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DESCRIPTION
The BUX87 is manufactured using High Voltage SOT-32
Multi Epitaxial Planar technology for high
switching speeds and high voltage withstand
capability.
THERMAL DATA
o
R thj-case Thermal Resistance Junction-case Max 3.12 C/W
o
R thj-amb Thermal Resistance Junction-ambient Max 100 C/W
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BUX87
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BUX87
mm inch
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
e 2.2 0.087
F 3.8 0.150
H 2.54 0.100
H2 2.15 0.084
H2
0016114
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BUX87
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express
written approval of SGS-THOMSON Microelectonics.
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This datasheet has been download from:
www.datasheetcatalog.com