To all our customers

Regarding the change of names mentioned in the document, such as Hitachi

Electric and Hitachi XX, to Renesas Technology Corp.

The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
www.DataSheet4U.com
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand
names are mentioned in the document, these names have in fact all been changed to Renesas
Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and
corporate statement, no changes whatsoever have been made to the contents of the document, and
these changes do not constitute any alteration to the contents of the document itself.

Renesas Technology Home Page: http://www.renesas.com

Renesas Technology Corp.

Customer Support Dept.
April 1, 2003
 Cautions
Keep safety first in your circuit designs!
1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better
and more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.

Notes regarding these materials

1. These materials are intended as a reference to assist our customers in the selection of the Renesas
www.DataSheet4U.com Technology Corporation product best suited to the customer's application; they do not convey any
license under any intellectual property rights, or any other rights, belonging to Renesas Technology
Corporation or a third party.
2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any
third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are
subject to change by Renesas Technology Corporation without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Renesas Technology Corporation
or an authorized Renesas Technology Corporation product distributor for the latest product information
before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss
rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corporation by various
means, including the Renesas Technology Corporation Semiconductor home page
(http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams,
charts, programs, and algorithms, please be sure to evaluate all information as a total system before
making a final decision on the applicability of the information and products. Renesas Technology
Corporation assumes no responsibility for any damage, liability or other loss resulting from the
information contained herein.
5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device
or system that is used under circumstances in which human life is potentially at stake. Please contact
Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor
when considering the use of a product contained herein for any specific purposes, such as apparatus or
systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
6. The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in
whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be
exported under a license from the Japanese government and cannot be imported into a country other
than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the
country of destination is prohibited.
8. Please contact Renesas Technology Corporation for further details on these materials or the products
contained therein.
 PF08122B
MOS FET Power Amplifier Module
for E-GSM and DCS1800 Dual Band Handy Phone

ADE-208-1400H (Z)
www.DataSheet4U.com

Rev.8
Jul. 2002

Application
• Dual band amplifier for E-GSM (880 MHz to 915 MHz) and DCS1800 (1710 MHz to 1785 MHz).
• For 3.5 V & GPRS Class12 operation compatible

Features
• All in one including output matching circuit
• Simple external circuit
• Simple power control
• High gain 3stage amplifier : 0 dBm input Typ
• Lead less thin & Small package : 8 × 13.75 × 1.6 mm Typ
• High efficiency : 55% Typ at 35.0 dBm for E-GSM
50% Typ at 32.5 dBm for DCS1800
• Lower consume current at low power
100 mA Typ at 7 dBm for E-GSM
60 mA Typ at 5 dBm for DCS1800

Pin Arrangement

• RF-K-8A 1: Pin GSM

2: Vapc
5 3: Vdd1
G6 G 4: Pout GSM
8 7
5: Pout DCS
4 6: Vdd2
G G 3
12 7: Vctl
8: Pin DCS
G: GND
 PF08122B

Absolute Maximum Ratings

(Tc = 25°C)

Item Symbol Rating Unit Remark

Supply voltage Vdd 7.0 V at no-operation
5.0 V at operation (50 Ω load)
Supply current Idd GSM 3.5 A

w w w . D a t a S h e e t 4 U . c o m
Idd DCS 2 A
Vctl voltage Vctl 4 V
Vapc voltage Vapc 4 V
Input power Pin 10 dBm
Operating case temperature Tc (op) −25 to +90 °C
Storage temperature Tstg −30 to +100 °C
Output power Pout GSM 5 W
Pout DCS 3 W
Note: The maximum ratings shall be valid over both the E-GSM-band (880 to 915 MHz),
and the DCS1800-band (1710 to 1785 MHz).

Electrical Characteristics for DC

(Tc = 25°C)

Item Symbol Min Typ Max Unit Test Condition

Drain cutoff current Ids   20 µA Vdd = 4.7 V, Vapc = 0 V,
Vctl = 0.2 V
Vapc control current Iapc   2.0 mA Vapc = 2.2 V
Vctl control current Ictl   2 µA Vctl = 3 V

Rev.8, Jul. 2002, page 2 of 11

 PF08122B

Electrical Characteristics for GSM900 band

(Tc = 25°C)

Test conditions unless otherwise noted:

f = 880 to 915 MHz, Vdd1 = Vdd2 = 3.5 V, Pin = 0 dBm, Vctl = 2.0 V, Rg = Rl = 50 Ω, Tc = 25°C,
Pulse operation with pulse width 1154 µs and duty cycle 2:8 shall be used.

Item Symbol Min Typ Max Unit Test Condition

www.DataSheet4U.com Frequency range f 880  915 MHz

Band select (GSM active) Vctl 2.0  2.8 V
Input power Pin –2 0 2 dBm
Control voltage range Vapc 0.2  2.2 V
Supply voltage Vdd 3.0 3.5 4.5 V
Total efficiency ηT 47 55  % Pout GSM = 35 dBm,
Vapc = controlled
2nd harmonic distortion 2nd H.D.  −45 −35 dBc
3rd harmonic distortion 3rd H.D.  −45 −35 dBc
4th~8th harmonic distortion 4th~8th H.D.   −35 dBc
Input VSWR VSWR (in)  1.5 3 
Output power (1) Pout (1) 35.0 36.0  dBm Vapc = 2.2 V
Output power (2) Pout (2) 33.5 34.5  dBm Vdd = 3.1 V, Vapc = 2.2 V,
Tc = +85°C
Idd at Low power   100 300 mA Pout GSM = 7 dBm
Isolation   −50 −37 dBm Vapc = 0.2 V
Isolation at   −25 −18 dBm Pout GSM = 35 dBm,
DCS RF-output Measured at f = 1760 to 1830 MHz
when GSM is active
Switching time t r, t f  1 2 µs Pout GSM = 5 to 35 dBm
Stability  No parasitic oscillation  Vdd = 3.1 to 4.5 V, Pout ≤ 35 dBm,
Vapc GSM ≤ 2.2 V,
Rg = 50 Ω, Tc = 25°C,
Output VSWR = 6 : 1 All phases
Load VSWR tolerance  No degradation  Vdd = 3.1 to 4.5 V, Pout GSM ≤ 35 dBm,
Vapc GSM ≤ 2.2 V,
Rg = 50 Ω, t = 20 sec., Tc = 25°C,
Output VSWR = 10 : 1 All phases
Load VSWR tolerance  No degradation  Vdd = 3.1 to 4.2 V, Pout GSM ≤ 35 dBm,
at GPRS CLASS 12 Vapc GSM ≤ 2.2 V,
operation Rg = 50 Ω, t = 20 sec., Tc ≤ 90°C,
Output VSWR = 10 : 1 All phases
Slope Pout/Vapc   160 200 dB/V Pout GSM = 5 to 35 dBm
AM output   15 30 % Pout GSM = 5 to 35 dBm,
4% AM modulation at input
50 kHz modulation frequency

Rev.8, Jul. 2002, page 3 of 11

 PF08122B
Electrical Characteristics for DCS1800 band
(Tc = 25°C)

Test conditions unless otherwise noted:

f = 1710 to 1785 MHz, Vdd1 = Vdd2 = 3.5 V, Pin = 0 dBm, Vctl = 0.2 V, Rg = Rl = 50 Ω, Tc = 25°C,
Pulse operation with pulse width 1154 µs and duty cycle 2:8 shall be used.

Item Symbol Min Typ Max Unit Test Condition

Frequency range f 1710  1785 MHz
www.DataSheet4U.com
Band select (DCS active) Vctl 0  0.2 V
Input power Pin –2 0 2 dBm
Control voltage range Vapc 0.2  2.2 V
Supply voltage Vdd 3.0 3.5 4.5 V
Total efficiency ηT 43 50  % Pout DCS = 32.5 dBm,
Vapc = controlled
2nd harmonic distortion 2nd H.D.  −45 −35 dBc
3rd harmonic distortion 3rd H.D.  −45 −35 dBc
4th~8th harmonic distortion 4th~8th H.D.   –35 dBc
Input VSWR VSWR (in)  1.5 3 
Output power (1) Pout (1) 32.5 33.5  dBm Vapc = 2.2 V
Output power (2) Pout (2) 31.0 32.0  dBm Vdd = 3.1 V, Vapc = 2.2 V,
Tc = +85°C,
Idd at Low power   60 150 mA Pout DCS = 5 dBm
Isolation   −47 −37 dBm Vapc = 0.2 V
Switching time t r, t f  1 2 µs Pout DCS = 0 to 32.5 dBm
Stability  No parasitic oscillation  Vdd = 3.1 to 4.5 V, Pout DCS ≤ 32.5 dBm,
Vapc ≤ 2.2 V, Rg = 50 Ω,
Output VSWR = 6 : 1 All phases
Load VSWR tolerance  No degradation  Vdd = 3.1 to 4.5 V, Pout DCS ≤ 32.5 dBm,
Vapc ≤ 2.2 V,
Rg = 50 Ω, t = 20 sec., Tc = 25°C,
Output VSWR = 10 : 1 All phases
Load VSWR tolerance  No degradation  Vdd = 3.1 to 4.2 V, Pout DCS ≤ 32.5 dBm,
at GPRS CLASS 12 Vapc ≤ 2.2 V,
operation Rg = 50 Ω, t = 20 sec., Tc ≤ 90°C,
Output VSWR = 10 : 1 All phases
Slope Pout/Vapc   160 200 dB/V Pout DCS = 0 to 32.5 dBm
AM output   15 30 % Pout DCS = 0 to 32.5 dBm,
4% AM modulation at input
50 kHz modulation frequency

Rev.8, Jul. 2002, page 4 of 11

 PF08122B

Circuit Diagram

PIN7 PIN6
Vctl Vdd2

PIN8 PIN5
Pin DCS Pout DCS

www.DataSheet4U.com
PIN1 PIN4
Pin GSM Pout GSM

Bias circuit

PIN2 PIN3
Vapc Vdd1

Rev.8, Jul. 2002, page 5 of 11

 PF08122B

Characteristic Curves

GSM mode (880MHz to 915 MHz)

GSM mode (880 MHz) Pout, Eff vs. Vapc GSM mode (915 MHz) Pout, Eff vs. Vapc
40 100 40 100
30 Pin = 0 dBm 90 30 Pin = 0 dBm 90
20 Vdd = 3.5 V 80 20 Vdd = 3.5 V 80
Pout (dBm)

Pout (dBm)
10 Vapc = control 70 10 Vapc = control 70
Eff

Eff (%)

Eff (%)
0 Tc = 25°C Eff 60 0 Tc = 25°C 60
www.DataSheet4U.com –10 Pout 50 –10 Pout 50
–20 40 –20 40
–30 30 –30 30
–40 20 –40 20
–50 10 –50 10
–60 0 –60 0
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2
Vapc (V) Vapc (V)

GSM mode (880 MHz) Eff vs. Pout GSM mode (915 MHz) Eff vs. Pout
60 60
Pin = 0 dBm Pin = 0 dBm
50 Vdd = 3.5 V 50 Vdd = 3.5 V
Vapc = control Vapc = control
40 Tc = 25°C 40 Tc = 25°C
Eff (%)

Eff (%)

30 30
20 20
10 10
0 0
0 5 10 15 20 25 30 35 40 0 5 10 15 20 25 30 35 40
Pout (dBm) Pout (dBm)

GSM mode (880 MHz) Pout, Eff vs. Pin GSM mode (915 MHz) Pout, Eff vs. Pin
38.0 55 37.0 60
Vdd = 3.5 V Vdd = 3.5 V Eff
37.5 Tc = 25°C Eff 53 36.5 Tc = 25°C 57
Pout (dBm)

Pout (dBm)
Eff (%)

Eff (%)

37.0 51 36.0 54
Pout
36.5 Pout 49 35.5 51

36.0 Pout:Vapc = 2.2 V 47 35.0 Pout:Vapc = 2.2 V 48

Eff:Pout = 35 dBm Eff:Pout = 35 dBm
35.5 45 34.5 45
–10 –8 –6 –4 –2 0 2 4 6 8 10 –10 –8 –6 –4 –2 0 2 4 6 8 10
Pin (dBm) Pin (dBm)

Rev.8, Jul. 2002, page 6 of 11

 PF08122B

GSM mode (880MHz to 915 MHz) (cont)

GSM mode (880 MHz) Idd vs. Pout GSM mode (915 MHz) Idd vs. Pout
10 10
Pin = 0 dBm Pin = 0 dBm
Vdd = 3.5 V Vdd = 3.5 V
Vapc = control Vapc = control
1 Tc = 25°C 1 Tc = 25°C
Idd (A)

Idd (A)
0.1 0.1
www.DataSheet4U.com

0.01 0.01
–50 –40 –30 –20 –10 0 10 20 30 40 –50 –40 –30 –20 –10 0 10 20 30 40
Pout (dBm) Pout (dBm)

GSM mode Pout, Eff vs. Freq GSM mode Pout vs. Vdd
38 60 39.0
Pout Eff
37 55 38.0
Pout (dBm)

Pout (dBm)

880 MHz
Eff (%)

36 50 37.0 915 MHz

35 Vdd = 3.5 V 45 36.0 Vdd = 3.5 V
Tc = 25°C Tc = 25°C
34 Pout:Vapc = 2.2 V 40 35.0 Pout:Vapc = 2.2 V
Eff:Pout = 35 dBm Eff:Pout = 35 dBm
33 35 34.0
800 820 840 860 880 900 920 940 960 3 3.2 3.4 3.6 3.8 4 4.2 4.4
Freq (MHz) Vdd (V)

GSM mode (880 MHz) Pout vs. Pin (Temperature variation) GSM mode (915 MHz) Pout vs. Pin (Temperature variation)
37.0 37.0
Vapc = 2.2 V Vdd = 3.5 V, Tc = 25°C Vapc = 2.2 V
36.0 Vdd = 3.5 V, Tc = 85°C 36.0 Vdd = 3.5 V, Tc = 25°C
Pout (dBm)

Pout (dBm)

Vdd = 3.5 V, Tc = 85°C

35.0 35.0
Vdd = 3.1 V, Tc = 85°C

34.0 34.0 Vdd = 3.1 V, Tc = 85°C

33.0 33.0
–8 –6 –4 –2 0 2 4 6 8 –8 –6 –4 –2 0 2 4 6 8
Pin (dBm) Pin (dBm)

Rev.8, Jul. 2002, page 7 of 11

 PF08122B

DCS mode (1710MHz to 1785 MHz)

DCS mode (1710 MHz) Pout, Eff vs. Vapc DCS mode (1785 MHz) Pout, Eff vs. Vapc
40 100 40 100
30 Pin = 0 dBm 90 30 Pin = 0 dBm 90
Vdd = 3.5 V 80 Vdd = 3.5 V 80
20 Vapc = control 20 Vapc = control
Pout (dBm)

Pout (dBm)
10
0 70 10
0 70
Tc = 25°C Tc = 25°C

Eff (%)

Eff (%)
–10 Pout Eff 60 –10 Pout Eff 60
50 50
–20 40 –20 40
–30 30 –30 30
www.DataSheet4U.com –40 20 –40 20
–50 10 –50 10
–60 0 –60 0
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2
Vapc (V) Vapc (V)

DCS mode (1710 MHz) Eff vs. Pout DCS mode (1785 MHz) Eff vs. Pout
60 60
Pin = 0 dBm Pin = 0 dBm
50 Vdd = 3.5 V 50 Vdd = 3.5 V
Vapc = control Vapc = control
40 Tc = 25°C 40 Tc = 25°C
Eff (%)

Eff (%)

30 30
20 20
10 10
0 0
0 5 10 15 20 25 30 35 0 5 10 15 20 25 30 35
Pout (dBm) Pout (dBm)

DCS mode (1710 MHz) Pout, Eff vs. Pin DCS mode (1785 MHz) Pout, Eff vs. Pin
34.0 55 33.5 55

33.0 52
33.5 Pout
Pout (dBm)

Pout (dBm)

Eff 50
Eff (%)

Eff (%)
32.5 49
33.0 Pout
Vdd = 3.5 V 32.0 Vdd = 3.5 V 46
45 Eff
32.5 Tc = 25°C Tc = 25°C
Pout:Vapc = 2.2 V 31.5 Pout:Vapc = 2.2 V 43
Eff:Pout = 32.5 dBm Eff:Pout = 32.5 dBm
32.0 40 31.0 40
–10 –8 –6 –4 –2 0 2 4 6 8 10 –10 –8 –6 –4 –2 0 2 4 6 8 10
Pin (dBm) Pin (dBm)

Rev.8, Jul. 2002, page 8 of 11

 PF08122B

DCS mode (1710MHz to 1785 MHz) (cont)

DCS mode (1710 MHz) Idd vs. Pout DCS mode (1785 MHz) Idd vs. Pout
10 10
Pin = 0 dBm Pin = 0 dBm
Vdd = 3.5 V Vdd = 3.5 V
Vapc = control Vapc = control
1 Tc = 25°C 1 Tc = 25°C
Idd (A)

Idd (A)
0.1 0.1
www.DataSheet4U.com

0.01 0.01
–50 –40 –30 –20 –10 0 10 20 30 40 –50 –40 –30 –20 –10 0 10 20 30 40
Pout (dBm) Pout (dBm)

DCS mode Pout, Eff vs. Freq DCS mode Pout vs. Vdd
35 60 36.0
Pin = 0 dBm 1710 MHz
34 Pout 55 35.0 Vapc = 2.2 V
Pout (dBm)

Pout (dBm)

Tc = 25°C
Eff (%)

33 50 34.0 1785 MHz

Eff
32 Vdd = 3.5 V 45 33.0
Tc = 25°C
31 Pout:Vapc = 2.2 V 40 32.0
Eff:Pout = 32.5 dBm
30 35 31.0
1600 1650 1700 1750 1800 1850 1900 3 3.2 3.4 3.6 3.8 4 4.2 4.4
Freq (MHz) Vdd (V)

DCS mode (1710 MHz) Pout vs. Pin (Temperature variation) DCS mode (1785 MHz) Pout vs. Pin (Temperature variation)
35.0 35.0
Vapc = 2.2 V Vapc = 2.2 V
34.0 Vdd = 3.5 V, Tc = 25°C 34.0
Pout (dBm)

Pout (dBm)

Vdd = 3.5 V, Tc = 25°C

33.0 Vdd = 3.5 V, Tc = 85°C 33.0
Vdd = 3.5 V, Tc = 85°C
32.0 32.0
Vdd = 3.1 V, Tc = 85°C
31.0 31.0 Vdd = 3.1 V, Tc = 85°C

30.0 30.0
–8 –6 –4 –2 0 2 4 6 8 –8 –6 –4 –2 0 2 4 6 8
Pin (dBm) Pin (dBm)

Rev.8, Jul. 2002, page 9 of 11

 PF08122B

Package Dimensions

Unit: mm

1.6 ± 0.2
8 7 G 6 5

8.0 ± 0.3
8.0 ± 0.3

www.DataSheet4U.com
G G

1 2 G 3 4
(Upper side) 5
G6 G
8 7
4
G G 3
13.75 ± 0.3 12
1: Pin GSM
(5.375) (5.375)
2: Vapc
3: Vdd1
(3.275) (3.275)
4: Pout GSM
(1.6) (1.6) (3.7) (1.6) (1.6) 5: Pout DCS
(1.1) (0.3)

6: Vdd2
(1.3) 7: Vctl
8: Pin DCS
(1.5) (1.5)

(0.7)
G: GND
(2.2)
(3.7)

(1.4) (2.4) (3.7) (2.4)

(0.3) (1.1)

Remark:
(3.7) (3.7)
Coplanarity of bottom side of terminals
(Bottom side) are less than 0 ± 0.1mm.
Hitachi Code RF-K-8A
JEDEC 
JEITA 
Mass (reference value) 

Rev.8, Jul. 2002, page 10 of 11

 PF08122B

www.DataSheet4U.com

Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Keep safety first in your circuit designs!
1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with
them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of
nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corporation product best suited to the customer's application; they
do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corporation or a third party.
2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts,
programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these
materials, and are subject to change by Renesas Technology Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers
contact Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor for the latest product information before purchasing a product listed
herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corporation by various means, including the Renesas Technology Corporation Semiconductor home page
(http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information
as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corporation assumes no responsibility for any damage,
liability or other loss resulting from the information contained herein.
5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially
at stake. Please contact Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor when considering the use of a product contained
herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
6. The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be
imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
8. Please contact Renesas Technology Corporation for further details on these materials or the products contained therein.

http://www.renesas.com

Copyright © 2003. Renesas Technology Corporation, All rights reserved. Printed in Japan.
Colophon 0.0

Rev.8, Jul. 2002, page 11 of 11