Detailed Design For Manufacturability Analysis

Product Name: XYZ1243

Component BOM Number
Product Name: 1
Component 1 8
Component 2 2
Component 3 1
Component 4 6
Component 5 3
Component 6 2
Component 7 1
Component 8 2
Component 9 3
Component 10 2
Component 11 1
Component 12 1
Component 13 1
Processes Number
Board prep 1
Screen Printing 1
Autoinsertion (overhead) 2
Adhesive dispense (overhead) 1
Solder reflow 1
Inspect 2
Test 1
Que 3
Board Handling 8
Manual Insertion (overhead) 1
Total
Assembly time sec. 1910
Assembly time min. 31.8
DPU 0.222
DPPM 222,164
First Pass Yield 80.1%
© Thomas A. Little CONSULTING, 1999
 Customer Name: n/a Date:
Description Assy Type Component Assy Time (sec.)
SMT&Manual
SMT/Auto 2
SMT/Auto 0.5
SMT/Auto 3
SMT/Auto 0.5
SMT/Auto 0.5
SMT/Auto 0.5
SMT/Auto 1
SMT/Auto 0.75
SMT/Auto 1.2
SMT/Auto 0.35
Manual 0.5
Manual 0.5
Manual 1.3
Description n/a n/a

Definitions:
# Component opportunities
# Board opportunities
# Adhesive dispense opportunities
# Auto-insertion opportunities
# Manual insertion opportunities
# Screen printing opportunities
3/1/2002
Extended Assy Time # Opportunities (d) Probability of a Defect P(d)
16000 0
16 65 0
1 20 0
3 56 0
3 2 0
1.5 2 0
1 2 0
1 150 0
1.5 65 0
3.6 55 0
0.7 4 0
0.5 2 0
0.5 2 0
1.3 54 0
Assembly Time # Opportunities (d) Probability of a Defect P(d)
100 5 0
200 13000 0
100 150 0
100 75 0
150 13000 0
100 16000 0
320 16000 0
500 0 0
75 6 0
200 4 0

=number of leads/joints for all components (includes component defects, and insertion related defects)
=number of SMT solder pads+number of through holes+number of interconnects (board related defects o
=total number of adhesive spots placed on the board (adhesive dispense related defects only)
=machine setup related errors (defects which are other than component placement)
=manual insertion setup related errors
=number of SMT solder pads
 DPU Ave. Rework (sec.) Rework (sec.) Yield
0.1600 24.00 150 85.2%
0.0013 0.08 60 99.9%
0.0004 0.01 25 100.0%
0.0112 1.34 120 98.9%
0.0000 0.00 50 100.0%
0.0000 0.00 50 100.0%
0.0000 0.00 50 100.0%
0.0030 0.24 80 99.7%
0.0013 0.07 50 99.9%
0.0011 0.08 75 99.9%
0.0001 0.00 30 100.0%
0.0000 0.00 20 100.0%
0.0000 0.00 20 100.0%
0.0011 0.09 80 99.9%
DPU Ave. Rework (sec.) Rework (sec.) Yield
0.0015 0.30 200 99.9%
0.0091 1.82 200 99.1%
0.0000 0.00 75 100.0%
0.0001 0.00 75 100.0%
0.0091 0.68 75 99.1%
0.0112 0.84 75 98.9%
0.0112 0.84 75 98.9%
0.0000 0.00 75 100.0%
0.0004 0.03 75 100.0%
0.0000 0.00 75 100.0%

insertion related defects)

ects (board related defects only)
ted defects only)
 units
USL 9 mils
LSL 5 mils
Target 7 mils
Average 7.2 mils
Standard Deviation 0.95 mils

Loss USL 2.91%

Loss LSL 1.03%
Loss Total 3.93%
Yield 96.07%
DPU 0.0393