From Atoms to Systems

Microelectronics Applications Group

Systems integration based on high-density packaging
The research focus of the MAI group is the development of miniaturised microelectronic devices for applications in the body, on the body and around the body whereby the person and their needs are the central driver for ICT development. This research goal is achieved through the convergence of Microelectronics and Microsystems. The three strategic research strands of the group and examples of technology demonstrators developed from their research are: Ambient Electronic Systems: miniaturised wireless sensor modules Biomedical Microsystems: smart pills & microneedles for localised cancer treatment and pain free transdermal drug delivery Energy Processing for ICT: power supply-on chip, micro-energy scavenging Ambient Electronic Systems The main driver for the Ambient Group is the concept of miniaturised wireless sensor modules (from 25mm cubes down to a futuristic 1mm intelligent seed iSeed) and their application in ad-hoc networks that will drive future ICT opportunities in Personal Health (e.g. Smart Pills, localised cancer treatment and motion sensing for elderly care in the home) and Sustainable Development (e.g. remote environmental monitoring, sustainable agriculture and energy management). Wireless Sensor Networks: Intelligent sensors will be miniaturized wireless devices that will integrate the functions of sensing, signal and data processing, communications and power. We are developing miniaturised 3-D autonomous, wireless sensor modules (with dimensions of 25mm, 10mm, 5mm cube and the ultimate 1mm intelligent seed). This technology route offers a unique level of modularity, design exibility and robustness for applications in e-health and sustainable development. Technology Demonstrators: Miniaturised wireless electronics distributed in the environment can add intelligence to everyday objects allowing humans to interact with their environment to enable Assisted Living. Utilising miniaturised sensors (e.g. Inertial Measurement Units) embedded in clothing, wireless technologies enable Human Computer Interfacing and motion tracking to enable people to interact with their environment. We have produced a miniaturised wireless inertial measurement units, incorporating accelerometers, gyroscopes and magnetometers, which can deliver six degrees of freedom orientation data as well as location data in a 25mm cube. Applications being investigated include elderly homecare and expressive dance. Biomedical Microsystems The Biomedical Microsystems team is targeting research applications on the body & in the body, to improve the quality of life of patients suffering from disease and discomfort. The microsystems targeted are integrated in four device types: implants, capsules or smart pills, mucous membrane devices (e.g. endoscope) and compromised surfaces (e.g. skin patch). The two main research strands are featured overleaf.

Above: 25mm cube module featuing: 1 - Sensors, 2 - FPGAs, 3 - Communications, 4 - Power

Above: Fully assembled 10mm module connecting to a chemical sensor

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From Atoms to Systems

Microsystem Fabrication Building on established Tyndall fabrication capabilities planar and 3-dimensional microelectrodes arrays have been developed in silicon and polymers. Examples: Microneedle electrode arrays for cancer/gene therapy and painless vaccination through the skin Flexible planar electrodes for targeted electrochemotherapy of tumours System integration technologies Power and communication are typical functions that need to be integrated. An inductively powered nerve stimulation (for drop foot) implant was developed which requires an external transmitter unit. Novel embedded planar inductive coils are used for both transmitter and receiver. Presently a power supply platform, including a rechargeable battery and an RF link for mono or bi-directional communication, is being developed to drive active low and medium power implants. To enable miniaturisation and achieve reliable system performance in a typical body environment, ip-chip interconnect and assembly on exible substrates is being investigated as well as the development of near-hermetic packaging solutions for implant packaging solutions or swallow able capsules. Energy Processing for ICT Energy processing for ICT includes generation, transmission, storage and delivery of power to electronic circuits as well as the removal of heat through cooling. Whilst ever increasing levels of information processing are driving the ICT revolution, in many cases, the major challenges, as identied by the roadmaps, are due to limitations in current energy processing technologies. Research by this group addresses the provision of energy for future ICT. This involves Energy Harvesting Power Conversion Energy Transmission Energy Harvesting Electromagnetic microgenerators to supply power for MEMS using high aspect ratio plated coil technology developed in-house and already utilised in microinductors and micro-transformers integrated onto silicon. Power Conversion Low loss inductor integrated onto silicon Miniaturised PCB converter utilising advanced magnetic material and plated lamination. Coupled inductors to enhance current handling and transient response of magnetics integrated onto silicon. Advanced packaging for high power density applications. Energy Transmission Inductively powered sensors for use in ambient applications. Inductively powered module for use in an implantable neuromuscular stimulator. Inductive powering of implanted rechargeable battery.
Above: Toroidal inductor integrated onto silicon

Above: Micro needle array for the painless delivery of therapeutic agents

Above: High Aspect Ratio magnetics On Silicon Structure

For More Information on these topics contact: Dr. Cian OMathuna E: cian.omathuna@tyndall.ie T: +353 21 4904350