High Volume Manufacturing

Capacity Assurance

Proven Design Solutions

Advanced Technologies

Rapid Time to Market

SAMSUNG FOUNDRY

Samsung Pushes Foundry Technology Expertise to New Levels

The dynamic aspects of the consumer electronics market make it one of the most challenging in the semiconductor industry. Predicting consumers interests coupled with the need to provide power efficient products that offer PC-like experiences on a handheld product is enough to test any designers fortitude and creativity. Samsungs expertise in deep sub-micron manufacturing is enabling customers to quickly design exciting new products at the most advanced process nodes.

Design Enablement
Samsung Foundry offers customers access to a comprehensive ecosystem of design enablement and implementation business partners from the EDA, IP, packaging and design services industries. Customers can tap into services required to solve their most critical design issues. These include:
Best-in-class reference flows from major EDA vendors via the Common Platform alliance of IBM, Samsung and GLOBALFOUNDRIES. An extensive IP portfolio from Samsung and the Common Platform alliance ecosystem including mixed signal/ analog, logic and memory. Comprehensive libraries of standard cells, memory compilers and I/Os. Integrated DFM solutions to address yield upstream in the design flow.

High-k Metal Gate

High-k dielectric materials with metal gate in the transistors gate stack extends the CMOS process technology well beyond 32/28nm. Samsung Foundry, in conjunction with the IBM Joint Development Alliance (JDA), tuned its 32/28nm LP High-k Metal Gate (HKMG) gate-first process node to deliver a competitive, cuttingedge process platform with: double the logic density of 45nm LP x100 lower gate leakage 40% faster speed at fixed leakage x10 lower leakage at fixed speed
HKMG Enables Performance Boost

Immersion Lithography
First introduced at 45nm, immersion lithography is a critical feature of Samsung Foundrys 32/28nm process flow. Samsung has the largest installation of immersion lithography tools in the industry, and extensive experience using them in its highly successful memory fabrication.

3D Packaging Technology
Savvy chip companies are closely investigating new packaging solutions as a way to stay ahead of Moores Law. Also known as 3D or vertical packaging, through silicon via (TSV) allows chipmakers to increase functionality by vertically connecting components using silicon vias in the packaging process.
Logic and Memory TSV

Unequaled Customer Benefits

Advanced process technology In addition to its own significant process R&D investments, Samsung is actively involved in many joint research and development alliances, including IBMs Joint Development Alliance. As a result, Samsung foundry customers can design innovative products built on the most advanced process platforms. Design IP Samsung has an extensive portfolio of libraries and IP that is available to customers, particularly in the embedded memory and mixed signal areas, including licensed IP from leading companies such as ARM. Manufacturing plant Maintains advanced 90, 65, 45, 32/28nm production equipment. The Giheung, South Korea foundry serves customers with leadingedge, high-volume manufacturing services.

Partnerships for multisourcing Along with IBM and GLOBALFOUNDRIES, Samsung is a member of the Common Platform alliance. The three companies provide worldwide multi-sourcing of the same product design to meet customer needs, without any redesign required. Extensive customer support From the initial engagement to volume manufacturing, Samsungs business, engineering and logistics teams are focused on full customer satisfaction. Customer IP protection Samsung has put firewalls and strict security systems in place to ensure that no unauthorized individuals have any access to customer IP. Customers can audit the system at any time. Long-term commitment Samsung has made the investments in facilities, personnel and time in order for its foundry to succeed over the long term by satisfying customers. The companys executive-level commitment and financial strength are the backbone enabling this approach.

Samsungs Full-Service Foundry Solution

START ENGAGEMENT

TECHNICAL REQUIREMENTS Detailed, expert-level technical disscusions Clear understanding of customer requirements

DESIGN SUPPORT Design Kits Libraries and IP Design services and DFM

EXPEDITED PROTOTYPING & SHUTTLES In-house mask making for fast TAT Super hot lot prototyping service Cost-effective prototyping & IP verification shuttles

HIGH-VOLUME MANUFACTURING 300mm capacity VDSM high-volume production experience Aggressive yield improvement methods

WAFER-LEVEL TESTING Wafer sort Quality and realibility expertise Fully equipped failure analysis labs

BUMPING, ASSEMBLY & FINAL TEST Turn-key management

SHIP PRODUCTS

Samsung 65/45/32/28nm IP Solutions

Standard Cell Library Generic Process Multi Vth (RVT, LVT, HVT) MTCMOS Over Drive (RVT, LVT) Low-Power Process Multi Vth (SHVT, HVT, RVT, LVT) MTCMOS PMK Voltage Scaling Memories Single-Port SRAM (HD, LP) Dual-Port SRAM (HD, LP) Register File (1RW, 1R1W) Redundancy SRAM ROM (Via) eDRAM OTP Analog Cores ADC/DAC/AFE Audio DAC/CODEC Class-AB/Class-D Amp. PLL/DLL Power Management (DC-DC Converter/ Regulator) CPUs and DSPs ARM7TDMI-S ARM9XX ARM11XX ARM156T2-S ETM7/ETM9/ETM10/ETM11/CoreSight Teak/TeakLite Cortex-A8/Cortex-M3/Cortex A-9 High-speed Interfaces (PHY) USB 2.0/ USB 3.0/OTG (Pico Phy) 8G Universal SerDes ( 2~8G FC/ SAS/SATA/PCI Express) 3G Serial ATA DDR2, GDDR3, mDDR, LPDDR2 1.05 Gbps LVDS Rx/Tx subLVDS Rx/Tx HDMI Tx DDR2/3 combo High-speed Interfaces ( Link) USB HS OTG/Device/Host S-ATA 10/100M Ethernet MAC+BDMA IEEE1394a PCI Device/Bridge Multimedia MPEG4/H.264 2D/3D Engine JPEG Codec MP3/AAC NTSC/PAL Encoder General & Special-purpose I/O LVCMOS (In-Line, STG, CUP) SSTL2/SSTL18 USB1.1 Transceiver mini-LVDS RSDS WiseBus PCI/PCI-X AMBA-based Peripherals AMBA-2.0/3.0-based Peripherals Memory Controller (SDRAM/ SRAM/NOR/NAND) Multimedia Card Interface ARM Prime Cell Library

Samsungs Logic Foundry

The fab is located on a 350-acre site in Giheung, South Korea. It has a round-the-clock staff that includes dedicated resources for customer service, design, DFM, product engineering, test, failure analysis and reliability. Production is now at 49,000 wafers per month, which will continue to ramp up to meet demand. The plant produces advanced logic chip solutions including those with embedded memory RF-CMOS chips and other sophisticated ICs.

For more information, visit the Samsung Foundry homepage at:

www.samsung.com/Products/Semiconductor/StrategicFoundry.
As well as Samsungs Facebook page at:

http://www.facebook.com/SamsungUSATech

www.usa.samsungsemi.com www.facebook.com/samsungusatech
2010. The appearance of all products, dates, figures, diagrams and tables are subject to change at any time without notice. Samsung and Samsung Semiconductor, Inc. are trademarks of Samsung Electronics Co., Ltd.
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