. .

. .

, 2006


1
1.1
1.2
1.3
1.4
1.5
1.6

SMT
SMT-

10 SMT

2
2.1
2.1.1
2.1.2
2.1.3 (Fine-pitch)
2.1.4 ?
2.1.5
2.2 (area array packages)
2.2.1
Ball grid array (BGA) chip size/scale-package (CSP)
2.2.1.1 BGA fine pitch QFP
2.2.1.2 BGA fine pitch QFP
2.2.1.3 BGA
2.2.1.4 BGA
2.2.1.5 (Layout)
2.2.1.6
2.2.1.7 BGA
2.2.1.8
2.3 Tape automate bonding (TAB)
2.3.1 (Inner lead bonding)
2.3.2 (Outer lead bonding)
2.4 Chip-on-board (COB)
2.5 Flip-chip
2.6
2.7
2.7.1
2.7.2
2.8
2.9 HVQFN

3
3.1
3.1.1 1
3.1.2 2
3.1.3 3
3.1.4 4
3.1.5
3.2 ()
3.3 ()

ii

1
1
2
3
8
9
10

14
14
14
17
18
19
22
23
23
24
25
25
28
30
30
31
31
32
32
32
33
34
34
36
36
36
37
37

42
42
43
43
43
43
44
45
46

3.4
3.5
3.6
3.7
3.8
3.9
3.10

/
/


()

SMT-
3.10.1 DEK-565
3.10.2 Vantis
3.10.3 Vitronics Soltec XPM
3.10.4 Vitronics Soltec Delta

4
4.1
4.1.1
()
4.1.1.1
4.1.1.2
4.1.2

4.1.2.1
4.1.2.2
4.2
4.3
4.3.1

4.3.1.1
4.3.1.2 (, )
4.3.1.3
4.3.1.4
4.3.1.5 /
4.3.2
no-clean
4.3.3

4.3.3.1 /
4.3.3.2
4.4
4.4.1

4.4.2

4.4.2.1
4.4.2.2 ()
4.4.2.3 (Forced convection, FC)
4.4.2.4 (Vapor phase, VP)
4.4.2.5
4.4.3

4.4.4

4.5
4.5.1
4.5.2
4.5.3 ()

5 ()
5.1
5.1.1

5.1.1.1
5.1.1.2
iii

47
49
50
51
52
53
53
55
57
60
62
64
64
65
65
66
66
66
67
68
70
71
71
73
73
73
73
74
75
75
76
77
79
82
82
82
83
84
85
85
86
87
87
87
87

89
89
89
89
90


5.1.1.3 /
5.1.1.4
5.1.1.5
5.1.2

5.1.3
Pick&Place
5.1.4
(chip shooter)
5.1.4.1

5.1.4.2
5.1.4.3 Collect&Place

5.1.4.4 4 Collect&Place 4
5.1.4.5 Collect&Place fine-pitch

5.1.5

5.1.5.1
5.1.5.2
5.1.5.3
5.1.6

5.1.6.1
5.1.6.2
5.2
5.2.1

5.2.2

5.2.2.1
5.2.2.2
5.2.2.3
5.2.2.4
5.2.3

5.2.3.1
5.2.3.2
5.2.4
(Sticks)
5.2.5

5.3 (Nozzles)
5.3.1

5.3.1.1
5.3.1.2
5.3.1.3
5.3.1.4
5.3.1.5
5.3.1.6
5.3.2

5.4
5.4.1
,

5.4.2

5.4.2.1
5.4.2.2
5.4.3
,
5.4.4

5.4.4.1
iv

91
91
92
93
93
94
95
95
96
99
99
100
100
101
102
103
103
104
104
105
106
106
107
107
108
108
108
109
109
110
110
110
110
111
111
111
111
111
111
112
112
112
113
114
114
116
117

5.4.5
5.4.5.1
5.4.5.2
5.4.5.3
5.4.5.4
5.4.5.5

-
-


- flip-chip ( -BGA/CSP)
/

5.4.5.6
5.4.5.7 BGA/CSP- flip-chip-
5.4.5.8
5.4.6

5.4.6.1
5.4.6.2
5.4.7

5.4.8
() ( )
5.4.8.1
5.4.8.2
5.5
5.5.1
5.5.2
5.5.3
5.6 0201
5.6.1

5.6.2
0201
5.6.3
0201
5.6.3.1
5.6.3.2
5.6.3.3
5.6.3.4
5.6.3.5
5.6.4

5.6.5

5.6.5.1 ,

5.6.5.2

118
118
120
122
124
124
125
125
125
126
127
128
129
130
130
131
132
132
132
134
135
135
136
137
137
137
137
138
138
138
139
139
140
141

. 1

. 2

142
145




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, (
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1949 .
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1970 .
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 SMT

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 SMT

1.

. 10 13

1.6. 10 SMT
10- (step-by-step)
.
, SMT
Magazine:
1 (Design for Manufacture, DFM, /
Design for Excellence, DFX),
. ,
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:

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(fiducials).

.
2 .
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13

 SMT

2.

2.

. 14 28.

. ,
,
. (),
, BGA, CSP flip-chip.

.

. (lead ball
pitch) . , ,

, .

2.1.

2.1.1.
,
DIP SMD- (Surface Mounted
Device), , , ().
SMD- DIP- :
, ,
.
SMD- , 80%
.
11% SMD (.2-1) 6%
DIP-. DIP-
,
. , , , -

14

 SMT

2.

. 15 28.

, , DIP-, SMD-.
SMD.

. 2-1.
, SO- (SO = small outline) DIP (dual
in-line package). SMD-
. DIP-, SMD PSO (plastic small outline) , PLCC (plastic
leaded chip carrier), PQFP (plastic quad flat pack), SOD (small outline diode) SOT (small
outline transistor). CLCC
(ceramic leaded chip carrier), C-flat-pack CPGA (ceramic pin grid array). PLCC-
PSO PQFP
. /
, J-
, , PLCC .
PLCC-
, PSO PQFP
, ,
(. . 2-2 2-3).
.
15

 SMT

2.

. 16 28.

(high-density interconnect, HDI), (tape automated bonding,
2.3), chip-on-board (COB, 2.4) flip-chip (FC, 2.5).

die wire-bond.

. 2-2. -

. 2-3. SMT-

16

 SMT

2.

. 17 28.

, , ,
.
.
, , PTSOP (plastic thin
small outline package) PQFP PSO ,
BGA (ball grid array) CSP (chip scale package), ,
,
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PQFP, , ,
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,
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, 6% 7%.
2.1.2.

, ,
ASICs (application specific integrated circuits).
, DRAM,
. ,
DRAM , .. ,
. 1 .
0,7 0,8 .
CSP. -
. , CSP-
DRAM, , 256 1 .

ASIC,
.
PQFP.
400, , , .
BGA (.2-4).
, BGA
. ,
.
1991. ,
, EIAJ (Electronic Industry Association of Japan) JEDEC
(Joint Electronic Device Engineering Council, USA) , JEDEC
.

17

 SMT

2.

. 18 28.

. 2-4. PBGA
JEDEC (USA) BGA :
:
1,5 / 1,27 / 1,0
:
0,3
:
0,15
2.1.3. (Fine-pitch)
,
, ,
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,
.
0,3 . ,
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0,4 .
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, , .
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.
.
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0,5
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.
0,4 , 150 dpm .
-.
PQFP
, , PQFP
( ), ..
. PQFP
0,3 .
, ,
. BGA (ball grid
array), .
18

 SMT

2.

. 19 28.

, .
, 1,5 , 1, 27 1
.
, .

10 dpm, 3 dpm
. Siemens , 1 dpm
.
(BGA) .
1,2 (-BGA)
.
1997. ,
chip-size
chip-scale package (CSP). 20%
-. 1997. 50
CSP (.2-5). 4 :



CSP .
CSP:
300 ,
0,7 ,
0,4 1,27 .
micro-BGA Tessera,
. -,
SRAM, DRAM .
CSP BGA ( < 1 ), 0,8 0,9 .
2001. 0,5 ,
.
0,65 .

(.2-6),
.
.
, .
2.1.4. ?
, , ,
,
, ,
:

, ASIC.
,
,
SiP (System
in a package).
.
-
.
19

 SMT

2.

. 20 28.

. 2-5. (CSP)
,
, ,
(transfer molding process).
,
(chip on board) flip-chip ( ).
flip-chip flip-chip (FCIP, flip-chip in package)
flip-chip (FCOB, flip-chip on board). FCOB
, flip-chip
BGA CSP (FCIP).
, SMT. ,
20

 SMT

2.

. 21 28.

flip-chip.
. ,
known good die
(KGD, ) ,
, .
,
. CSP- ,
flip-chip SMT-
(.2-8).
BGA

CSP

1,27

1,00

0,8

0,5

150

150

100

70

800

800

800

800

/
. 2-6.

. 2-7.
21

 SMT

2.

. 22 28.

CSP-
, , , , 3 5
QFP, SO BGA.
, ,
flip-chip-.

FC

CSP
,
FC

SMT

KGD (known good

die)

, SMT

SMT.

,
KGD

, KGD

, SMT

SMT.

. 2-8. .
2.1.5.
QFP- -
, ,
.
EIAJ () JEDEC ().
: JEDEC
, EIAJ,
,
.
,
, ,
(.2-9).

22

 SMT

2.

. 23 28.

. 2-9. QFP.
1987. QFP (BQFP)
0,635 .
,
, .
, , BQFP ,
, . 0,635 ,
.
,
() .
QFP EIAJ ( ) ,
, .

.
100 ,
,
ASICs, (.2-10).

2.2.
2.2.1.

(area array packages)

Ball grid array (BGA) chip size/scale-package (CSP)

,
(BGA). BGA
PGA (pin grid array),
1,27 2,54 . BGA- 5-
(Controlled Collapse Chip Carrier Connection).
(JEDEC). :
: 1 , 1,27 , 1,5
: 7 50
: 150 .

23

 SMT

2.

. 24 28.

. 2-10. ,
.
.
2.2.1.1. BGA fine pitch QFP
BGA fine pitch QFP :
,
, QFP. , BGA 31
1, 5 400 . 900 1 .
, QFP208 32 0,5
208 .

/ .
, ,
BGA (
).
BGA- (), ,

.
,

BGA , 10 , QFP.
4 dpm/. BGA400
, 500- BGA .
-

/ .

.
: ,
,
. ,
FR4
(, 60Sn40Pb).
-
.
24

 SMT

2.

. 25 28.

2.2.1.2. BGA fine pitch QFP

:
.
/
.
, BGA
.
BGA (BGA) -
,
.
,
.
.
, .
BGA
,
.
BGA .
BGA .
BGA (90Pb10Sn)
,
. .
, ,
. :
, ( ) , QFP -
. ,
, .
, ,
, (. CBGA CCGA).
BGA
. .
2.2.1.3. BGA
BGA (PBGA)
PBGA -
60Sn40Pb. 0,75 ( 0,76 OMPAC
Motorola). BGA 0,6 .
, BGA
150 200 . 400 .
, QFP 150 250 . BGA BGA
, . ,
.
-BGA (SBGA)
SBGA- , ,
. cavity down wire bond
. SBGA (
25

 SMT

2.

. 26 28.

1,4 ), ,
, PDA.
BGS (CBGA)
CBGA (MLC).
, (
0,3 ) PBGA.
, (90Pb10Sn)
,
. 0,9 ( ),
. ,
FR4 -
(, ).
CBGA 18,5 32,5 .
flip-chip, IBM (. 6.1), ..

.
, ,
, 90Pb10Sn ( >
300) FR4, - CBGA.
,
.

. 2-11. BGA (CBGA)

BGA (CGA)
BGA
BGA (CGA
IBM). 2,2
.
CCGA (SOP/QFP) BGA.
. IBM CCGA
-
.

26

 SMT

2.

. 27 28.

2.2.1.4.
2.2.1.5.
2.2.1.6.
2.2.1.7.
2.2.1.8.
2.2.1.9.
2.2.1.10.
2.2.1.11.
. 2-12. CBGA

. 2-13.
BGA (CGA).

/ (63Sn37Pb), ( IBM) CCGA.
, ,
CCGA. CCGA
, BGA
FR4. , CCGA
.
(tape) BGA (TBGA)
BGA IBM TBGA. TBGA
(1.5 ) .

. 2-14. TBGA
/ ( )
, .
CBGA, /
BGA.
FR4.
27

 SMT

2.

. 28 28.

, (
. 2-14). CBGA CCGA, -
, FR4, ..
(90Pb10Sn) .
-BGA CSP (chip-size/scale package)
-BGA CSP
0,80/0,75 . 50
. CSP:
Chip size package. .
Chip size/scale package. 20% .
-BGA/CSP
, BGA.

. 2-15. -BGA.

. 2-16. Flip-chip BGA

-BGA , .2-15, ,
. :

.
. ,
,
.


.
/ (, RAMBUS-) 1 ,
flip-chip
.
flip-chip CSP
.

.
, -BGA/CSP flip-chip,
(0,75/0,80
0,50 ). .
2.2.1.4. BGA
BGA 1,27 ,
QFP. , .
, dpm
. 2 dpm,
1000 BGA 500 .
28

 SMT

2.

. 29 28.

/ PAreq
BGA, .
- ()

) ,

:

PAreq <

.
2

, 600
300 .
. 200 4,
PBGA
- . ,
.
-BGA/CSP
250 ,
125 . , 4
100 .
: BGA (TBGA)
BGA (CBGA)

(
). BGA, ,
,
, .
.
BGA (, 150 )
.
, , TBGA CBGA,
, /
. BGA (150 )
(1%)
. ,
1 2 . 2-17,
. 3 BGA (TBGA
CBGA), .. , .
.
BGA ,
(overprinting).
,
100 200 4.

29

 SMT

2.

. 30 28.

. 2-17. BGA.
2.2.1.5. (Layout)

:
(PBGA, CBGA,
-BGA/CSP)
( )

( -)
.
BGA, , ,
. ,
,
.
2.2.1.6.

, (printing) BGA > 1,27

( BGA) QFP/SOP 0,5 .
(stencil)
.
. ,
BGA ,
150 .
BGA ( , CBGA TBGA) QFP/SOP
0,3 .
QFP/SOP 0,3
100 , CBGA TBGA 200 .
-BGA/CSP
0,25/0,3 .
-BGA/CSP 100 .
,
-BGA/CSP flipchip, .

30

 SMT

2.

. 31 28.

2.2.1.7. BGA

BGA ( CBGA TBGA) ,

, SMD.
, .. BGA
, .
(forced) .
.
PBGA -BGA/CSP ,
QFP.
(vapor phase, VP) ,
.

.
2.2.1.8.

, , ,
,
/ BGA.

BGA BGA, .

, .

.

. 2-18. BGA- -

(, : / ,
, )
. - 0 100
-25 +100 . ,

.
.
.
()
/ .
31

 SMT

2.

. 32 28.

85 /85% .
.
,
BGA 72, BGA 165, BGA 225:
30 /85%
48 ( )

QFP 208 15 , BGA
BGA > 200,
BGA .

2.3. Tape automate bonding (TAB)

:
.
2.3.1.

(Inner lead bonding)

(. 2-19)
, .

. 2-19.

.

.
.
2.3.2.

(Outer lead bonding)

. (.2-20) .

.

32

 SMT

2.

. 2-20.

2.4.

. 33 28.

Chip-on-board (COB)

.
.

() . .
. ,
,
(glob-top).
, ..

. 2-21.

, SMD-


, ,
-,

.

,


-

33

 SMT

2.

. 34 28.

.
6% 7-8%.

2.5.

Flip-chip

.
,
. , .. .
flip-chip ( ). Flip-chip .
<bump>.
, , ,
, .

. 2-22. Flip-chip (FC)

flip-chip:
, flip-chip


flip-chip:
flip-chip'
flip-chip ,
,

flip-chip

<KGD known good die>

2.6.

SMD- SOT 23 1970- .

SMD ,
(.2-27). 1980- . ,
,

.
34

 SMT

2.

. 35 28.

. ,
12 MW4 (Siemens).

. 2-23. SMD-

( ).

SMD-

,
,
.
,
, ,

SOT 23 (small outline transistor) (.2-23). SOD
123 - .
,
. MINI SOT, SOT 23. TO 220
SMD ( D2PAK) 220, ,
. .

. 2-24.
,

35

 SMT

2.7.

2.

. 36 28.

, SMT, .

. 2-25.

(.2-25),
MELF-.
:
, RF- ..
2.7.1.

0805 (2,0 1,2

) 0603 (1,6 0,8 ). 0402 (1,0 0,5 ),
10%. fine pitch,
.

. 2-26. -.
. 0201 3,5%
1206
0402 , ..
0201 (0,6 0,3 ).
, .
2.7.2.

:

(
)
(, )
.
36

 SMT

2.

. 37 28.

, . ,
,
, <tombstone>.

2.8.

SMD, ,
. , ,
,
RF-
,
..

.
,
<nozzle>.
, / .
, :
,
, , , 11 12
,

, .
(
)

(
, ), .
.
.

2.9.

HVQFN

HVQFN
(Heatsink /enHanced/ Very thin Quad Flat, No leads),
.
SMD-.
.
. 2-27, 2-28.

. 2-27. HVQFN ( ).

HVQFN Chips Scale Package (CSP) Land Grid Array (LGA), ..

(cupper frame base). (leads), ,

37

 SMT

2.

. 38 28.

( ) (land terminals,
), .
: ( ) NiPdAu, ( ) PbSn
Sn.
. 2-28.
).

HVQFN

2,52,5 1212 , 14 100.

()
0,5 . 0,5 ,
,
.

/ (stencil),
25
. ,
0,05 ,
.

.
, ,
( ),
20
35% , . 2-29.

. 2-29.

,

.
HVQFN
. 2-30.
HVQFN16 HVQFN48.
.

38

 SMT

2.

. 39 28.

. 2-30. (footprint pattern)

Ax

Ay

Bx

By

SLx

SLy

HVQFN16
HVQFN48

0,65
0,50

5,00
8,00

5,00
8,00

2,80
6,20

2,80
6,20

1,10
0,90

0,30
0,29

2,00
5,10

2,00
5,10

SPx tot

Spy tot

SPx

SPy

Gx

Gy

Hx

Hy

nSPx

nSPy

HVQFN16
HVQFN48

1,20
3,00

1,20
3,00

0,45
0,75

0,45
0,75

4,30
7,30

4,30
7,30

5,25
8,25

5,25
8,25

2
3

2
3

1.

:
PbSn: 62% Sn, 36% Pb, 2 % Ag
SAC: 95,5% Sn, 4% Ag, 0,5% Cu
39

 SMT

2.

3.

2.

. 40 28.

Stencil , :
125 0,5
150 0,65
100 0,5
, 3 (. . 2-31)

. 2-31. :

0
1 ( )
2
3
4 ( ) a b
5 b > a
6
4.

HVQFN- .
.
+125 4,5 ,
.
50 .
5.

HVQFN , .
:
:
PbSn 205
SAC 235
. . 2-32.

. 2-32.

40

 SMT

2.

. 41 28.

PbSn 240 +0 / -5
SAC 260 + 5 / -0

HVQFN-
. HVQFN-
. 2-33, . 2-34.

. 2-33.

. 2-34.

41

 SMT

3.

. 42 22

3.
,
( ) .

, .
,
(. ).

3.1.

.

. ,
: ,
.
,
, ,
.
42

 SMT

3.

. 43 22

( )
.
3.1.1. 1
1 .
,
, ,
(.. ).
.
, .
3.1.2. 2
2 .

.
( ),
( 1000 )
. 2
.
2 ,
.
.
3.1.3. 3
3
.
,
( 0,625
). 3 2000 6000
. 50
4.
3 /
,
( ).
. ,
( ,
), .

( ), -
() .
3.1.4. 4
4
.
( ()
43

 SMT

3.

. 44 22

) ( 4000 )
/ (
0,4 ). 4, ,
.
4 ,

. ,
, . ,

( BGA) ().
3.1.5.

.
-
, -
.

, .
1 2. ,

/ . ,
( , ,
)
,
.

2.
. 1 (, )
, , , .
3
4. (, )
.

,
.

:

,

.
,
(.. ;
).

44

 SMT

3.

. 45 22

3.2. ()
(stencil)

, , .


.

,
-

45

 SMT

3.

. 46 22

3.3.
()

:
, ,
.

7000 /

,
.
40000
/
2 3

46

 SMT

3.

. 47 22

3.4. /

300 600 /
1500

, ,

3000 5000
/
,

0201 Fine Pitch QFP, BGA

47

2 8
40000
/
0201 Fine Pitch
QFP, BGA, BGA, CSP

 SMT

3.

. 48 22

+

4
4000 /
0201 QFP 0,3 ,
FlipChip, BGA
100

Chip shooter

48

15000 /
120
1826
: 0, 45, 90,
135, 180 1
2,5 7,7

 SMT

3.

. 49 22

3.5. /

:

3, 5 6
7 16
0,2 2 /

49

 SMT

3.

. 50 22

3.6.

:

50

 SMT

3.

. 51 22

3.7.

51

 SMT

3.

. 52 22

3.8. ()
:
80

:
, ,

10 20 2/
,

52

2000
12000
0,2
3-

 SMT

3.

. 53 22

3.9.

,
:

3.10. SMT-

Chip shooter

53

 SMT

3.

. 54 22

( 7-8 2006.)

( ,
) ,
.

54

 SMT

3.

. 55 22

3.10.1. DEK-565

1
2
3
4
5
6
7
8
9

(E Stop)

( ,
MMI, - , ).
55

 SMT

3.

. 56 22

.
;
; (fiducials);

56

 SMT

3.

. 57 22

.
.
,
.
3.10.2. Vantis

57

 SMT

3.

. 58 22

Vantis

pick&place

58

 SMT

3.

. 59 22

()

Advantis

59

 SMT

3.

3.10.3. Vitronics Soltec XPM

60

. 60 22

 SMT

3.

:
( )
( )
.

61

. 61 22

 SMT

3.

. 62 22

3.10.4. Vitronics Soltec Delta C

( )
1 ;
2 ;
3 .
62

 SMT

3.

. 63 22

2
3

( )
1 ;
2 ;
3 .

63

 SMT

4.

4.

. 64 25

, .
(, printed circuit board)
30
.
,
.

4.1.

SMD- 1.
SMD-
SMD .

SMD ().
.
,
, ,
( ) .

64

 SMT

4.

. 65 25

4.1.1. ()
,
, (. .4-1
4-2).

. 4-1. (1) (2)

()

. 4-2.

4.1.1.1.
. ,
, .
.
(,
/ )
. ,
.
:
. ,
. ()
.
.
DIN 53 489.
1.4.

65

 SMT

4.

. 66 25

40 / 93% ,
11010 .
().
1% 7 85.
.
SMD , , .
.

,
, , .
4.1.1.2.
, ().
, ,
. 5-6
5 8, .. .
,
( 7 ),
.

1:1 1:2.

.
8 .
,
.
. ,
.
4.1.2.
,
.
,
/, .
4.1.2.1.
,
SMD-.
= 1.

. ,
CAD-.

.
.

66

 SMT

4.

. 67 25

4.1.2.2.
SMD,
, .. .
SMD
.
/,
.
. 4-1 .
25 .
. 4-1. (. .4-3 / 4-4)

SMD
0603
0805
1206
1212
1812
2220
SOT 23
SOT 143
SOT 89
SO 8
SO 14
SO 20L
MINIMELF
(0204)
MELF
(0207)

SMD-
h2 []
0,03
0,03
0,03
0,03
0,03
0,03
0,05
0,05
0,01
015
0,15
0,20
0,05

-SMD h []
0,06
0,06
0,06
0,06
0,06
0,06
0,08
0,08
0,04
0,18
0,18
0,23
0,08

[]
0,8
0,9
1,4
1,7
2,0
2,5
0,9
0,9
1,2
1,5 2,5
1,5 2,5
2,0 3,5
1,0

[3]
0,03
0,04
0,09
0,14
0,19
0,29
0,05
0,05
0,05
0,3 0,9
0,3 0,9
0,7 2,2
0,10

0,10

0,13

1,0 1,5

0,3 0,6

. 4-3.

. 4-4.

67

 SMT

4.

. 68 25

,
,
. :
: 100 150
: 1 3
.
. ,
SOT 23 (. 4-3).

( d h).
d ,
.
h ( SMD)
h1 h2:
h = h1 + h2
:
V=

d2
4

h.

(. 4-4) , SOT 23
h.

h = h1 + h2 h3 .
, -SMD . 4-1
,
0,03 . ,
, .

4.2.

,
.
.
( ) :
;
( )
;
;
( )
.

( ).
, , , (

).
68

 SMT

4.

. 69 25

.
(. .4-5).

:

. 4-5.

.

1 3
(
) .
(
).
1 5 .

20 40 .
(. .4-6).
5 5
.
(tombstoning
. .4-7)

, .
(
) 1,5 .
, ,

.
0,13 (. .4-8).

( , ),
( ).

( ).

, , ..
.
.

69

 SMT

4.

. 70 25

. 4-7.
(tombstoning).
. 4-6.
.
()
(/2)

. 4-8. . 4-9.


()
(/2)

4.3.

,
.
.
/ <stencil>.

, .
, ..
.
.
(. .4.4.1)
:
70

 SMT

4.

. 71 25

,
.
( )
.
,

.
, , .

4.3.1.
.
SMT /,
.
.
(), ,
.
( ) :
90% : / (
)
10% : 5% , 4% , 1%
.
50%
50% .
SMD-
, ,
,
,

, , ..,
, .
, .

.
01.01.2006.
: ,
.
: , ,
( 145 260 ).
4.3.1.1.
( )
. : Sn60Pb40,
183 190 , Sn6Pb37, 183 .
, -,
1,5 2% ,
. Sn62/Pb/Ag2,
178 190 .
:
(-)
63S4

71

 SMT

4.

. 72 25

SMT-

J-STD-006
Sn62
Sn62/Pb36/Ag2
Sn63
Sn63/Pb37
63S4
Sn62,5/Pb36,5/Ag1
96SC
Sn95,5/Ag3,8/Cu0,7

179 C
183 C
179 183 C
217 C

.
. .
.
. 4-2.
3- 4-
fine pitch ultra-fine pitch ( 0,5 0,3 ).
.
, ,
, (. .4-10).
. 4-2.

min

85% ()
1
1b
2a
2b
2c
3
4
5

75 150
20 150
45 75
20 75
20 63
20 45
20 38
15 25

Max 10%

()
> ()
150 200
200
150 200
200
75 100
100
75 100
100
63 80
80
45 60
60
38 50
50
25 30
30

Max 10%
Max 3% <
()
()
50 75
50
15 20
5
32 45
32
15 20
15
15 20
15
15 20
15
15 20
15
10 15
10

. 4-10. , (
)

72

 SMT

4.

. 73 25

,
.
, ,

. ,
( , . 4.3.1.3).
4.3.1.2. (, )
( ).

( SMD
) , .. (
) .
,
. ,
. ,
.
4.3.1.3.
( )
( ) ,
. ,
.
. , -
, .
,
.
,
. .
4.3.1.4.
().
( ) .

, .

. , , .
,
,
. ,
.
4.3.1.5. /
( ),
, (,
) . ,
,
73

 SMT

4.

. 74 25

. ,
, .

( ),
( , ).
, .. ,
.
,
,
( ).
,
, .. .
4.3.2. no-clean
no-clean ,
, .
.
, ..
, .

no-clean ,
.
( ) ( ,
). ,
, .
.

.

74

 SMT

4.

. 75 25

4.3.3.
4.3.3.1. /
<stencils>
.
(), .
, .
(.4-11).
, ,
. ,
, ..

( ).

. 4-11. (
)
, ,
.
. ,
, .
,
, . ,
. 1997.
,
.
,

.
, .
.

,

75

 SMT

4.

. 76 25

. ,
,
,
. ,
( ).

. 4-12.

, , ,
,
.
.
, ,
, .

120 150 , .
fine-pitch 0,5 . 0,4

. , CSP FC, 0,3
0,2 , ;
.
: , ,
, .
,
.
4.3.3.2.
:


.
, , , ,
.
.
(.4-13),
1,5,
. ,
. ,

76

 SMT

4.

. 77 25

,
(.4-13).
() - 150 200 . :

0,65
0,50
0,40

200
125 150
75 100

75 45
45 25
38 20

75 90%
.

4.4.

. 4-13.

.
, .
. ,
,
.

, , , .
, , :
77

 SMT

4.

. 78 25

.
1950- . ( )
.

.
.
, SMD
.

:
. ,
.

-.
.
.
.
, SMD.
. Nd-YAG_.
.
-.
.
, .
()
.

. 4-14. SMT

78

 SMT

4.

. 79 25

4.4.1.

, , .
:
,

,
.
-
. ,
SMD,
. .4-4 ,
,
.
. 4-4.
(
)

(.)
(, )

(
)

, ,
, - (. .4-15).
.
, ,
.
:


-


,
.

79

 SMT

4.

. 80 25

. 4-15.
.
IPC/ANSI-J-STD-004:

Rosin (RO)
Resin (RE)
Organic (OR) -

(% )
(0%)
(<0,5%)
(0%)
(0,5 2,0%)
(0%)
(>2%)

L0
L1
M0
M1
H0
H1

:


.
:


: , (No Clean,
5%, ) (Water Soluble, OR-).
:






, , .
80

 SMT

4.

. 81 25

,
() .
, , ,




,
,


.

.4-16. ()
()
,
,
, .

.

.
(, -
). ,
,
, ,
.
, -.
,
. ,
( ), .

81

 SMT

4.

. 82 25

. 4-5.

IR
FC

- +

VP

4.4.2.
,
. , ,
.
,
,
.
4.4.2.1.
:
()
-
.
4.4.2.2. ()

. .

.
, , .
. 4-6. , -

()

120 150 .

82

 SMT

4.

. 83 25

.
150 170 .
, ,
. 210 .

. 4-17.
- ()

- :
, ..

, .. ,


,
.

(Tg),
.
4.4.2.3. (Forced convection, FC)
- ,
, .
, .
.
, ,
.
, ,
.
,
- .
,
.

83

 SMT

4.

. 84 25

. 4-18.
FC- ()

4.4.2.4. (Vapor phase, VP)

.
,
.
( ) ( ,
).

. 4-19.
VP-

.
215 220 ,
.
VP-
( )
( ).
.
.
VP- :
(=
)
( )
84

 SMT

4.

. 85 25

,

,
=1

VP- :
6
( 40 / )

( , ),


( )
. 4-7. VP-

=

()

4.4.2.5.
VP- - ,
, -
.

, ,
.
.
4.4.3.
SMD-
.
:


.


.

85

 SMT

4.

. 86 25

,
,
.
, SMD, , .
- ,

.
4.4.4.
SMD- (
, -),
( )
,
(, - ).
,
.
:

, -


, SMD,
, ..
,

.

,
.
:

no-clean
( ,
, )

, .
no-clean

500 1000 ppm .
100 ppm.
,
, ,
.

. 20 3/, 0,13 /3
100 /, , 0,03 .
.

.

86

 SMT

4.5.

4.

. 87 25

4.5.1.

.

. 4-20.

.

, .
:
,
,
, ,
.
,
.
4.5.2.
, 80%

, . -,
, ,
1- .
, 6 12 .
,
.
4.5.3. ()
, , , ,
.
, , .
,
, ,
.
87

 SMT

4.

. 88 25

,
, .
130 150 , ,
,
.
,

. ,
. ,

. , ,
, .. .
,
.
, ,
, .
,
,
. , -
, .

.
, , ,
.
/
/ .

. ,
- ( )
, (
). , , , ,
.
.
,
, , .
, ,
. ,
,
.
80 100 . .

88

 SMT

5. ()

5.

5.1.

. 89 52

()

5.1.1.
SMD-
. :


/

.
5.1.1.1.
SMD-
.
, (nozzle,
.5-1).

89

 SMT

5. ()

. 90 52

. 5-1. SMD

, .
() SMD,
.
.
,
, .
:
( 500 )
, .
-
.

, ..
.
5.1.1.2.
,
,
.


(.5-2).
. ,
, .

()
()

. 5-2. SMD
90

 SMT

5. ()

. 91 52

: pick&place chip shooter ()
collect&place.
Pick&place- ,
.
,

, , ,
.
Pick&place- ,
.
5.1.1.3. /
/

- , (.5-3).

.

. 5-3.
/
.

,
.

. X/Y -, Y.

.
.

. /

,
. .
/
30 000 .
5.1.1.4.

.
pick&place-, / .

. , ,
, .

91

 SMT

5. ()

. 92 52

, 140 000
.
, .
5.1.1.5.

SMD-
,
, (.5-4).

. 5-4.

/
.
,
, .
. 5-1. SMD-

(/)

pick&place

collect&place

Chipshooters

< 2000

2000 4000

4000 30000

1000060000

2500055000

10000140000

.,
pick&place

.,
pick&place

.

.,
pick&place

.,

.,

Pick&place
/

< 60

60 120

60 300

80 300

80 300

100 200

,
,

-,

-,

92

 SMT

5. ()

. 93 52

5.1.2.
SMD-
.
6 :


pick&place
collect&place
Chip-shooters
.
.5-1 .
.
5.1.3. Pick&Place
pick&place .
,
.
.

, .
(.5-5), SMD- .
, 2 . ,
( ), 1-
.

. 5-5. pick&place-

, ,
, , , .
(MELF-)
(,
, , ). ,
93

 SMT

5. ()

. 94 52

,
SMD-.
,
.
pick&place-
. ,

. ,

,
.
, ,
(
). ,
,
0402, 0201. ,
collect&place , ..
, .
, ,
pick&place .
5.1.4. (chip shooter)
pick&place ,
.

.
(
pick&place), .
,
, .
, .

. 5-6. chip shooter .

94

 SMT

5. ()

. 95 52

5.1.4.1.
, .5-6,
( 120).
, , ,
, .
,
.
:
, ,
, ..

,

, ,

(- ,
)
(0402 )
,


.
5.1.4.2.
.5-7 chip-shooter
. ,
.
,
. ,
,
, .

. 5-7. chip shooter

95

 SMT

5. ()

. 96 52

:
, ,
, ..

,
. ( ) ,
,
.


,
0402 ( )
,
,

. ,
,


.
.
, .


,
.
5.1.4.3. Collect&Place
Collect&Place .
.
.
, . chip shooter
Collect&Place (.5-8).
2 , .
.
.
, , , 12
. 12
.
,
(. 5-9).
.
chip shooter
collect&place. ,
, .
.

. .

96

 SMT

5. ()

. 97 52

. 5-8. Chip shooter Collect&Place -

. ,

. 5-9. chip shooter

collect&place 2- .
,
:
,
,


,

97

 SMT

5. ()

. 98 52

(X, Y, Z)
.
0201 0402
, .

.

collect&place
(.5-10).

. 5-10.
collect &
place

collect&place
,
collect&place.
collect&place, ,
;
. ,
, .
.5-11 , .
2 .
, .
, ..
,
.
12 ,
12 .
.
,
. .

.
collect&place 2-
2- ,
.
collect&place- .
, collect&place.

98

 SMT

5. ()

. 99 52

. 5-11. collect&place collect&place 2 . ,

, ,
5.1.4.4. 4 Collect&Place 4
2- 4- . 4
collect&place ,
. collect&place
( 1 4 2 3). ,
, , .
2- ,
4 . 2-
(.5-12).
5.1.4.5. Collect&Place fine-pitch
SIPLACE (.5-13), fine pitch,
collect&place
.
.
2-
, . Fine pitch
, collect&place .
,
. , . fine pitch, ,
.
1 5 fine pitch,
, fine pitch . ,
,

.

99

 SMT

5. ()

. 100 52

collect&place
.
. chip
shooter ( ).
5.1.5.

.
.

. 5-12. collect&place 4-
. ,
, ,
5.1.5.1.
collect&place X/Y-
, .
, ,
.
chip shooter .
.
,
(), ,
.

100

 SMT

5. ()

. 101 52

. 5-13. chip shooter collect&place fine

pitch 2- .
5.1.5.2.
,
.
. 5-2. / SIPLACE-
HS-50
S-25 HM
F5

70
140
330

4
2
1
Max (/)
50000
25000
11500

SIPLACE collect&place.
, ,
.
140 (0.14 ).
, chip shooter
, , 0,09 0,65 . 5500 40000
. , ,
, .
S-25 HM 25700
. chip shooter,
, 5500 40000 ,
. -
, chip shooter,
.
, chip shooter

101

 SMT

5. ()

. 102 52

/ .
SIPLACE- .

.
5-14.

. 5-3.

0402
0603
0805
1206
SOT23
DPACK
Tant A
Tant B
Tant C
Tant D
ALU E
TRIM POT
TRIM CAP
COIL
SO 28 L

chip shooter (c)

0,09
0,09
0,09
0,14
0,12
0,20
0,16
0,20
0,20
0,25
0,40
0,30
0,40
0,40
--

S-25 (c)
0,14
0,14
0,14
0,14
0,14
0,14
0,14
0,14
0,14
0,14
0,14
0,14
0,14
0,14
0,14

5.1.5.3.
SIPLACE-
, .
chip shooter, - . ,
0,5 ,
, 0,14 ,
0,5 .
, .
, , ..
.
.
()
.
,
,
. , chip shooter.

102

 SMT

5. ()

. 5-15. Chip shooter

. 103 52

. 5-16. SIPLACE- collect&place

,
:

()

; .
5.1.6.

, .

. , -
. ,
.
5.1.6.1.

. :



-

(), ().


(.5-17). ,
, ,
.
.

103

 SMT

5. ()

. 104 52

,
.
, .
10 30%, .

. 5-17.

. 5-18.

5.1.6.2.
SIPLACE-
, .
, ,
.
,
. ,
25%.
.7.3.

5.2.

SMD- .

. , ,
, .
,
, ,
. ,
:


/

-

,



.
104

 SMT

5. ()

. 105 52

SMD-
(Stick), .
. ,
, fine pitch, .
.
,
.
,
. ,
.
, 0402/0201,
. .

.
.
. ,
,
.

. 5-19. . 8
2 . .
5.2.1.
,
, . ,
. ,
,
.
,
, , .
.
,
.
.

.
,
, .
, ().
105

 SMT

5. ()

. 106 52

-
. .
5.2.2.
SMD- .
, ,
, .
, , :





.
5.2.2.1.
SMD- :
DIN EN 60286-3, 1998-12 edition (.5-20). Taping and magazining of
components for automatic processing part 3: Taping of surface mount devices
(IEC 602286-3:1997)
JEDEC EIA

. 5-20.
- (DIN EN 60286-3)
. 5-20:
A0, B0
D0

D1

E1

E2

F

G

P0

P1

P2

W
.
( 8 ), .
, - ,
106

 SMT

5. ()

. 107 52

.
.
. .
, ,
180 380 , 3000 15000 .
(8 ) 2- MELF
SOT23. ,
,
(, SO) .

.
5.2.2.2.
8, 12, 16, 24, 32, 44, 56, 72 88 .
(.5-19 5-20).
,
. ,
.

.
5.2.2.3.

(.5-21). ,
,
. .
,
.

. 5-21.
8 .

,
,
. .
,
pick&place, collect&pick&place collect&place.
chip shooter, pick&place,
, (2, 4, 8
..), .
.

107

 SMT

5. ()

. 108 52

5.2.2.4.
,
. ,
. ,
( ),

(). .
,
. ,
, , .

.
. , ,
.
5.2.3.
-
.
() (MELF) .
5.2.3.1.
,
.
Murata. (.522), .
, . 5 10
.
.

. 5-22.
.

:
, ;

, ,
,
(25000 0603
50000 0402)
( )
DIN EN 60286-6 (IEC 60286-6)
108

 SMT

5. ()

. 109 52

5.2.3.2.

(.5-23). .
, , ..
.

. 5-23.
,

,
, .. ,
. ,
, .. , , 8
.
, ,
.
5.2.4. (Sticks)
( sticks)
.
.

. 5-24.
-

(
: 13
, 31 21 11)
- (.5-24) ,
.
. ,
. DIN EN
60286-5 (IEC 60286-4).

.

109

 SMT

5. ()

. 110 52

5.2.5.
( trays)
fine pitch.
,
,
.

. 5-25.

.5-25 pick&place
.
,
. pick&place
() -
. , pick&place
. .
DIN EN 60286-5 (IEC 60286-5) JEDEC.

5.3.

(Nozzles)

()
. ,
, .. .

.
: , ,
.
.
,
.
5.3.1.
5.3.1.1.
.
. .

110

 SMT

5. ()

. 111 52

5.3.1.2.
,
( 3 ). ,
, .
.
, . .
5.3.1.3.
, .
, , ,
0201, 0402, 0603. , .
, .
5.3.1.4.
.
( 40 ),
.
, 1500 ,
1,5 . ,
8 8000 .
200 .
5.3.1.5.
.. ,
. ,
.
.
5.3.1.6.
,
flip-chip .
5.3.2.

, .. . ,
0201 4/5, 2/3
0402.

. 5-26. 0201

. ,

111

 SMT

5. ()

. 112 52

0201.
.

5.4.

,
, ,
:
Fine pitch QFP TSOP 0,4 ( 0,3 )
Flip-chip 100
0201.

( )
, . ,
.

.

.
.
5.4.1. ,

SMD-.
, , ..
.

.
,
, , -
.

, .
.

.
,
.
.
, .. ,

.
.
5.4.2.
,
(), .
112

 SMT

5. ()

. 113 52

SMD- .
.
5.4.2.1.

() 2 (.5-27):
f ( x, , ) =

( x )2
1
exp

2 2
2

. 5-27.

2 ( ).
,
- +.
F .
,
:
F ( x, , ) = Pr( X x ) =

f (t , , )dt .

, r ,
d,

P( d < X < + d ) = 2

+d

f (t , , )dt .

.
:
. 5-4. d, ,
[ d , + d ]
d
p
1-p
68,26%
31,74%
1
95,44%
4,56%
2
99,74%
2600
ppm
3
99,994%
60 ppm
4
100%
0,002 ppm
6

SMD-
. ,
X 1 , X 2 ,..., X n
.
:
113

 SMT

5. ()

. 114 52

= 12 + 22 + ... + n2 .
5.4.2.2.

.
.
; .

.
, (,
50 4) SMD? ,
4
50 (.5-28), .
, , 4 60 ppm (.5-4),
, 50 60
. ,
37,5 (3) 2600 ppm, 0,002 ppm 75 (6).

. 5-28.

.
12,5 ,
= 0.
,

.
,
. 50 4, 25 2 75 6
, .. = 12,5 .

,
, .
,
. ,
.
5.4.3. ,

,
.
:


.
114

 SMT

5. ()

. 115 52

, .
.6. ,
, .
, fine pitch
0,5 . ,
, .
4. .5-29 :
TLS = 70
LS lead skew


TLW = 50
LW lead width

TPP = 20
PP pad position

TPW = 20
PW pad width

TRF = 40 .
RF local reference fiducials

. 5-29.


. .

,
V

2

T
T
2
2
TV = T + LW + TPP
+ PW + TRF
= 87,3 .
2
2
2
LS

, BU
(
), V
(ELL . 5.29)

V=

PW LW
PW LW

+ ELL =

= 118, 7 .
2
2
2
6

, ,
, , :
P = V 2 TV2 = 80, 4 .

115

 SMT

5. ()

. 116 52

50 4
.
,
fine pitch , ;
, .
,
.
, (fiducials)
. 0,4
, 0,3 , .
5.4.4.

, ,

SMD-.
.
,

, .. ( )
, ,
, .

. 5-30.
SMD-
:




116

 SMT

5. ()

. 117 52

-
-
. .5.4.5.
( ) (.5-30),

( ) .
- ,
.
-
.

,
.
,
,
.
,
,
.
5.4.4.1.
,
.
(.5-31).

. 5-31.

. ,
.
-
, .

, ,

.
,
(. 5-32).

117

 SMT

5. ()

. 118 52

.
5-32.

.
5.4.5. -

SMD- / (fiducials)
-. , , .
fine pitch -,
.., ,
. -
,
, .
- SMD-
:
,

/
( )
(fiducials) fine pitch

fine pitch.
5.4.5.1. -
-
, . ,
, -, ,
. , -
3838 - 480480 .
7979 .
.
,
, .
.
(1)
().
, .
(grayscale value systems)
, , 8
256 .

118

 SMT

5. ()

. 119 52

, ..
,
. , , ,
.
, SMD-
.
- .
, .

.

.
, (.534), .
, :
.

, .

. 5-33. -
.

. 5-34.
, ,
.
.

, , .
119

 SMT

5. ()

. 120 52

.
,
.
, , ,
(QFP), (BGA) (flip-chip).
,
.
5.4.5.2.

, ,
.
, ,
.
, - (.535) .
,
(.5-36).

. 5-35. .

. ,
,

. 5-36. . ,

. .
120

 SMT

5. ()

. 121 52

fine pitch
. .

2- ,
, .
( ).
, .
(, ),
.

.
x, y .

, .

. -, ,
.
.
,
.
, .
/
()
(),
, , .
, , .

().
,
, .
,
,
. :
( )
.
,
, .
,
. .
, ,
.
. ,
0,3 .
,
,
.
,
. (

121

 SMT

5. ()

. 122 52

) .
.

/,
.
.
, .
, .
, .
,
.
.
.

FR3 FR4.
, .
-, FR3 FR4,
.
, ,
. SMD-
.

:

(fiducials)





.

.
.

, , .
, .
, , (, ) ,
. .
, , ,
, .
, .
5.4.5.3.
,
- (.5-37).
, .. .
-

122

 SMT

5. ()

. 123 52

, ,
, .
-
( fine pitch ),
.
, ,
,
. ,
,
() .
.

. 5-37. -

:

(, )

.

. , , .

. , SO14
SO16 , , .
fine pitch
, BGA .
, , ,
,
.
, ( ),
, ..
. ,
(, ),
123

 SMT

5. ()

. 124 52

.
-
.
5.4.5.4. - flip-chip ( -BGA/CSP)

, flip-chip ,
BGA CSP, - .
SMD-
.
SMD: -,
CPS ,
0,3 . , CSP flip-chip
CSP .
25 .
CSP BGA .
5.4.5.5. /

CSP flip-chip.
/
.
,
,
.
.
( )
,
.

1
2
3
. 5-38. -

(/) .

124

 SMT

5. ()

. 125 52

5.4.5.6.
,
.. , ,
.
(
1). , ,
1.
, BGA, CSP flip-chip

/. flip-chip , ,

BGA . BGA
. TBGA CSP Tessers
Intel.
5.4.5.7. BGA/CSP- flip-chip-
BGA -BGA/CSP
- SMD- . BGA,
. , ,
. , BGA
, ,
( ) .

/ ( ). , , ,
-
.

, ,
/ -
.
flip-chip , BGA CSP,
flip-chip .

/ . ,
/,
(, ) / . , ..
0,15 20 /,
400 .

(/, , )
. ,
, .

.
5.4.5.8.
fine pitch
, ( )
(.5-40).
,
. ,
.

125

 SMT

5. ()

. 126 52

,
fine-pitch.
.5-41 .
.
.

. 5-40.
.

. 5-41.
.

,
.

,
.
.
,
.

. : 100
0,65 80 0,5 .
5.4.6.

SMD-
.
. ,
,
, , , .
-
(machine capacity testing), .

126

 SMT

5. ()

. 127 52

- , ..
X Y .
-
.
, s x
n xi
:
1 n
x = xi ,
n i =1
1 n
sx =
( xi x ) 2 .

n 1 i =1

. 5-42. ( x0 , y0 ) ( x1 , y1 )
1

.
5.4.6.1.
, , ,
X, Y ? .5-42
1.
X, Y

d =

1
l sin .
2

X, Y.
, ,

127

 SMT

5. ()

. 128 52

s = [max( s x s y )] + l sin s .
2

,
:

1
2

= max( x , y ) + l sin .
5.4.6.2.
n ,
s
.
.
, 1 ,
2
( n 1) 2 s 2 ( n 1) 2 s 2
2
.
,
n21;
n 1;1 2
2

2
1 . n,
.
,
:

max
s

min
s

n 1

n21;

n 1

n21;1

.5-5 95%

n.
. 5-5.
95%
n

10
-31%
+83%
20
-24%
+46%
32
-20%
+33%
50
-17%
+25%
100
-12%
+16%

, 9,4
32 , 95% ,
12,5 ,
50 4.

128

 SMT

5. ()

. 129 52

100.
, ..
.
5.4.7.

(machine capacity testing)

.
,
. ,

.

(USL, LSL) .
. , SL =
USL LSL. cm
-
:
cm =

USL LSL
SL
cm =
.
6
3

cm .
cmk ,
-.
cmk =

SL
.
3

. 5-43.
cmk ,
,
.

.5-43 , cmk
. =1 ,
3 .
,
,
.
129

 SMT

5. ()

. 130 52

= 1,33
.
4 .

= 12,5 , = 10 .
SL =
60 .
cmk =

SL 60 10
=
= 1,33 .
3
3 12,5

. ,
, ,
.

, . ,

.
.
5.4.8. () ( )

, SMT
-
, .
. SMD, :
, ,
.

X, Y, .
,
.
(
) (. .5.4.7).
5.4.8.1.
,
.

. 5-44.

130

 SMT

5. ()

. 131 52

,
, .
X, Y, .
. :
(, 48) ,
. ()
. .
- 4
, .
X, Y, .
. ,
. , ,
,
.
-.
,
.
,
.
5.4.8.2.
, cmk
1,33 1,92 .
:

. 5-45.

SL = 50
= 8
= 18 .

:
cmk =

SL (50 18)
=
= 1,33 .
3
24

, , 4 , .545, cmk:
131

 SMT

5. ()

cmk =

. 132 52

SL (50 4)
=
= 1,92 .
3
24

5.5.
,
SMD- .
.
,
, ,
, - .

. , , ,
(,

, ,
.
5.5.1.

.
, ,
:
,
,

.
.

, .. .
: ,
- .
.
5.5.2.

,
, . ,
SEMI E10, :

, .
.

, .. ,
. ,
.
,
, ,
.
132

 SMT

5. ()

. 133 52

, ,
- , .
,
- .
, .
, ,
.
,
, , , .

, .
, , ,
.

, ,
.

, -
.

, .

.
,
.

. ,
,
, ,
().
( )
( ).
(MTBF mean time between failures)
(MTTR mean time to repair)
.

. 5-46. N V.
133

 SMT

5. ()

. 134 52

PDA/MDA (production/machine data acquisition),
, ,
, . , ,
MTBF, MTTR , ,
.
(, )
(, ,
)
, MTBF, MTTR.
,
, .
5.5.3.

.
chip shooter
. ,
fine pitch
pick&place.
,
.
, ,
,
,
.
, .
.
.
, ,
-.

. 5-47.

.

,
, .
,
(.5-47).
.

, .

134

 SMT

5. ()

. 135 52

.
..

5.6.

0201

5.6.1.

SMT ,
50 90% .
, , 0603 (
). ,
SMT .
,
, .
, ,
palmtop .
,
, .. , .

. 5-48. 0603 0201

,
0402 (1 0,5 ). 0201 (0,6
0,3 ). 0201
. 0201
.
0201 2000 .,
. ,
01005!
, 2001 .,
0201 .

135

 SMT

5. ()

. 136 52

. 5-49.
5.6.2. 0201

0201
.
(stencil). ,
, .
. 5-50 QFP,
0402 0201.

. 5-50.
QFP, 0402 0201 ( )

:
3 ( 20 45 )
25 35 /
: 0,32 0,32 ( Murata).
,
0201 - , .
120 ,
0201.

120 125 .

136

 SMT

5. ()

. 137 52

5.6.3. 0201
5.6.3.1.
0201 .
, 0201
. ,
0201 , ..
, 0201.
.

300 , 0201.
:
. :
,
-. ,
0201,
.
, .
X Y ,
.

. 5-51. S- 38 0201 ( )
5.6.3.2.
,
, . ,
.
.
, .

.
5.6.3.3.
chipshooter
10%.

137

 SMT

5. ()

. 138 52

5.6.3.4.
0201 . ,
, 0201.
chipshooter Z,
, ..
.
,
.
, ,
.
5.6.3.5.


.
, ,
0201.

..
-

. 5-52. 0201
5.6.4.

0201 ,
, .
, ..
.
.
, 0201.
, . ,
,
.
. ,
.
,
.

138

 SMT

5. ()

. 139 52

5.6.5.

0201
:




.
.
0201 .
:
IPC

- .
5.6.5.1. ,
IPC J-STD-001B IPC A-610B
(. .5-53):

. 5-53.
:
50% 1 ( )
2 ( , )
:
1, 2 3. 3
,

:
: Padtol = 25
: Comptol = 30 (Murata)
139

 SMT

5. ()

. 140 52

5.6.5.2.
. 5-53 150 X Y
.
,
( ), .
310 200 Y.

:
YDEV = 100
XDEV = 80 .
,
PAreq - (
):
2

PAreq = X

2
DEV

PADTol COMPTol

=
2
2

25 30
= 80 = 77,6 .
2 2
,
dpm , 100.
, 4
60 dpm.
2

140

1. - , ;
. 1990
2. N Durr, W Eggerer et al. Surface Mount Technology Basics; Siemens,
2001
3. G Blackwell Surface Mount Technology for PC Boards, 2005
4. R Prasad Surface Mount Technology Principles and practice, 2nd ed.
1997
5. M Judd, K Brindley Soldering in Electronics Assembly, 1992
6. D Boswell, M Wickham Surface Mount Guidelines, 1992

141

 SMT

. 1

. 142 3

1



( , ),
. ,
, ,
/, ,
, .
PFL (Plane Foreign English) de facto
( ),
.
:

( )

ANSI

American National Standards

Institute
Application specific integrated
circuit

BGA

Ball grid array

CBGA

Ceramic ball grid array

CLCC

Ceramic leaded chip carrier

COB
CSP

Chip on board
Chip scale package

DIP

Dual inline package

DIP-

EIA

Electronic Industries Association

EIAJ

Electronic Industries Association

of Japan

FC
FCOB
FP
FQFP

Flip chip
Flip chip on board
Flat pack
Fine pitch quad flat pack

HVQFN

Heatsink (enHanced) very thin

quad flat

IC
IPC

Integrated circuit
The Institute for Interconnecting
and Packaging Electronic Circuits

ASIC

142

 SMT

. 1

. 143 3

J-STD

Joint Industry Standards

JEDEC

Joint Electron Devices Engineering

Council of the EIA

KGD

Known good die

LGA

Land grid array

MID
MQFP

Molded interconnection device

Metric quad flat pack

P&P
PCB

Pick&place
Printed circuit board

PLCC

Plastic leaded chip carrier

PQFP

Plastic quad flat pack

PSO
PTSOP

Plastic small outline

Plastic thin small outline package

PWB

Printed wiring board

QIP

Quad inline package

SiP

System in package

SIP
SMD

Single inline package

Surface mounted device

SMT
SO
SOD
SOIC
SOJ
SOT
SSOP

Surface mount technology

Small outline
Small outline diode
Small outline integrated circuit
Small outline J-lead
Small outline transistor
Shrink Small outline package

TAB
THP

Tape automated bonding

Through hole package

THT

Through hole technology

TQFP
TSOP I/II
TSSOP

Thin quad flat pack

Thin Small outline package, type
I/II
Thin shrink Small outline

UTSOP

Ultra thin small outline package

ZIP

Zigzag inline package

143

(
)

(
)

J-

I/II

 SMT

. 1

. 144 3

Bare chip
Bare die
Bulk components
Bump

( )

Chip
Chip shooter
Coplanarity

Feeder
Fiducial
Fine pitch
Flip-chip

/
/

Infrared (IR-) soldering

No-clean
Nozzle

,
/

Pad
Pitch

Reflow soldering

Set-up time
Solder paste
Stencil
Substrate

//

Tombstone effect

Wafer
Wave soldering

Yield

144

 SMT

. 2

. 145 3

2



, .
.
. www.IPC.org.
IPC J-STD:
IPC (The Institute for Interconnecting and Packaging Electronic Circuits)
, 1957 .
IPC 2200 49
, ,
, 1000 .
J-STD-Joint Industry Standards

Title

J-STD-001D
IPC-A-600G
IPC-A-610D
IPC-7711/21A

:


,

,

Requirements for Soldered Electrical

and Electronic Assemblies
Acceptability of Printed Boards
Acceptability of Electronic
Assemblies
Rework and Repair Guide

IPC-T-50G

IPC-7351

:










PC Card

IPC-2221A
IPC-2222
IPC-2223A
IPC-2224

145

Terms and Definitions for

Interconnecting and Packaging
Electronic Circuits
Surface Mount Design and Land
Pattern Standard
Generic Standard on Printed Board
Design
Sectional Standard on Rigid Organic
Printed Boards
Sectional Design Standard for Flexible
Printed Boards
Sectional Standard of Design of PWB
for PC Cards

 SMT

. 2

IPC-2225

MCM-L
MCM-L

IPC-2226

IPC-2315
IPC-2615
IPC-D-279

IPC-D-322

IPC-D-325A

. 146 3

Sectional Design Standard for Organic

Multichip Modules (MCM-L) and
MCM-L Assemblies
Sectional Design Standard for High
Density Interconnect (HDI) Boards
Design Guide for High Density
Interconnects & Microvias
Printed Board Dimensions and
Tolerances
Design Guidelines for Surfaces Mount
Technology Printed Board Assemblies
Guidelines for Selecting Printed
Wiring Board Sizes Using Standard
Panel Sizes
Documentation Requirements for
Printed Boards

J-STD-020C

IPC/JEDEC
J-STD-033A

IPC-9500-K
IPC-9501
IPC-9502
IPC-9503
IPC-9504

/


, ,

/

:








,

,
,

Moisture/Reflow Sensitive
lassification for Nonhermetic Solid
State Surface Mount Devices
Handling, Packing, Shipping and Use
of Moisture/Reflow Sensitive Surface
Mount Devices
Assembly Process Component
Simulations, Guidelines &
Classifications Package
PWB Assembly Process Simulation
for Evaluation of Electronic
Components
PWB Assembly Soldering Process
Guidelines for Electronic Components
Moisture Sensitivity Classification for
Non-IC Components
Assembly Process Simulation for
Evaluation of Non-IC Components
(Preconditioning Non-IC
Components)

IPC-TA-722

IPC-TA-723

IPC-TA-724

146

Technology Assessment Handbook on

Soldering
Technology Assessment Handbook on
Surface Mounting
Technology Assessment Series on
Clean Rooms

 SMT

IPC-CM-770E
IPC-SM-780
IPC-AJ-820
IPC-7525
IPC-7530

IPC-S-816
IPC-TM-650

. 2

( )

. 147 3

Component Mounting Guidelines for

Printed Boards
Component Packaging and
Interconnecting with Emphasis on
Surface Mounting
Assembly & Joining Handbook
Stencil Design Guidelines
Guidelines for Temperature Profiling
for Mass Soldering (Reflow & Wave)
Processes
SMT Process Guideline & Checklist
Test Methods Manual

J-STD-004A
J-STD-005
J-STD-006A
IPC-SM-817
IPC-CA-821
IPC-3406
IPC-3408

IPC-SM-840C

IPC-TP-1115

IPC-7711/21A

Requirements for Soldering Fluxes

Requirements for Soldering Pastes
Requirements for Electronic Grade
Solder Alloys and Fluxed and NonFluxed Solid Solders
General Requirements for Dielectric
Surface Mounting Adhesives
General Requirements for Thermally
Conductive Adhesives
Guidelines for Electrically Conductive
Surface Mount Adhesives
General Requirements for
Anisotropically Conductive Adhesives
Films
Qualification and Performance of
Permanent Solder Mask
Selection and Implementation Strategy
for A Low-Residue No-Clean Process

147

Rework and Repair Guide