PD - 94291B

AUTOMOTIVE MOSFET
Typical Applications
q q

IRF3808
HEXFET Power MOSFET
D

Integrated Starter Alternator 42 Volts Automotive Electrical Systems Advanced Process Technology Ultra Low On-Resistance Dynamic dv/dt Rating 175C Operating Temperature Fast Switching Repetitive Avalanche Allowed up to Tjmax

Benefits
q q q q q q

VDSS = 75V
G S

RDS(on) = 0.007 ID = 140AV

Description
Designed specifically for Automotive applications, this Advanced Planar Stripe HEXFET Power MOSFET utilizes the latest processing techniques to achieve extremely low on-resistance per silicon area. Additional features of this HEXFET power MOSFET are a 175C junction operating temperature, low RJC, fast switching speed and improved repetitive avalanche rating. This combination makes the design an extremely efficient and reliable choice for use in higher power Automotive electronic systems and a wide variety of other applications.

TO-220AB

Absolute Maximum Ratings

Parameter
ID @ TC = 25C ID @ TC = 100C IDM PD @TC = 25C VGS EAS IAR EAR dv/dt TJ TSTG Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Pulsed Drain Current Q Power Dissipation Linear Derating Factor Gate-to-Source Voltage Single Pulse Avalanche EnergyR Avalanche CurrentQ Repetitive Avalanche EnergyW Peak Diode Recovery dv/dt S Operating Junction and Storage Temperature Range Soldering Temperature, for 10 seconds Mounting Torque, 6-32 or M3 screw

Max.
140V 97V 550 330 2.2 20 430 82 See Fig.12a, 12b, 15, 16 5.5 -55 to + 175 300 (1.6mm from case ) 10 lbfin (1.1Nm)

Units
A W W/C V mJ A mJ V/ns C

Thermal Resistance
Parameter
RJC RCS RJA Junction-to-Case Case-to-Sink, Flat, Greased Surface Junction-to-Ambient

Typ.
0.50

Max.
0.45 62

Units
C/W

HEXFET(R) is a registered trademark of International Rectifier.

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1
02/06/02

IRF3808
Electrical Characteristics @ TJ = 25C (unless otherwise specified)
V(BR)DSS
V(BR)DSS/TJ

RDS(on) VGS(th) gfs IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf LD LS Ciss Coss Crss Coss Coss Coss eff.

Parameter Drain-to-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Static Drain-to-Source On-Resistance Gate Threshold Voltage Forward Transconductance Drain-to-Source Leakage Current Gate-to-Source Forward Leakage Gate-to-Source Reverse Leakage Total Gate Charge Gate-to-Source Charge Gate-to-Drain ("Miller") Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Internal Drain Inductance Internal Source Inductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Output Capacitance Output Capacitance Effective Output Capacitance U

Min. 75 2.0 100

Typ. 0.086 5.9 150 31 50 16 140 68 120 4.5 7.5 5310 890 130 6010 570 1140

Max. Units Conditions V VGS = 0V, ID = 250A V/C Reference to 25C, ID = 1mA 7.0 m VGS = 10V, ID = 82A T 4.0 V VDS = 10V, ID = 250A S VDS = 25V, ID = 82A 20 VDS = 75V, VGS = 0V A 250 VDS = 60V, VGS = 0V, TJ = 150C 200 VGS = 20V nA -200 VGS = -20V 220 ID = 82A 47 nC VDS = 60V 76 VGS = 10VT VDD = 38V ID = 82A ns RG = 2.5 VGS = 10V T D Between lead, 6mm (0.25in.) nH G from package and center of die contact S VGS = 0V pF VDS = 25V = 1.0MHz, See Fig. 5 VGS = 0V, VDS = 1.0V, = 1.0MHz VGS = 0V, VDS = 60V, = 1.0MHz VGS = 0V, VDS = 0V to 60V

Source-Drain Ratings and Characteristics

IS
ISM

VSD trr Qrr ton Notes:

Parameter Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode) Q Diode Forward Voltage Reverse Recovery Time Reverse RecoveryCharge Forward Turn-On Time

Min. Typ. Max. Units

Conditions D MOSFET symbol 140V showing the A G integral reverse 550 S p-n junction diode. 1.3 V TJ = 25C, IS = 82A, VGS = 0VT 93 140 ns TJ = 25C, IF = 82A 340 510 nC di/dt = 100A/s T Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)

Q Repetitive rating; pulse width limited by

max. junction temperature. (See fig. 11). R Starting TJ = 25C, L = 0.130mH RG = 25, IAS = 82A. (See Figure 12). S ISD 82A, di/dt 310A/s, VDD V(BR)DSS, TJ 175C T Pulse width 400s; duty cycle 2%.

U Coss eff. is a fixed capacitance that gives the same charging time
as Coss while VDS is rising from 0 to 80% VDSS . VCalculated continuous current based on maximum allowable junction temperature. Package limitation current is 75A. WLimited by TJmax , see Fig.12a, 12b, 15, 16 for typical repetitive avalanche performance.

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IRF3808
1000

I D, Drain-to-Source Current (A)

100

I D, Drain-to-Source Current (A)


TOP BOTTOM VGS 15V 10V 8.0V 7.0V 6.0V 5.5V 5.0V 4.5V

1000

100


TOP BOTTOM VGS 15V 10V 8.0V 7.0V 6.0V 5.5V 5.0V 4.5V

4.5V

4.5V

10

10

1 0.1 1


20s PULSE WIDTH T J= 25 C
10 100

1 0.1 1


20s PULSE WIDTH T J= 175 C
10 100

V DS, Drain-to-Source Voltage (V)

V DS, Drain-to-Source Voltage (V)

Fig 1. Typical Output Characteristics

Fig 2. Typical Output Characteristics

1000.00

3.0

I D = 137A 

ID, Drain-to-Source Current ( )

2.5

TJ = 175C
RDS(on) , Drain-to-Source On Resistance
2.0

(Normalized)

100.00

1.5

T J = 25C

1.0

0.5

10.00 1.0 3.0 5.0 7.0

VDS = 15V 20s PULSE WIDTH

9.0 11.0 13.0 15.0

0.0 -60 -40 -20 0 20 40 60 80

V GS = 10V 
100 120 140 160 180

TJ , Junction Temperature

( C)

VGS, Gate-to-Source Voltage (V)

Fig 3. Typical Transfer Characteristics

Fig 4. Normalized On-Resistance Vs. Temperature

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IRF3808
100000 VGS = 0V, f = 1 MHZ Ciss = C + Cgd, C gs ds SHORTED Crss = C gd Coss = C + Cgd ds
12

ID = 82A 

10


V DS = 60V V DS = 37V V DS = 15V

C, Capacitance(pF)

VGS, Gate-to-Source Voltage (V)

10000

Ciss

1000

Coss

Crss
100 1 10 100
0 0 40 80 120 160

QG , Total Gate Charge (nC)

VDS, Drain-to-Source Voltage (V)

Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage

Fig 6. Typical Gate Charge Vs. Gate-to-Source Voltage

1000.00

10000 OPERATION IN THIS AREA LIMITED BY R DS (on)

100.00

T J = 175C

10.00 T J = 25C 1.00 VGS = 0V 0.10 0.0 0.5 1.0 1.5 2.0 VSD , Source-toDrain Voltage (V)

ID, Drain-to-Source Current (A)

ISD, Reverse Drain Current (A)

1000

100 100sec

10 Tc = 25C Tj = 175C Single Pulse 1 1 10

1msec

10msec 100 1000

VDS , Drain-toSource Voltage (V)

Fig 7. Typical Source-Drain Diode Forward Voltage

Fig 8. Maximum Safe Operating Area

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IRF3808
140

 LIMITED BY PACKAGE
120

VDS VGS RG

RD

D.U.T.
+

100

-VDD

ID , Drain Current (A)

80

10V
Pulse Width 1 s Duty Factor 0.1 %

60

40

Fig 10a. Switching Time Test Circuit

VDS 90%

20

0 25 50 75 100 125 150 175

TC , Case Temperature

( C)

Fig 9. Maximum Drain Current Vs. Case Temperature

10% VGS
td(on) tr t d(off) tf

Fig 10b. Switching Time Waveforms

1

(Z thJC)

D = 0.50

0.1

0.20 0.10

Thermal Response

0.05 0.02 0.01 0.01


SINGLE PULSE (THERMAL RESPONSE)

0.001 0.00001


Notes: 1. Duty factor D = 2. Peak T t1/ t
2 J = P DM x Z thJC


P DM t1 t2 +T C 1

0.0001

0.001

0.01

0.1

t 1, Rectangular Pulse Duration (sec)

Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case

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IRF3808
1 5V
800

VDS

D R IV E R E AS , Single Pulse Avalanche Energy (mJ)

640


ID TOP 34A 58A 82A BOTTOM

RG
20V tp

D .U .T
IA S

+ V - DD

480

0 .0 1

320

Fig 12a. Unclamped Inductive Test Circuit

V (B R )D SS tp

160

0 25 50 75 100 125 150

Starting Tj, Junction Temperature

( C)

IAS

Fig 12b. Unclamped Inductive Waveforms

QG

Fig 12c. Maximum Avalanche Energy Vs. Drain Current

10 V
QGS VG QGD
VGS(th) Gate threshold Voltage (V)
3.5

3.0

Charge

2.5

ID = 250A

Fig 13a. Basic Gate Charge Waveform

Current Regulator Same Type as D.U.T.

2.0

50K 12V .2F .3F

1.5

D.U.T. VGS
3mA

+ V - DS

1.0 -75 -50 -25 0 25 50 75 100 125 150 175 200

T J , Temperature ( C )
IG ID

Current Sampling Resistors

Fig 13b. Gate Charge Test Circuit

Fig 14. Threshold Voltage Vs. Temperature

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IRF3808
1000

Duty Cycle = Single Pulse

Avalanche Current (A)

100

0.01

Allowed avalanche Current vs avalanche pulsewidth, tav assuming Tj = 25C due to avalanche losses

0.05
10

0.10

1 1.0E-07 1.0E-06 1.0E-05 1.0E-04 1.0E-03 1.0E-02 1.0E-01

tav (sec)

Fig 15. Typical Avalanche Current Vs.Pulsewidth

500

EAR , Avalanche Energy (mJ)

400

TOP Single Pulse BOTTOM 10% Duty Cycle ID = 140A

300

200

100

0 25 50 75 100 125 150

Starting T J , Junction Temperature (C)

Notes on Repetitive Avalanche Curves , Figures 15, 16: (For further info, see AN-1005 at www.irf.com) 1. Avalanche failures assumption: Purely a thermal phenomenon and failure occurs at a temperature far in excess of Tjmax. This is validated for every part type. 2. Safe operation in Avalanche is allowed as long asTjmax is not exceeded. 3. Equation below based on circuit and waveforms shown in Figures 12a, 12b. 4. PD (ave) = Average power dissipation per single avalanche pulse. 5. BV = Rated breakdown voltage (1.3 factor accounts for voltage increase during avalanche). 6. Iav = Allowable avalanche current. 7. T = Allowable rise in junction temperature, not to exceed Tjmax (assumed as 25C in Figure 15, 16). t av = Average time in avalanche. 175 D = Duty cycle in avalanche = t av f ZthJC(D, tav) = Transient thermal resistance, see figure 11) PD (ave) = 1/2 ( 1.3BVIav) = T/ ZthJC Iav = 2T/ [1.3BVZth] EAS (AR) = PD (ave)tav

Fig 16. Maximum Avalanche Energy Vs. Temperature

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IRF3808
Peak Diode Recovery dv/dt Test Circuit
D.U.T*

S
+

Circuit Layout Considerations Low Stray Inductance Ground Plane Low Leakage Inductance Current Transformer

R
-

Q
RG VGS dv/dt controlled by RG ISD controlled by Duty Factor "D" D.U.T. - Device Under Test

+ VDD

Reverse Polarity of D.U.T for P-Channel

Driver Gate Drive P.W. Period D=

P.W. Period

[VGS=10V ] ***

D.U.T. ISD Waveform Reverse Recovery Current Body Diode Forward Current di/dt D.U.T. VDS Waveform Diode Recovery dv/dt

[VDD]

Re-Applied Voltage Inductor Curent

Body Diode

Forward Drop

Ripple 5%

[ ISD ]

*** VGS = 5.0V for Logic Level and 3V Drive Devices Fig 17. For N-channel HEXFET power MOSFETs

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IRF3808
TO-220AB Package Outline
Dimensions are shown in millimeters (inches)
10 .5 4 (.415 ) 10 .2 9 (.405 ) 3.7 8 ( .14 9 ) 3.5 4 ( .13 9 ) -A 6 .4 7 (.2 55 ) 6 .1 0 (.2 40 ) -B4 .6 9 (.1 85 ) 4 .2 0 (.1 65 ) 1.32 (.05 2) 1.22 (.04 8)

2.87 (.11 3) 2.62 (.10 3)

4 1 5.24 (.60 0) 1 4.84 (.58 4)

1 .1 5 (.0 4 5) M IN 1 2 3

L E A D A S S IG NM E NT S 1 - GATE 2 - D R A IN 3 - S O U RC E 4 - D R A IN

1 4.09 (.55 5) 1 3.47 (.53 0)

4 .0 6 (.160 ) 3 .5 5 (.140 )

3X 3X 1 .4 0 (.0 55 ) 1 .1 5 (.0 45 )

0 .9 3 (.0 37 ) 0 .6 9 (.0 27 ) M B A M

3X

0.55 (.02 2) 0.46 (.01 8)

0.36 (.0 14 )

2.54 (.10 0) 2X N O TE S : 1 D IM E N S IO N IN G & TO L E R A N C IN G P E R A N S I Y 14 .5 M , 1 982 . 2 C O N TR O L LIN G D IM E N S IO N : INC H

2.92 (.11 5) 2.64 (.10 4)

3 O U TL IN E C O N F O R MS TO J E D E C O U T L IN E TO -2 20 A B . 4 H E A T S IN K & LE A D M E A S U R E M E N T S D O N O T IN C LU DE B U R R S .

TO-220AB Part Marking Information

EXAMPLE: THIS IS AN IRF1010 LOT CODE 1789 ASSEMBLED ON WW 19, 1997 IN THE ASSEMBLY LINE "C" PART NUMBER

INTERNATIONAL RECTIFIER LOGO ASSEMBLY LOT CODE

DATE CODE YEAR 7 = 1997 WEEK 19 LINE C

Data and specifications subject to change without notice. This product has been designed and qualified for the Automotive (Q101) market. Qualification Standards can be found on IRs Web site.

IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information.02/02

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Note: For the most current drawings please refer to the IR website at: http://www.irf.com/package/