basic concepts in RF design:
Nonlinearly and Time Variance, Intersymbol interference, random processes and noise. Sensitivity and
dynamic range, conversion of gains and distortion.

Unit-2

Analog and digital modulation of RF circuits, Comparison of various techniques for power efficiency,
Coherent and non-coherent detection, Mobile RF communication and basics of Multiple Access
techniques. Receiver and Transmitter architectures. Direct conversion and two step transmitters.

Unit-3

RF testing for heterodyne, Homodyne, Image reject, Direct IF and sub sampled receivers.

BJT and MOSFET behavior at RF frequencies, Modeling of the transistors and SPICE model, Noise
performance and limitations of devices, integrated parasitic elements at high frequencies and their
monolithic implementation

Unit-4

Overview of RF Filter design, Active RF components & modeling, Matching and Biasing

Networks. Basic blocks in RF systems and their VLSI implementation, Low noise Amplifier design in
various technologies, Design of Mixers at GHz frequency range, Various mixersworking and
implementation. Oscillators- Basic topologies VCO and definition of phase noise, Noise power and trade
off. Resonator VCO designs, Quadrature and single sideband generators.

Unit-5

Radio frequency Synthesizers- PLLS, Various RF synthesizer architectures and frequency dividers,
Power Amplifier design, Liberalization techniques, Design issues in integrated RF filters.

Text Book:

1. Thomas H. Lee “Design of CMOS RF Integrated Circuits” Cambridge University press

1998.

References Book:

1. B. Razavi “RF Microelectronics” PHI 1998

2. R. Jacob Baker, H.W. Li, D.E. Boyce “ CMOS Circiut Design, layout and Simulation”

PHI 1998
3.Y.P. Tsividis “Mixed Analog and Digital Devices and Technology” TMH 1996

MEC205: Design of Semiconductor Memories

Unit-1
SRAM Cell Structures-MOS SRAM Architecture-MOS SRAM Cell and Peripheral Circuit Operation-
Bipolar SRAM Technologies-Silicon On Insulator (SOl) Technology-Advanced SRAM Architectures and
Technologies-Application Specific SRAMs.
Unit-2
DRAM Technology Development-CMOS DRAMs - DRAMs Cell Theory and Advanced Cell Strucutures
- BiCMOS, DRAMs - Soft Error Failures in DRAMs - Advanced DRAM Designs and Architecture-
Application Specific DRAMs.
Unit-3
Masked Read-Only Memories (ROMs)-High Density ROMs-Programmable Read-Only Memories
(PROMs)-Bipolar PROMs-CMOS PROMs-Erasable (UV) - Programmable Road-Only Memories
(EPROMs)-Floating-Gate EPROM Cell-One-Time Programmable (OTP) Eproms-Electrically Erasable
PROMs (EEPROMs)-EEPROM Technology And Architecture-Nonvolatile SRAM-Flash Memories
(EPROMs or EEPROM)-AdvancedFlash Memory Architecture.
Unit-4
RAM Fault Modelling, Electrical Testing, Peusdo Random Testing-Megabit DRAM Testing-Non-volatile
Memory Modelling and Testing-IDDQ Fault Modelling and Testing-Application Specific Memory
Testing
Unit-5
General Reliability Issues-RAM Failure Modes and Mechanism-Non-volatile Memory Reliability-
Reliability Modelling and Failure Rate Prediction-Design for Reliability-Reliability Test Structures-
Reliability Screening and Qualification. RAM Fault Modelling, Electrical Testing, Pseudo Random
Testing-Megabit DRAM Testing-Non-volatile Memory Modelling and Testing-IDDQ Fault Modelling
and Testing-Application Specific Memory Testing.
Text/Reference Books:

• Ashok K. Sharma, "Semiconductor Memories", Two-Volume Set, Wiley-IEEE Press, 2003

• Brent Keeth, R. Jacob Baker, "DRAM Circuit Design: A Tutorial", Wiley-IEEE Press, 2000
Betty Prince, "High Performance Memories: New Architecture DRAMs and SRAMs - Evolution and
Function", Wiley, 1999
MEC206: Analog and low power digital VLSI design

Unit 1

Low Power Design and Physics of Power Consumption, Power Estimation and Synthesis for low power,
Design and test of low voltage CMOS circuits

Unit 2

Low power Static RAM architecture, Low power computing with energy recovery, Digital low power
deign using hazard filters and balanced parities

Unit 3

Software design for low power, Case studies of Gilbert Cell Design with layout for low power

Unit 4

Case study of PLL design with layout for low power, Case study of A/D and D/A Converters for low
power applications

Unit 5

Low power design for woreless circuits, Integrated radio frequency CMOS design

Text/Reference Books:
1. Introduction to Low-Power VLSI Design (G Yeap & A Wild)
2. Low Power Design of Off-Chip Drivers and Transmission Lines: A Branch and
Bound Approach (R Gupta et al.)
3. A New CMOS Driver Model for Transient Analysis and Power Dissipation
Analysis (H Liao et al.)
4. On the Optimal Drivers of High-Speed Low Power ICs (D Zhou & X Y Liu)
5. Floorplan Design with Low Power Considerations (K-Y Chao & D F Wong)
MEC207: Microcontroller and Applications

Unit-1

Single Chip Controllers, Design and testing of software for Micro-controllers,

Architectural features of different types of architectures used in Micro-controllers,
like Van Neuman, Harward, CISC, RISC, SISC architectures. Special features like
watchdog timer, digital signal processors, clock monitor, resident program, loader,
monitor, General applications of Micro-controllers.

Unit-2

Comparison of Intel MCS 51/251 and MCS 96 Microcontroller Families, Overview and
features of MCS 96(HSIO) family, Intel 80C196 CHMOS 16 bit Microcontroller, Pin
configuration, Architectural block diagram, Signal descriptions, memory and
address space, registers, buses, and data transfers, different modes of operation.

Unit-3

Instruction set : different types of instructions, instruction significance and

execution, Addressing modes, effective address, simple programs, loop programs,
subroutines and examples, Memory Management, Programming the Microcontroller
for different applications, Synchronous Serial Port, Serial port wave forms (shift
register mode), Interrupts handling and priority, External Memory Interfacing.

Unit-4

Serial and parallel ports and software control of ports, port I/O registers,
synchronization in data transfer and handshaking, interrupt management, interrupt
service routines, and interrupt examples keeping time and parallel port transfers,
A/D control and status registers and applications.

Unit-5

Interfacing of LEDs, Switches and 7- segment displays, keyboard interfacing, RS-232

interfacing, DC motor interfacing, Stepper motor interfacing, DAC, Data acquisition
system, real world interfacing.

References:
1. The 8051 Microcontroller, 3rd Ed., Scott MacKenzie,1999, Prentice Hall.
2. The 80251 Microcontroller, Kenneth Ayala, 2000 Prentice Hall.
3. The 8051 Microcontroller: Hardware, Software, and Interfacing, 2nd Ed, James
Stewart and
Kai Miao, 1999, Prentice Hall.
4. The art of programming embedded systems by Jack G. Ganssle.
5. Design with Microcontrollers by John B. Peatman.
6. Microcontroller: Architecture, implementation and Programming by Kenneth Hintz
and
Daniel Tabak, Tata McGraw Hill.

MEC251: Lab (EDA Tool-1 Lab)

1. To measure the resistivty using four probe method

2. To measure the sheet resistance of a given sample

3. To measure the IV characteristics of the given diode

4. To measure the C-V characteristics of the given diode

5. To measure the IV characteristics of the transistor

6. To measure the carrier concentration at the surface by C-V measurement

7. To measure the carrier concentration by Hall Effect

8. To measure the physical parameters of the layout of the chip

9. To measure the sub threshold voltage of the given transistor

10. To measure the short channel effect of the MOS device

MEC252: Lab (EDA Tool-2 Lab)

It is circuit level design tool to implement the various BJT, FET, CMOS, and BiCMOS circuits.
 MEC301: Advance Optical Communication

Unit-1
Need of optical transmission, Fibre optics communication system, basic blocks , Evolution of Fibre Optic
Systems, Advantage of OFC. Basic opticals laws and transmission parameters, optical fibre structure,
mode theory for optical propogaton, modes in a planar wave, phase and group velocity, phase shift on
TER and evanescent field, cylindrical wave-guides, step index and graded index, planar and dielectric
wave guides.

Unit-2
Attenuation, material absorption, scattering loss, bending loss, inter modal dispurtion, intra modal
dispersion, overall fibre dispersion, dispersion modified SMF, polarization. Light emitting diode (LEDs),
LASER, and its characterstics fibre laser(edge emitting and vertical cavity surface emitting lasers),
optical transmitters.

Unit-3
Optical detection principles and devices, detection response time, avalanche multiplication noise,
structure for InGaAs APDs, comparision of detectors, splices and connectors, optical receivers.
Semiconductor optical amplifier, EDFA (Erbium Doped fiber amplifier), planner amplifiers, Raman
amplifiers and repeaters fiber amplifiers and related components.

Unit-4
Attenuation measurement, dispersion measurement, OTDR & its field applications, eye pattern.
PHD, data pulse stream on- array Moarkov source, convulationary coded modulation, CPM, scalar and
vector communication over memory less channels, optical receivers, metrix generation, colored GN
whitening approach, in phase and quadrature, phase modem, non coherent receivers, performance of non
coherent receiver in random phase channel.
Unit-5
Basic networks, SONET/ SDH networks, broadcast and select VDM networks, wavelength routed
networks, non linear effects on N/w performance, performance of WDM & EDFA systems, LAN,
solitions, optical CDMA, high frequency capacity network. Pulse propagation and solitons, integrated
optics and photonic switching.
Texts/References:
1. Optical Fiber Communication by Senior JM
2. Optical Fiber Communication by Gerd Keiser
3. Introduction to Optical Fiber by Allien H Chairin
4. Optical Fibers by Taknan Orosh

MEC302: Nano-Electronics

Unit-1
Physics of solid state Structure - Energy band - Quantum mechanics.
Unit-2
Technology Film deposition methods - Lithography.
Unit-3
Analysis Electron microcopies - Scanning probe microcopies.
Unit-4
Logic devices Limitation of MOSFETS - Single electron devices - Quantum transport devices - Carbon
nano tubes - Molecular devices.
Unit-5
Spintronics Principle - Applications, Quantum computing, nano sensors.
Text/References Books:

• W. Roy VCH, "Nano Electronics and Information Technology", Rainen waser 2nd Edition 2005

• Chonles P.Pook Jr., Frank. J. Owens, "Introduction to Nano technology", Wiley Interscience, 1 st
Ed 2003

• T. Pradeep, "Nano: The essentials", Tata McGraw Hill, 1 st Ed,2007

Mark Ratne, Danill Ratne, "Nano Technology", Pearson education, 1 st edition, 2006

MEC303: Minor Project

The student will submit a synopsis at the beginning of the semester for the approval to the project
committee in a specified format. The student will have to present the progress of the work through
seminars and presentation. A report must be submitted to the dept. for evaluation purpose at the end of the
semester in a specified format

MEC304: FPGA/CPLD Based Systems

Unit 1
Introduction. Basic Concepts. Digital Design and FPGAs. FPGA-Based System Design. Summary.
Problems.

Unit 2
VLSI Technology behind FPGA/CPLD, Manufacturing Processes. CMOS Logic Gates. Wires, Registers
and RAM, Packages and Pads.

Unit 3
FPGA Fabrics. FPGA Architectures. SRAM-Based FPGAs. Permanently Programmed
FPGAs. Chip I/O. Circuit Design of FPGA Fabrics. Architecture of FPGA Fabrics.

Unit 4
Combinational Logic, The Logic Design Process. Hardware Description Languages.
Combinational Network Delay. Power and Energy Optimization. Arithmetic Logic.
Logic Implementation for FPGAs. Physical Design for FPGAs. The Logic Design
Process Revisited. Summary. Problems.

Unit 5
Sequential Machines, The Sequential Machine Design Process. Sequential Design
Styles. Rules for Clocking. Performance Analysis. Power Optimization, Architecture, Behavioral Design.
Design Methodologies.

Text/References Books:
1. FPGA-Based System Design Wayne Wolf, Verlag: Prentice Hall PTR
2. Modern VLSI Design: System-on-Chip Design (3rd Edition) (3RD) Wayne Wolf
MEC305: Computer Aids for VLSI Design

Unit-1
Introduction to VLSI Design methodologies - Review of Data structures and algorithms - Review of
VLSI Design automation tools - Algorithmic Graph Theory and Computational Complexity - Tractable
and Intractable problems - general PURPOSE methods for combinatorial optimization.
Unit-2
Layout Compaction - Design rules - problem formulation - algorithms for constraint graph compaction -
placement and partitioning - Circuit representation - Placement algorithms - partitioning
Unit-3
Floor planning concepts - shape functions and floorplan sizing - Types of local routing problems - Area
routing - channel routing - global routing - algorithms for global routing.
Unit-4
Simulation - Gate-level modeling and simulation - Switch-level modeling and simulation - Combinational
Logic Synthesis - Binary Decision Diagrams - Two Level Logic Synthesis- High level Synthesis.
Unit-5
Hardware models - Internal representation - Allocation -assignment and scheduling - Simple scheduling
algorithm - Assignment problem - High level transformations.
Text/References Books;

• S.H. Gerez, "Algorithms for VLSI Design Automation", John Wiley & Sons,2002
• N.A. Sherwani, "Algorithms for VLSI Physical Design Automation", Kluwar Academic
Publishers, 2002
MEC306: MEMS and IC Integration

Unit-1

Overview of CMOS process in IC fabrication

Unit-2

MEMS system-level design methodology

Unit-3

Equivalent Circuit representation of MEMS, signal-conditioning circuits, and sensor noise calculation.

Unit-4

Pressure sensors with embedded electronics(Analog/Mixed signal).

Unit-5

Accelerometer with transducer,Gyroscope,RF MEMS switch with electronics,Bolo meter design. RF

MEMS, and Optical MEMS.

Text/References Books:

• Gregory T.A. Kovacs, Micromachined Transducers Sourecbook, The McGraw-Hill, Inc.1998

• Stephen D. Senturia, Microsystem Design, Kluar Publishers, 2001
• Nadim Maluf, An Introduction to Microelectromechanical Systems Engineering, Artech House,
2000.
• M.H. Bao, Micro Mechanical Transducers, Volume 8, Handbook of Sensors and
Actuators, Elsevier, 2000.

• Masood Tabib-Azar, Microactuators, Kluwer, 1998.

• Ljubisa Ristic, Editor, Sensor Technology and Devices, Artech House, 1994
MEC307: Compound Semiconductor Material and Devices

Unit-1

III-V and II-VI compound semiconductor materials and their applications in electronics

and optoelectronic devices, crystal structures and their band structures, variation of band

gap with the contents of compound metals, refractive index variation with respect to the

contents of compound metals.

Unit-2

Liquid Phase Epitaxy, Molecular Beam Epitaxy, and Metal Organic Chemical Vapor

Deposition techniques for crystal growth.

Unit-3

HBT, DHBT, Heterostructure laser, waveguides and optical modulators and switches,

SLAPDS, and other Heterostructure p-i-n diodes.

Unit-4

Photoluminescence Techniques, X-Ray diffraction, SIMS, SEM, TEM, measurement of

waveguides, modulator and optical detector.

Text/References Books:

• Stephen A. Campell. “The science and engineering of microelectronics fabrication”, Oxford

University Press. 1996.
• Donald L. Smith. “Thin Film Deposition”. McGraw Hill. 1995.
• H. C. Cassey and M. B. Panish. “Heterostructure Laser”. Academic Press
• M. J. Kelly. “Low Dimensional Semiconductor Materials, Physics Technology,
Devices”. Oxford Science Publication. 1995.
 • John L. Vossen and Werner Kern. “Thin Film Processes II”. Academic Press Inc.
1991.

MEC351: Lab (Microcontroller Lab)

Introduction of various front-end and back-end techniques.

MEC401: Dissertation

This includes the analysis, design of hardware/software construction of an apparatus/Instrument and

testing and evaluation of its performance. Usually, the project work is based on a scientific/engineering
problem of current interest. Every student has to complete the work in the specified period.

The student will submit a synopsis at the beginning of the semester for the approval of Dissertation topic,
from the department project committee in a specified format. Synopsis must be submitted within two
weeks after registration. The student will have to present a seminar on the literature survey, past work etc.
in their area of work through seminars and progress reports at the interval of four weeks.

The first defense, for the dissertation work, should be held during mid-semester. Dissertation Report must
be submitted in a specified format to the department for evaluation purpose before the final defense.

Syllabus Designed by
Mr. Vijay Kumar Sharma
ECE Deptt.
COE, TMU Moradabad (U.P.)