Winstar Display Co.

, LTD

SPECIFICATION CUSTOMER : MODULE NO.: WH1602A-YYH-JTK#

APPROVED BY:
( FOR CUSTOMER USE ONLY ) PCB VERSION: DATA:

Praa Oswaldo Cruz, 15 conjunto 505 5 andar 90038-900 Porto Alegre RS Brasil Fone: (51) 3227.1166 Fax: (51) 3228.8448 comercial@clcomercial.com.br

www.clcomercial.com.br
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Winstar Display Co., LTD MODLE NO

DOC. FIRST ISSUE

RECORDS OF REVISION
REVISED PAGE NO. SUMMARY

VERSION

DATE

2007.07.03

First issue

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Contents
1.Module Classification Information 2.Precautions in use of LCD Modules 3.General Specification 4.Absolute Maximum Ratings 5.Electrical Characteristics 6.Optical Characteristics 7.Interface Pin Function 8.Contour Drawing & Block Diagram 9.Function Description 10.Character Generator ROM Pattern 11.Instruction Table 12.Timing Characteristics 13.Initializing of LCM 14.Reliability 15.Backlight Information 16. Inspection specification 17. Material List of Components for RoHs

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1.Module 1.Module Classification Information

WH 1602 AY Y H JTK#

BrandWINSTAR DISPLAY CORPORATION Display TypeHCharacter Type, GGraphic Type Display FontCharacter 16 words, 2Lines. Model serials no. Backlight Type NWithout backlight TLED, White BEL, Blue green ALED, Amber DEL, Green RLED, Red WEL, White OLED, Orange FCCFL, White GLED, Green YLED, Yellow Green LCD Mode BTN Positive, Gray TFSTN Negative NTN Negative, GSTN Positive, Gray YSTN Positive, Yellow Green MSTN Negative, Blue FFSTN Positive LCD Polarize AReflective, N.T, 6:00 HTransflective, W.T,6:00 Type/ Temperature DReflective, N.T, 12:00 KTransflective, W.T,12:00 range/ View GReflective, W. T, 6:00 CTransmissive, N.T,6:00 direction JReflective, W. T, 12:00 FTransmissive, N.T,12:00 BTransflective, N.T,6:00 ITransmissive, W. T, 6:00 ETransflective, N.T.12:00 LTransmissive, W.T,12:00 Special Code JT : English and Japanese standard font ; #:Fit in with the ROHS Directions and regulations K: LED 20 Dice

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2.Precautions in use of LCD Modules

(1)Avoid applying excessive shocks to the module or making any alterations or modifications to it. (2)Dont make extra holes on the printed circuit board, modify its shape or change the components of LCD module. (3)Dont disassemble the LCM. (4)Dont operate it above the absolute maximum rating. (5)Dont drop, bend or twist LCM. (6)Soldering: only to the I/O terminals. (7)Storage: please storage in anti-static electricity container and clean environment.

3.General Specification
Item Number of Characters Module dimension View area Active area Dot size Dot pitch Character size Character pitch LCD type Duty View direction Backlight Type Dimension 16 characters x 2 Lines 84.0 x 44.0 x 13.2(MAX) 66.0 x 16.0 56.20 x 11.5 0.55 x 0.65 0.60 x 0.70 2.95 x 5.55 3.55 x 5.95 STN, Positive, Transflective, Yellow Green 1/16 6 oclock LED Yellow green Unit mm mm mm mm mm mm mm

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4.Absolute Maximum Ratings

Item Operating Temperature Storage Temperature Input Voltage Supply Voltage For Logic Supply Voltage For LCD Symbol TOP TST VI VDD-VSS VDD-V0 Min -20 -30 VSS -0.3 -0.3 Typ Max +70 +80 VDD 7 13 Unit V V V

5.Electrical Characteristics
Item Supply Voltage For Logic Supply Voltage For LCD Input High Volt. Input Low Volt. Output High Volt. Output Low Volt. Supply Current Symbol VDD-VSS Condition Ta=-20 VDD-V0 Ta=25 Ta=70 VIH VIL VOH VOL IDD VDD=5.0V Min 4.5 3.2 0.7 VDD VSS 3.9 1.0 Typ 5.0 3.8 1.2 Max 5.5 5.2 VDD 0.6 0.4 1.5 Unit V V V V V V V V mA

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6.Optical Characteristics
Item View Angle (H) Contrast Ratio Response Time T fall CR T rise CR2 -30 Symbol (V) Condition CR2 Min 20 Typ 3 150 150 Max 40 30 200 200 Unit deg deg ms ms

Definition of Operation Voltage (Vop)

Definition of Response Time ( Tr , Tf )

Intensity 100

Selected Wave Non-selected Wave

Non-selected Conition Intensity

Selected Conition

Non-selected Conition

10

Cr Max Cr = Lon / Loff

100 90

Vop

Driving Voltage(V)

Tr

Tf

[positive type]

[positive type]

Conditions : Operating Voltage : Vop Frame Frequency : 64 HZ Viewing Angle() : 0 0 Driving Waveform : 1/N duty , 1/a bias

Definition of viewing angle(CR2)

b f = 180

= 270

= 90

= 0
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7.Interface Pin Function

Pin No. Symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 VSS VDD VO RS R/W E DB0 DB1 DB2 DB3 DB4 DB5 DB6 DB7 A K Level 0V 5.0V Ground Supply Voltage for logic Description

(Variable) Operating voltage for LCD H/L H/L H,HL H/L H/L H/L H/L H/L H/L H/L H/L H: DATA, L: Instruction code H: Read(MPUModule) L: Write(MPUModule) Chip enable signal Data bus line Data bus line Data bus line Data bus line Data bus line Data bus line Data bus line Data bus line LED + LED

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8.Contour Drawing &Block Diagram

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9.Function Description
The LCD display Module is built in a LSI controller, the controller has two 8-bit registers, an instruction register (IR) and a data register (DR). The IR stores instruction codes, such as display clear and cursor shift, and address information for display data RAM (DDRAM) and character generator (CGRAM). The IR can only be written from the MPU. The DR temporarily stores data to be written or read from DDRAM or CGRAM. When address information is written into the IR, then data is stored into the DR from DDRAM or CGRAM. By the register selector (RS) signal, these two registers can be selected. RS 0 0 1 1 R/W 0 1 0 1 Operation IR write as an internal operation (display clear, etc.) Read busy flag (DB7) and address counter (DB0 to DB7) Write data to DDRAM or CGRAM (DR to DDRAM or CGRAM) Read data from DDRAM or CGRAM (DDRAM or CGRAM to DR)

Busy Flag (BF) When the busy flag is 1, the controller LSI is in the internal operation mode, and the next instruction will not be accepted. When RS=0 and R/W=1, the busy flag is output to DB7. The next instruction must be written after ensuring that the busy flag is 0. Address Counter (AC) The address counter (AC) assigns addresses to both DDRAM and CGRAM Display Data RAM (DDRAM) This DDRAM is used to store the display data represented in 8-bit character codes. Its extended capacity is 808 bits or 80 characters. Below figure is the relationships between DDRAM addresses and positions on the liquid crystal display. High bits Low bits Example: DDRAM addresses 4E AC (hexadecimal) AC6 AC5 AC4 AC3 AC2 AC1 AC0 1 0 0 1 1 1 0

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Display position DDRAM address 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

00 01 40 41

02 03 42 43

04 05 06 07 08 09 0A 0B 0C 0D 0E 0F 44 45 46 47 48 49 4A 4B 4C 4D 4E 4F 2-Line by 16-Character Display

Character Generator ROM (CGROM) The CGROM generate 58 dot or 510 dot character patterns from 8-bit character codes. See Table 2. Character Generator RAM (CGRAM) In CGRAM, the user can rewrite character by program. For 58 dots, eight character patterns can be written, and for 510 dots, four character patterns can be written. Write into DDRAM the character code at the addresses shown as the left column of table 1. To show the character patterns stored in CGRAM.

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Relationship between CGRAM Addresses, Character Codes (DDRAM) and Character patterns Table 1.
F o r 5 * 8 d o t c h a ra c te r p a tte r n s C h a ra c te r C o d e s ( D D R A M d a ta ) 7 6 5 4 3 2 1 0 C G R A M A d d re ss 5 H ig h 4 3 2 1 0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 C h a r a c te r P a tte r n s ( C G R A M d a ta ) 7 * * * * * * * * * * * * * * * * * 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 C h a r a c te r p a tte r n ( 2 ) C h a r a c te r p a tte r n ( 1 )

H ig h

Low

* 0

* 0

Low 0 0 0 0 0 1 0 1 0 0 0 1 0 1 0 1 1 1 1 0 0 0 0 0 1 0 1 1 0 0 0 1 1 0 1 1 1 1 0 0 0 0 1 1 1 1 1 1 1 0 0 1 1

H ig h * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *

Low

0 0 0 0 0 0

C u r s o r p a tte r n

C u r s o r p a tte r n

F o r 5 * 1 0 d o t c h a r a c te r p a tte rn s C h a ra c te r C o d e s ( D D R A M d a ta ) 7 6 5 4 3 2 1 0 C G R A M A d d re ss 5 H ig h 0 0 0 0 0 0 0 0 1 1 1 1 4 3 2 0 0 0 0 1 1 1 1 0 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 0 1 0 1 0 1 0 1 0 1 C h a r a c te r P a tte r n s ( C G R A M d a ta ) 7 * * * * * * * * * * * * 6 * * * * * * * * * * * * 5 4 3 0 0 0 0 0 0 0 0 0 * 2 Low 0 0 0 0 0 0 0 0 0 * 0 0 0 0 0 0 0 0 0 * 0 0 0 0 0 * C h a r a c te r p a tte r n 0 0 0 1 0

H ig h

Low

Low

H ig h * 0 * 0 * * * * * * * * * 0 * *

* 0

C u r s o r p a tte r n

: " H ig h "

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10.Character 10.Character Generator ROM Pattern .C

Table.2
Upper 4 bit Lower 4 bit

LLLL LLLH LLHL LLHH LHLL LHLH LHHL LHHH HLLL HLLH HLHL HLHH HHLL HHLH HHHL HHHH
CG RAM (1)

LLLL

LLLH

(2)

LLHL

(3)

LLHH

(4)

LHLL

(5)

LHLH

(6)

LHHL

(7)

LHHH

(8)

HLLL

(1)

HLLH

(2)

HLHL

(3)

HLHH

(4)

HHLL

(5)

HHLH

(6)

HHHL

(7)

HHHH

(8)

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11.Instruction 11.Instruction Table

Instruction Code Instruction RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Clear Display 0 0 0 0 0 0 0 0 0 1
Write 00H to DDRAM and set DDRAM address to 00H from AC Set DDRAM address to 00H from AC and return cursor to its original position if shifted. The contents of DDRAM are not changed. Assign cursor moving direction and enable the shift of entire display. Set display (D), cursor (C), and blinking of cursor (B) on/off control bit. Set cursor moving and display shift

Description

Execution time (fosc=270Khz)

1.53ms

Return Home

1.53ms

Entry Mode Set Display ON/OFF Control Cursor or Display Shift

I/D

SH

39s

39s

S/C R/L

control bit, and the direction, without

changing of DDRAM data. Set interface data length (DL:8-bit/4-bit), numbers of display line (N:2-line/1-line)and, display font type (F:511 dots/58 dots)

39s

Function Set

DL

39s

Set CGRAM Address Set DDRAM Address Read Busy Flag and Address Write Data to RAM Read Data from RAM

0 0

0 0

0 1

AC5 AC4 AC3 AC2 AC1 AC0 Set CGRAM address in address counter.

39s 39s

AC6 AC5 AC4 AC3 AC2 AC1 AC0 Set DDRAM address in address counter.
Whether during internal operation or not

BF AC6 AC5 AC4 AC3 AC2 AC1 AC0

can be known by reading BF. The contents of address counter can also be read. Write data into internal RAM (DDRAM/CGRAM). Read data from internal RAM (DDRAM/CGRAM).

0s

1 1

0 1

D7 D7

D6 D6

D5 D5

D4 D4

D3 D3

D2 D2

D1 D1

D0 D0

43s 43s

dont care

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12.Timing Characteristics
12.1 Write Operation

Ta=25, VDD=5.0V Item Enable cycle time Enable pulse width Enable rise/fall time Address set-up time (RS, R/W to E) Address hold time Data set-up time Data hold time Symbol TC TPW TR,TF tAS tAH tDSW tH Min 1200 140 0 10 40 10 Typ Max 25 Unit ns ns ns ns ns ns ns

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12.2

Read Operation

Ta=25, VDD=5V Item Enable cycle time Enable pulse width (high level) Enable rise/fall time Address set-up time (RS, R/W to E) Address hold time Data delay time Data hold time Symbol TC TPW TR,TF tAS tAH tDDR tH Min 1200 140 0 10 10 Typ Max 25 100 Unit ns ns ns ns ns ns ns

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13.Initializing of LCM

Power on Wait for more than 40 ms after VDD rises to 4.5 V

BF can not be checked before this instruction.

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function set 0 0 1 1 * 0 * * * 0 Wait for more than 39us
BF can not be checked before this instruction.

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 0 0 0 1 0 * * * * 0 0 * * * * * N F * 0 Wait for more than 39 s

Function set

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 0 1 0 * * * * Function set 0 0 0 0 N F * * * * * * 0 Wait for more than 37us

BF can not be checked before this instruction.

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display ON/OFF control 0 0 0 0 0 * * * * 0 0 1 D C B * * * * 0 Wait for more than 37 s RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display Clear 0 0 0 0 0 * * * * 0 0 0 0 0 1 * * * * 0 Wait for more than 1.53ms RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Entry Mode Set 0 0 0 0 0 * 0 * * * 0 0 1 * * * 0 I/D SH * Initialization ends

4-Bit Ineterface

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Power on W for more than 40 ms after VDDrises to 4.5 V ait

BF can not be checked before this instruction.

RS R/WDB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function set 0 0 0 0 1 1 N F * * W for more than 39us ait
BF can not be checked before this instruction.

RS R/WDB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function set 0 0 0 0 1 1 N F * * W for more than 37us ait RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display ON/OFF control 0 0 0 0 0 0 1 B C D W for more than 37 s ait RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display Clear 0 0 0 0 0 0 0 0 0 1 W for more than 1.53ms ait RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Entry Mode Set 0 0 0 0 0 0 0 1 I/D S Initialization ends

8-Bit Ineterface

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14.Reliability
Content of Reliability Test (wide temperature, -20~70) Environmental Test Test Item High Temperature storage Low Temperature storage High Temperature Operation Low Temperature Operation Content of Test Endurance test applying the high storage temperature for a long time. Endurance test applying the high storage temperature for a long time. Endurance test applying the electric stress (Voltage & Current) and the thermal stress to the element for a long time. Endurance test applying the electric stress under low temperature for a long time. The module should be allowed to stand at 60 ,90%RH max For 96hrs under no-load condition excluding the polarizer, Then taking it out and drying it at normal temperature. The sample should be allowed stand the following 10 cycles of operation -20 25 70 Test Condition 80 200hrs -30 200hrs 70 200hrs -20 200hrs Note 2 1,2 1

High Temperature/ Humidity Operation

60,90%RH 96hrs

1,2

Thermal shock resistance

-20/70 10 cycles

30min 1 cycle

5min

30min

Total fixed amplitude : 1.5mm Vibration Frequency : Endurance test applying the vibration during 10~55Hz Vibration test 3 transportation and using. One cycle 60 seconds to 3 directions of X,Y,Z for Each 15 minutes VS=800V,RS=1.5k Endurance test applying the electric stress to the Static electricity test terminal. CS=100pF 1 time Note1: No dew condensation to be observed. Note2: The function test shall be conducted after 4 hours storage at the normal Temperature and humidity after remove from the test chamber. Note3: Vibration test will be conducted to the product itself without putting it in a container.

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15.Backlight Information
Specification
PARAMETER Supply Current Supply Voltage Reverse Voltage Luminous Intensity Wave Length Life Time Color SYMBOL MIN ILED V VR IV p 80 4.0 80 560 TYP 100 4.2 95 570 MAX 150 4.4 8 580 UNIT mA V V TEST V=4.2V CONDITION

CD/M2 ILED=100mA nm Hr. ILED=100mA ILED100mA

100000

Yellow Green

Note: The LED of B/L is drive by current onlydriving voltage is only for reference To make driving current in safety area (waste current between minimum and maximum).

2.Drive from pin15,pin16

A K

B/L

LCM
(Will never get Vee output from pin15)

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16. Inspection specification

NO Item Criterion 1.1 Missing vertical, horizontal segment, segment contrast defect. 1.2 Missing character , dot or icon. 1.3 Display malfunction. 1.4 No function or no display. 1.5 Current consumption exceeds product specifications. 1.6 LCD viewing angle defect. 1.7 Mixed product types. 1.8 Contrast defect. AQL

01

Electrical Testing

0.65

02

Black or white 2.1 White and black spots on display 0.25mm, no more than spots on LCD three white or black spots present. (display only) 2.2 Densely spaced: No more than two spots or lines within 3mm

2.5

03

LCD black spots, white spots, contamination 3.2 Line type : (As following drawing) (non-display) Length Width --W0.02 L3.0 0.02W0.03 L2.5 0.03W0.05 --0.05W If bubbles are visible, judge using black spot specifications, not easy to find, must check in specify direction. Size 0.20 0.200.50 0.501.00 1.00 Total Q TY

3.1 Round type : As following drawing =( x + y ) / 2 SIZE 0.10 0.100.20 0.200.25 0.25

Acceptable Q TY Accept no dense 2 1 0

2.5

Acceptable Q TY Accept no dense 2.5 2 As round type Acceptable Q TY Accept no dense 3 2 0 3

04

Polarizer bubbles

2.5

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NO 05

Item Scratches

Criterion Follow NO.3 LCD black spots, white spots, contamination

AQL

Symbols Define: x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length: 6.1 General glass chip : 6.1.1 Chip on panel surface and crack between panels:

06

Chipped glass

z: Chip thickness y: Chip width x: Chip length Z1/2t Not over viewing area x1/8a 1/2tz2t Not exceed 1/3k x1/8a If there are 2 or more chips, x is total length of each chip. 6.1.2 Corner crack:

2.5

z: Chip thickness y: Chip width x: Chip length Z1/2t Not over viewing area x1/8a 1/2tz2t Not exceed 1/3k x1/8a If there are 2 or more chips, x is the total length of each chip.

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NO

Item

Criterion Symbols : x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length 6.2 Protrusion over terminal : 6.2.1 Chip on electrode pad :

AQL

y: Chip width x: Chip length y0.5mm x1/8a 6.2.2 Non-conductive portion:

z: Chip thickness 0 zt

06

Glass crack

2.5

y: Chip width x: Chip length z: Chip thickness y L x1/8a 0 zt If the chipped area touches the ITO terminal, over 2/3 of the ITO must remain and be inspected according to electrode terminal specifications. If the product will be heat sealed by the customer, the alignment mark not be damaged. 6.2.3 Substrate protuberance and internal crack. y: width y1/3L x: length xa

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NO 07

Item Cracked glass

Criterion The LCD with extensive crack is not acceptable. 8.1 Illumination source flickers when lit. 8.2 Spots or scratched that appear when lit must be judged. Using LCD spot, lines and contamination standards. 8.3 Backlight doesnt light or color wrong.

AQL 2.5 0.65 2.5 0.65

08

Backlight elements

09

Bezel

9.1 Bezel may not have rust, be deformed or have fingerprints, stains or other contamination. 9.2 Bezel must comply with job specifications.

2.5 0.65

10

PCBCOB

10.1 COB seal may not have pinholes larger than 0.2mm or contamination. 10.2 COB seal surface may not have pinholes through to the IC. 10.3 The height of the COB should not exceed the height indicated in the assembly diagram. 10.4 There may not be more than 2mm of sealant outside the seal area on the PCB. And there should be no more than three places. 10.5 No oxidation or contamination PCB terminals. 10.6 Parts on PCB must be the same as on the production characteristic chart. There should be no wrong parts, missing parts or excess parts. 10.7 The jumper on the PCB should conform to the product characteristic chart. 10.8 If solder gets on bezel tab pads, LED pad, zebra pad or screw hold pad, make sure it is smoothed down. 10.9 The Scraping testing standard for Copper Coating of PCB
X Y

2.5 2.5 0.65 2.5

2.5 0.65

0.65 2.5 2.5

X * Y<=2mm

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Soldering

11.1 No un-melted solder paste may be present on the PCB. 11.2 No cold solder joints, missing solder connections, oxidation or icicle. 11.3 No residue or solder balls on PCB. 11.4 No short circuits in components on PCB.

2.5 2.5 2.5 0.65

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NO

Item

Criterion 12.1 No oxidation, contamination, curves or, bends on interface Pin (OLB) of TCP. 12.2 No cracks on interface pin (OLB) of TCP. 12.3 No contamination, solder residue or solder balls on product. 12.4 The IC on the TCP may not be damaged, circuits. 12.5 The uppermost edge of the protective strip on the interface pin must be present or look as if it cause the interface pin to sever. 12.6 The residual rosin or tin oil of soldering (component or chip component) is not burned into brown or black color. 12.7 Sealant on top of the ITO circuit has not hardened. 12.8 Pin type must match type in specification sheet. 12.9 LCD pin loose or missing pins. 12.10 Product packaging must the same as specified on packaging specification sheet. 12.11 Product dimension and structure must conform to product specification sheet.

AQL 2.5 0.65 2.5 2.5 2.5 2.5 2.5 0.65 0.65 0.65 0.65

12

General appearance

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17. Material List of Components for RoHs

1. WINSTAR Display Co., Ltd hereby declares that all of or part of products (with the mark #in code), including, but not limited to, the LCM, accessories or packages, manufactured and/or delivered to your company (including your subsidiaries and affiliated company) directly or indirectly by our company (including our subsidiaries or affiliated companies) do not intentionally contain any of the substances listed in all applicable EU directives and regulations, including the following substances. Exhibit AThe Harmful Material List .

Material

(Cd)

(Pb)

(Hg)

(Cr6+)

PBBs

PBDEs

Limited Value

100 ppm

1000 ppm

1000 ppm

1000 ppm

1000 ppm

1000 ppm

Above limited value is set up according to RoHS. 2.Process for RoHS requirement (1) Use the Sn/Ag/Cu soldering surfacethe surface of Pb-free solder is rougher than we used before. (2) Heat-resistance temp. Reflow250 ,30 seconds Max. Connector soldering wave or hand soldering320 , 10 seconds max. (3) Temp. curve of reflow, max. Temp.2355 Recommended customers soldering temp. of connector280 , 3 seconds.

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winstar Module Number 1. Panel Type

LCM Sample Estimate Feedback Sheet

Page: 1 Pass Pass Pass Pass Pass Pass Pass NG , NG , NG , NG , NG , NG , NG ,

1Panel Specification
2. View Direction 3. Numbers of Dots 4. View Area 5. Active Area 6. Operating Temperature 7. Storage Temperature 8. Others

2Mechanical Specification
1. PCB Size 2. Frame Size 3. Materal of Frame 4. Connector Position 5. Fix Hole Position 6. Backlight Position 7. Thickness of PCB 9. Height of Module 10. Others Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass NG , NG , NG , NG , NG , NG , NG , NG , NG , NG , NG , NG , NG , NG , NG , NG , NG , Pass NG , NG , NG , NG , NG ,

8. Height of Frame to PCB Pass

3Relative Hole Size

1. Pitch of Connector 2. Hole size of Connector 3. Mounting Hole size 4. Mounting Hole Type 5. Others 4Backlight Specification 1. B/L Type 2. B/L Color 4. B/L Driving Current 5. Brightness of B/L 6. B/L Solder Method 7. Others

3. B/L Driving Voltage (Reference for LED Type)

Go to page 2
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winstar Module Number

Page: 2 Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass NG , NG , NG , NG , NG , NG , NG , NG , NG , NG ,

5Electronic Characteristics of Module

1. Input Voltage 2. Supply Current 3. Driving Voltage for LCD 4. Contrast for LCD 5. B/L Driving Method 6. Negative Voltage Output 7. Interface Function 8. LCD Uniformity 9. ESD test 10. Others

6Summary

Sales signature Customer Signature

Date

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