JAMES D. MACDONALD, JR.

2290 E.Coconino Dr.

Chandler, AZ 85249
(919) 274-4670 (mobile)
jmdd21f8@westpost.net
SUMMARY
* 30 years industry experience in new product design, development, and manufactu
ring
* Proven record of building successful product design and development teams
* Specializing in mechanical, electronic/microelectronic, and RF packaging
ACCOMPLISHMENTS
* Led Freescale packaging team for 77GHz Automotive Radar package and module des
igns
* MEMS wafer level chip scale RF oscillator using vacuum packaged resonator on s
ynthesizer ASIC as direct chip attach package
* Led mechanical design of Ericsson concept phones and advanced microelectronic
packaging
* Wrote winning bid, designed and shipped the integrated antenna and electronic
WRA's for the Navy's current lead MMW Radar Warning Receiver- ALR-67 V3
* Developed substrate system and flexible automated manufacturing line for the h
igh volume production of optoelectronic assemblies- this substrate array proces
s is now mainstream at major packaging subcons
* 27 US Patents
EXPERIENCE
Freescale Semiconductor, Inc., Tempe, AZ 2006- 2010
Automotive Radar Development Leader- Technology Solutions Organization (TSO)
2006- 2010
* Initiated (2007) and led (2010) program for development of 77GHz auto radar ch
ip scale packages with integrated antennas, TX/RX module assemblies
Packaging Development Manager- Sensors and Actuator Solutions Div.(SASD)
* Leader of MEMS Division packaging development group responsible for design, NP
I, and manufacturing of products: automotive, consumer and industrial for inert
ial, pressure, proximity, magnetic, and RF/MMW products
* Grew team from 6 to 14 packaging engineers, implemented modeling and verificat
ion techniques to meet industry best product performance requirements. Increase
d NPI's from 4 to 14 per year, owned product roadmaps
* Initiated DARPA sponsored advanced modeling technique development for MEMS tra
nsducer and package interactions in high G environments to address stiction and
breakage issues
Discera, Inc., San Jose, CA 2003 - 2006
Director of Manufacturing
* Key participant in initial fund raising involving Qualcomm Ventures, 3I, Parte
ch, and Ardesta. Directed Operations and Manufacturing during start-up
* Built interdisciplinary engineering team of 10 to develop a package and qualif
y the manufacturing processes for Chip Scale Package (CSP) Programmable RF freq
uency source products, also generating several key patents
* Team produced new type wafer level vacuum package for RF MEMS: resonator flip
chip integrated onto control ASIC for direct chip attach form factor
* Team installed key equipment required for process development at San Jose Lab,
selected key suppliers, and out-sourced production to Asia
Ericsson, Inc., 1995 - 2003
Ericsson Microelectronics, Richardson, TX 2001 - 2003
Design Center Manager (2001 - 2003)
* Refocused small 6 member R&D group specializing in RF power transistors to cus
tom solutions for Bluetooth and WiFi: hardware, software, and manufacturing in m
ultiple locations worldwide, coordinating new customer products and product lin
e engineering
* Responsible for hardware and software development in multiple locations in US
and Sweden as well as product manufacturing at Ericsson factories worldwide
* Sponsored development of unique integrated antennas for Bluetooth/802.11 trans
ceivers
* Infineon Technologies purchased Microelectronics Division in 2002 -became Mana
ger of Advanced Packaging RF Products at Infineon- development and manufacturing
of RF power transistor packages for cellular base stations
Ericsson Mobile Communications, RTP, NC 1995 - 2001
Sr. Consulting Engineer (1995 - 2001)
* Research and Technology - Mechanical concepts of new phone platforms and micro
electronic packaging
* Platform phone project management of up to 12 engineers on major concepts: pho
ne platform, antennas, advanced SMD packaging, modules, and phone accessories
* Lead role for design and manufacturing of RF module products for GPS and Bluet
ooth
* Founding member of Ericsson worldwide Packaging Interconnect and Assembly Coun
cil (PIA) responsible for roadmaps, advanced packaging, phone development, and m
anufacturing, Ericsson Distinguished Inventor Award 2000
Technical Manager - Research and Development
* Built new 10 engineer team for the design and NPI of the Asian Cellular/Satell
ite (ACeS) phone.
* Mechanical design, qualification and industrialization of phone assembly inclu
ding satellite antennas
* Implemented use of advanced drop test modeling using nonlinear FEA tools to me
et development schedules
General Signal Corp., Leeds & Northrup Unit, Horsham, PA 1993 - 1995
Principal Technologist, Development and Engineering
* Technical lead for field of Electronic Packaging of sensors: ISFET MEMS pH se
nsors for FDA applications, Optical MEMS, high purity water pH cells, instrument
ation video recorders, process control I/O modules, and distributed processor un
its for Distributed Control Systems (DCS)
* Designed automated leadframe packaging line for MEMS pH electrodes
AEL Defense Corp., Lansdale, PA 1988 - 1993
Sr. Staff Consultant - Systems Div.
* Led mechanical design and technical program management of new products for RF/
Microwave/Millimeterwave (RF/MW/MMW) EW systems covering 2 to 94GHz for rigorous
thermal and vibration environments requiring extensive analysis and verificatio
n
* Packaged MW/MMW MIC/MMIC modules, antennas, and radomes for both broadband rec
eiver and jammer applications, high power RF, all in severe EMI weight restrict
ed environments
* Mechanical Engineering Manager of Integrated Antenna Receiver WRA's on Navy Ad
vanced Special Receiver Program (ASR)- AN/ALR-67 ASR V3, for Hughes, IBM, AEL te
am
* Bid and won program for which ASR team invested in development to win producti
on contract, built development team which peaked at 15 engineers. This is curre
ntly the Navy lead RWR system (Raytheon) for carrier based attack aircraft
Section Head, Product Development Engineering - Microwave/Hybrid Div.
* Mechanical design and manufacture of custom RF/MW/MMW products
* Grew 5 engineer Mechanical packaging team to 18 members which included Protot
ype Lab, and Microcircuit Group (sustaining electrical engineering in manufactur
ing)
TRW, Inc., Hybrid Systems Group, Optoelectronics Div., Carrollton, TX 1983 - 198
8
Manager of Advanced Product Development
* Built successful team of 7 engineers for the design and industrialization of c
ustom optoelectronic hybrids
* Founding member of start-up group which developed new strip laminate array pro
cess and assembly lines for large area hybrid substrates, using automated work c
enters for flexible manufacturing
* New business responsibility from product technical definition to production la
unch for medium to high volume products in commercial, medical and defense custo
mer bases
* State of the art infrared and visible device assemblies incorporated custom IC
s, lensing, actively trimmed polymer resistors, chip-on-board, surface mount com
ponents, custom interconnect systems and molded housings
* Product Group exceeded TRW, Inc. 5 year growth and profit goals
ALGAS Industries, Inc., Dallas, TX 1980 - 1983
Engineering Manager
* Design and Manufacturing Engineering - Sustaining of product lines: Direct fi
red and electric LP gas vaporizers, air-gas mixers/ratio blenders, and pressure
vessels, liquid and vapor regulators, pressure relief valves, solenoid valves an
d carburetion systems
* Produced and qualified new products for multi-fuel automotive carburetion sys
tems, thermal control devices for vaporizing regulators and electronic liquid le
vel monitoring systems
* Redesigned existing automotive carburetion systems and certified to California
clean air standards, passing CFR-49 emissions testing
* Maintained ASME certifications and UL listings for product lines. Served on th
e Technology and Standards Committee of the National LP-Gas Association (standar
ds writing for NFPA-58) as Vice Chairman of Engine Fuels (1983)
EDUCATION
* BFA, Cleveland Institute of Art (Case Western Reserve University Affiliate), C
leveland, OH
o 5-year degree program specializing in Metal Casting
PERSONAL INFORMATION
* Member - IMAPS, AOC, AIAA, ASM, ASME, IEEE