HUFA76419P3, HUFA76419S3S

Data Sheet December 2001

27A, 60V, 0.040 Ohm, N-Channel, Logic

Level UltraFET® Power MOSFETs
Packaging
JEDEC TO-220AB JEDEC TO-263AB Features
• Ultra Low On-Resistance
SOURCE
DRAIN
DRAIN - rDS(ON) = 0.035Ω, VGS = 10V
(FLANGE)
GATE - rDS(ON) = 0.040Ω, VGS = 5V

GATE • Simulation Models

- Temperature Compensated PSPICE® and SABER™
SOURCE Electrical Models
DRAIN
- Spice and SABER Thermal Impedance Models
(FLANGE) - www.fairchildsemi.com
HUFA76419P3 HUFA76419S3S • Peak Current vs Pulse Width Curve
• UIS Rating Curve
Symbol • Switching Time vs RGS Curves

D Ordering Information
PART NUMBER PACKAGE BRAND

G HUFA76419P3 TO-220AB 76419P

HUFA76419S3S TO-263AB 76419S
S NOTE: When ordering, use the entire part number. Add the suffix T
to obtain the variant in tape and reel, e.g., HUFA76419S3ST.

Absolute Maximum Ratings TC = 25oC, Unless Otherwise Specified

HUFA76419P3, HUFA76419S3S UNITS
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS 60 V
Drain to Gate Voltage (RGS = 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR 60 V
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS ±16 V
Drain Current
Continuous (TC = 25oC, VGS = 5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID 27 A
Continuous (TC = 25oC, VGS = 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID 29 A
Continuous (TC = 100oC, VGS = 5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID 19 A
Continuous (TC = 100oC, VGS = 4.5V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID 18 A
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM Figure 4
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . UIS Figures 6, 17, 18
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD 75 W
Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 W/oC
Operating and Storage Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG -55 to 175 oC

Maximum Temperature for Soldering

Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL 300 oC
Package Body for 10s, See Techbrief TB334. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T pkg 260 oC

NOTES:
1. TJ = 25oC to 150oC.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

This product has been designed to meet the extreme test conditions and environment demanded by the automotive industry. For a copy
of the requirements, see AEC Q101 at: http://www.aecouncil.com/
Reliability data can be found at: http://www.fairchildsemi.com/products/discrete/reliability/index.html.
All Fairchild semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems certification.

©2001 Fairchild Semiconductor Corporation HUFA76419P3, HUFA76419S3S Rev. B

 HUFA76419P3, HUFA76419S3S

Electrical Specifications TC = 25oC, Unless Otherwise Specified

PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS

OFF STATE SPECIFICATIONS
Drain to Source Breakdown Voltage BVDSS ID = 250µA, VGS = 0V (Figure 12) 60 - - V
ID = 250µA, VGS = 0V , T C = -40oC (Figure 12) 55 - - V
Zero Gate Voltage Drain Current IDSS VDS = 55V, VGS = 0V - - 1 µA
VDS = 50V, VGS = 0V, TC = 150oC - - 250 µA
Gate to Source Leakage Current IGSS VGS = ±16V - - ±100 nA
ON STATE SPECIFICATIONS
Gate to Source Threshold Voltage VGS(TH) VGS = VDS, ID = 250µA (Figure 11) 1 - 3 V
Drain to Source On Resistance rDS(ON) ID = 29A, VGS = 10V (Figures 9, 10) - 0.029 0.035 Ω
ID = 19A, VGS = 5V (Figure 9) - 0.033 0.040 Ω
ID = 18A, VGS = 4.5V (Figure 9) - 0.035 0.044 Ω
THERMAL SPECIFICATIONS
Thermal Resistance Junction to Case RθJC TO-220 and TO-263 - - 2.0 oC/W

Thermal Resistance Junction to RθJA - - 62 oC/W

Ambient
SWITCHING SPECIFICATIONS (VGS = 4.5V)
Turn-On Time tON VDD = 30V, ID = 18A - - 245 ns
Turn-On Delay Time td(ON) VGS = 4.5V, RGS = 12Ω - 12 - ns
(Figures 15, 21, 22)
Rise Time tr - 150 - ns
Turn-Off Delay Time td(OFF) - 27 - ns
Fall Time tf - 55 - ns
Turn-Off Time tOFF - - 125 ns
SWITCHING SPECIFICATIONS (VGS = 10V)
Turn-On Time tON VDD = 30V, ID = 29A - - 110 ns
Turn-On Delay Time td(ON) VGS = 10V, - 6.7 - ns
RGS = 12Ω
Rise Time tr (Figures 16, 21, 22) - 66 - ns
Turn-Off Delay Time td(OFF) - 45 - ns
Fall Time tf - 76 - ns
Turn-Off Time tOFF - - 185 ns
GATE CHARGE SPECIFICATIONS
Total Gate Charge Qg(TOT) VGS = 0V to 10V VDD = 30V, - 22 28 nC
ID = 19A,
Gate Charge at 5V Qg(5) VGS = 0V to 5V - 13 16 nC
Ig(REF) = 1.0mA
Threshold Gate Charge Qg(TH) VGS = 0V to 1V - 0.9 1.1 nC
(Figures 14, 19, 20)
Gate to Source Gate Charge Qgs - 2.7 - nC
Gate to Drain "Miller" Charge Qgd - 6 - nC
CAPACITANCE SPECIFICATIONS
Input Capacitance CISS VDS = 25V, VGS = 0V, - 900 - pF
Output Capacitance COSS f = 1MHz - 250 - pF
(Figure 13)
Reverse Transfer Capacitance CRSS - 45 - pF

Source to Drain Diode Specifications

PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Source to Drain Diode Voltage VSD ISD = 19A - - 1.25 V
ISD = 10A - - 1.0 V
Reverse Recovery Time trr ISD = 19A, dISD/dt = 100A/µs - - 78 ns
Reverse Recovered Charge QRR ISD = 19A, dISD/dt = 100A/µs - - 230 nC

©2001 Fairchild Semiconductor Corporation HUFA76419P3, HUFA76419S3S Rev. B

 HUFA76419P3, HUFA76419S3S

Typical Performance Curves

1.2 30
POWER DISSIPATION MULTIPLIER

1.0 VGS = 10V

ID, DRAIN CURRENT (A)

0.8 20
VGS = 4.5V
0.6

0.4 10

0.2

0
0
0 25 50 75 100 125 150 175 25 50 75 100 125 150 175
TC , CASE TEMPERATURE (oC) TC, CASE TEMPERATURE (oC)

FIGURE 1. NORMALIZED POWER DISSIPATION vs CASE FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs
TEMPERATURE CASE TEMPERATURE

2
DUTY CYCLE - DESCENDING ORDER
1 0.5
0.2
0.1
THERMAL IMPEDANCE
ZθJC, NORMALIZED

0.05
0.02
0.01
PDM
0.1
t1
t2
NOTES:
SINGLE PULSE DUTY FACTOR: D = t1/t2
PEAK TJ = PDM x ZθJC x RθJC + TC
0.01
10-5 10-4 10-3 10-2 10-1 100 101
t, RECTANGULAR PULSE DURATION (s)

FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE

500
TC = 25oC
FOR TEMPERATURES
ABOVE 25oC DERATE PEAK
IDM, PEAK CURRENT (A)

CURRENT AS FOLLOWS:

I = I25 175 - TC
100
150

VGS = 10V VGS = 5V

TRANSCONDUCTANCE
MAY LIMIT CURRENT
IN THIS REGION
10
10-5 10-4 10-3 10-2 10-1 100 101
t, PULSE WIDTH (s)

FIGURE 4. PEAK CURRENT CAPABILITY

©2001 Fairchild Semiconductor Corporation HUFA76419P3, HUFA76419S3S Rev. B

 HUFA76419P3, HUFA76419S3S

Typical Performance Curves (Continued)

200 60

100

IAS, AVALANCHE CURRENT (A)

STARTING TJ = 25oC
ID, DRAIN CURRENT (A)

100µs 10 STARTING TJ = 150oC

10
OPERATION IN THIS
AREA MAY BE
LIMITED BY rDS(ON) 1ms
If R = 0
tAV = (L)(IAS)/(1.3*RATED BVDSS - VDD)
SINGLE PULSE
10ms If R ≠ 0
TJ = MAX RATED TC = 25oC tAV = (L/R)ln[(IAS*R)/(1.3*RATED BVDSS - VDD) +1]
1 1
1 10 100 200 0.001 0.01 0.1 1 10
VDS, DRAIN TO SOURCE VOLTAGE (V) tAV, TIME IN AVALANCHE (ms)
NOTE: Refer to Fairchild Application Notes AN9321 and AN9322.
FIGURE 5. FORWARD BIAS SAFE OPERATING AREA FIGURE 6. UNCLAMPED INDUCTIVE SWITCHING
CAPABILITY

60 60
PULSE DURATION = 80µs VGS = 10V
VGS = 5V
DUTY CYCLE = 0.5% MAX
50 VDD = 15V 50
ID, DRAIN CURRENT (A)

ID, DRAIN CURRENT (A)

VGS = 4V
40 40

30 30
VGS = 3.5V
20 20
PULSE DURATION = 80µs
TJ = 175oC DUTY CYCLE = 0.5% MAX
10 10
TJ = 25oC
VGS = 3V TC = 25oC
TJ = -55oC
0 0
1 2 3 4 5 0 1 2 3 4
VGS, GATE TO SOURCE VOLTAGE (V) VDS, DRAIN TO SOURCE VOLTAGE (V)

FIGURE 7. TRANSFER CHARACTERISTICS FIGURE 8. SATURATION CHARACTERISTICS

50 2.5
ID = 29A PULSE DURATION = 80µs PULSE DURATION = 80µs
NORMALIZED DRAIN TO SOURCE

DUTY CYCLE = 0.5% MAX DUTY CYCLE = 0.5% MAX

TC = 25oC
rDS(ON), DRAIN TO SOURCE

ID = 10A
ON RESISTANCE (mΩ)

2.0
ON RESISTANCE

40
ID = 19A
1.5

30
1.0

VGS = 10V, ID = 29A

20 0.5
2 4 6 8 10 -80 -40 0 40 80 120 160 200
VGS, GATE TO SOURCE VOLTAGE (V) TJ, JUNCTION TEMPERATURE (oC)

FIGURE 9. DRAIN TO SOURCE ON RESISTANCE vs GATE FIGURE 10. NORMALIZED DRAIN TO SOURCE ON
VOLTAGE AND DRAIN CURRENT RESISTANCE vs JUNCTION TEMPERATURE

©2001 Fairchild Semiconductor Corporation HUFA76419P3, HUFA76419S3S Rev. B

 HUFA76419P3, HUFA76419S3S

Typical Performance Curves (Continued)

1.2 1.2
VGS = VDS, ID = 250µA ID = 250µA

NORMALIZED DRAIN TO SOURCE

BREAKDOWN VOLTAGE
THRESHOLD VOLTAGE

1.0
NORMALIZED GATE

1.1

0.8

1.0
0.6

0.4 0.9
-80 -40 0 40 80 120 160 200 -80 -40 0 40 80 120 160 200
TJ, JUNCTION TEMPERATURE (oC) TJ , JUNCTION TEMPERATURE (oC)

FIGURE 11. NORMALIZED GATE THRESHOLD VOLTAGE vs FIGURE 12. NORMALIZED DRAIN TO SOURCE BREAKDOWN
JUNCTION TEMPERATURE VOLTAGE vs JUNCTION TEMPERATURE

2000 10

VGS , GATE TO SOURCE VOLTAGE (V)

CISS = CGS + CGD VDD = 30V
1000
COSS ≅ CDS + CGD 8
C, CAPACITANCE (pF)

6
CRSS = CGD
100
4
WAVEFORMS IN
DESCENDING ORDER:
2 ID = 29A
ID = 19A
VGS = 0V, f = 1MHz ID = 10A
10 0
0.1 1 10 60 0 5 10 15 20 25
VDS , DRAIN TO SOURCE VOLTAGE (V) Qg, GATE CHARGE (nC)
NOTE: Refer to Fairchild Application Notes AN7254 and AN7260.
FIGURE 13. CAPACITANCE vs DRAIN TO SOURCE VOLTAGE FIGURE 14. GATE CHARGE WAVEFORMS FOR CONSTANT
GATE CURRENT

250 150
VGS = 4.5V, VDD = 30V, ID = 18A VGS = 10V, V DD = 30V, ID = 29A
tr
200
SWITCHING TIME (ns)
SWITCHING TIME (ns)

100
150 tf
tr
tf
100
td(OFF) 50
td(OFF)
50
td(ON)
td(ON)
0 0
0 10 20 30 40 50 0 10 20 30 40 50
RGS, GATE TO SOURCE RESISTANCE (Ω) RGS, GATE TO SOURCE RESISTANCE (Ω)

FIGURE 15. SWITCHING TIME vs GATE RESISTANCE FIGURE 16. SWITCHING TIME vs GATE RESISTANCE

©2001 Fairchild Semiconductor Corporation HUFA76419P3, HUFA76419S3S Rev. B

 HUFA76419P3, HUFA76419S3S

Test Circuits and Waveforms

VDS
BVDSS

L tP
VDS

VARY tP TO OBTAIN IAS

+ VDD
REQUIRED PEAK IAS RG
VDD
VGS -
DUT

tP
0V IAS
0
0.01Ω
tAV

FIGURE 17. UNCLAMPED ENERGY TEST CIRCUIT FIGURE 18. UNCLAMPED ENERGY WAVEFORMS

VDS
RL VDD Qg(TOT)

VDS
VGS = 10V

VGS Qg(5)
+
VDD
VGS VGS = 5V
-

DUT VGS = 1V
Ig(REF) 0
Qg(TH)
Qgs Qgd

Ig(REF)
0

FIGURE 19. GATE CHARGE TEST CIRCUIT FIGURE 20. GATE CHARGE WAVEFORMS

VDS tON tOFF

td(ON) td(OFF)

RL tr tf
VDS
90% 90%

+
VGS
VDD 10% 10%
- 0

DUT 90%
RGS
VGS 50% 50%
PULSE WIDTH
VGS 10%
0

FIGURE 21. SWITCHING TIME TEST CIRCUIT FIGURE 22. SWITCHING TIME WAVEFORM

©2001 Fairchild Semiconductor Corporation HUFA76419P3, HUFA76419S3S Rev. B

 HUFA76419P3, HUFA76419S3S

PSPICE Electrical Model

.SUBCKT HUFA76419 2 1 3 ; rev 21 June 1999

CA 12 8 1.1e-9
CB 15 14 1.1e-9
CIN 6 8 8.5e-10

DBODY 7 5 DBODYMOD
LDRAIN
DBREAK 5 11 DBREAKMOD DPLCAP 5 DRAIN
DPLCAP 10 5 DPLCAPMOD 2
10
RLDRAIN
EBREAK 11 7 17 18 69.6 RSLC1
51 DBREAK
EDS 14 8 5 8 1 +
EGS 13 8 6 8 1 RSLC2
5
ESG 6 10 6 8 1 ESLC 11
51
EVTHRES 6 21 19 8 1 -
EVTEMP 20 6 18 22 1 50 +
-
RDRAIN 17 DBODY
6 EBREAK 18
ESG 8
IT 8 17 1
+ EVTHRES 16
-
+ 19 - 21
LDRAIN 2 5 1e-9 LGATE EVTEMP MWEAK
8
LGATE 1 9 4.4e-9 GATE RGATE + 18 - 6
LSOURCE 3 7 4.5e-9 1 22 MMED
9 20
RLGATE MSTRO
MMED 16 6 8 8 MMEDMOD
MSTRO 16 6 8 8 MSTROMOD LSOURCE
CIN SOURCE
MWEAK 16 21 8 8 MWEAKMOD 8 7 3
RBREAK 17 18 RBREAKMOD 1 RSOURCE
RLSOURCE
RDRAIN 50 16 RDRAINMOD 1.5e-2
RGATE 9 20 3.1 S1A S2A
12 RBREAK
RLDRAIN 2 5 10 13 14 15
17 18
RLGATE 1 9 44 8 13
RLSOURCE 3 7 45
S1B S2B RVTEMP
RSLC1 5 51 RSLCMOD 1e-6
RSLC2 5 50 1e3 13 CB 19
CA
RSOURCE 8 7 RSOURCEMOD 9e-3 + + 14 IT -
RVTHRES 22 8 RVTHRESMOD 1 6 5 VBAT
RVTEMP 18 19 RVTEMPMOD 1 EGS EDS +
8 8
- - 8
S1A 6 12 13 8 S1AMOD 22
S1B 13 12 13 8 S1BMOD RVTHRES
S2A 6 15 14 13 S2AMOD
S2B 13 15 14 13 S2BMOD

VBAT 22 19 DC 1

ESLC 51 50 VALUE={(V(5,51)/ABS(V(5,51)))*(PWR(V(5,51)/(1e-6*70),3.5))}

.MODEL DBODYMOD D (IS = 1.3e-12 RS = 7.5e-3 TRS1 = 1e-4 TRS2 = 3e-6 CJO = 1.07e-9 TT = 4.9e-8 N = 1.03 M = 0.5)
.MODEL DBREAKMOD D (RS = 3.5e- 1TRS1 = 1e- 4TRS2 = 0)
.MODEL DPLCAPMOD D (CJO = 7.5e-1 0IS = 1e-3 0N = 10 M = 0.85)
.MODEL MMEDMOD NMOS (VTO = 2.0 KP = 4 IS = 1e-30 N = 10 TOX = 1 L = 1u W = 1u RG = 3.1)
.MODEL MSTROMOD NMOS (VTO = 2.34 KP = 43 IS = 1e-30 N = 10 TOX = 1 L = 1u W = 1u)
.MODEL MWEAKMOD NMOS (VTO = 1.74 KP = 0.13 IS = 1e-30 N = 10 TOX = 1 L = 1u W = 1u RG = 31 RS = 0.1)
.MODEL RBREAKMOD RES (TC1 = 1.2e- 3TC2 = -5e-7)
.MODEL RDRAINMOD RES (TC1 = 9e-3 TC2 = 2e-5)
.MODEL RSLCMOD RES (TC1 = 3.5e-3 TC2 = 7e-6)
.MODEL RSOURCEMOD RES (TC1 = 1e-3 TC2 = 1e-6)
.MODEL RVTHRESMOD RES (TC1 = -1.8e-3 TC2 = -5.8e-6)
.MODEL RVTEMPMOD RES (TC1 = -1.7e- 3TC2 = 1e-6)

.MODEL S1AMOD VSWITCH (RON = 1e-5 ROFF = 0.1 VON = -4.5 VOFF= -2.8)
.MODEL S1BMOD VSWITCH (RON = 1e-5 ROFF = 0.1 VON = -2.8 VOFF= -4.5)
.MODEL S2AMOD VSWITCH (RON = 1e-5 ROFF = 0.1 VON = -0.5 VOFF= 0.5)
.MODEL S2BMOD VSWITCH (RON = 1e-5 ROFF = 0.1 VON = 0.5 VOFF= -0.5)

.ENDS

NOTE: For further discussion of the PSPICE model, consult A New PSPICE Sub-Circuit for the Power MOSFET Featuring Global
Temperature Options; IEEE Power Electronics Specialist Conference Records, 1991, written by William J. Hepp and C. Frank Wheatley.

©2001 Fairchild Semiconductor Corporation HUFA76419P3, HUFA76419S3S Rev. B

 HUFA76419P3, HUFA76419S3S

SABER Electrical Model

REV 21 June 1999
template HUFA76419 n2,n1,n3
electrical n2,n1,n3
{
var i iscl
d..model dbodymod = (is = 1.3e-12, cjo = 1.07e-9, tt = 4.9e-8, n=1.03, m = 0.5)
d..model dbreakmod = ()
d..model dplcapmod = (cjo = 7.5e-10, is = 1e-30, m = 0.85, n = 10)
m..model mmedmod = (type=_n, vto = 2.0, kp = 4, is = 1e-30, tox = 1)
m..model mstrongmod = (type=_n, vto = 2.34, kp = 43, is = 1e-30, tox = 1) LDRAIN
m..model mweakmod = (type=_n, vto = 1.74, kp = 0.13, is = 1e-30, tox = 1) DPLCAP 5 DRAIN
sw_vcsp..model s1amod = (ron = 1e-5, roff = 0.1, von = -4.5, voff = -2.8) 2
10
sw_vcsp..model s1bmod = (ron =1e-5, roff = 0.1, von = -2.8, voff = -4.5) RLDRAIN
sw_vcsp..model s2amod = (ron = 1e-5, roff = 0.1, von = -0.5, voff = 0.5) RSLC1
sw_vcsp..model s2bmod = (ron = 1e-5, roff = 0.1, von = 0.5, voff = -0.5) 51 RDBREAK
RSLC2
72 RDBODY
c.ca n12 n8 = 1.1e-9 ISCL
c.cb n15 n14 = 1.1e-9
c.cin n6 n8 = 8.5e-10 50 DBREAK
-
6 RDRAIN 71
d.dbody n7 n71 = model=dbodymod ESG 8 11
d.dbreak n72 n11 = model=dbreakmod + EVTHRES 16
d.dplcap n10 n5 = model=dplcapmod + 19 - 21
LGATE EVTEMP MWEAK
8 DBODY
i.it n8 n17 = 1 GATE RGATE + 18 - 6
1 MMED EBREAK
9 22 +
20
l.ldrain n2 n5 = 1e-9 RLGATE MSTRO 17
l.lgate n1 n9 = 4.4e-9 18 LSOURCE
l.lsource n3 n7 = 4.5e-9 CIN
8
- SOURCE
7 3
m.mmed n16 n6 n8 n8 = model=mmedmod, l=1u, w=1u RSOURCE
m.mstrong n16 n6 n8 n8 = model=mstrongmod, l=1u, w=1u RLSOURCE
m.mweak n16 n21 n8 n8 = model=mweakmod, l=1u, w=1u S1A S2A
12 RBREAK
13 14 15
res.rbreak n17 n18 = 1, tc1 = 1.2e-3, tc2 = -5e-7 17 18
8 13
res.rdbody n71 n5 = 7.5e-3, tc1 = 1e-4, tc2 = 3e-6
S1B S2B RVTEMP
res.rdbreak n72 n5 = 3.5e-1, tc1 = 1e-4, tc2 = 0
res.rdrain n50 n16 = 1.5e-2, tc1 = 9e-3, tc2 = 2e-5 13 CB 19
CA
res.rgate n9 n20 = 3.1 + + 14 IT -
res.rldrain n2 n5 = 10 6 5 VBAT
res.rlgate n1 n9 = 44 EGS 8 EDS 8 +
res.rlsource n3 n7 = 45 - - 8
res.rslc1 n5 n51 = 1e-6, tc1 = 3.5e-3, tc2 = 7e-6 22
res.rslc2 n5 n50 = 1e3 RVTHRES
res.rsource n8 n7 = 9e-3, tc1 = 1e-3, tc2 = 1e-6
res.rvtemp n18 n19 = 1, tc1 = -1.7e-3, tc2 = 1e-6
res.rvthres n22 n8 = 1, tc1 = -1.8e-3, tc2 = -5.8e-6

spe.ebreak n11 n7 n17 n18 = 69.6

spe.eds n14 n8 n5 n8 = 1
spe.egs n13 n8 n6 n8 = 1
spe.esg n6 n10 n6 n8 = 1
spe.evtemp n20 n6 n18 n22 = 1
spe.evthres n6 n21 n19 n8 = 1

sw_vcsp.s1a n6 n12 n13 n8 = model=s1amod

sw_vcsp.s1b n13 n12 n13 n8 = model=s1bmod
sw_vcsp.s2a n6 n15 n14 n13 = model=s2amod
sw_vcsp.s2b n13 n15 n14 n13 = model=s2bmod

v.vbat n22 n19 = dc=1

equations {
i (n51->n50) +=iscl
iscl: v(n51,n50) = ((v(n5,n51)/(1e-9+abs(v(n5,n51))))*((abs(v(n5,n51)*1e6/70))** 3.5))
}
}

©2001 Fairchild Semiconductor Corporation HUFA76419P3, HUFA76419S3S Rev. B

 HUFA76419P3, HUFA76419S3S

SPICE Thermal Model th JUNCTION

REV 21 June 1999

HUFA76419T

CTHERM1 th 6 1.1e-3 RTHERM1 CTHERM1

CTHERM2 6 5 2.5e-3
CTHERM3 5 4 3.6e-3
CTHERM4 4 3 8.2e-3 6
CTHERM5 3 2 2.6e-2
CTHERM6 2 tl 3.5e-1

RTHERM1 th 6 6.8e-3 RTHERM2 CTHERM2

RTHERM2 6 5 8.4e-2
RTHERM3 5 4 3.9e-1
RTHERM4 4 3 4.2e-1 5
RTHERM5 3 2 5.0e-1
RTHERM6 2 tl 2.0e-1

RTHERM3 CTHERM3

SABER Thermal Model

SABER thermal model HUFA76419T
4
template thermal_model th tl
thermal_c th, tl
{
RTHERM4 CTHERM4
ctherm.ctherm1 th 6 = 1.1e-3
ctherm.ctherm2 6 5 = 2.5e-3
ctherm.ctherm3 5 4 = 3.6e-3
ctherm.ctherm4 4 3 = 8.2e-3 3
ctherm.ctherm5 3 2 = 2.6e-2
ctherm.ctherm6 2 tl = 3.5e-1
RTHERM5 CTHERM5
rtherm.rtherm1 th 6 = 6.8e-3
rtherm.rtherm2 6 5 = 8.4e-2
rtherm.rtherm3 5 4 = 3.9e-1
rtherm.rtherm4 4 3 = 4.2e-1 2
rtherm.rtherm5 3 2 = 5.0e-1
rtherm.rtherm6 2 tl = 2.0e-1
} RTHERM6 CTHERM6

tl CASE

©2001 Fairchild Semiconductor Corporation HUFA76419P3, HUFA76419S3S Rev. B

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