SinglFuse™ SF-2410HI-T Series Features

T
AN
n Single blow fuse for overcurrent protection

LI
LO & MP

EE
FR
n EIA 2410 (6125 metric) footprint
CO

N
S

GE
oH

n Ceramic tube design for high inrush fusing speed applications

*R

HA

n UL 248-14 listed
2.
**

T
5A n Surface mount packaging for automated assembly
n RoHS compliant* and halogen free**

T
N
IA
SF-2410HI-T Series – High Inrush SMD Fuses
PL
M
CO
S
oH
*R

Electrical Characteristics

Certifications
Rated Typical
Resistance Rated Interrupting
EE
Model Current Fusing Time FR I2t (A2s) cUL
(Ω) Typ.*** Voltage Rating
AD

(A) ****
LE

E198545
SF-2410HI0375T-2 0.375 0.6208   0.4147 3
SF-2410HI050T-2 0.5 0.3462  0.495 3
SF-2410HI075T-2 0.75 0.1666   1.2632 3
M SA E
IA E
*
CO ION FRE
PL R
NT
HS RS D
SF-2410HI100T-2 1 0.1079   1.9933
Ro VE LEA

3
SF-2410HI150T-2 1.5 0.057  2.82 3
Open within
SF-2410HI200T-2 2 0.0509 50 A @ 125 VAC  7.488 3
1-60 sec. 125
50 A @ 125 VDC
SF-2410HI250T-2 2.5 at 200 % 0.0317 VAC  16.771
rated current
300 A @ 32 VDC 3
SF-2410HI300T-2 3 0.0228  24.99 3
SF-2410HI350T-2 3.5 0.0196  24.908 3
SF-2410HI400T-2 4 0.015  27.056 3
SF-2410HI500T-2 5 0.0112  50.308 3
SF-2410HI700T-2 7 0.0083 100.06 3
*** Resistance value measured with ≤10 % rated current at 25 °C ambient. Tolerance ±30 %.
**** Melting I2t calculated at 10 times rated current.

Environmental Characteristics Agency Recognition

Operating Temperature���������������������������������������������������������������������������������� -55 °C to +125 °C UL File Number���������������������������� E198545
Storage Conditions
Temperature���������������������������������������������������������������������������������������������� +15 °C to +30 °C
Humidity���������������������������������������������������������������������������������������������������������� 20 % to 70 %
Shelf Life���������������������������������������������������������������������������2 years from manufacturing date
Moisture Sensitivity Level���������������������������������������������������������������������������������������������������������1
ESD Classification (HBM)����������������������������������������������������������������������������������������������Class 6

WARNING Cancer and Reproductive Harm

www.P65Warnings.ca.gov
* RoHS Directive 2015/863, Mar 31, 2015 and Annex.
** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and
Chlorine (Cl) content is 1500 ppm or less.
“SinglFuse” is a trademark of Bourns, Inc.
Specifications are subject to change without notice. Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
SinglFuse™ SF-2410HI-T Series Applications
n Notebooks n PC Servers
n LCD Monitors n Power Supplies
n LCD Backlight Inverters n Battery Protection
n POE, POE+ n White Goods

SF-2410HI-T Series – High Inrush SMD Fuses

Reliability Testing

No. Test Test Condition Requirement Test Reference

Temperature setup: 235 ±5 °C After test terminal electrode wetting
1 Solderability IEC 60068-2-58
Time setup: 10 ±1 sec. area must be greater than 95 %
Resistance to Temperature setup: 235 ±5 °C
2 DCR change ≤ ±15 % IEC 60068-2-58
soldering heat Time setup: 30 ± 5 sec.
Temperature setup:
25 °C ~ -65 °C ~ 25 °C ~ 125 °C DCR change ≤ ±15 % MIL-STD-202G
3 Thermal shock Time setup: -65 °C (30 min) No mechanical damage Method 107G
~ 25 °C (5 min) ~ 125 °C (30 min) Test Condition B
~ 25 °C (5 min), 5 cycles
Heat (85 ±0.5 °C) DCR change ≤ ±15 % MIL-STD-202G
4 Humidity unload High Humidity (85 ±1 % RH) No mechanical damage Method 103B
240 hours Test Condition A
Salt spray concentration: 5 ±1 % DCR change ≤ ±15 % MIL-STD-202G
5 Salt spray Test liquid temperature: 35 ±0.5 °C No mechanical damage Method 101E
96 hours Test Condition A
The board shall be bent by 1 mm
6 Bending DCR change ≤ ±15 % IEC 60127-4
at a rate of 1 mm/sec.
Frequency setup: 10 ~ 55 ~ 10 Hz DCR change ≤ ±15 %
MIL-STD-202G
7 Vibration Time setup: 1 Minute/cycle No mechanical damage
Method 201A
(X-Y-Z, 120 cycles, 6 hours)

Typical Part Marking How to Order Construction

Represents total content. Layout may vary. SF - 2410 HI 0375 T - 2 END CAP
(GOLD-PLATED
SinglFuse™ BRASS)
2.

Product Designator
T
T
5A

SMD Footprint
2.5A 2410 = EIA 2410
(6125 metric)
Ceramic Tube
Fuse Blow Type
Rated Current Part Marking HI = High inrush
375 mA 375 mA Rated Current
0375 ~ 700 (375 mA ~ 7 A) Packaging Quantity
500 mA 500 mA
Structure Type
750 mA 750 mA 1,000 pieces per 7-inch reel
T = Ceramic Tube
1A 1A Packaging Type
1.5 A 1.5 A - 2 = Tape & Reel
2A 2A
2.5 A 2.5 A
3A 3A
3.5 A 3.5 A
4A 4A
5A 5A
7A 7A

Specifications are subject to change without notice.

Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
 SF-2410HI-T
3312 - 2 Series
mm SMD – High Inrush SMD
Trimming Fuses
Potentiometer
Product Dimensions Recommended Pad Layout

2.95
6.10 ± 0.20 2.60 ± 0.10
(.116)
(.240 ± .008) (.102 ± .004)

T 3.15
2.5A (.124)
2.15 ± 0.10
1.45 ± 0.10 (.085 ± .004) 2.60 ± 0.10
(.057 ± .004) (.102 ± .004) 1.96
(.077)

MM MM
DIMENSIONS: DIMENSIONS:
(INCHES) (INCHES)

Average Pre-Arcing Time vs. Current Curves Average I2t vs. t Curves

2 A2 A 2.5 2.5
A A
1.5 1.5
A A 3 A3 A
1 A1 A 3.5 3.5
A A
750750
mAmA 4 A4 A
500500
mAmA 5 A5 A
375375
mAmA 7 A7 A
100000
100000 1000000
1000000

375375
mAmA
500500
mAmA
10000
10000 100000
100000 750750
mAmA
1 A1 A
1.5 1.5
A A
2 A2 A
2.5 2.5
A A
PRE-ARCING TIME (SECONDS)
PRE-ARCING TIME (SECONDS)

1000
1000 10000
10000 3 A3 A
3.5 3.5
A A
4 A4 A
5 A5 A
1000
1000 7 A7 A
100100
I2t (A22s)
I2t (A s)

10 10 100100

1 1 10 10

0.10.1 1 1

0.01
0.01 0.10.1
0.10.1 1 1 10 10 100100 0.01
0.01 0.10.1 1 1 10 10 100100 1000
1000 10000
10000 100000
100000

CURRENT
CURRENT
(A)(A) TIME
TIME
(SECONDS)
(SECONDS)

Specifications are subject to change without notice.

Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
 SF-2410HI-T Series – High Inrush SMD Fuses

Solder Reflow Recommendations

tp Profile Feature Pb-Free Assembly

TP
RAMP-UP CRITICAL ZONE Preheat / Soak:
T L TO TP Temperature Min. (Tsmin) 150 °C
TL Temperature Max. (Tsmax) 200 °C
tL Time (ts) from (Tsmin to Tsmax) 60~180 seconds
Temperature

TS MAX.
Ramp Up Rate (TL to Tp) 3 °C / second max.
RAMP-DOWN Ramp Up Rate (Tsmax to TL) 5 °C / second max.
TS MIN.
ts
Liquidous Temperature (TL) 217 °C
PREHEAT
Time (tL) maintained above TL 60~90 seconds
25 °C Peak Package Body
235 °C ± 5 °C
t 25 °C TO PEAK
Temperature (Tp)
Time within 5 °C of actual peak
20~30 seconds*
Time temperature (Tp)
Ramp Down Rate (Tp to TL) 6 °C / second max.
Time 25 °C to Peak Temperature 8 minutes max.
Do not exceed 240 °C
* Tolerance for peak profile temperature (Tp ) is defined as a
supplier minimum and a user maximum.

Solder Wave Recommendations

Peak Temperature (Dwell Time)

300
280
Profile Feature Pb-Free Assembly
260 Preheat:
240 Temperature Max. (Tsmax) 150 °C
220 Time (Min. to Max.) 60~90 seconds
Temperature (°C)

200
180
Solder Pot Temperature 260 °C max.
160 Solder Dwell Time 2~3 seconds
140
120
100
80
60
40
20
0
20 40 60 80 100 120 140 160 180 200 220 240

PREHEAT TIME COOLING TIME

Time (Sec.)

Specifications are subject to change without notice.

Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
 SF-2410HI-T Series – High Inrush SMD Fuses

Current Rating Thermal Derating Curve

120

100
DERATING (%)

80

60

40
25 °C
20

0
-60 -40 -20 0 20 40 60 80 100 120 140

AMBIENT TEMPERATURE (°C)

Pulse Cycle Withstand Capability

100,000

10,000
NUMBER OF PULSES

1,000

100
10 % 100 %

PULSE I2t / AVERAGE MELTING I2t

Specifications are subject to change without notice.

Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
 SF-2410HI-T Series – High Inrush SMD Fuses

Packaging Specifications

178 ± 1
(7 ± .039)
DIA.

60 ± 0.50
(2.362 ± .019)

16 ± 0.5
(.630 ± .020)

1.75 ± 0.10 SECTION B-B

1.50 ± 0.10 4.00 ± 0.05 (.069 ± .004)
DIA. 0.25 ± 0.05
(.059 ± .004) (.157 ± .002)
(.010 ± .002)

B
1.50 ± 0.10 5.50 ± 0.05
(.059 ± .004) (.216 ± .002) SECTION A-A
DIA.
6.50 ± 0.10
(.256 ± .004)
A A
2.90 ± 0.10
12.00 ± 0.20 (.114 ± .004)
(.472 ± .008)

B 2.80 ± 0.10
(.110 ± .004)
4.00 ± 0.10 2.00 ± 0.05
(.157 ± .004) (.079 ± .002) MM
DIMENSIONS:
(INCHES)

Asia-Pacific: Tel: +886-2 2562-4117 • Email: asiacus@bourns.com

EMEA: Tel: +36 88 885 877 • Email: eurocus@bourns.com
The Americas: Tel: +1-951 781-5500 • Email: americus@bourns.com
www.bourns.com

REV. 03/19
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
 Legal Disclaimer Notice
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Bourns:
SF-2410HI300T-2 SF-2410HI0375T-2 SF-2410HI075T-2 SF-2410HI050T-2 SF-2410HI100T-2 SF-2410HI500T-2
SF-2410HI350T-2 SF-2410HI400T-2 SF-2410HI150T-2 SF-2410HI200T-2 SF-2410HI700T-2 SF-2410HI250T-2