Академический Документы
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ON
SUJESH.N
LATHEESH.T
MANORANJ KK.
NAJUMUDDEEN NP
RAHUL V GOPINATH
GOVT.COLLEGE OF ENGINEERING
KANNUR
CERTIFICATE
CONTENTS
ABSTRACT
CIRCUIT DIAGRAM
• Power supply
• JAM Circuit
CIRCUIT DESCRIPTION
PCB LAYOUT
• Power supply section
• JAM Circuit
MAKING OF PCB
SOLDERING
DATASHEET
• IC 74LS00
• IC 74LS04
• IC 74LS30
• IC 74LS373
• IC 74LS147
• IC 7805
BIBLIOGRAPHY
CONCLUSION
ABSTRACT
CIRCUIT DIAGRAMS
CIRCUIT DESCRIPTION
CIRCUIT OPERATION
DC voltage generator
This unit will generate +5 volt & ground from the AC supply,
which is used for driving all ICs. This generator contains 230/6-0-6 volt
transformer, bridge rectifier circuit (using 1N4001diodes) & 7805-voltage
regulator IC. Transformer secondary output is applied to bridge rectifier .The
bridge rectifier will produce a DC voltage. To remove ripples of the bridge
rectifier output; a capacitor (C1) is connected across the bridge output. To
remove the remaining ripples regulator IC 7805 used. Then +5V & ground
are obtained from 7805.
• Initial Condition
PCB LAYOUT
MAKING OF PCB
PCB Fabrication
Etching
In this process, all excess copper is removed leaving behind only
the drawn pattern. To do etching the aqueous solution of ferric chloride with
the quantity depending upon the size of the PCB to be etched is then poured
in the tray. The etching process may take about half an hour. The laminate is
now thoroughly washed in water after etching is completed. The mark is
then removed with alcohol.
Drilling-Tinning
After etching the process employed is drilling of holes. The
diameter of holes varies from component. It is 1mm per IC pins, 1.25mm for
resistors and capacitors 1.5mm for diodes and even larger mounting presets.
Using a soldering iron can do the oxidation of copper portions can be
prevented by tinning that.
SOLDERING
Soldering is the process of joining metals by lower melting metal to
wet or alloy with adjoined surfaces.
SOLDER
Solder is the joining material that melts below 427 degree Celsius.
Soldered joints in electronic circuits will establish string connection between
components leads .The popularly used solders are alloys of tin & lead that
melts below the melting point of tin.
FLUXES
In order to make the surfaces accept solder readily, the component
terminals are made free from oxides and other obstructing films. The leads
are cleaned chemically or by abrasion using blades or knives. Small amounts
of lead coating are done on the clean portion of leads using soldering iron.
This process is called tinning. Zinc chloride or ammonium chloride
separately or in combination are used fluxes. These are in available in
petroleum jelly as paste flux. The residues which remain after soldering is
washed out with more water accompanied by brushing.
SOLDERING IRON
It is the tools used to melt the solder apply at the joints in the
circuits. It operates in 230volts mains supply. The iron bit at the tip of it gets
heated up with in few minutes. 50W and 25W soldering irons are commonly
used soldering purpose.
PROCEDURE
1. The layout of the connection of the components in the circuit is taken.
The chord of the soldering iron is plugged to the main supply to get it
heated up.
2. The component leads are straightened and cleaned using blade or
knife. Then a little flux is applied on the leads. A little solder is taken
on soldering iron and is applied on molten solder on the leads. Care is
taken to avoid the components getting heated up.
3. The components are mounted on the PCB by bending the leads of
components using nose pliers.
4. Flux is applied on the joints to solder it. To avoid dry soldering and
heating up of the components, it is done in minimum time.
Advantages
Disadvantages
DATA SHEETS
1) IC 74LS00
Description
These devices contain four independent 2-input NAND gates.
2) IC 74LS04
Description
These devices contain six independent NOT gates.
3)IC 74LS30
Description
These devices contain a single 8 input NAND Gate.
4)IC 74LS373
Description
These 8-bit registers feature 3-state outputs designed specifically for driving
highly capacitive or relatively low-impedance loads. The
high-impedance 3-state and increased high-logic-level drive provide these
registers with the capability of being connected directly to and
driving the bus lines in a bus-organized system without need for interface or
pullup components. These devices are particularly attractive for
implementing buffer registers, I/O ports, bidirectional bus drivers, and
working registers. The eight latches of the ’LS373 and ’S373 are transparent
D-type latches, meaning that while the enable (C or CLK) input is high, the
Q outputs follow the data (D) inputs. When C or CLK is taken low, the
output is latched at the level of the data that was set up.The eight flip-flops
of the ’LS374 and ’S374 are
edge-triggered D-type flip-flops. On the positive transition of the clock, the
Q outputs are set to the logic states that were set up at the D inputs.Schmitt-
trigger buffered inputs at the enable/clock lines of the ’S373 and ’S374
devices simplify system design as ac and dc noise rejection is improved by
5)IC 74LS147
Description
These TTL encoders feature priority decoding of the inputs to ensure that
only the highest-order data line is encoded. The ’147 and ’LS147 devices
encode nine data lines to four-line (8-4-2-1) BCD. The implied decimal zero
condition requires no input condition, as zero is encoded when all nine data
lines are at a high logic level.Cascading circuitry(enable input EI and enable
output EO) has been provided to allow octal expansion without the need for
external circuitry. For all types, data inputs and outputs are active at the low
logic level. All inputs are buffered to represent one normalized Series 54/74
or 54/74LS load, respectively.
6)IC 74LS47
Description
The 74LS47 feature active-low outputs designed for driving common-anode
LEDs or incandescent indicators directly.74LS47 circuit incorporate
automatic leading and/or traling-edge zero-blanking control .Inputs and
outputs are entirely compatible for use with TTL logic outputs.
7)IC 7805
BIBLIOGRAPHY
1. www.electronic-circuits.com
2. www.alldatasheet.com
3. E F Y Magazine
11. CONCLUSION