MULTIFUNCTION VEHICLE BUS INTERFACE MODULE (MVB)

• Enables redundant MVB bus interfaces

• Conforms to IEC 61375-1 standard
• ESD+, EMD or OGF type medium
• Local processor for implementing TCN link layer
functions
• IEC 821 VMEbus interface for Gateway access
• Complies to EN 50155 standard for electronics in
railway rolling stock

The EKE-Trainnet® MVB modules

FEATURES AND BENEFITS Optical Glass Fibre (OGF) medium

The MVB module is the Multi-Function
Vehicle Bus (MVB) interface module for
EKE-Trainnet® family of products. It
provides the train networking, diagnostics
and control applications of the coach
computer with all the necessary functions
for accessing the MVB vehicle bus.
Redundant bus operation is supported
through to the bus interfacing ASIC
circuitry and the link layer functions are
implemented with the local processor on
the module. TCN Real Time Protocols will
be implemented by the system CPU.
The MVB module is realised through a
highly efficient combination of local
microprocessor, FPGA logic and a
dedicated MVB controller. Optically
isolated Electrical Short Distance (ESD+),
Electrical Medium Distance (EMD) and
physical interfaces are supported.
The interface connectors are located at
the front panel of the module and
communication to the system CPU module
is done via the VME back plane bus.
PROPERTIES
The MVB Module of the Vehicle Computer
implements the MVB link layer functions of
the IEC 61375-1 Train Communications
Network Standard.
The MVB Module supports full bus master
functionality as specified in the IEC 61375-
1 Standard.
Cable redundancy is implemented up to
the MVBC02 ASIC, i.e. there is one ASIC
on the board.
A dedicated firmware is implemented to
correct the erroneous redundancy
management of the ASIC, i.e. the
automatic redundancy feature of the ASIC
is not used.
Bus administrator redundancy is
supported on software level.
Standard bus connectors: two (2) sub D-9
connectors for EMD medium and ESD+
medium or four (4) ST-bayonet fibre
connectors for OGF medium. Mechanical
coding of the MVB connectors will be
available. The coding method will be
chosen during the project design phase.
The module utilizes MVBC02 ASIC
IEC 821 VMEbus interface for gateway
CPU access.

Technical Information:
DIMENSIONS: ESD+: 4 TE × 3 U × 160 mm (W × H × D)
EMD: 8 TE × 3 U × 160 mm (W × H × D)
OGF: 4 TE × 3 U × 160 mm (W × H × D)
WEIGHT: ESD+: 160 g
EMD: 220 g
OGF: 180 g
INPUT POWER: 5 V DC ± 5% (1 A max., 0.5 A typ.)
MTBF: ESD+: 1.408.000 h (40°C ambient temperature)
EMD: 1.408.000 h (40°C ambient temperature)
OGF: 618.000 h (40°C ambient temperature)
TEMPERATURE RANGE: Operational -40°C…+70°C

VEHICLE BUS (IEC 61375-1: MVB)

Data rate: 1,5 Mbit/s; Manchester encoding
Medium: Optically isolated Electrical Short Distance (ESD+)
Electrical Medium Distance ( EMD)
Optical Glass Fibre (OGF)

VMEbus (IEC 821)

Interface: A24 Slave with D08(EO)/D16
246 kB SRAM and 512 kB traffic memory for
process and message data

EKE-Trainnet® MVB module block diagram

EKE-Electronics Ltd.
EKE-Trainnet® is a registered trademark of EKE-Electronics Ltd. Piispanportti 7 – 02240 Espoo – FINLAND
All data subject to change without notice. Tel: +358 9 6130 3308 – Fax: +358 9 6130 3300
08/2006 www.eke.com – electronics@eke.fi