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Digital Circuits
6-1
Discrete components: Resistors
6-2
Discrete components: Diodes
6-3
Discrete components: transistors
6-4
Example of a simple circuit
LED
5V
SW
6-5
6-6
Scale of integration
6-7
Examples of SSI logic devices
6-8
Example of GSI device:
A microprocessor, MPU, CPU
6-9
To make logic outputs switch between High
and Low (1 and 0), transistors are used.
2 broad families:
• use bipolar junction transistors
• e.g. TTL (transistor-transistor logic)
circuits
6-10
Bipolar junction transistors (BJT)
• Base, emitter, collector IC IC
• With correct voltage at B,
current will flow between
C and E
npn pnp
6-11
TTL family
• different prefixes
• different in electrical characteristics such
as power dissipation, delay time, switching
speed
• do not differ in pin layout or logic function
6-12
examples (hex inverters)
6-13
CMOS family
6-14
examples (quad 2-input NOR)
6-15
Logic-level Voltage Ranges
TTL
• Vcc nominally +5v
CMOS
• VDD ranges from +3 to +18v
• +5v is most often used when CMOS
ICs are used in same circuit with TTL
ICs
6-16
Incompatible voltage ranges
2.0V
Indeterminate
Indeterminate
Indeterminate
Indeterminate
1.5V
0.8V
Logic 0
Logic 0
0V 0V
6-17
Unconnected (floating) inputs
TTL
• floating input acts like logic 1
• measures dc level between 1.4 to 1.8
volts
• not recommended due to noise pick-up
CMOS
• disastrous result
• IC may become overheated
• all unused input pins must be connected
to VDD, GND, or another input
6-18
Active levels
6-19
Active levels
E.g. active high signal OPEN is used to open
a door when OPEN=1
6-20
RESET* RESET
6-21
Asserted and negated
A logic signal is asserted when it is in its
active level
Otherwise, it is negated
asserted 1 0
negated 0 1
6-22
Logic circuit connection diagrams
Fig. 4-32 contains more information than the
usual circuit diagram to facilitate circuit
connection and troubleshooting
6-23
CLOCK*
CLKOUT*
LOAD*
SHIFT
SHIFTOUT*
6-24
Fig. 6-11 Bubble-to-bubble logic diagram (Wakerly, 4th ed)
6-25
Troubleshooting Digital Systems
Read supplementary lab manual
• Fault detection
• Fault isolation
• Fault correction
Internal IC faults
• malfunction in internal circuitry
• short circuit
• open circuit
• short between two pins
6-26
External IC faults
• open signal line
• shorted signal lines
• faulty power supply
• wrong connection
6-27
The transistor as a Switch
Current
flow
Current
flow
6-28
A simple BJT logic inverter
0 1
1
0 Q1 off
6-29
A simple BJT logic inverter
1 0
0
1
Q1 on
6-30
TTL inverter 0 1
A Y
ON
OFF
ON
1
0 OFF
6-31
TTL inverter 1 0
A Y
OFF
ON
OFF
0
1 ON
6-32
CMOS inverter
NOT VDD
0 1
X Y PMOS
0 X Y 1
NMOS
6-33
CMOS inverter
NOT VDD
1 0
X Y
1 X Y 0
6-34
Examples of CMOS logic circuits
6-35
VDD
2 transistors in
A B parallel
NAND X
A A
B X 2 transistors in
B series
VDD
A 2 transistors in
NOR
A B series
B X
X
A B 2 transistors in
parallel
6-36
VDD
Either A or B=0
A B will cause X=1
NAND X
A A
B X Both A and B=1
B will cause X=0
VDD
A Both A and B=0
NOR
A B will cause X=1
B X
X
A B Either A or B=1
will cause X=0
6-37
Either A, B or C=0
will cause Z=1
6-38
Either A or B=0
will cause Z=0
NAND NOT
6-39
Digital Circuits Characteristics
Not
guaranteed
6-41
Voltage parameters:
VOH (min) - Minimum output voltage
produced for logic 1
VIH (min) - Minimum input voltage to be
recognised as logic 1
VIL (max) - Maximum input voltage to be
recognised as logic 0
VOL (max) – Maximum output voltage
produced for logic 0
6-42
Voltage parameters and noise margin:
6-43
Voltage parameters and noise margin:
6-45
Current parameters
IIH – Maximum current that flows
into the input at logic 1 Very small
leakage current in
IIL - Maximum current that flows CMOS (1µA)
into the input at logic 0
IOH – Maximum current that flows
from the output at logic 1 0.02 - 24 mA
depends on
IOL – Maximum current that flows family
6-46
Other characteristics
Fan-out
• specifies the number of standard loads
that the output gate can drive
• More loads may reduce DC noise
margins and switching speed
Speed
• Time taken for output to switch between 0
and 1
6-47
Power dissipation
• power consumed by the gate or device
• For CMOS, most of the power is
consumed when output switches
between 0 and 1 (dynamic power
dissipation)
•P=CV2f
• Proportional to switching frequency f
and square of power supply voltage V
• Static power dissipation (when there is
no switching) is usually very small
6-48
Propagation delay
• average transition delay time for signal
to propagate from input to output
• e.g. 9 – 19 ns for 74HC00
• tPD , or tPHL & tPLH
• tPHL= delay when output changes from
High to Low
• tPLH= delay when output changes from
Low to High
6-49
Propagation delay (inverter):
6-50
Tristate outputs
3 output states:
• logic 0
• logic 1
• high impedance (Hi-Z)
- neither 0 nor 1
- behaves like an open circuit
When a device is enabled, output is logic 0 or 1
When device is disabled, output is in Hi-Z
E.g. tristate buffer, tristate inverter
6-51
Tristate inverter
6-53
Advantage of using logic
devices with tristate outputs
Two or more outputs can be connected
together.
However, at any one time only one (or no)
output should be enabled.
Otherwise, it can lead to bus contention and
damage the devices.
Example: memory devices have tristate
outputs to share the same data bus.
6-54
shared data bus
ROM-A
ROM-B
CPU
RAM
6-55
shared data bus
ROM-A
ROM-B
CPU
RAM
6-56
shared data bus
ROM-A
ROM-B
CPU
RAM
6-57
shared data bus
ROM-A
ROM-B
CPU
RAM
6-58
Open-collector/drain output
Need external pull-up
resistor to make output=1
Symbol for
open-drain
6-59
Open-drain output can be
used to drive LED
• If A=B=1
• Q1 and Q2 ON
• LED ON
• If A=0 or B=0
• Q1 or Q2 OFF
• LED OFF
6-60
Open-drain outputs can be tied together
6-61
Wired-AND logic (in figure on
previous page):
6-62
Imagine an elastic band:
6-63