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1. General description
The TDA6107AJF contains three video output ampliers which are intended to drive the three cathodes of a color CRT. The device is contained in a plastic DIL-bent-SIL 9-pin medium power (DBS9MPF) package, and uses high-voltage DMOS technology. To obtain maximum performance, the amplier should be used with black-current control.
2. Features
s s s s s s s s Typical bandwidth of 5.5 MHz for an output signal of 60 V (p-p) High slew rate of 900 V/s No external components required Very simple application Single supply voltage of 200 V Internal reference voltage of 2.5 V Fixed gain of 81 Black-Current Stabilization (BCS) circuit with voltage window from 1.8 V to 6 V and current window from +100 A to 10 mA s Thermal protection s Internal protection against positive ashover discharges appearing on the CRT
3. Ordering information
Table 1: Ordering information Package Name TDA6107AJF DBS9MPF Description plastic DIL-bent-SIL medium power package with n; 9 leads Version SOT111-1 Type number
Philips Semiconductors
TDA6107AJF
Triple video output amplier
4. Block diagram
VDD 6 MIRROR 1 MIRROR 5
TDA6107AJF
CASCODE 1
3
1 9, 8, 7 Voc(1), Voc(2), Voc(3)
1, 2, 3 Ri Ra
MIRROR 3
Iom
CASCODE 2
MIRROR 2 4
mce457
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Philips Semiconductors
TDA6107AJF
Triple video output amplier
5. Pinning information
5.1 Pinning
1 2 3 4 5 6 7 8 9
001aac587
TDA6107AJF
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Philips Semiconductors
TDA6107AJF
Triple video output amplier
6. Internal circuitry
GND to cascode stage 1, 2, 3 4 VDD 6 to black-current measurement circuit
TDA6107AJF
(1)
esd
from input circuit esd to black-current measurement circuit from control circuit from input circuit Vbias
esd esd
flash 7, 8, 9
5 esd 6.8 V
esd
(1) All pins have an energy protection for positive or negative overstress situations.
7. Limiting values
Table 3: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages measured with respect to ground; currents as specied in Figure 9; unless otherwise specied. Symbol VDD Vi Vom |Iom(mean)| Voc Tstg Tj Vesd Parameter supply voltage input voltage at pins Vi(1), Vi(2) and Vi(3) measurement output voltage absolute value of mean current of measurement output (for three channels) cathode output voltage storage temperature junction temperature electrostatic discharge voltage Human Body Model (HBM) Machine Model (MM) Voc = 0 V to VDD; Vom = 1.8 V to 6 V Conditions Min 0 0 0 0 55 20 Max 250 12 6 5.6 VDD +150 +150 3000 300 Unit V V V mA V C C V V
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Philips Semiconductors
TDA6107AJF
Triple video output amplier
8. Thermal characteristics
Table 4: Symbol Rth(j-a) Rth(j-n)
[1]
Typ 56 11
8 Ptot (W) 6
(1)
mbh989
(2)
0 40
40
80
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Philips Semiconductors
TDA6107AJF
Triple video output amplier
9. Characteristics
Table 5: Characteristics Operating range: Tj = 20 C to +150 C; VDD = 180 V to 210 V; test conditions: Tamb = 25 C; VDD = 200 V; Voc(1) = Voc(2) = Voc(3) = 12VDD; CL = 10 pF (CL consists of parasitic and cathode capacitance); Rth(h-a) = 18 K/W; measured in test circuit of Figure 9; unless otherwise specied. Symbol Iq Vref(int) Ri G G PSRR ct(DC) Iom(offset) Iom/Ioc Parameter quiescent supply current internal reference voltage (input stage) input resistance gain of amplier gain difference power supply rejection ratio DC crosstalk between channels offset current of measurement output (for three channels) linearity of current transfer (for three channels) Ioc = 0 A; Vom = 1.8 V to 6 V Ioc = 100 A to +100 A; Vom = 1.8 V to 6 V Ioc = 100 A to +10 mA; Vom = 1.8 V to 4 V Output pins Voc(1), Voc(2), Voc(3) Voc(DC) Voc(DC)(offset) Voc(T) Voc(T)(offset) DC output voltage Ii = 0 A 76 5 87 0 10 0 97 +5 V V mV/K mV/K differential DC output offset Ii = 0 A voltage between two output pins output voltage temperature drift differential output offset voltage temperature drift between two output pins maximum peak output current minimum output voltage maximum output voltage small signal bandwidth large signal bandwidth Voc = 50 V to VDD 50 V Vi = 4.5 V; at Ioc = 0 mA Vi = 0.5 V; at Ioc = 0 mA Voc = 60 V (p-p) Voc = 100 V (p-p)
[3] [2] [2]
Conditions
Unit mA V k
f < 50 kHz
[1]
50 0.9 0.9
dB dB A
VDD 15 10
20 5.5 4.5 60 0
10 +10
mA V V MHz MHz ns ns
cathode output propagation time Voc = 100 V (p-p) square 50 % input to 50 % output wave difference in cathode output propagation time 50 % input to 50 % output (between two output pins) cathode output rise time 10 % output to 90 % output cathode output fall time 90 % output to 10 % output Voc = 100 V (p-p) square wave
[3]
toc(r) toc(f)
[3]
67 67
91 91
113 113
ns ns
[3]
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Philips Semiconductors
TDA6107AJF
Triple video output amplier
Table 5: Characteristics continued Operating range: Tj = 20 C to +150 C; VDD = 180 V to 210 V; test conditions: Tamb = 25 C; VDD = 200 V; Voc(1) = Voc(2) = Voc(3) = 12VDD; CL = 10 pF (CL consists of parasitic and cathode capacitance); Rth(h-a) = 18 K/W; measured in test circuit of Figure 9; unless otherwise specied. Symbol tst SR Ov Parameter settling time input (50 %) to output (99 % to 101 %) slew rate between 50 V to VDD 50 V cathode output voltage overshoot Conditions Voc = 100 V (p-p) square wave Vi = 2.5 V (p-p) square wave Voc = 100 V (p-p) square wave
[3]
Min -
Typ 900 2
Max 350 -
Unit ns V/s %
[3]
[3]
The ratio of the change in supply voltage to the change in input voltage when there is no change in output voltage. See Figure 6 for the typical DC-to-DC transfer of Vi to Voc. f < 1 MHz; tr = tf = 40 ns [pins Vi(1), Vi(2) and Vi(3)]; see Figure 7 and Figure 8.
mce455
120
80
40
0 0 1 2 3 Vi (V) 4
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Philips Semiconductors
TDA6107AJF
Triple video output amplier
2.96 Vi (V)
2.34 t
1.73
60 50
t toc(r) tco(p)
mce477
Fig 7. Output voltage [pins Voc(1), Voc(2) and Voc(3)] rising edge as a function of the AC input signal
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Philips Semiconductors
TDA6107AJF
Triple video output amplier
2.96 Vi (V)
2.34 t
1.73
tst
51
Fig 8. Output voltage [pins Voc(1), Voc(2) and Voc(3)] falling edge as a function of the AC input signal
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Philips Semiconductors
TDA6107AJF
Triple video output amplier
To limit the diode current an external 1.5 k carbon high-voltage resistor in series with the cathode output and a 2 kV spark gap are needed (for this resistor value, the CRT has to be connected to the main PCB). VDD must be decoupled to GND: 1. With a capacitor > 20 nF with good HF behavior (e.g. foil); this capacitor must be placed as close as possible to pins VDD and GND and must be within 5 mm. 2. With a capacitor > 3.3 F on the picture tube base print, depending on the CRT size.
10.4 Bandwidth
The addition of the ash resistor produces a decreased bandwidth and increases the rise and fall times.
10.5 Dissipation
A distinction must rst be made between static dissipation (independent of frequency) and dynamic dissipation (proportional to frequency). The static dissipation of the TDA6107AJF is due to voltage supply currents and load currents in the feedback network and CRT. The static dissipation Pstat equals: Pstat = VDD IDD + 3 Voc Ioc Where: VDD = supply voltage IDD = supply current Voc = DC value of cathode output voltage Ioc = DC value of cathode output current The dynamic dissipation Pdyn equals: Pdyn = 3 VDD (CL + Cint) fi Voc(p-p) Where: CL = load capacitance Cint = internal load capacitance (4 pF) fi = input frequency Voc(p-p) = cathode output voltage (peak-to-peak value) = non-blanking duty cycle The TDA6107AJF must be mounted on the picture tube base print to minimize the load capacitance.
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Philips Semiconductors
TDA6107AJF
Triple video output amplier
Rf Vof
C7 20 nF
C8 10 F
C3 22 F C4
Rf Vof 8
C5 22 F C6
Rf Vof 7
TDA6107AJF
4 GND
Current sources J1, J2 and J3 must be adjusted so that the DC output voltage of pins Voc(1), Voc(2) and Voc(3) is set to 100 V.
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Philips Semiconductors
TDA6107AJF
Triple video output amplier
D1 q P P1 Q A2
A3 q1 q2
L 1 Z b2 e b b1 w M 9
e2
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT111-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION A 18.5 17.8 A2 A3 max. 3.7 8.7 8.0 A4 b b1 b2 c D (1) D1 E (1) e e2 L 3.9 3.4 P 2.75 2.50 P1 3.4 3.2 Q q q1 4.4 4.2 q2 5.9 5.7 w 0.25 Z (1) max. 1
65o o 55
15.5 1.40 0.67 1.40 0.48 21.8 21.4 6.48 2.54 2.54 15.1 1.14 0.50 1.14 0.38 21.4 20.7 6.20
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Philips Semiconductors
TDA6107AJF
Triple video output amplier
14. Soldering
14.1 Introduction to soldering through-hole mount packages
This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board.
Suitability of through-hole mount IC packages for dipping and wave soldering methods Soldering method Dipping suitable Wave suitable suitable [1] not suitable
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. For PMFP packages hot bar soldering or manual soldering is suitable.
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Philips Semiconductors
TDA6107AJF
Triple video output amplier
The format of this data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors. Changed data sheet status to product data sheet Preliminary specication 9397 750 11632 -
TDA6107AJF_1
20030919
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Philips Semiconductors
TDA6107AJF
Triple video output amplier
III
Product data
Production
Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
17. Denitions
Short-form specication The data in a short-form specication is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values denition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specication is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specied use without further testing or modication.
18. Disclaimers
Life support These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status Production), relevant changes will be communicated via a Customer Product/Process Change Notication (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specied.
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Philips Semiconductors
TDA6107AJF
Triple video output amplier
20. Contents
1 2 3 4 5 5.1 5.2 6 7 8 8.1 9 10 10.1 10.2 10.3 10.4 10.5 11 11.1 12 13 14 14.1 14.2 14.3 14.4 15 16 17 18 19 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Thermal characteristics. . . . . . . . . . . . . . . . . . . 5 Thermal protection . . . . . . . . . . . . . . . . . . . . . . 5 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Application information. . . . . . . . . . . . . . . . . . . 9 Cathode output . . . . . . . . . . . . . . . . . . . . . . . . . 9 Flashover protection . . . . . . . . . . . . . . . . . . . . . 9 Switch-off behavior . . . . . . . . . . . . . . . . . . . . . 10 Bandwidth . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Test information . . . . . . . . . . . . . . . . . . . . . . . . 11 Quality information . . . . . . . . . . . . . . . . . . . . . 11 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 Handling information. . . . . . . . . . . . . . . . . . . . 13 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Introduction to soldering through-hole mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Soldering by dipping or by solder wave . . . . . 13 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 13 Package related soldering information . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 15 Denitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information . . . . . . . . . . . . . . . . . . . . 15