EL-518: VLSI Design:

Basic VLSI Design: Fundamentals of CMOS & BiCMOS, Scaling of CMOS Devices, CMOS, Digital Circuit Design, CMOS Analog Circuit
Design, VLSI Design Methodology, Scaling of MOS Circuit, Stick Diagram & Lay out � l-rules, System Design � FSM � Model, ASM
Chart.

VLSI Physical Design: ASIC Design Flow, Top Down Approach, Bottom up approach, Partitioning � Approximation of Hyper graphs
with graphs, Kernighan � LIN, heuristic, Ratio cut partitioning, Genetic Algorithms Based portioning, F. M. partitioning, Floor
Planning � rectangular dual graph approach to floor planning, hierarchical approach simulated annealing, Floor plan sizing,
Placement � Cost function, force directed approach, placement by simulated annealing, regular placement, partitioning placement,
Routing � Line Searching, Steiner Trees, Maze Running, Global Routing � sequential approaches, hierarchical approach
randomized routing, linear programming etc., Detail Routing � channel routing, switch box routing, routing in Field Programmable
Gate Arrays (FPGA), array based and row based. Lay out Methodologies, Packaging.

EL-520: Quality and Reliability Engineering:

Basic Concepts of quality analysis. Quality costs. Probability Analysis. Quality improvement - management controllable defects.
Quality Improvement. Designing for Quality. Quality planning in Manufacturing. Inspection & Testing. Measurement, Product Safety
& Liability. Quality Assurance. Quality Information System. Concepts of Reliability. Reliability Data & Analysis. System reliability &
Modeling. Reliability Improvement, Fault Tree Analysis. & other techniques. Maintainability & Availability of equipment & Value
Engineering.

EL-522: Intelligent Instrumentation:

1.Intelligent sensors: Definitions- Classical sensors and transducers, Smart sensors, Cogent sensors, Self adaptive sensors, VLSI-
ANN sensors, MEMs , Computational sensors, Integrated intelligent sensors (ISS), Passive and active elements, AD and DA
conversions, Micromachining sensors, Thermocouple and RTD signal processing-Cold junction compensation, Integrated
compensating ADC, Realization of differential temperature, Temperature compensation in Resistive strain gauge sensors-
Integrated compensating DAC, Calibration of IC thermal sensors- Integrated calibration and compensation in pressure sensors,
Integrated offset, gain and nonliterary compensation

2.Sensor Intelligence: Metrological intelligence-Linearization techniques, Look up table, Piece-wise linearization, Interpolation,
Progressive polynomial, LMS curve fitting, PWM, ANN , Auto calibration- autozero and autorange, Offset nullification, Error and drift
compensation , Ambient errors , Circuit compensation- Dummy circuit, Mathematical compensation- Intelligent compensation,
Electrical/Electronics errors, Mechanical errors, Computational errors.

Transmission intelligence- Sampling ,Digitization and AD conversion, Signal conversion, Voltage to frequency conversion, Voltage to
current conversion, 4-20mA transmitter, Capacitance/Inductance to duty cycle, Modulation, FM, PWM

Signal manipulation intelligence- Semantic transformation, Data validation, Missing data and data restoration, Decision making,
Derived information

Artificial and adaptive Intelligence- Human intelligence, Array based sensors, Basic Sensor Metrics, Signal and image features,
Prognostics diagnostics and predictive, Tracking, classification and discrimination, Adaptive least square models
Other Intelligences- Power saving, Voltage and current regulation, Reliability, Failure detection
3.Intelligent Sensor Standards and Protocols : IEEE 1451.1, Network communication models, STIM, Lon Talk TM Protocol,
Integrated SAE JI850, MI bus, FieldBus,

EL-524: Modeling and Simulation:

Behavior simulation using VHDL, HDL, PALASM, etc. logic minimisation, Gate level simulation using view-logic, ORCAD etc., Circuit
simulation - DC, Transient, AC analysis using SPICE etc. Model cards/description of various devices convergence, circuit
cards/description, mixed mode simulation. Re-optimisation of the circuit & automatic list pattern generation. Fault simulation.

EL-516: Design of Fine Mechanics and Power Devises:

1. Survey of Mechanical Components assembly & Systems for Fine Mechanics Applications. Basic Mechanical Laws & Analysis
of Load Characteristics for actuator selection & coupling. Measurement of mechanical Parameters. Introduction to various
incremental motion systems. Principle of operation & classification of various types of stepper motors. Controls & drive
circuits. Improved control & drive techniques in open & closed loop. Use of DC motor in incremental motion systems &
related control techniques. Use of permanent magnets. Design of sensors. (Optical Encoders etc.) Design of Actuators
(Electromagnets, Step motors etc.) Design & Fabrication of Pulse & Rectifier Transformers. Operation & Characteristics of
power semiconductor devices like Thyristors, MCTs, SITHS, RCTs, GTCs, IGBTs etc. Drive & Protection of PSDs. Cooling of
PSDs. PCB design aspects of power circuits. Linear & Power switching converters.