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A heat pipe has three sections: the evaporator, adiabatic, steel. It must be compatible
and condenser. The interior of the pipe is covered with a with the working fluid to prevent
chemical reactions, such as
wick, and the pipe is partially filled with a liquid such as
oxidation.
water. When the evaporator section (Le) is exposed to a
heat source, the liquid inside vaporizes and the pressure in 2. Working fluid Several types of
that section increases. The increased pressure causes the fluids have been used to date.
vapor to flow at a fast speed toward the condenser section These include methane, water,
of the heat pipe (Lc). The vapor in the condenser section ammonia, and sodium. Choice
loses heat to the integral heat sink and is converted back of fluid also depends on the
to liquid by the transfer of the latent heat of vaporization operating temperature range.
to the condenser. The liquid is then pumped back to the 3. Wick The wick structure comes in
evaporator through the wick capillary action. The middle different shapes and materials.
section of the heat pipe (La), the adiabatic portion, has a Figure 3 shows the profiles of
very small temperature difference. common wick types: axial groove, Figure 3. Different Wick
Structures
© Advanced Thermal Solutions, Inc. 3
3. Wick (continued) fine fiber, screen mesh, and the effective thermal conductivity of the heat pipe may be
sintering. Each wick has its own characteristics. drastically reduced due to the extra thermal resistances
For example, the axial groove has good conductivity added by the bonding. A rule of thumb for the effective
poor flow against gravity, and low thermal resistance. thermal conductivity of a heat pipe is 4000 W/mK.
Conversely, a sintering wick has excellent flow Heat pipe manufacturers generally provide data sheets
in the opposite direction of gravity, but has high showing the relationship between the temperature
thermal resistance. difference and the heat input. Figure 5 shows the
temperature difference between the two ends of a heat
pipe as a function of power [2].
Table 1 shows experimental data for the operating
temperature and heat transfer for three different types of
heat pipes [1].
Axial Heat
Working Operating Wick Wall
Transport,
Fluid Temp (°C) Design Material
(W)
Circumferential Stainless
Methane -140 12
mesh steel
Copper with
rectangular
Water 100 Axial grooves 70
cross
section
Circumferential
Stainless
Sodium 430-790 stainless steel 1309
steel
screen
temperature reaches the water temperature in about 25 There are many heat pipe shapes in the market, but the
seconds, while the copper rod reaches just 30°C after 200 most common are either round or flat. Round heat pipes can
seconds. However, in an actual application when a heat be used for transferring heat from one point to another. They
pipe is soldered or epoxied to the base of a heat sink, can be applied in tightly spaced electronic components, such
© Advanced Thermal Solutions, Inc. 4
Fundamentals:
Effective Thermal Conductivity Of A Heat Pipe
Introduction
The question often arises that what is the effective thermal conductivity of a heat pipe. The correct answer
depends on the construction and the wick material inside the heat pipe. To understand this better, consider figure 1
which shows all the resistances from the hot source on the evaporator side to the cold side which is the condenser.
Considering that the thermal resistance of the vapor space
is extremely small in the range of 10-8 °C/W, equation 1
can be simplified to:
Reference:
(1) Peterson, G.P, “An introduction to Heat pipes –
Modeling, Testing and Applications”, New York:
John Wiley and sons, 1994
© Advanced Thermal Solutions, Inc. 6
A heat pipe is a self-driven, two-phase device. A 1) Viscous Limit. At low temperature, the vapor pressure
schematic view is shown in Figure 1. At its hot end difference between the evaporator and the condenser
(evaporator) the liquid evaporates and turns to vapor. This may not be enough to overcome viscous forces.
vapor flows to the cold end (condenser) where it liquefies. 2) Sonic Limit. This occurs when the vapor velocity
The liquid is driven back from the cold end to the hot end reaches sonic speed at the evaporator and any increase
by capillary forces within the heat pipe’s wick structure. in the pressure difference will not speed up the flow.
The heat transfer ability of a heat pipe is determined by its limit determines the maximum heat transfer rate of the
diameter, fluid type, wick structure, and orientation. The heat pipe.
heat flux limitations of a heat pipe are governed by the For a heat pipe, the pumping power ΔPcapillary occurs on
following factors (Figure 2): the gas and liquid interface of the wick structure due to
surface tension differences. Pore radius and permeability
are the two most important characteristics of a wick
structure. The pore radius determines the pumping
pressure that the wick can develop. The smaller the pore
radius, the larger the pumping power. The permeability
determines the fractional pressure losses of the working
fluid ΔPl. The pressure drop ΔPV is directly related to
the rate of vapor traveling from the evaporator to the
condenser.
to be transported from the evaporator to the condenser heat pipes, large diameter heat pipes transport more heat
than in a small diameter pipe. The cross sectional area with the same ΔT. Figure 5 illustrates the relationship
of a heat pipe affects the sonic limit and entrainment between power and the inclination angle for different
limit, as well. In general, heat pipes with larger diameters heat pipes. Clearly the sintered wick structure pipes are
transport more heat. The gravitational pressure head ΔPg
better with the help of gravity. When the inclination angle
is determined by the relative positions of the evaporator
is larger than 10˚, the heat flux that the heat pipes can
and condenser.
transport does not vary much. As the inclination angle
If the angle between a straight heat pipe and horizontal gradually decreases from 10˚C, the heat flux decreases
is f (f is positive when the evaporator is lower than
as well. At a -90˚ angle, the heat flux is less than half of
condenser), the gravitational pressure head ΔPg can
that at 10˚.
be calculated as follows:
ΔPg = - ρIgIsinø
Where ρl is liquid density and l is heat pipe length.
Figure 4 shows the temperature difference between structure and orientation on heat pipe performance. The
evaporator and condenser at different power levels when bench they used for the tests is shown in Figure 6. The
the heat pipes are vertical. Compared to small diameter heat pipes they tested were 4, 5, and 6 mm in diameter.
© Advanced Thermal Solutions, Inc. 8
The pipes were 200 mm long with a 35 mm evaporator angle changes to negative, even at low heat flux.
and a 35 mm condenser. Each test started with an It fails at a negative inclination angle when the heat
inclination angle f of 90°, the vertical position at which flux is larger than 15 W.
the evaporator block was located at the bottom. The The performance of a heat pipe with sintered
tests ran through a 180° rotation that paused at each of metal powder is not affected much by its orientation
the following inclination angles: 60°, 30°, 0° (horizontal), when the heat flux is less than 15 W. At moderate
-30°, -60° and –90°. heat flux, the sintered metal powder heat pipe can
Figures 7, 8 and 9 show the temperature differences still work against gravity with an increased temperature
between evaporator and condenser for mesh, groove difference. At high heat flux (>25 W), it can only work
and sintered metal powder heat pipes, respectively. with help of gravity.
DESIGN CORNER
VeDh
Re = h(Tf 4- T 4) = ε σ(T - T ∙
v t t t w
) Q = h∙A(Ts - T∞)
Rtotal = Rconv,1 + Rwall,1 + Rwall, 2 + Rwall,3 + Rconv,4 Nu = h∙L
k
compact heat sink size with many turns and bends. The
high capillary pumping pressure achieved by using a
sintered powder metal wick due to its small pore size,
allows a heat pipe to operate in any orientation. Other
VISIT COOLINGZONE’S DESIGN CORNER
wick structures do not work as well in non-vertical
FOR CALCULATION TOOLS ON:
orientations because they cannot lift the returning working
fluid along the length of the heat pipe against gravity. • Impingement Heat Transfer
References: • Jet Impingement (Circular Nozzle)
1. http://www.lightstreamphotonics.com/technology.htm
• Radiation Shielding
• Effect of Radiation on Temperature Measurement
2. R
eay, D. and Kew, P., Heat Pipes: Theory, Design and
• Heat Transfer from a PCB
Applications, 5th Edition, Butterworth-Heinemann, 2006.
• Flat Plate Inside a Duct
3. HP-1 Heat pipe specification, www.thermacore.com.
• Heat Sink Optimum Spacing
4. Loh, C., Harris, E. and Chou, D., Comparative Study
• Radiation from a Heat Sink
of Heat Pipes Performances in Different Orientations,
• Heat Transfer Through a Composite Slab
Semiconductor Thermal Measurement and
Management Symposium, 2005.
WWW.COOLINGZONE.COM
© Advanced Thermal Solutions, Inc. 10
However, such solutions prevent significant progress in and condenser. In order for the device to function, the
the design of electronic products. A radical new way of condensate must return to the evaporator in a timely
thermal management can be achieved by integrating manner. This function is served by a capillary or wick
thermal design criteria early into the electronic design structure that must be placed on the walls of the enclosure.
process. This approach will allow the design of a The wick enables the liquid return from the condenser to
printed circuit board with full integration of the thermal the evaporator through the capillary pressure caused by
management hardware, with the aim of reducing thermal the difference in curvature of the liquid menisci. In order
gradients inside electronic products. for a heat pipe to operate, the following condition must be
satisfied:
where,
ΔPcap = capillary pressure (Pa)
ΔPv = pressure drop of vapor flow (Pa)
ΔPl = pressure drop of liquid flow (Pa)
ΔPg = pressure drop due to gravity (Pa)
θ = mesh wall - working liquid contact angle (degrees) non-functional layers must be introduced. Water was
used as working fluid and the cavity was made of copper.
g = gravitational constant (m/s2)
To reduce the contact angle and, therefore, increase the
L = heat pipe length (m)
capillary pressure, a cleaning method was used. A reduction
γ = heat pipe’s inclination angle (degrees)
in contact angle from 104 degrees to 56 degrees was
φ = porosity of the wick
achieved. In terms of thermal performance, heat pipe failure
fRe = Reynolds based friction factor
occurred around 10W, due to delamination of the PCB.
Av = vapor space cross-sectional area (m2)
μl = viscosity of the liquid (Pa•s)
μv = viscosity of the vapor (Pa•s)
Leff = effective length (m)
K = permeability of the wick (m2)
Aw = wick cross-sectional area (m2)
ρl = density of the liquid (kg/m3)
ρv = density of the vapor (kg/m3)
Hfg = latent heat of vaporization of the working fluid (J/Kg)
a) staggered lay-up (schematically)
Since the heat pipes presented in this paper have a
rectangular cross-section, hydraulic properties are used in
equation (2).
c) m
inimize the amount of dead volume (bonding layers in
contact with heat pipe cavity)
Figure 4. Experimental Setup [3] To address the first challenge, it is useful to take a look
at Equation (2). In the numerator, the first term, indicating
© Advanced Thermal Solutions, Inc. 13
capillary pressure, must be enlarged in comparison with the multilayer board, each layer is given a surface finish to
the second term, corresponding to pressure losses due enhance the bonding strength. Since the surface finish also
to gravity. The capillary microgrooves of both presented enhances the wettability, the wick structure is also treated
designs failed to transport the working fluid against gravity; with this surface finish. The wick structure is placed inside
therefore, a different wick structure, with a smaller pore the heat pipe cavity and the copper inserts are placed in the
radius, should be chosen. Both microgroove designs had an evaporator and condenser areas.
effective pore radius of about 50-100 μm. A screen mesh,
The third challenge can be overcome by introducing an
sintered media or metal foam will yield lower pore radii.
intermediate process step during the construction of the
Also from Equation (2), it is clear that for a chosen mode
PCB. For instance, the bottom and intermediate layers can
of operation, geometry and working fluid, only the internal
be assembled first to allow overplating and the sealing of the
distribution of vapor and liquid areas and the wick structure
intermediate permeable zones from the inside. The second
remain at the designer’s discretion.
process step will then include stacking and laminating the
Based on this discussion, a new PCB prototype was built bottom half of the board with the wick structure, copper insert
by Wits et al. [1] (Figure 6). The PCB features an insertable and top layer. Finally, a seal groove needs to be machined
wick structure with a smaller pore diameter, to address the and plated Figure 6. Prototype Heat Pipe Design [1] to seal
first challenge. The wick is positioned inside the cavity with the remaining top intermediate permeable zone.
the aid of copper inserts, which are also lowering the top to
The theoretical maximum amount of heat that can be
bottom thermal resistance. Therefore, the second challenge
transported with a PCB such as this one, presented in
is addressed as well.
The prototype is constructed from three layers of double Figure 6 with a sintered wick structure, is 11 W, according
plated polymeric material (FR 4+). The top layer has two to Equation (2). This value was obtained assuming an
machined openings for the pressure sensor and filling operational temperature of 80°C. Also, this value is for
tube. Also, multiple small thermal vias are provided. the worst case scenario, with the heat pipe working fluid
The vias are plated and filled with a thermally enhanced ascending against gravity.
epoxy (k = 3.5 W/m∙K). Conclusions
The middle layer features a rectangular slot that forms In conclusion, two existing concepts for integrating heat
the heat pipe cavity. The third (bottom) layer is a regular pipes into PCBs have been presented. Several challenges
flat laminate. The second and third layer will be laminated have been identified and a new prototype for a PCB-
together and subsequently metalized. Before assembling integrated heat pipe design has been proposed.
© Advanced Thermal Solutions, Inc. 13
through the use of an ultrasonic bath. Harikrishnan et al. [3] In addition to the common nanofluids listed above, other
studied CuO nanoparticles in an 80:20 water-glycerin base researchers have explored more exotic nanofluids. Tsai et
fluid at different concentrations as seen in Figure 2. al. [6] used gold nanoparticles and found that the thermal
© Advanced Thermal Solutions, Inc. 16
resistance of the heat pipe dropped from 0.215 to 0.17°C/W in an 80:20 water-glycerin base fluid, measured by using
with a specific cocktail of HAuCl4, Na3 Citrate and Tannic differential scanning calorimetry [3]. Curiously, although
Acid. This is almost the same fluid as Alumina as used in [5] attempts have been made in understanding the mechanism
but with added complexity and more expensive gold. Kang et for the increase in thermal conductivity, there is no clear
al. [7] found success with 35 nano-meter silver particles at a explanation. Wang et. al summarized the plethora of
concentration level of 10 parts-permillion in pure water. The research work that has gone into understanding the heat
thermal resistance reduced from a range of 0.004-0.005°C/ transfer characteristics of the nanofluids [7].
W to 0.001-0.002°C/W for different power loads.
block the liquid flow in the wicking and disrupt the capillary 3. Harikrishnan, S., Roseline, A., Kalaiselvam, S.,
pumping. The general consensus in the operation of heat “Preparation and Thermophysical Properties of Water-
pipes and thermosyphons (a wickless heat pipe) is to remain Glycerol Mixture-Based CuO Nanofluids as PCM for Cooling
to the left, regions I and II in Figure 6, of the CHF [8]. Applications”, IEEE Transactions on Nanotechnology, 2013.
The addition of nanofluids increases the CHF [4]. This 4. Sureshkumar, R., Mohideen, S., “Heat Transfer
phenomenon raises the overall boiling limit of the heat pipe. Characteristics of nanofluids in heat pipes: A review”,
As an example, Yang and Liu [10] found a 14% increase in Renewable and Sustainable Energy Reviews, 2013
allowable maximum heat flux for a looped thermosyphon
5. Shafahi, M., Bianco, V., Vafai, K., Manca, O., “An
by using a 1.5% concentration of Al2O3 by weight. The
Investigation of the thermal performance of cylindrical
researchers attributed that performance increase to an
heat pipes using nanofluids”, International Journal of
increase in CHF.
Heat and Mass Transfer, 2009.
Conclusions
6. Wang, X., Mujamdar, A., “Heat Transfer characteristics
The addition of nanoparticles to a base working fluid can of nanofluids: a review”, International Journal of Thermal
increase the thermal performance of a heat pipe. The Sciences, 2007.
performance increase comes as a decrease in thermal
7. Ghiaasiaan “Two-Phase Flow, Boiling, and
resistance and an increase in total allowable heat load.
Condensation”, 2008.
The two most common nanofluids with water are Alumina
8. Reay, D. and Kew, P., “Heat Pipes: Theory,
(Al2O3) and Copper Oxide (CuO); although positive effects
Design and Applications”, 2006.
have also been seen with Titanium Oxide (TiO), Gold
and Silver. While many of these nano-particles come in 9. Yang, X., Liue, Z., “Flow Boiling heat transfer
commercially available powder form, manufacturers should in the evaporator of a loop thermosyphon operating
evaluate the increased complexity of creating such a heat with CuO based aqueous nanofluid”. International
pipe vs the benefits outlined in this article. Journal of Heat and Mass Transfer, 2012.
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