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Featured Products
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From Interphase: iSPAN 36701
Wireless Basestation AMC
Developers Heed the
Bandwidth Explosion
New Standards Advance Telecom
Evolution
The Sky is the Limit extending ATCA into
military applications
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Engineers Guide to ATCA
& MicroTCA Technologies 2010 2

Welcome to the 2010
&
MicroTCA
Technologies
Content surge. Bandwidth explosion. 40 gigabits per second.
If these hyperboles leave you feeling whiplashed, dont
worry: were right there with you. Now, more than ever,
engineers are charged with meeting the worlds increasing,
insatiable demand for data. Evolution is natural, but it doesnt
come easy. By leaning on AdvancedTCA, the backbone (and
backplane) of telecommunications equipment, vendors are
deploying new products to meet the needs of knowledge
workers and consumers.
In this issue, embedded developers and tech specialists con-
verge for a roundtable discussion about trends driving ATCA
and MicroTCA development. Then, in The Sky is the Limit,
Christian Engels of Emerson Network Power argues that
ATCA, as an open system, is best suited for military appli-
cations. And four experts explain why higher throughput,
lower power, and restricted radiation will be the keystones of
tomorrows wireless communication. Lastly, Marc DeVinney
of Interphase takes a quick look at how silicon advancements
have yielded bsestation applications on single Systems on a
Chip (SoC).
This is your guide to the expanding world of ATCA and
MicroTCA products, services and vendors, whether youre
looking for fresh editorial content or targeted ads. Get caught
up to speed. And as always, dont forget to send feedback,
thoughts and comments to info@extensionmedia.com.
As your work through the future, do not forget to send your
feedback, thoughts and comments to:
info@extensionmedia.com
Camer on B i r d
Editor, EECatalog.com
P.S. To subscribe to our series of Engineers Guides for
embedded developers and engineers, visit:
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MicroTCA
Technologies 2010
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The Engineers Guide to AdvancedTCA
& MicroTCA
Technologies 2010 is published by Extension

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contained herein. Engineers Guide to AdvancedTCA
& MicroTCA
Technologies is Copyright
2010
Extension Media LLC. No information in this Catalog may be reproduced without expressed written
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indicated by their companies.
November 9-11, 2010
The Only Ccnference
Fccused cn AdvancedICA,
AMC, and MicroICAl
"AcvstcecTCA 3umm/| /: ote ol |he put/:| |tsce
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/tvo/vec w/|h ATCA ot sty ol /|: te/s|ec :pec/l/cs
|/ot: |het you teec |o be s| |h/: :how.
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AdvancedICA Summit | !he on|y
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Contents
New Standards Advance Telecom Evolution. ......................................................................................................................... 6
AdvancedTCA Innovations Poised to Change the Game
by Elma Bustronic Inc................................................................................................................................................................................. 8
Developers Heed The Bandwidth Explosion
by Cameron Bird ...................................................................................................................................................................................... 14
NAT-MCH
by NAT ..................................................................................................................................................................................................... 16
The Sky is the Limit
by Christian Engels .................................................................................................................................................................................. 20
Online & Ofine: Industry Websites + Events .............................................................................................. 23
Tomorrows Wireless Communication Requires Higher Throughput and a Smaller Energy Budget
by Liesbet Van der Perre, Wim Van Thillo, Antoine Dejonghe, and Joris Van Driessche ........................................................................ 23
Winning Technology for Small Footprint Wireless Basestation Designs
by Marc DeVinney .................................................................................................................................................................................... 48
Products and Services
Hardware
Blades
Adax, Inc.
AdaxPacketRunner ................................................................ 27
Emerson Network Power
ATCA-7365 & ATCA-7365-CEProcessor Blades .................... 28
ATCA-7367 High Performance Processor Blade ................... 28
ATCA-F140 40G ATCA Switch Blade ..................................... 29
Pinnacle Data Systems, Inc.
ATCA-F1 Dual AMD Socket F AdvancedTCA Blade .............. 30
ATCA-RT01 AdvancedTCA RTM with Video and Storage .... 31
Boards / Board Accessories
Adax, Inc.
ATM4-AMC ........................................................................... 32
HDC3 ..................................................................................... 33
PacketAMC (PktAMC) ........................................................... 34
Boards / Smallform Factor
Interphase
iSPAN 36701 Wireless Basestation AMC ............................ 35
LeCroy Corporation
LeCroys PCI Express
Protocol Analysis and Test Tools ......... 36

Scan Engineering Telecom
SMCH-102 Cost-effective MCH for MicroTCA systems .......... 37
SAMC-203 High-performance AdvancedMC storage module ...... 38
SAMC-504 Quad-Core AdvancedMC Processor module ......... 39
Development Platform
Katana
2000 Commercial ATCA Bladed Server .................. 40

Enclosures
Elma Electronic Inc.
AdvancedTCA System Platforms .......................................... 41
Schroff
MicroTCA Enclosures ............................................................ 42
MicroBlade
MicroBoxPlus 1U ................................................................... 43
MicroBoxPlus 2U ................................................................... 44
Packaging
Elma Electronic, Inc.
AdvancedTCA
and MicroTCA
System Platforms .............. 45

Power Supply Modules
MicroBlade
Panther 380 and 760 MicroTCA DC Power Module ............. 46
Puma 300, 600 and 900 MicroTCA AC Power Module ......... 47

EECatalog
INDUSTRY FORECAST
Predictions, even those built on solid methodological
foundations, often collapse in the face of unforeseen
variables. But one selection pressure, as Rob Pettigrew of
Emerson Network Power reminds in our annual industry
roundtable (see page TK), remains. The introduction of
ATCA technologies will be evolutionary, he notes. Still,
analysts are split on the prospects of ATCAs evolution.
Here, we excerpt some appraisals hot, cold lukewarm and
every temperature in between:
From Heavy Readings ATCA, AMC & MicroTCA forecast
(www.heavyreading.com):
The ATCA sector will grow from $798 million in 2009
to $6.7 billion in 2012 - a compound annual growth rate
of 103 percent over that span. With second-generation
platforms already in production, ATCA-based system
shipments are growing quickly.
The COTS share of the ATCA market will fall below 50
percent by 2010, before recovering in 2011. As companies
ship more systems based on in-house ATCA components,
the COTS market share will fall, before recovering
slightly as the market matures.
ATCA-based 2G/3G/4G wireless systems from multiple
equipment vendors are delivering new flexibility for car-
riers. By using a single platform for several generations
of wireless technology, network equipment providers
can offer 2G and 3G solutions now, with simple upgrades
to Long Term Evolution (LTE) or WiMax when required.
IP Multimedia Subsystem (IMS), LTE, and Evolved
Packet Core (EPC) systems based on ATCA are now being
used for trials and network deployments. ATCA market
growth is partly being driven by carrier investment in
these key technologies.
More than 200 AMC modules are now available from 35
vendors, with several new market entrants. AMCs are
now available for central processing unit (CPU), digital
signal processor (DSP), storage, packet processing, net-
working, and general input/output (I/O) applications.
From Light Readings analysis, AdvancedTCA Makes
Headway, on the potential of a new wireless infrastruc-
ture based on ATCA (www.lightreading.com):
The idea behind the standard is that blades from one
vendor could be incorporated into a chassis made by
another vendor. Today, if you look, you have a separate
infrastructure for ATM, IP, wireless, storage, PSTN
switches, and so on, says Danny Berko, BATMs product
manager. One day all services could be integrated into a
single platform. The concept is any protocol on any card on
any slot on an AdvancedTCA platform.
Whether this level of interoperability is a practical
reality remains to be seen. Establishing standards and
implementing them is a good start, but service providers
will probably take a lot of convincing before they ll start
mixing different vendors cards in the same chassis. All
the same, the existence of the standards will probably help
drive down equipment prices, because it will lead to greater
commoditization of subystems as well as the components
that go into them.
New Standards Advance
Telecom Evolution
Forecasters point to wireless, 4G, and interoperability as reasons
to cheer on ATCA - with cautious optimism.
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Tere are up and coming products for ATCA that are ready to take
the industry by storm. Tese include orthogonal backplanes,
SerDes test units, and 40G ATCA backplanes.
Orthogonal Backplanes
Te orthogonal concept is a completely dierent approach to
backplane design. Developed with partner Z-Plane Inc, Bustronic
has a backplane with the high-speed routing across the rear of the
backplane (see photo 1 example), essentially the z-axis of the board.
With the high-speed signals taken o the backplane and onto rear
pluggable links that carry point-to-point signals directly, there
are virtually no negative stub eects on the backplane. Te result is
rates of 80-100 Gbps across the backplane.
Te Bustronic ATCA backplane with Z-Plane Links oers up to
triple the performance of traditional versions of the architecture
at a reduced cost. Tis is achieved using the Z-Plane Links which
carry the high-speed, long-trace signals via a small, low-prole
PCB board that plugs directly into the rear of the backplane. Te
basic clock signals and shorter trace lines are left on the back-
plane. Tis orthogonal link approach allows the backplane to
have only 10 layers, compared to a traditional ATCA backplane
which may have 18-24 layers or higher. Characterization studies
conrm that the signal integrity of the backplane with the Z-
Plane Links can produce solid results at higher data rates than
conventional backplanes.
Te ATCA community is moving to 40 Gigabit/second speeds
per channel across the backplane. Te version with the Z-Plane
Links will help ATCA backplanes achieve these very high perfor-
mance levels, while keeping costs low. Te Z-Plane Links feature
an adapter with guide pins used to rmly secure the rear plane
PCB in place and provide strain relief. Tis adapter has a short,
impedance-matched connection between the rear Z dimension
PCB (Link) and the backplane connector. Tey also have staggered
arrays, so they can be stacked adjacent to one another, and they
come in press-t pin or compliant pin termination depending on
the backplane thickness.
SerDes Test Units for VPX Backplanes
Bustronic currently oers SerDes test units for VPX backplanes.
With the multi-gigabit speeds in VPX and ATCA, designers will
need to test their boards, backplanes, and systems. Whether you
are an integrator/end-user or vendor, you need to ensure that the
product works properly with clean signals. Te DJ1000/1600 tests
the bit error rate (BER) of the backplane, plug-in module or full
interconnect path. It can provide Eye Diagrams and other modules
to troubleshoot problems with the system. Pre-emphasis tuning
can also be applied to optimize signal outcomes. VPX versions are
now available and ATCA versions are on the roadmap.
40G ATCA Backplanes
Te eorts for 40G ATCA backplanes are underway in PICMG and
Bustronic is heavily involved. By 40G, we mean 4x channels of 10
Gbps signals. To come up with a standard, the industry is doing a
close review of the IEEE 802.3-2008 requirements for 10-Gbit Eth-
ernet Base-KR. Te PICMG community needs to come to consensus
on what parameters should be specied as part of compliance and
what their actual limit values should be. IEEEs 802.3-ba work on
40G has also hit some snags, especially with regards to crosstalk
quantication. However, progress is being made and late in the
year, we should have the issues resolved and provide proven perfor-
mance at 40G speeds.
CONTACT INFORMATION
Elma Bustronic Inc.
44350 Grimmer Blvd.
Fremont, CA 94538 USA
510.490.7388 Telephone
sales@bustronic.com
www.bustronic.com
by Elma Bustronic Inc.
AdvancedTCA Innovations
Poised to Change the Game
Bustronic ATCA Backplane with rear Z-Plane Links.
SerDes test unit that can be used for VPX, ATCA,
and other high-speed serial architectures.
Example of 40G AdvancedTCA backplane.
JTAG
GTX (8)
FMC DP[07]
LVDS I/Os (76)
LA[0033] P-N (full)
HA[0023] P-N (full)
HB[0017] P-N
High-pin-
count FMC
AMC
DDR3
MicroBlaze code
128 MB
DDR3 SODIMM
1 GB (by default)
QDR2 SRAM
Bank 1: 9 MB
QDR2 SRAM
Bank 2: 9 MB
Flash memory
64 MB
Low-jitter
clock switch
Xilinx Virtex-6
LXT or SXT
JTAG switch
Mestor interface
JTAG interfaces: FPGA/IPMI
User I/Os: LVDS 14, clock 1
FPGA UART interface (serial TX and RX)
FMC clock (4)
TCLKA, B, C, D
I
2
C SMT
jumper
Module management
controller (MMC)
IPMI (I
2
C)
Fabric clock
Port 0
Port 1
Port 2
Port 3
Ports 47
Ports 811
Ports 1215
Ports 1720
GigE (1)
GigE (1)
Storage (1)
Storage (1)
PCIe/SRIO/XAUI (4)
PCIe/SRIO/XAUI (4)
LVDS I/O (4)
RTM MGT (4)
U
A
R
T
U
s
e
r

I
/
O
U
A
R
T
JTAG chain
JTAG
FPGA JTAG
I
P
M
I

J
T
A
G
Perseus 601X functional block diagram
Fabric switch
Perseus 601X
The rst Virtex-6 AMC with a VITA 57.1 expansion site
High-performance, high-bandwidth,
low-latency processing applications
at your ngertips
Outstanding features
Mid-size AMC for TCA and AdvancedTCA platforms
Choice of powerful LXT and SXT Virtex-6 FPGAs
High-pin-count VITA 57.1 FMC expansion site for I/Os
DDR3 SODIMM interface to upgrade system memory
Supports multiple switch fabrics PCIe, SRIO, XAUI, GigE
Comprehensive line of software development tools
The Perseus 601X advanced mezzanine card (AMC) is
designed around the powerful Virtex-6 FPGA, combining
unsurpassed fabric exibility and a colossal external memory,
as well as beniting from multiple high-pin-count, modular
add-on FMC-based I/O cards.
The Perseus is designed for hi gh-perf ormance, hi gh-
bandwi dth, l ow-l atency processi ng appl i cati ons. The card
also takes full advantage of the Virtex-6 FPGAs power,
which, when combined with Lyrtechs advanced soware
development tools, makes the Perseus perfect for reducing
size, complexity, risks and costs associated to leading-
edge telecommunications, networking, industrial, defense
and medical applications. On top this, the Perseus FMC
expansion site oers almost endless I/O possibilities.
Mid-size conguration
Full-size conguration
1 GB DDR3 SDRAM SODIMM
9 MB QDR2 SRAM banks
(2
nd
bank under heat sink)
Full-size AMC
Mid-size AMC
Mestor expander
troubleshooting interfaces
Full-size AMC panel shown. Mid-size AMC front panel also available.
64 MB NOR fash memory
containing FPGA images,
MicroBlaze boot code, user code
128 MB DDR3 SDRAM
(MicroBlaze memory)
High-pin-count FMC interface (VITA 57)
FMC front panel
The Perseus at a glance
The Perseus high-performance Virtex-6
LXT and the SXT platform families are
supported. They both oer the exibility
and acceptable tradeos between high-
performance logic and massive digital
signal processing power.
Mid-size and full-size congurations
Support for AMC R2.0 and R1.0 through
an onboard clock switch
GTX base clocks 100 MHz, 125 MHz,
and 625 MHz (PCIe/GigE/XAUI/SRIO)
Fabric clock RX or TX (100 MHz
PCIe, default)
IPMI controller (based on the
AVR version of the Pigeon Point
AdvancedMC MMC)
FPGA and IPMI JTAGs on the Mestor interface
Deb ug g i ng op ti ons
M estor-to-FPG A JTA G a d a p tor
Connected to a Xi l i nx JTA G p od , you ca n ea si l y d eb ug your softw a re throug h USB.
M estor exp a nd er
O ffers a w i d e va ri ety of d eb ug g i ng i nter fa ces ri g ht on the Perseus ful l -si z e front p a nel
FPG A JTA G a nd IPM I, USB UA RT, LVDS I/ O s a nd more.
Ba ckp l a ne
You ca n ea si l y d eb ug your softw a re
throug h the ca rd s b a ckp l a ne FPG A JTA G
Debugging interfaces
The FPGA and IPMI JTAGs are available from the standard
AMC backplane or from the onboard Mestor interface.
Lyrtech oers two optional Mestor debugging modes:
Processing power
The Virtex-6 family of FPGAs is the high-performance silicon
foundation for targeted design platforms. Consuming 50 %
less power and costing 20 % less than the previous generation
of FPGAs, the Virtex-6 family is built with the right mix
of programmability, integrated blocks for digital signal
processing, memory and connectivity support including
high-speed transceiver capabilities to satisfy the insatiable
demand for higher bandwidth and higher performance.
Software development tools
The Perseus comes with a comprehensive set of integrated,
multilayer soware development tools that oer users a
choice of environments from a base-level hand-coded
design environment to a high-level graphical model-based
design environment.
Commonly referred to
as the BSDK, this kit
oers recongurable
FPGA components and
reference designs, along
with the infrastructure
to implement, simulate,
synthesize, validate, and
deploy complete applications on the cards Virtex-6 FPGA.
This development kit takes care of the tiresome burden of
reinventing interface drivers for the FPGA, freeing you to
focus on unique, value-added development.
Optional kit
Model-based design kit
(MBDK)
Board software development kit (BSDK)
Standard Lyrtech
software development tools
High-level, optional
software development tools
The MBDK is optional and allows you to
easily design high-performance digital
signal processing systems within the cards
FPGA with the MATLAB/Simulink design
environment and extensive DSP IP libraries
from Xilinx.
For even greater exibility, System Generator
for DSP supports MicroBlaze so processor cores, which
allows using high-level abstractions that can be automatically
compiled into the FPGA without losing any performance over
VHDL designs. Use it with ChipScope Pro to debug your
applications.
These features, combined with the capabilities of the Virtex-6
FPGA, make it simple for designers to harness the parallel
processing power of an FPGA.
The Perseus MBDK edge
Interface and integrate with the interface libraries
supplied with the Perseus in no time at.
Benet from all-integrated conguration, simulation, and
code generation advantages of the Perseus MBDK.
Save precious development time using the debugging
tools part of the MBDK, namely recording/playback tools
and shared-memory GigE/PCIe HIL co-simulation tools.
Congure the Perseus in a snap with its graphical
conguration tools.
Draw the maximum out of the Perseus streaming
interface between the FPGA and host computer running
MATLAB (GigE/PCIe).
Further your understanding of the Perseus with its
extensive library of demonstrations and applicative
examples.
Optional FMC modules
The Perseus benets from a growing pool of FMC modules,
among which the following.
ADAC250
This module is designed around the high-performance A/D
and D/A conversion technology from Texas Instruments
it integrates one dual, 14-bit, 250 MSPS analog-to-digital
converter (ADS62P49) and a dual, 16-bit, 1 GSPS digital-
to-analog converter (DAC5682Z; also capable of a 24
interpolation mode). Combined with multiple clocks and
synchronization modes, the ADAC250 is at its best in DSP
applications such as soware-dened radio (SDR), advanced
telecommunications (MIMO systems, cognitive radios,
beamformers, LTE, WiMAX), signal intelligence (SIGINT),
radar, sonar, and medical imaging applications.
SFP+2
Dual, 10 Gbps SFP+ interface on a high-pin count FMC
module. Board under development. Contact Lyrtech for
availability.
A variety of other FMC modules are also underway.
Dont hesitate to contact us for more information.
Contact us for details at info@lyrtech.com
or visit us on the Web at www.lyrtech.com.

EECatalog
SPECIAL FEATURE
To ease the ow of data gushing through telecommunica-
tion networks, President Obama recently called on the U.S.
government to free up part of the wireless spectrum. ATCA
and MicroTCA platforms are becoming increasingly important
players in dealing with the bandwidth explosion. To get a pulse
on key trends in development, EECatalog interviewed Louis
Perez, director of North American engineering at Interphase;
Rob Pettigrew, director of marketing and communications for
embedded computing at Emerson Network Power; and Justin
Moll, director of marketing at Elma Bustronic.
EECatalog: What major trends are driving engineering of
ATCA/MicroTCA systems?
Louis Perez, Interphase: 4G, Carrier Grade
Ethernet, and Deep Packet Inspection (DPI)
applications. Another, specially for MicroTCA,
is cost reduction.
Rob Pettigrew, Emerson: Clearly the mega-
trend in the industry is the insatiable subscriber
demand for bandwidth, largely in wireless
networks. Tis is driving the need to develop
and deploy new infrastructure equipment. Te
decision to deploy on ATCA systems is driven
by time-to-market, giving telecom equipment makers the
ability to rapidly develop and deploy systems with the latest
technology.
Justin Moll, Elma Bustronic: One of the
main drivers is the push, or need for more
bandwidth in the systems from several points.
With the popularity of mobile devices, social
networking, surge in video usage, etc., the data
demand is really putting a strain on todays
networks. Tese same demands are driving military and aero-
space to consider ATCA/uTCA to meet the need for Integrated
Communication Systems, Command and Control, Next-Gen
BMD and Radar Tracking. Historically, tier two customers
with telecom and enterprise applications have leveraged stan-
dards like ATCA and uTCA but we have seen an increased move
to outsource from Tier one players with higher volume needs
as well.
EECatalog: How is 4G impacting development?
Perez: 4G requires equipment thats common to ATCA and
MicroTCA. Tis is stimulating creative cost optimized solu-
tions for 4G. Te volumes will drive cost down further. 4G also
requires an increase of backplane throughput and processing
performance.
Pettigrew: Our customers are developing 4G infrastructure
now. For LTE/EPC, AdvancedTCA systems are a great t for
both control plane (MME) and data plane (S-GW / P-GW) ele-
ments, creating strong demand for current 10Gbps integrated
systems, and next generation 40Gbps systems.
Moll: ATCA has the inherent attractiveness of being an open
specication, with wide vendor support, a proven and suc-
cessful architecture, and has the forward performance push
into speeds like 40 gigs and even beyond that. Itll be very
attractive as 4G comes online.
EECatalog: In Telecom, the leap from 10 to 40 Gbps (gigabit
per second) ATCA shelves is set to begin this year, will a full-
edged roll out in 2011. What are the challenges of building
these new shelves? And how are designers mitigating these
concerns?
Perez: Maintaining signal quality is a challenge in building
these new shelves, and designers are focused on solving these
issues.
Pettigrew: Te biggest challenge currently is that the 40Gbps
ATCA standards are not yet ratied. While we are condent
that the physics are well understood, what remains is the
allocation of insertion loss and cross talk budgets between
the various system elements (backplane, fabric hub board,
and payload board). In the absence of such budget allocations,
early developers are forced to be very conservative with their
assumptions.
As fabric switches and payload blades come to market, we can
assume that there will inevitably be interoperability issues
between products from dierent vendors. Tese issues will be
mitigated through interoperability testing by bodies such as
PICMG and the CP-TA.
Of course, customers looking to reduce their risk during this
interval will be able to mitigate this by purchasing system-level
by Cameron Bird
Developers Heed The
Bandwidth Explosion
Demand for faster data transfer coincides with upgrades to the
telecom infrastructure.
www.eecatalog.com/atca 15
EECatalog
SPECIAL FEATURE
redundancy and system management. However, cost alone can
limit it to certain apps. Recently, some developers have moved
to simpler versions of MicroTCA without separate intelligent
power supply modules and without inherent redundancy.
Instead, active circuitry can be designed on the backplane to
account for intelligent power delivery to each slot, rather
than counting on a more complex hot-swappable power unit.
Simpler versions can now reach more markets, because at this
level its at a competitive price point. MicroTCA is now also
seeing more competition from architectures such as 3U VPX
and purpose-built solutions from various vendors.
EECatalog: Looking ahead, what other ATCA/MicroTCA-
based technologies do you see as the next game-changers?
Perez: Mobile and 3D Video applications are going to be the
next game-changers driving ATCA/MicroTCA based technolo-
gies.
Pettigrew: I believe the introduction of ATCA technologies
will be evolutionary, driven by the network demands for
more compute performance and bandwidth capacity, and the
availability of technologies to meet those demands. For ATCA
fabrics, look for the introduction of 40Gbps switches this
year, with future products delivering more I/O and packet
processing capabilities. For payload, the focus will remain on
keeping up with the latest general purpose server and spe-
cialized packet processing technologies, with introduction of
40Gbps payload next year. And since computing blades never
seem to get any cooler, look for chassis with improved airow,
cooling and acoustics.
Moll: 40G ATCA Backplanes will be a huge boost in bandwidth.
Well also likely see more of ATCA in mil/aero applications and
perhaps some hybridized rugged versions. Aside from 40G
eorts, Elma has been involved in an orthogonal approach
with our partners at Z-Plane Inc. So what weve done is develop
a backplane with links on the rear. If you think of a backplane
with X and Y axes, these links are on a Z axis. Tey can carry
the high-speeds or the worst-case traces. Tis can help take a
backplane - say with 24 layers - to 8 or 10 layers. When youre
going from higher to lower layers, the stub eect from longer
stubs will be minimized. Ultimately, you can get triple the
performance and the costs are expected to drop to half or stay
about the same. Weve tested about 75 gigs across the links, so
we have much higher performance across the total backplane
solution.
Cameron Bird is editor of EECatalog.com.
products, with chassis, switches and payload boards developed
by the same vendor.
Moll: Tere have been claims of capability up to 40Gbps.
Maybe a card with four links at ten gigs each has been proven
at those speeds, but what about the full interconnect path -
from card going across backplane to a card? Te industry is
still working out those issues. Te IEEE P802.3ba task force is
working on an eort to achieve 40 gigs across the backplane,
along with the PICMG community. Its still dicult to produce
a backplane and/or daughter card that will replicate the card
as it was simulated. We need to make decisions on the total
channel loss, and there needs to be a consensus of method-
ology in standardization in general on a few things. More time
needs to be invested in areas such as the 10GBase-KR and
40GBase-KR4. In short, there just needs to be more time and
development. We expect late this year that the PICMG 3.1 Rev
2 committee will have something more solidied and the IEEE
P802.3ba just announced ratication in June of this year. Until
then, companies can claim 40 gigs across an ATCA backplane,
but we need to be sure that, like I said, the same methods are
standardized and agreed upon. Were very condent well get
there as an industry, probably by the end of this year, but thats
not all settled yet.
EECatalog: About a year ago, the PCI Industrial Computer
Manufacturers Group boasted that air-cooled rugged MicroTCA
would extend the use of the platform beyond its original
Telecom focus. How successful has this initiative been?
Perez: MicroTCA systems has had successes in ruggedized
applications in conduction cooled and fanless environments.
Ruggedized MicroTCA systems are a perfect t for defense and
aerospace applications. In the past year, we have seen growth
in this market segment.
Pettigrew: Te MicroTCA market continues to evolve. But I
think its still a bit early to determine how well it will succeed
in markets requiring ruggedized systems.
Moll: Rugged MicroTCA has size and performance possibilities
that are quite intriguing. Te challenge has been to maintain
the advantages of the AMC COTS ecosystems while rugged-
izing the architecture to meet the environmental demands of
a deployed environment. As the cost and the complexity of the
solution increase other competing architectures become attrac-
tive. Well have to see whether the market will accept some of
the inherent compromises that the specication might have
to achieve a certain ruggedness and cooling level and if the
competing technologies will take a strong foothold.
MicroTCA is very attractive with its smaller footprint and
functionality. Te architecture in general reaches a wide range
of applications. Initial versions were designed with high-level

N.A.T. Gesellschaft fr Netzwerk- und Automatisierungs-Technologie mbH
Kamillenweg 22 l 53757 Sankt Augustin, Germany l Phone: +49 2241 398 90
Fax: +49 2241 398 910 l sales@nateurope.com l www.nateurope.com
The N.A.T. MicroTCA Carrier Hub NAT-MCH is the
central management and data switching engine
for all MicroTCA systems.
The NAT-MCH is designed to provide any
functionality as defined by the MicroTCA
specification MTCA.0 R1.0, serving up to the
maximum of 12 Advanced Mezzanine Cards (AMCs),
1-4 power units and two cooling subsystems.
Because of its scalable and flexible design the
NAT-MCH can be used in any kind of MicroTCA
system, supporting telecom and non-telecom
environments as well as redundant and non-
redundant architectures.
The mandatory carrier manager is realized util-
izing the on-board Freescale ColdFire CPU. For
MicroTCA systems operated in a detached or
stand-alone mode a shelf manager as well as a
system manager can be provided, too.
Beside the intelligence the MCH base module
incorporates a managed, non-blocking and low-
latency Gigabit Ethernet L2 switch for base channel
connectivity. Numerous options like a fabric switch
module for PCI-Express (PCIe), Serial Rapid I/O
(SRIO), 10 Gigabit Ethernet or a clock distribution
module for telecom environments are available as
mountable daughter boards.
Serial Rapid I/O
- - - - - - - - - - - - - - - - - - - - -
10GigaBit(XAUI)
- - - - - - - - - - - - - - - - - - - - - - - - -
GigaBit Ethernet
- - - - - - - - - - - - - - - - - - - - - - - - -
PCI Express
- - - - - - - - - - - - - - - - - - - - -
Telecom clock and FCLK
Serial Attached SCSI
- - - - - - - - - - - - - - - - - - - - - - - - -
Following the building block model the
NAT-MCH can be individually arranged to meet
the exact system requirements. A comprehensive
software support like a Java based GUI interfacing
to the Open HPI compliant top level API of the
NAT-MCH completes the product and makes it
an ideal choice for any AMC based MicroTCA
solution.
NAT-MCH
Technical Data
Overview and Purpose
The NAT-MCH is a MicroTCA (uTCA/MTCA)
Carrier Hub in the form factor of a single
width and mid size or full size Advanced
Mezzanine Card (AMC). It provides the cen-
tral management and data switching entity
for all MicroTCA systems.
The NAT-MCH comprises of a base module
and numerous optional daughter cards
which can be mounted on the base module.
The NAT-MCH is MicroTCA.0 R1.0 compliant
and delivers switching and hub functional-
ity for the various system fabrics as defined
in the AMC.x standard series, i.e. 1Gigabit
Ethernet, PCI-Express (PCIe), Serial Rapid I/O
(SRIO), 10Gigabit Ethernet (XAUI) or Serial
Attached SCSI (SAS). The NAT-MCH can also
provide a centralized clock distribution to all
AMCs in the system.
CPU, memory and O/S
The NAT-MCH base board is equipped with
a CPU of the Freescale ColdFire family of
processors. The CPU operates at core fre-
quency of 200 MHz. The NAT-MCH provides
32/64MB SDRAM and 16/32/64MB FLASH
memory. The operating system used with
the NAT-MCH is OK1 or Linux.
Gigabit Ethernet Hub and Switch
and 10GbE (XAUI) Support
The Gigabit Ethernet Switches incorporated
in the NAT-MCH both provide a layer 2,
non-blocking, low-latency Gigabit Ethernet
switches, supporting VLAN as well as a port
based rate control. The NAT-MCH supports
Fabric A (1GbE) and Fabrics D-G (10GbE,
XAUI) according to MicroTCA.0 R1.0 and
PICMG SFP.1 R1.0, serving up to 12 AMCs as
well as the update channel from the second
MCH in redundant environments. Also
supported are uplink ports at the front panel
of the NAT-MCH in order to interconnect to
other carriers, shelves or systems.
PCI Express Hub and Switch
The PCI Express Switching option allows
PCIe connectivity for up to 12 AMCs at
PCIe rates from x1 to x4. The used PCIe
chipsets provide a Quality of Service (QoS)
module and are configurable in terms of a
non-transparent port for multi-Host sup-
port. The PCIe option can optionally provide
a PCIe clock by a Spread Spectrum Clock
(100MHz mean) or a fixed 100MHz clock.
The clock can be provided compliant to
HCSL or MLVDS signaling levels. The PCIe
hub provides clustering support for two
independant clusters of 6 slots each.
SRIO Hub Module
Alternatively to PCIe or 10GbE (XAUI) the
NAT-MCH can be equipped with a Serial
Rapid I/O (SRIO) daughther board to support
contention less point-to-point connectivity
between up to 12 AMC modules. The SRIO
hub supports x1 and X4 fat pipe transport
density.
Clock Distribution
Besides the PCIe clock the NAT-MCH also
offers a sophisticated clock distribution
module for special requirements, i.e. as by
comms applications. Thus the module al-
lows a flexible selection of the telecom and
non-telecom clocking structures as defined
in MicroTCA.0 R1.0.
The on-board Stratum 3 type PLL sources its
clock reference configurable from either any
of the 12 AMCs or from an external clock via
the front panel BNC type connector. With
respect to the PCIe clock the NAT-MCH sup-
ports both signal levels, HSCL as required
by PCI-SIG and MLVDS as requested by the
MicroTCA.0 specification.
Management
The NAT-MCH incorporates a MicroTCA
Carrier Management Controller (MCMC)
which supports and manages up two 12
AMCs, 2 cooling units and 1-4 power units.
Special care has been taken to support
numerous aspects of system architectures,
i.e. E-Keying, redundancy, load sharing,
clocking, fail-over scenarios or system integ-
rity. External system or shelf managers can
connect to the NAT-MCH through and of
the Ethernet front panel ports. For remote
control and visualization N.A.T. holds its
JAVA based application NATView available.
Like any other remote management tool (i.e.
ipmitool (open source) or any tool based
on the HPI recommendation of the Service
Availability Form (SAF)) NATView accesses
the NAT-MCH via the Remote Management
Control Protocol (RMCP) as requested by
the MicroTCA.0 specification.
Configuration
The NAT-MCH can be configured comfort-
ably by the included web interface using any
standard web browser or by the command
line interface via serial connection (RS232)
or a Telnet connection.
GigEth
Switch
Fabric B
R
J
4
5
1
0
0

B
a
s
e
T
-
M
a
n
a
g
e
m
e
n
t

-
Fast Ethernet
NAT-MCH
- Block Diagram -
Stratum 3
PLL
FPGA
BNC on
faceplate
Fat Pipe Switch
for AMCs 1-6
Fabric D-G
Fat Pipe Switch
for AMCs 7-12
Fabric D-G
AMC 1-6
AMC 7-12
Fat Pipe nterconnect
Tongue 1
Tongue 2
Tongue 3
Tongue 4
R
J
4
5
1
0
0
0
B
a
s
e
T
-
U
p
l
i
n
k

-
Clock 1-3
ndicator
Leds
Backplane
Face Plate
HUB-PCB - Optional
FCLKA
generator
(if required)
Clock-PCB - Optional
Optional
L
o
c
a
l P
M
, S
P
Fabric A
PM
Controller
PM
Local Bus
CPU
Carrier Manager
Shelf Manager (opt.)
System Manager (opt)
OS
Mng Controller
Mng Controller
Extended Fat Pipe
Switches avaiIabIe:
- PCIe
- SRIO
- 10GbE (Q1/08)
M
Gigabit Ethernet Uplink

NAT-MCH-Mezzanine Modules
Clock Mezzanine
FPGA
b
a
c
k
p
la
n
e
c
o
n
n
e
c
to
r
NAT-MCH Clock Mezzanine
CLK1
Update CLK1
MLVDS
Transceiver
Update CLK3
to second
NAT-MCH
CLK2
MLVDS
Transceiver
MLVDS
Transceiver
CLK3/
FCLKA
Tel. CLK
Tel. CLK
Tel. CLK
Tel. CLK
Tel. CLK /
FCLKA
to 12
AMCs
to 12
AMCs
to 12
AMCs
Stratum 3
PLL
ext. ref. CLK
Tel. CLK
various frequecies
ref. CLK 0-2
configuration
Micro-
controIIer
PCe Clock
parallel
Bus
PM/SP
MLVDS/
HCLS
Transceiver
NAT-MCH
Base Board
Connector
SAS/SATA
Expander
SATA
Backplane
Tongue 2
The Clock Mezzanine Module allows a
flexible selection of the telecom and non-
telecom clocking structures as defined in
MicroTCA.0 R1.0. The on-board Stratum
3 type PLL sources its clock reference con-
figurably from either any of the 12 AMCs
or from an external clock via the front panel
BNC type connector. In conjunction with
the PCIe Hub module it provides a PCIe
compliant fabric clock (FCLKA) to all AMC
slots. This can be either a 100MHz fixed or
100MHz Spread Spectrum clock (SSC). The
PCIe clock can be provided compliant to
HCSL or MLVDS signaling levels.
Key Features:
Support of AMC clocks CLK1, CLK2
and CLK3 for up to 12 AMCs
Update clock for a second NAT-MCH
in a redundant systems
Reference clock In/Output on
face plate
Stratum 3 type PLL clock source
for telecom applications
Variable switching and distribution
of clocks by onboard FPGA
Reference for the Stratum 3 PLL can
be either CLK1 or CLK2 from any AMC
or sourced from the front panel
PCI Express compliant clock signal can
be distributed via FCLKA to all
12 AMCs (only supported with an
installed PCI Express Hub-Module)
PCIe Hub Mezzanine
Fabric D-G
Fabric D-G
AMC 1-6
AMC 7-12
PCe
x8
Tongue 3
Tongue 4
Spread
Spectrum
PLL
Mng Controller
PCe Clock to
CLK-Mezzanine
MCH
Base/Clk Board
Connector
PM
Backplane
Clock
100MHz
100MHz Fix /
Spread
Selector
Hot Plug Control
NAT-MCH - PCIe Mezzanine
Temp
Sensor 2
PC Express
Switch 2
PLX PEX8532
Temp
Sensor 1
PC Express
Switch 1
PLX PEX8532
The PCI Express Switching Mezzanine is an
AMC.1 compliant module for the NAT-MCH
that enables users to add scalable high
bandwidth, non-blocking interconnection
to a wide variety of applications including
servers, storage, video streaming, blade
servers and embedded control products.
The PCIe Hub module supports full non-
transparent bridging functionality to allow
implementation of multi-host systems
and intelligent I/O modules in applications
such as communications, storage and blade
servers.
Key Features:
support for 6 (option -X24) or 12
(option- X48) AMC modules,
Fabrics D-G
non-blocking switch fabric
built of two PLX PEX 8532 chips (-X48)
high density x8 interconnect between
chips to prevent performance
bottleneck
upstream port configurable to any
of the 12 AMC slots
PCIe hot plug support for each
AMC slot
secondary (failover) host possible
clustering support, two clusters of
6 AMC modules each can be operated
individually, each having its own root
complex
supports x1 and x4 width ports to
any AMC
configuration option for Spread
Spectrum Clock (SSC) or 100MHz
fixed PCIe clock
PCIe clock can be provided as Fabric
Clock (FCLKA) to the AMC slots
SRIO Hub Mezzanine
SRO
Switch
Tundra TS578
SRO
Switch
Tundra TS578
AMC 1-6
AMC 7-12
Dual
X4 SRO
Tongue 3
Tongue 4
Backplane
NAT-MCH: SRIO Mezzanine
Local PM
nterface
/Power
Mng
Controller
NAT-MCH
Base Board
Connector
Fat Pipe
X4
X4
Fat Pipe
PM
Temp
Sensor 1
Temp
Sensor 2
Face
plate
Uplink 1
Uplink 2
The SRIO Mezzanine module provides a non-
blocking high performance data switching
functionality for up to 12 AMCs. The non-
hierarchical structure of SRIO allows for
superior bandwidth data communication
between each end point. Additonally, with
SRIO data integrity and health checks are
performed by hardware.
Key Features:
flexible port width: X1 and X4
12.5 GBit/sec Bandwith per port (X4)
80 Gbit/s aggregate bandwidth
operating baud rate per data lane
1.25 GBit/s, 2.5 GBit/s or 3.125 GBit/s
transport layer error management
low latency packet transport
power down modes and routing
capabilities per port
decentralised communication model:
per-to-per
10GbE (XAUI) Hub Mezzanine
Fabric D-G
AMC 1-6
AMC 7-12
Tongue 3
Tongue 4
Backplane
NAT-MCH 10GbE (Xaui) Mezzanine
PM, SP
to MCH-Base
Mng Controller
Fabric D-G
Update
To MCH 2
Update
To MCH 2
Temp
Sensor
10Gigabit
Ethernet
Switch
NAT-MCH
Base Board
Connector
2C
Face
plate
Uplink 1
Uplink 2
The NAT-MCH 10 GbE Hub Mezzanines
provides high performance, low latency and
robust Ethernet packet switching service for
MTCA systems.
Key Features:
10GbE Ethernet port for 12 AMC slots
2 Uplink ports on faceplate
per Port selction of:
XAUI - 10GBase-CX4 t
2.5 GbE t
1 Gb t
Link Aggregation (802.3 aad)
240 Gbps bandwidth
Security:
MAC address security
Port access control (802.1x)
Layer 2 Bridging Features:
Spanning Tree (802.1D,s,w)
VLAN priority (802.1Q,P)
Duplex Flow Control (802.3x)
user defined monitoring and
filter rules
2 Uplink ports on faceplate
per Port selction of:
XAUI - 10GBase-CX4 t
2.5 GbE t
1 Gb t
240 Gbps bandwidth
Security:
MAC address security
Port access control (802.1x)
N.A.T. Gesellschaft fr Netzwerk- und Automatisierungs-Technologie mbH
Kamillenweg 22 l 53757 Sankt Augustin, Germany l Phone: +49 2241 398 90
Fax: +49 2241 398 910 l sales@nateurope.com l www.nateurope.com
Technical Data NAT-MCH
CPU and memory
Freescale ColdFire 547x @ 200MHz
DRAM: 32/64MB
FLASH: 16/32/64MB
IPMI and Compliance
12 AMCs,
2 cooling units
1-4 power units
PICMG AMC.0 R1.0
PICMG 2.9 R1.0
Supported Fabrics and Compliance
Fabric A: Gigabit Ethernet
12 AMCs t
PICMG AMC.2 R1.0 t
PICMG SFP.1 R1.0 t
Fabric B: Serial Attached SCSI
Serial ATA t
PICMG AMC.3 R1.0 t
option available on request t
Fabric D-G:
PCI Express (PICMG AMC.1 R1.0) t
12 AMCs, x1-x4 each t
Serial Rapid I/O (PICMG AMC.4) t
10GbE (XAUI) (PICMG AMC.2) t
Clock Distribution
Telecom: Stratum 3 PLL with reference
from either 1 of the 12 AMCs
or external clock via front panel
PCIe: Spread Spectrum Clock
(100MHz mean) or oscillator (100MHz
fixed), HCSL or MLVDS signaling
Carrier Manager
Management of up to 12 AMCs, 2 cooling
units and 1-4 power units, supports redun-
dant architectures and fail-over procedure
Shelf and System Manager
For detached or stand-alone operation both
managers are available on-board, hook-in
for external managers via 100BaseT or 1GbE
port at front panel or backplane GbE
Operating System and API
O/S: OK1, Linux
API: HPI compliant
Indicator LEDs
4 standard AMC LEDs
12 bi-colour LEDs for AMC slot stati
2 bi-colour LEDs for cooling units
2 bi-colour LEDs for power units
Front Panel Connectors
100 BaseT management connection
1 GbE system up-link for Fabric A
external clock reference (bi-directional)
serial debug connector
NATView
Overview and Purpose
NATView is an easy to use visualisation tool
for any MicroTCA system that includes a
NAT-MCH. NATView is operating system in-
dependent and runs on any host computer
internal or external to the MicroTCA system.
NATView allows the user to view at and ma-
nipulate the components of the MicroTCA
system in a graphical way.
Operating System
NATView is a JAVA based tool and thus
independent of any host operating system.
NATView can run on an host CPU internal
or external to the MicroTCA system if it can
execute SUN JAVA 1.5.
Linking to the NAT-MCH
NATView connects to the NAT-MCH us-
ing RMCP (Remote Management Control
Protocol) as requested by the MicroTCA
specifcation. The host part of the RMCP is
included in NATView, so no additional pro-
tocol support is required for the host.
Features
When connected to a NAT-MCH NATView
retrieves any information about the Mi-
croTCA system, i.e. components such as
backplane, power modules, cooling units
and payload cards and the information pro-
vided by these, i.e. manufacturer and prod-
uct names, serial numbers, versions, sensors
and actors and displays them in a photo-
graphical way:
The picture displayed is a photographic visu-
alisation identical to the real MicroTCA
system.
NATView then offers the user the
following features:
animation of hot-swap process of
AMC modules
tree structured representation of
sensor and actor data including fans
and temperatures
sensor threshold setting
intelligent alarm monitoring
and prioritization
logging of events, incidents
and alarms
access to the system event log
viewing and editing Field Replaceable
Unit (FRU) information via a FRU editor
visual verification of correct FRU
informations
Customization
By default NATView supports any MicroTCA
chassis, power modules, cooling units or
AMCs the NAT-MCH has been validated
with. However, support of any other com-
ponent including custom designs can be
easily integrated into NATView by provid-
ing a JPEG picture of that component in
the correct naming convention (vendor ID
required!).

VIEWPOINT
Military programs such as Command, Control, Communications,
Computers, Intelligence, Surveillance, and Reconnaissance
(C4ISR) call for commercial o-the-shelf (COTS)-based equip-
ment that can be deployed into diverse application spaces
(including laser and RADAR remote sensing, simulator and
trainers, LAN/WAN network analysis, client server applica-
tions, telephony/wireless base stations, SATCOM, video and
image, VoIP processing, targeting and tactical intelligent ground
terminals).
Some equipment required to support C4ISR must be rug-
gedized, because it is located in the area of the conict. Other
parts of the infrastructure have more moderate environmental
specications that make it easier to use COTS equipment that
may be more cost-eective. Behind the scenes, appropriate com-
munications infrastructure is necessary in order to handle data
ows, retrieving, processing and storing data, or maintaining
communication via IP networks. Tis infrastructure requires
reliable equipment, including gateways, applications servers
and storage equipment. Typically, this equipment resides in
a controlled environment that provides a narrow ambient
temperature range. Tis makes it easier to cool equipment and
makes it possible to better exploit the performance range pro-
vided by the market.
Up to this point, the C4ISR infrastructure resembles that of a
traditional data center. However, the application range demands
support for highly reliable equipment that can help save lives
during critical missions. Consequently, computer systems
must host redundant servers, disk drives or power supplies. In
addition, it must be possible to remove or install parts of the
equipment without interrupting mission critical services.
Equipment based on the AdvancedTCA (ATCA) open standard is
well suited to meet these challenges. It provides high reliability,
redundancy and hot swap capability, and is remotely maintain-
able. In addition, server infrastructure equipment based on the
ATCA architecture can be easily scaled for performance and
capabilities to meet diverse application requirements.
What Makes a Server a Server?
Performance and capacity requirements vary across the desired
application range, and for a specic application they may change
over time. As a result, server equipment needs to provide enough
exibility to accommodate the needs of the dierent application
spaces in electronic warfare.
This includes:
Scalable compute performance from moderate to outstanding,
depending on performance requirements and cost targets
SMP capability and use of multiple cores per CPU
Virtualization in both CPUs and I/O for better exploitation of
compute resources and to provide additional security levels
Support for energy eciency
Scalable main memory capacity from 10s of GB to 100s of GB
Scalable mass storage capacity from 100s of GB to 1,000s of GB
Direct attached storage (DAS)
Multiple RAID levels to support both storage throughput
and reliability requirements
Driving it to the Extreme
Scalability is possible with ATCA technology, as proven by the
wide array of product solutions. However, some of the CPU
derivatives oered by the silicon suppliers today require elec-
trical, thermal and mechanical precautions that are dicult to
meet with existing standards. One could certainly wait for the
next technology upgrade that promises the increase in perfor-
mance that is expected of every new processor generation. But
improvements to the server infrastructure are also necessary in
order to exploit the increased performance of the CPU deriva-
tives. Changing some of the boundary conditions seems to be
inevitable. To meet future performance expectations, the fol-
lowing three major improvements are required.
Sufcient real estate on blade and system level
In general, the most compelling CPU derivatives are clocked at
higher frequencies that require higher core voltages. In general,
these chips also have architectural improvements that make
them perform much better. Tis can include larger caches or
more cores. As a result, power dissipation is signicantly higher
than the more moderately specied derivatives. For these high
performers, thermal design power of 100 W and more per CPU
is common, requiring larger heat sinks to be designed-in. CPUs
of this type also often have wider memory and I/O connectivity,
requiring the use of larger CPU packages.
To address the need for larger main memory capacity, more and
likely taller memory modules are required. It is also desirable
to provide direct attached storage close to the server blade. Ide-
ally, it should reside directly on the blade to keep infrastructure
cost down. Increasing the available real estate on future ATCA
blades or systems is necessary to overcome space constraints.
Improved power distribution to blades
Faster CPUs, larger memory arrays and wider system buses
simply require more electrical power. To run high performance
compute blades, sucient power feeding is crucial. For instance,
todays ATCA blades that use the latest processor generations
typically consume electrical power in the range of 200 W to
300 W. Tese numbers are expected to increase as future CPU
by Christian Engels
The Sky is the Limit
Emerson Network Power describes how to extend ATCA into
military applications.
VIEWPOINT
generations are introduced. Limitations in a systems power
capability could prevent them from supporting future blade
generations. Te trend toward increased power on server blade
designs cannot be denied. To be clear, current server designs do,
and future designs will, support energy eciency by reducing
power whenever possible; however, electrical support for the
maximum expected workload is required.
Better system cooling capabilities
What goes in must come out. Tis means that feeding higher
electrical power into blades results in higher thermal power
dissipated on the blades. Some electrical power is channeled
away through backplane interconnect and cables, but typically
the eect is negligible. Terefore, future blades need enhanced
cooling to transport the expected additional heat away from the
blades.
Most servers, including ATCA systems, are cooled by using fans
to move air. One possible approach to improving airow in
future blade designs is to widen the blade slot-to-slot pitch. Tis
provides more space for cooling air to pass hot components and
dissipate their heat. In addition, designing in more powerful
fans will improve systems cooling capabilities.
Last but not least, limiting the maximum ambient temperature
in a controlled environment can reduce cooling requirements.
While equipment designed for central oces in the telecom
space requires operating temperatures up to 55 degrees Celsius,
data center servers typically are operated in lower ambient
temperatures. Te American Society of Heating, Refrigerating
and Air-Conditioning Engineers (ASHRAE) recommends a con-
trolled environment of 18 to 27 degrees Celsius. Restricting the
ambient temperature allows the use of components with higher
thermal power dissipation and lower maximum operating
temperature; consequently, blades with better computational
performance based on faster processors can be supported.
In addition, reducing cooling requirements allows the use of
mainstream processors intended for the general server market,
which can help to reduce costs.
Shifting Boundaries
While the constraints outlined above do not constitute an
immediate problem, future server processors and architectures
will present more challenges when implementing the ATCA
architecture, as it will require changing some of todays bound-
aries. Te current specication denes a maximum of 400 W
per ATCA slot. To accommodate future ATCA-based server
generations, shifting that boundary to a much higher level is
advisable. Doing so requires reviewing and redening require-
ments for power entry, backplanes and connectors, as well as
blades. Backward compliance with existing blades and systems
is certainly mandatory to support the widest possible reuse of
existing product solutions oered today.
For the same reason, increasing server and system real estate
needs to be carefully considered. One possible approach is to
make use of two ATCA slots instead of one. Tis approach would
t in well with the existing standard and would allow mixing
blades of single and double width in a single system.
As a result of widening the real estate, airow across boards
also could be improved. In addition, improvements in system
cooling capabilities would help to further shift the exploitable
performance range.
Applying equipment based on ATCA technology in applications
in less demanding thermal environments also raises the ques-
tion of which markets other than telecommunications are
suitable for ATCA equipment deployment.
Te need to extend system capabilities has been identied by
the ATCA ecosystem. Te PICMG standards organization has
initiated a new subcommittee working on extensions for the
existing ATCA standard that addresses some of the consider-
ations described in this article.
Some of the published goals of the initiative are:
Support for higher compute density
Cooling enhancements
Signicantly increased electrical power
Enhancements to blade and system real estate
Optimizations for relieved thermal environments
Maintaining forward and backward compatibility with
existing ATCA products
Summary
Military programs such as C4ISR that make use of COTS
equipment should consider the open standards-based ATCA
architecture when looking for a reliable and scalable bladed solu-
tion. Varying performance requirements can be addressed by
scalable compute equipment in a wide range. Exploiting future
compute performance has resulted in an industry-wide eort
to extend the current denitions of the ATCA standard, just as
future eorts will lead to increased performance capabilities.
Christian Engels is a senior technical marketing
manager for the Embedded Computing business of
Emerson Network Power. In his current role, Engels
focuses on AdvancedTCA, server architectures
and product denitions, in addition to inbound and
outbound technical marketing. He also represents
Emerson in several standards development organizations, includ-
ing the Communications Platforms Trade Association (CP-TA) and
the PCI Industrial Computer Manufacturers Group (PICMG).

EECatalog
SPECIAL FEATURE
Websites and Blogs

www.eecatalog.com/atca/
EECatalog.com - Comprehensive
technology information covering
the AdvancedTCA, MicroTCA and
AdvancedMC markets.
www.picmg.org/v2in-
ternal/newinitiative.htm
PICMG - Provides anoverview of the
latest trends in high-speed intercon-
nect technologies, next-generation
pro cessors and improved reliability,
manageability and serviceability
www.atcanewsletter.com
Lakeview Research is the developers
resource for computer interfacing,
especially USB, serial (COM) ports,
mass storage, Ethernet and Internet
communications for embedded sys-
tems, and parallel ports.
www.intelcommsalliance.
com/microtca/whitepapers/
Intel Embedded Alliance - A
library of MicroTCA white papers,
from Intel, Motorolla, GE Fanuc
Embedded Sytems, Interphase, Znyx
and others.
www.eg3.com/embedded-tutorials/advancedtca/
EG3 - A storehouse of ATCA and MicroTCA tutorials, from tech-
nical guides to shelf cooling to economic impact reports.
Events
Advanced/Micro TCA Summit
November 9-11, Santa Clara CA
www.advancedtcasummit.com
RTECC Austin
September, Austin, TX
www.rtecc.com/
Intel Developer Forum
Sep 13 - 15, 2010
San Francisco, CA
http://www.intel.com/idf/
ESC Boston
Boston, MA
September 20-23, 2010
http://esc-boston.techinsightsevents.com/
Embedded World
Nuremberg, Germany
March 1-3, 2011
http://www.embedded-world.de/en
SuperSpeed USB Developers
Conference
htt p: //www. usb. org/devel opers/
events/ssusb_devcon/
ESC Silicon Valley
San Jose, CA
May 2-5, 2011
http://esc-sv09.techinsightsevents.com/
Online & Offline Industry Websites + Events
EECatalog
SPECIAL FEATURE
No one can fail to notice the tremendous increase in wire-
less communication over the last decades. The amount of
information transmitted over the air has never been so
high. There were more than 450 million mobile-Internet
users worldwide in 2009. Four years from now, this
number is expected to double. Moreover, users want to get
ever-faster wireless-Internet access. The Wireless World
Research Forum predicts that 7 trillion wireless devices
will serve 7 billion people by 2020. Mobile phones have
never been so popular. And with every new generation, we
expect a better user experience. We want more functions,
larger screens, faster applications, ever more memory, and
lighter weight. The requirements for wireless modems
will be high: up to several 100 Mbits/s at high mobility. In
quasi-stationary conditions, gigabits per second will need
to be sustained.
Unfortunately, the tremendous increase in data traffic
goes along with a worrisome consumption of energy
that doesnt fit with the present call for sustainable
energy use. Experts predict that energy consumption
by wireless communication will double every five years
and gradually impact natural resources. On top of that,
todays power-hungry wireless devices directly impact the
users experience: They need bulky batteries and frequent
recharges and have a low autonomy. Yet a long autonomy
and small volume are essential for a range of future
wireless-communication applications. Think of wireless
portable devices for medical applicationsimplants of
sensors that measure heat and brain activity.
Aside from energy consumption, radiation is becoming
a major concern. Studies pointing toward the potential
impact of electromagnetic radiation on human health are
hitting the media. Such radiation is emitted by both base
stations and mobile devices. A lot of this radiation is badly
directed and hence being wasted. Moreover, radiation has
become a threat to communications quality because the
increasing traffic is causing signal interference. The chal-
lenge is to develop devices that restrict the radiation to
where its needed without using more energy or lowering
the performance of the devices.
Higher throughput, lower power, and restricted radiation
will be the keystones of tomorrows wireless communica-
tion. Add to this a fourth major trend: the need for more
intelligence and flexibility. For example, take devices that
can switch between frequencies. The current spectrum
used by wireless devices is overloaded while other parts
of the frequency spectrum are still underused. Future
devices should be able to use the available spectrum more
dynamically. They should be able to switch between com-
munication standards, choosing the best option depending
on the location and user environment, available frequency
bands, and requirements of the user or application.
Eco-Friendly yet High-Capacity Wireless
Communication
A very promising solution to achieve high-throughput
yet energy-friendly wireless communication is to always
connect to the best, often nearest access point or base sta-
tion. Whenever possible, wireless communication should
be restricted to short ranges. Indeed, too many connec-
tionsspecifically mobile-phone callsconnect to a
relatively faraway base station even if much closer access
points, such as indoor wireless local-area networking
(WLAN), are present. When setting up direct access to the
most directive link, significant improvements on energy
consumption and wasted radiation can be made. This con-
cept calls for more and smaller base stations in line with
future wireless network architectures. Those architectures
will evolve toward more distributed access in order to sus-
tain the ever-growing demand for wireless capacity.
Because it will ideally be complementary, the technology
should be able to switch to other communication standards,
such as GSM or broadband cellular standards for outdoor
communication. Hence, multi-standard terminals will be
key. Supporting multiple standards in these terminals can
be achieved in two ways: Either a dedicated chip will be
foreseen for every single standard or the platform can be
made reconfigurable. Its flexibility, low cost, and small
form factor make the reconfigurable radio solution an
obvious choice. After all, this solution is the only approach
that is scalable with the exploding number of standards
and modes within standards that have to be supported by
the terminal. Gradually, cognitive features will be desired.
They ll make the radio aware of its environment and the
available resources. It can then choose its parameters
accordingly to achieve the best possible performance in
by Liesbet Van der Perre, Wim Van Thillo, Antoine Dejonghe, and Joris Van Driessche
Tomorrows Wireless Communication
Requires Higher Throughput
and a Smaller Energy Budget
Electrical engineers consider the demands of next-gen standards.

EECatalog
SPECIAL FEATURE
that particular situation and at that particular moment.
For both the reconfigurable and cognitive radio, energy-
efficient operation is a main design goal.
Over the longer term, short-range connectivity at the mil-
limeter range (60 GHz) is considered a means to enable
even higher and more directive data-rate emission. Indeed,
the 60-GHz band is an unlicensed band featuring a large
amount of bandwidth and a large worldwide overlap,
resulting in broad interoperability. The large bandwidth
enables a very high volume of information (multi-gigabits
per second) to be transmitted wirelessly. Multiple appli-
cations can benefit from this, such as wireless HDTV,
wireless laptop docking stations, etc. By using 60-GHz
directional connections inside buildings, energy consump-
tion and radiation levels can be kept far lower. In addition,
the transmitted energy can be directed very well.
The proposed solution will cause a fundamental change in
the current wireless-communication market. Moreover, it
will create novel opportunities that take into account our
environment and personal health.
Technological Challenges and Answers
Next-generation wireless devices will build on (cognitive)
reconfigurable radio solutions. Finding low-energy solu-
tions is a main design goal on the system, architecture,
and circuit level of all the radio building blocks. Here, chal-
lenges and solutions are presented for the radio front end
and baseband. In addition, spectrum sensing is introduced
as an indispensible engine to enable cognitive solutions.
Recongurable-Radio Front End: Digital-
CMOS Radio Transceivers
Compared to dedicated single-standard radios, fully recon-
figurable, multi-standard transceivers face important
challenges in terms of power efficiency and performance.
Recent innovations in architectures and circuit design
have led to transceivers in deep-submicron, pure digital
CMOS technology that close the traditional gaps. More-
over, it opens the opportunity to integrate both the analog
and digital functionality onto the same system-on-a-chip,
facilitating its commercial deployment.
This idea has been successfully converted into a fully
reconfigurable, multi-mode transceiver in 40-nm CMOS
technology. The transceiver includes RF, analog base-
band, and data-converter circuits. It is compatible with
various wireless standards and applications (supporting
bandwidths to 40 MHz and carrier frequencies from 100
MHz to 6 GHz). The technology allowed this multi-stan-
dard programmability to be integrated in an extremely
small chip area of only 5 mm2. It achieves state-of-the-
art performance and power consumption for each covered
standard. With this achievement, we made a fully recon-
figurable radio solution that competes with single-mode
radios in mobile devices.
Gradually, other improvements will be needed. For example,
the transmitterbeing a major energy consumer and the
source of the radiation emissionneeds to be optimized
for reduced energy and radiation. On the system level,
major savings can be achieved by choosing the appropriate
transmission channel, given the environmental conditions
and the available access points.
Recongurable Radio Baseband: the
COBRA Platform
Next-generation mobile terminals require adequate
reconfigurable platform templates and new-generation
baseband processors that are complemented by innovative
components, such as forward-error-coding engines. The
overall platform template should support future fourth-
generation (4G) communication requirements. It also
should be a fit for multimode broadcasting systems. Area,
power, and programmability are of critical importance
to obtain a competitive reconfigurable radio solution. In
order to meet both flexibility and power requirements,
its envisaged that this platform will be a heterogeneous
Figure 1: Future network architectures will be more evenly distributed for
sustainable growth.
Figure 2: Shown is the test board of the single-chip, recongurable, multi-
standard wireless transceiver in 40-nm CMOS.
EECatalog
SPECIAL FEATURE
multi-processor system-on-a-chip (MPSoC) in nature. The
resulting template should enable area- and power-effi-
cient downscaling for a given set of specific application
targets.
For the baseband, novel processor architectures are
required with major improvements in energy efficiency.
The targeted total active power budget for baseband pro-
cessing (i.e., all baseband cores together) is in the range
of 200 mW in 40-nm technology. This requires about a
4X improvement in energy efficiency compared to todays
solutions, taking into account the desired increased
throughputs. In addition, architectures should cope with
the continuously increasing complexity of wireless physical
layers within the limited energy budget. They need to have
high performance and support higher-rate streams and
more simultaneous streams. Imecs answer to these needs
is a heterogeneous platform for cognitive reconfigurable
radios supporting multi-stream and gigabit-per-second
connectivity, named COBRA.
At the heart of the COBRA platform is the ADRES baseband
architecture. ADRES is a flexible, high-performance archi-
tecture template for low-power embedded applications. It
consists of a tightly coupled very-long-instruction-word
(VLIW) processor and a coarse-grained reconfigurable
array. Together with a re-targetable simulator and ANSI-C
compiler, the tool chain allows architecture exploration
and the development of application-domain-specific pro-
cessors. Coarse-grained-array (CGA) -based processors
offer higher power efficiency while keeping the flexibility
of typical processor solutions. Imec recently developed a
second generation of its ADRES architecture. Processors
derived from this architecture offer double the perfor-
mance, use half the energy, and support multithreading.
The platform template should also support forward-error-
correcting (FEC) engines that are used to repair errors in
data transmission. Tomorrows FEC engines need to be
flexible and target data transmission that combines high
throughput and low power consumption. Imecs solution
builds upon an innovative scalable and programmable
architecture and module-based firmware approach. It
includes functional reference designs for typical codes.
Spectrum Sensing: Enabling Cognitive
Solutions
A cognitive radio, by its most general definition, aims
at sensing and learning the environment to autono-
mously adapt its transmission parameters. This requires
the receiver to be able to scan a wide frequency range,
searching for optimal transmit opportunities that can be
found in the time-frequency hyperspace. Future mobile
terminals need flexible and intelligent sensing solutions
that achieve low power consumption.
Current radio architectures, which are focused on the
reception of a predefined channel, arent able to proceed
to a frequency-scan operation in a timely and cost- and
energy-efficient way. Therefore, a specific component
must be added into the reception path. This so-called
spectrum-sensing engine has to analyze the band occu-
pation without necessarily recovering the information.
Novel signal-processing algorithms are being designed
that trade off processing cost and sensing reliability as a
function of the spectrum-use scenario. In parallel, novel
radio architectures are being investigated that allow the
sensing of multiple channels in parallel while flexibly
tuning the center frequency.
Aside from an ADRES core and flexible FEC engine, Imecs
COBRA platform contains a digital front end (DIFFS) that
is capable of spectrum sensing and synchronization. An
ARM core is implemented for controlling the tasks on the
platform (see Figure 3).
Green Touch
So far, we focused on lowering the energy consumption on
the user terminal side. In a landscape with smaller cells
and more distributed networks, this energy consump-
tion will take up an important part of the overall energy
budget in the future. Obviously, if terminals will connect
predominantly via local-access possibilities, significant
energy savings need to be induced on the infrastructure
side as well. Worldwide, efforts are ongoing to radically
reduce the overall energy consumption of communication
networks and reduce the carbon footprint of the growing
network.
One of these initiatives is Green Touch, a new research
consortium initiated by Bell Labs. Its goal is to create the
technologies necessary to achieve a thousandfold improve-
ment in the future power consumption of the Internet
and other communication networks. Imec has joined
this consortium and will lend its expertise on low-power
Figure 3: The COBRA platform consists of a digital front end for sensing,
imecs ADRES core, a exible FEC engine, and an ARM core for controlling
the tasks on the platform.

EECatalog
SPECIAL FEATURE
reconfigurable-radio technologies, cognitive-radio solu-
tions, millimeter-wave wireless communication for gigabit
communications, and ultra-low-power wireless communi-
cation in the context of personal sensor networks.
In closing, flexibility, high data throughput, low energy
consumption, and restricted radiation are the keystones of
tomorrows wireless-communication devices. We have pre-
sented a solution that restricts wireless communication to
short ranges whenever possible, thereby implying the use
of more and smaller base stations. Reconfigurable-radio
solutions will allow devices to switch to other communi-
cation standards. This vision presents severe challenges
for the design of the radio front end and baseband. For
the reconfigurable front end, transceivers can be realized
in deep-submicron digital CMOS to answer the need for
low energy consumption without suffering in terms of
performance. For the baseband, novel architectures with
major improvements in energy efficiency are prerequisite.
Eventually, we will evolve toward cognitive reconfigurable
radio solutions. In doing so, we ll drive the development
of power-efficient, spectrum-sensing engines. The real-
ization of such power-efficient, cognitive reconfigurable
radios will be indispensable if we want to provide ubiq-
uitous yet sustainable connectivity for everyone and
everything.
Liesbet Van der Perre received the M.Sc.
degree and the PhD degree in Electrical
Engineering specializing in wireless com-
munication from the K.U.Leuven, Belgium.
Currently, she is director of the Green
Radio programs in imec. Also, she is a part-
time Professor at the K.U.Leuven.
Wim Van Thillo received the M.S. degree
in electrical engineering from the Katho-
lieke Universiteit Leuven, Belgium. He
obtained a PhD degree in engineering from
the same university while doing research
in imecs wireless communications group.
Joris Van Driessche received his M.Sc.
degree in Electrical Engineering from the
University of Ghent. He leads the project
on reconfigurable RF transceivers in the
Wireless Department of imec, focusing on
challenges towards true SDRs.
Antoine Dejonghe received the Electrical
Engineering degree and the Ph. D. degree
from the Universit catholique de Louvain
(UCL), Louvain-la-Neuve, Belgium. He
has been with the Wireless Group of imec,
Leuven, where hes currently Program
Manager for Cognitive Reconfigurable
Radio activities.
www.eecatalog.com/atca Hardware 27
CONTACT INFORMATION
Adax, Inc.
Adax, Inc.
614 Bancroft Way
Berkeley, CA 94710
USA
510-548-7047 Telephone
510-548-5526 Fax
sales@adax.com
www.adax.com
TECHNICAL SPECS
V 4 x AMC bays
V 4 x Ethernet ports 1G and 10/100M via RTM
V One USB communications port
V 2, 4 or 8 GB of DDR2 SDRAM
AVAILABILITY
Available Now
APPLICATION AREAS
Traditional SS7 & SIGTRAN Signaling including
Signaling GatewayVoice Processing via I-TDM
Cell site backhaul
IP-transport aggregation and concentration
Packet Processing
Carrier Ethernet including MPLS-TP
Signaling and Voice protection and enforcement
Bandwidth Management
QoS & per connection Content Management
AdaxPacketRunner
Specication Compliance: PICMG ATCA 3.0 and 3.1, Region 3
Option 9
The AdaxPacketRunner is a state-of-the-art I/O, purpose-
built, ATCA AMC carrier blade for NGN, IMS, and LTE
telecom applications. With IP-transport, MPLS/Carrier
Ethernet (CE), QoS, Security, Bandwidth Management,
Packet Processing, I-TDM and Signaling capabilities,
this blade meets the three greatest challenges for I/O in
todays ATCA systems:
Scalability - coordinate multiple blades
Cost-Effectiveness - lowers cost per function
High Availability - N+1 up to N+R
By meeting these challenges the Adax solution reduces
costs and dramatically improves the value for money of
each ATCA slot.
The AdaxPacketRunner (APR) is the foundation blade for
todays ATCA I/O subsystem requirements. The special-
ized Cavium Network Processing Unit (NPU) supports
packet monitoring, inspection, prioritization, insertion,
IPsec, and Kasumi, along with MPLS/CE, IPtransport, tra-
ditional and IP-based SS7/ATM signaling. The APR offers
four AMC bays available for any combination of applica-
tion I/O requirements. Designed to perform within the
constraints of ATCA power and thermal requirements,
the APR assures customers receive the highly-reliable,
high-performance solution they have come to expect
from Adax products.
FEATURES & BENEFITS
V Two 10 Gigabit Ethernets to the Backpane Fabric
V A dedicated 10 Gigabit Ethernet between the Cavium
and Ethernet Switch
V One front-panel, micro-USB port
V Optional Compact Flash
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28 Hardware Engineers Guide to ATCA
& MicroTCA Technologies 2010

CONTACT INFORMATION
CONTACT INFORMATION
2900 S. Diablo Way, Suite 190
Tempe, AZ 85282
USA
1 602 438 5720 Telephone
1 800 759 1107 Toll Free
EmbeddedComputingSales@
Emerson.com
Emerson.com/EmbeddedComputing
FEATURES
V Dual four- or six-core Intel Xeon processors E5620 or
E5645 (ATCA-7365-CE)
V Dual six-core Intel Xeon processor L5638 @ 2.0 GHz
(ATCA-7365)
V Up to 96GB main memory
V Hot-swappable hard disk with exible choice of stor-
age options
ATCA-7365 & ATCA-7365-CE
Processor Blades
Compatible Operating Systems: Red Hat RHEL 5.5, Wind River
PNE LE 3.0, Microsoft Windows Server 2008, VMware ESX/ESXi
Specication Compliance: PICMG 3.0, 3.1
The ATCA-7365-CE has two four- or six-core Intel
Xeon

processors and offers scalable, high-performance com-
puting power for data processing applications requiring
powerful server-class processing performance, exible
mass storage and network options. The ATCA-7365
NEBS processor blade has two 6-core Intel Xeon proces-
sors to help drive successful implementation of next-gen
telecom networks and communication infrastructures.
The PICMG 3.1 compliant fabric interface on both blades
provides 10GbE capabilities for applications needing
higher network throughput in the backplane.
Both blades offer best-in-class memory support of up to
96GB! Multiple network and storage I/O interfaces allow
the integration into different network infrastructures.
Main memory and mass storage options can be exibly
congured to t the applications needs.
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CONTACT INFORMATION
Tempe, AZ 85282
USA
1 602 438 5720 Telephone
1 800 759 1107 Toll Free
Emerson.com
FEATURES
V Six-core Intel Xeon processor L5638 @ 2.0 GHz
V Up to 48GB main memory
V One mid-size AMC site
V On-board SATA drive option
V Hot-swappable hard disk with exible choice of storage
options via RTM
ATCA-7367 High Performance
Processor Blade
Compatible Operating Systems: Red Hat RHEL 5.5, Wind River
PNE LE 3.0, Microsoft Windows Server 2008, VMware ESX/ESXi
Specication Compliance: PICMG 3.0, IPMI 1.5, AMC.0, AMC.1,
AMC.2, AMC.3
The ATCA-7367 processor blade, featuring a six-core
Intel
Xeon
processor L5638 and an AMC site, enables

the highest compute performance and I/O functionality in
an ATCA form factor. The AMC site provides exible con-
nectivity for networking, storage, telecom clocking and
I/O. The PICMG
3.1 compliant fabric interface provides

10 Gigabit Ethernet (10Gbps) capabilities for applications
requiring higher network throughput in the backplane.
Multiple network and storage I/O interfaces allow the
integration into different network infrastructures such
as telecommunication central ofces and network data
centers. Main memory conguration and mass storage
options can be exibly congured.
CONTACT INFORMATION
CONTACT INFORMATION
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s
Tempe, AZ 85282
USA
1 602 438 5720 Telephone
1 800 759 1107 Toll Free
Emerson.com
FEATURES
V PICMG
3.0 compliant base interface switch

V PICMG 3.1, Option 1, 9 fabric interface switch
(1G/10G)
V PICMG 3.1, R2 (4x 10Base-KR) fabric interface (40G)
V Single AMC site
V Optional SATA HDD and Telecom clock functions
ATCA-F140 40G ATCA Switch Blade
Compatible Operating Systems: Carrier-grade Linux
Specication Compliance: PICMG 3.0, 3.1, 3.2 R2, AMC.1, AMC.2,
AMC.3
The ATCA-F140 is a high performance, high bandwidth
40G switch blade for ATCA platforms that is ideal for
bandwidth-intensive telecom applications. With several
ATCA functions combined into a single blade, it allows
end users to maximize billable slots with revenue-gener-
ating application blades.
Optional functions include telecom clock generation and
distribution, SATA based hard drives devices and an
AMC site for general processing and packet processing
functions.
A fully integrated and veried software package is avail-
able that includes carrier-grade Linux OS, all required
device drivers and SRstackware switch software. The
ATCA-F140 is designed for NEBS/ETSI compliance.
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CONTACT INFORMATION
6600 Port Road
Groveport, OH 43125
USA
+1 (614) 748-1150 Telephone
+1 (614) 748-1209 Fax
info.sales@pinnacle.com
www.pinnacle.com
TECHNICAL SPECS
V AMD Opteron processors supported include power
efcient embedded dual- and quad-core models up
to 2.4GHz
V 4 DIMM sockets enable up to 32GB DDR2 ECC
Memory
V Front Panel Interfaces - 2 x GbE ports, 2 x USB 2.0
V Backplane Interfaces - 2 x GbE Base and 2 x GbE
Fabric, supports dual-star backplane topology
V AMC slot for HDD or I/O expansion, plus optional
onboard Compact Flash
AVAILABILITY
Now
APPLICATION AREAS
PDSis ATCA-F1 blade is targeted at the following indus-
tries and applications requiring the ultimate in computing
capability and dependability:
Military/Aerospace/Defense
Avionics and ship-board platforms
Communications systems
Real-time Intelligence systems
Telecom
Core applications
Edge applications
Access applications
ATCA-F1 Dual AMD Socket
F AdvancedTCA Blade
Compatible Operating Systems: Linux (SuSe, RHEL), Windows
(Server 2003, XP), Solaris x86, VMWare ESX Server 3.5 and 4.0
Specication Compliance: PICMG ATCA3.0 R2
PDSis Dual AMD Socket F AdvancedTCA Blade (ATCA-F1)
is an incredibly fast x86 server available in the ATCA form
factor. Now offered with a full 32GB of memory and two
benchmark-setting AMD Shanghai quad-core CPUs, this
blade provides the extra level of computing horsepower
and built-in virtualization support demanded by the next
generation of COTS integrated architectures. With its robust
design, the ATCA-F1 blade has been thoroughly tested and
successfully deployed in critical systems including military
applications.
The ATCA-F1 features a standard Zone 3 interface for
connection to PDSis ATCA-RT01 rear transition module
(RTM), which adds SAS storage, video, Ethernet and USB
resources. The ATCA-F1 and ATCA-RT01 RTM combina-
tion has been validated and is hardware-compliant with
the VMWare ESX Server virtualization platform.
Other on-blade features include a Compact Flash site and
an AdvancedMCslot for additional I/O or further storage
expansion. The blade includes Pigeon Points module
management for IPMI support and board-level health
monitoring.
PDSi gives telecom, aerospace, and military OEMs the ability
to deploy congurable, scalable, high-reliability ATCA solu-
tions using this powerful compute blade based on AMDs
latest Quad Core processor technology. Extended availability
from PDSi is assured as key components are supported by
embedded roadmaps. PDSi can also provide customization,
turnkey integration and support of ATCA systems, as well as
extended warranty and repair services.
FEATURES & BENEFITS
V Ultra - high performance AdvancedTCA server blade
features leading-edge AMD64 technology
V Supports two Quad-core Shanghai or Dual-core
AMD Opteron processors with HyperTransport
technology
V Zone 3 interface enables I/O and storage expansion
via PDSis ATCA-RT01 RTM
V Certied with VMWare ESX Server 3.5 and 4.0 when
used with PDSis ATCA-RT01 RTM
V Proven, third generation design
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CONTACT INFORMATION
6600 Port Road
Groveport, OH 43125
+1 (614) 748-1150 Telephone
+1 (614) 748-1209 Fax
info.sales@pinnacle.com
www.pinnacle.com
TECHNICAL SPECS
V VGA Video supports resolutions up to 1600 x 1200
V Onboard 2.5 inch serviceable SAS HDD provides up to
146 GB storage. External SAS connector for expansion.
V 2 - 10/100/1000 BaseT Ethernet ports (from front
blade)
V 2 - USB 2.0 ports
V 1 - RS232 serial port (from front blade)
AVAILABILITY
Now
APPLICATION AREAS
Military, Aerospace, Telco, Enterprise
ATCA-RT01 AdvancedTCA RTM
with Video and Storage
Compatible Operating Systems: Windows (Server, 2003, XP),
Linux (SuSe, RHEL), Solaris 10 x86 and SPARC, VMware ESX
Server 3.5 and 4.0
Specication Compliance: PICMG ATCA3.0
PDSIs Video + Storage ATCA Rear Transition Module
(ATCA-RT01) provides high reliability SAS storage,
VGA video output and additional I/O functionality for
AdvancedTCA systems using x86 processor blades
from PDSi or Sun Microsystems. In addition, it also oper-
ates with Suns UltraSPARC T2-based Netra CP3260
blade. For systems requiring a mix of these compute
blades, the ATCA-RT01 can provide a universal RTM
solution.
The ATCA-RT01 complies with PICMG ATCA 3.0 speci-
cations for seamless and dependable operation in
critical applications. It features a 2.5 inch SAS HDD for
local storage as well as front-panel access to the onboard
SAS controller for connection to secondary or redun-
dant storage arrays. Additional ports include VGA video
output and USB I/O for convenient local monitoring or
conguration of applications. Serial and Ethernet ports
are also routed from the front blade so that all required
I/O can be rear-accessible. The RTM includes Pigeon
Points module management.
Telecom, aerospace, and military OEMs will appreciate
the exibility this advanced RTM brings to their systems.
Extended availability from PDSi is assured. PDSi can
also provide customization, turnkey integration and sup-
port of ATCA systems, as well as extended warranty and
repair services.
FEATURES & BENEFITS
V RTM offers VGA video and SAS storage resources for
selected ATCA applications
V x86 blade compatibility: PDSi ATCA-F1 and SUN
Netra CP3220
V SPARC blade compatibility: SUN Netra CP3260
V Robust design for military, aerospace, telco and
enterprise applications
V Certied with VMWare ESX Server 3.5 and 4.0 when
used with PDSis ATCA-F1 blade
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CONTACT INFORMATION
Adax, Inc.
Adax, Inc.
614 Bancroft Way
Berkeley, CA 94710
USA
510-548-5526 Fax
sales@adax.com
www.adax.com
SSSAR/SSTED/SSADT, ITU-T I.366.1
HSL over AAL5, Telcordia GR-2878-Core
V AMC System Interconnect
PCI Express One x1 Express Interface
Gigabit Ethernet Four Gigabit Ethernet links on
AMC ports 0-1 and 8-9
V Front Panel LEDs
AMC.0 IPMI (2x)
Hot Swap (Adjacent to Latch)
Per Port Status (4x)
Board Status/User Programmable
V Interfaces
Four OC-3/STM-1
Two OC-12/STM-4
Support for single mode ber and multi-mode
ber (ITU G.957)
AVAILABILITY
Available Now
APPLICATION AREAS
3G RNC, MSC, SGSN, and Node B
Voice over Packet
Video Streaming
Broadband Networks
ATM to IP Gateways
Femtocell Access Controller
ATM4-AMC
Compatible Operating Systems: Linux and Solaris as standard.
Other OS support on request.
Specication Compliance: PICMG AMC.0 R2.0, AMC.1, AMC.2,
IPMI V1.5
The ATM4-AMC card is a high performance AdvancedTCA
Mezzanine Controller designed for use in all aspects of
telecommunications networks. The ATM4 includes sup-
port for ATM host termination, switching and L2/L3/L4 or
higher interworking between Gigabit Ethernet interfaces
and ATM interfaces. With support for AAL2 and AAL5, the
ATM4 has the ability for real-time voice and video over
AAL2, as well as signaling and IP over AAL5 in 3G networks.
The ATM4 is ideal for demanding carrier applications in
Wireless 2G, 3G, IMS, Internet Access, Fixed/Mobile Con-
vergence and Next Generation Networks.
The ATM4 enables development exibility in building
Next Generation infrastructure and can be congured in
many ways depending on customer specications and
preferred architecture. In addition, the AMC form factor
provides enhanced performance and reliability.
One or two ATM4s, integrated with an ATCA/SBC, can be
congured as a signaling blade, housing complete ATM/IP
gateways and offering a high density, single slot, market
leading solution. Alternatively, up to four AMC modules
can be mounted with an Advanced TCA carrier card for a
high density ATCA signaling blade. This exibility enables
integrators to satisfy a wide range of requirements with
a single core architecture, saving development time and
allowing customers to integrate their solutions ahead of
the competition.
FEATURES & BENEFITS
V Multi-Purpose I/O board for 3GPP/IMS Wireless
Networks
V Four OC-3/STM-1 or Two OC-12/STM-4
V ATM AAL2 & AAL5 on a single trunk
V On-board IP to AAL2 & IP to AAL5 Interworking
V AMC form factor for ATCA & MicroTCA Platforms
TECHNICAL SPECS
V Wintegra WinPath2 Network Processor
V Protocol Support
ATM AAL2, ITU-T I.363.2
ATM AAL5, ITU-T I.363.5
SSCOP, Q.2110
SSCF NNI, Q2140
SSCF at UNI per Q.2130
SSCS Layer Management Q.2144
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CONTACT INFORMATION
Adax, Inc.
Adax, Inc.
614 Bancroft Way
Berkeley, CA 94710
USA
510-548-5526 Fax
sales@adax.com
www.adax.com
High impedance ports in accordance with G.772
Up to 2 10/100/1000 BaseT Ethernet interfaces per
PCI, PCIe, EM card
Up to 2 1000 BaseX Ethernet interfaces per AMC card
V Power Requirements
PMC/LPe
6-10 watts typical-maximum power consumption
PCI/PCIe/EM
AMC
V AMC System Interconnect
PCI Express: One x4 PCI Express Interface.
AMC fat pipes region port 4-7 (root complex)
Gigabit Ethernet: Two Gigabit Ethernet 1000Base-BXZ
(SerDes) ports AMC common options region port 0-1.
AVAILABILITY
Available Now
APPLICATION AREAS
Signaling Gateways
Media Gateway Controllers
SGSN, GGSN, MSC, HLR, VLR, and BSS Nodes
VAS Applications such as SMS, Roaming and Billing
Test and Measurement applications
Simulation and Monitoring Systems
HDC3
Compatible Operating Systems: Linux, MontaVista CGE, Solaris
X.86 & SPARC. Other OS support on request.
Specication Compliance: PICMG AMC.0 R2.0, AMC.1, AMC.2,
AMC.3, IPMI V1.5
The HDC3 is the latest generation of the highly successful
Adax SS7 controller and is the rst to offer up to 8 T1, E1 or J1
trunks per card. Specically designed to meet the demands
of wireline, wireless and NGN convergence platforms, the
HDC3 excels at SS7 and provides a high density high perfor-
mance solution for narrowband signaling applications.
Delivering up to 248 LSL MTP2 links or 8 HSLs (Q.703
AnnexA and ATM AAL5) per card, the HDC3 provides
one of the highest densities on the market today, making
it ideal for demanding telecommunications applications
with high capacity and throughput requirements. The on
board processor performs many thousands of transactions
per second, with minimal load on the host, maximizing
the performance of the applications and reducing system
costs without compromising reliability.
The HDC3 is available in PMC, AMC, PCI/X and PCIe (including
the new ExpressModule) form factors, all of which share a
common software driver and have a consistent API for appli-
cation portability. This makes the HDC3 card a highly exible,
scalable and portable signaling solution for all system archi-
tectures that maximizes protection of investment.
FEATURES & BENEFITS
V 8 software selectable trunks of full E1, T1, or J1 per card
V PMC, AMC, PCI/X and PCIe (Full height and Low-Prole
and ExpressModule) board formats
V Up to 248 LSL MTP2 links per card with high line
utilization and 8 MTP2 HSLs
V Single HDC3 driver supports PCI/PCI-X, PCIe, PMC
and AMC form factors, so applications run unchanged
across all architectures
V Support for up to 128 channels of Frame Relay or a
combination of 248 channels of HDLC, X.25, LAPB/D/F/
V5 protocols
TECHNICAL SPECS
V Interfaces
T1: ANSI T1.102, T1.403, AT&T TR62-411, TR-TSY-
000170
E1: ITU Structured G.703; G.704 and G.705 including
CRC4, ETSI TBR 12 and 13
J1: ITU TTC JT-G.703, JT-G.704
8 E1/T1/J1 interfaces (software selectable)
Jitter and Wander in accordance with ITU-T G.823
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CONTACT INFORMATION
Adax, Inc.
Adax, Inc.
614 Bancroft Way
Berkeley, CA 94710
USA
510-548-5526 Fax
sales@adax.com
www.adax.com
V Ethernet Controller
- Dual Gigabit Ethernet Controller Intel 82571EB
- PCIe 4-lane interface to Cavium Processor
- 2 1000Base-BX (Serdes) interfaces to AMC connector
- Serial Over LAN via SMB
V Memory
- 1, 2 or 4 Gigabyte DDR2 Memory support with ECC
800MHz data rate (2GB standard)
- 128MB FLASH Memory
- USB Flash Disk up to 4 GB
V Interfaces
- 2x RS232 via micro-interface
- 1x micro USB
AVAILABILITY
Available Now
APPLICATION AREAS
Cell site backhaul
Femtocells / WiMAX / UMA / VoLTE ACs
MGW, MGC, RNC, SBC, MME
IP-transport aggregation and concentration
Routing and Security acceleration
Signaling and voice protection and enforcement
SIP & Diameter Protocols
RTP
IPTV, Video
Traditional SS7 & SIGTRAN Signaling including
Signaling Gateway
Voice Processing via I-TDM
PacketAMC (PktAMC)
Specication Compliance: PICMG AMC.0 R2.0, AMC.1 R2.0,
AMC.2, IEEE 802.3, IPMI V1.5
With a Cavium Octeon Plus 56XX processor and 4GbE
interfaces, frontend processing of the Layer 2 protocols
can reside on the Adax PacketAMC (PktAMC) providing
hardware acceleration of the basic Layer 2 switching.
At the same time the advanced Layer 2 Switching and
Routing, MPLS-TP, PBB-TE, QoS, High Availability and
Management can take place on the AdaxPacketRunner.
At a high level, the PktAMC is applicable in the broadest
range of ATCA legacy and emerging network elements
found in todays networks such as MSCs, MGs, HLRs, x-
CSCFs, HSSs, etc. The combination of the PktAMC and
the APR delivers a subsystem for LTE-SAE, IMS, VoLTE,
UMA & Femtocell applications.
The PacketAMC together with the AdaxPacketRunner
ATCA carrier blade provides the high performance delivery
of control and data plane services from one tightly coupled
resource. Contention on the chassis backplane is removed,
allowing multiple IP ows to be processed on the APR. Pro-
cessed packets are then available for immediate transport
to system application servers or the IP network.
FEATURES & BENEFITS
V I/O Subsystem for LTE-SAE
V High Performance hardware acceleration with
Cavium Octeon Plus 56XX
V High Performance Application Acceleration including:
- Packet I/O processing
- QoS Queuing & scheduling
- IPsec, SSL, SRTP, WLAN and 3G/UMB/LTE security
V Carrier Ethernet
- MPLS-TP
- PBB-TE
- Trafc & Bandwidth Management
TECHNICAL SPECS
V Processor
- Cavium Octeon Plus CN56XX, up to 12 cores 800 MHz
V Congurations:
Front Panel congurations:
- 4x SFP GbE
- 1x SFP+ 10GbE (Option)
SW congurable FAT pipe region Interface
10GbE; Quad GbE; PCIe x4 or x8
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CONTACT INFORMATION
Interphase
Interphase
2901 N. Dallas Pky, Suite 200
Plano, TX 75093
USA
+1 214-654-5000 Telephone
800-327-8638 Toll Free
fastnet@iphase.com
www.iphase.com
V Front Panel:
1 or 2 SFP receptacles for CPRI 4.1
SMB micro-coaxial for GPS antenna/1PPS I/O
signal input/output
1 or 2 10/100/1000 Ethernet ports
V AMC Interfaces:
Gigtabit Ethernet: AMC.2 Type E2, ports 0, 1 GE
(shared with the front panel RJ45s)
PCI Express: AMC.1 Type 4 PCIe on ports 4-7
Serial Rapid IO: AMC.4 Type 4 sRIO on ports 4-7
V Memory:
512MB DDR3 SDRAM Expandable to 1GB with
optional ECC
64MB Boot Flash
1 to 16GB Storage Flash
V Form Factor: AMC.0 R2.0 AdvancedMC Mid Size or
Full Size, or to custom spec
V Power Consumption: 26W Typical / 36W Max
V GPS Receiver onboard (optional)
V Precision clock sourcing on board (optional)
APPLICATION AREAS
Private applications such as rapidly deployable
networks, closed enterprise usage, and machine-
to-machine
Integration into remote radio heads
Public carrier macrocell, microcell, picocell, and
enterprise femtocell basestations
iSPAN 36701 Wireless
Basestation AMC
Compatible Operating Systems: Linux, VxWorks
Specication Compliance: LTE-FDD, LTE-TDD, WiMAX, W-CDMA,
TD-SCDMA
The iSPAN
36701 LTE Basestation on a Card is an appli-

cation-ready, small form factor, customizable basestation
module based on the innovative Mindspeed Transcede
4020 SoC. The module includes the basestation control,
baseband PHY, radio interface, and pre-integrated fully
compliant LTE (PHY/L2/L3) protocol layers, making it
ready to integrate with a radio and applications software
for quick time-to-market eNodeB microcell, picocell, or
enterprise femtocell basestations. Mix of programmable
DSP and H/W acceleration allows for DSP headroom for
additional customer feature development.
The iSPAN 36701 is designed as an entry point for the
development of next generation wireless basestations.
Interphase can adapt or extend this solution to meet your
needs in AMC or in any other form factor required.
FEATURES & BENEFITS
V Compact multi-capable SOC technology simplies
basestation design and reduces system latency
V Modular hardware/software/API pre-integration
enables equipment manufacturers to focus on
application and value-add features, accelerating the
development cycle
V Reduces service provider CAPEX and OPEX with
small basestation footprint and signicantly reduced
basestation cooling and power requirements
TECHNICAL SPECS
V Processor: Mindspeed Transcede 4020 SoC
6 ARM Cortex A9 (RISC) Processor Cores @ 750
MHz (9000 DMIPS)
Option to use T4000 @ 600 MHz
10 CEVA DSP Cores (24 GMAC/s)
FEC Processor
10 Application Processors for FFT (6000 MIPS / 24
GMAC/s)
2 Security Coprocessors
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V Zero Time Search provides a fast way to search large
traces for specic protocol terms.
V Cong space can be displayed in its entirety so that
driver registers can be veried.
TECHNICAL SPECS
V Analyzer
Lanes supported: X1,x2,x4,x8,x16
Speeds: 2.5GT/s, 5GT/s and 8GTs
Probes/Interposers: active and passive PCIe slot,
XMC, AMC, express card, express module, minicard,
MidBus, multi-lead, external PCIe cable and others.
Form factor: Card, Chassis
V Exerciser
Lanes supported: X1,x2,x4,x8,x16
Speeds: 2.5GT/s, 5GT/s, 8GT/s
Emulation: root complex and endpoint emulation
V Protocol Test Card
Speeds: 2.5GT/s and 5GT/s operation
Tests: Add-in-card test
BIOS Platform Test
Single Root IO Virtualization Test
APPLICATION AREAS
Mezzanine Boards, Add-in Cards, Host Carrier Systems,
System Boards, Chips
LeCroys PCI Express
Protocol
Analysis and Test Tools
Compatible Operating Systems: Windows XP/Vista
Specication Compliance: PCI Express Standards: 1.1, 2.0, and 3.0
Whether you are a test engineer or rmware developer,
LeCroys Protocol Analyzers will help you quickly iden-
tify, troubleshoot and solve all your protocol problems.
LeCroy works closely with industry standards groups such
as the PCI-SIG, PICMG, VITA and the Intel Embedded
Communication Alliance to help developers rapidly bring
to market high performance and reliable PCI Express pro-
tocol test solutions.
LeCroys products include a wide range of probe connec-
tions to support XMC, AMC, ATCA, microTCA, Express
Card, MiniCard, Express Module, HP Blade Server Mod-
ules, MidBus connectors and exible mult-lead probes for
PCIe 1.0a, 1.1(Gen1 at 2.5GT/s) , PCIe 2.0(Gen 2 at 5
GT/s) and PCIe 3.0(Gen 3 at 8 GT/s).
The high performance SummitTM T3-16 Protocol Analyzer
features the new PCIe virtualization extensions fo SR-IOV
and MR-IOV and in-band logic analysis.
LeCroy offers a complete range of protocol test solutions,
including analyzers, exercisers, protocol test cards, and
physical layer testing tools that are certied by the PCI-
SIG for ensuring compliance and compatibility with PCI
Express specications, including PCIe 2.0.
FEATURES & BENEFITS
V One button protocol error check. Lists all protocol errors
found in a trace. Great starting point for beginning a
debug session.
V Flow control screen that quickly shows credit balances
for root complex and endpoint performance bottlenecks.
Easily nd out why your add-in card is underperforming
on its benchmarks.
V LTSSM state view screen that accurately shows power
state transitions with hyperlinks to drill down to more
detail. Helps identify issues when endpoints go into and
out of low power states.
V Full power management state tracking with LeCroys
Interposer technology. Prevents loosing the trace when
the system goes into electrical idle.
V LeCroys Data View shows only the necessary protocol
handshaking ack/naks so you dont have to be a protocol
expert to understand if root complexes and endpoints
are communicating properly.
V Real Time Statistics puts the analyzer into a monitoring
mode showing rates for any user term chosen. Good for
showing performance and bus utilization of the DUT.
LeCroy Corporation
3385 Scott Blvd.
Santa Clara, CA, 95054
USA
1 800 909-7211 Toll Free
1 408 727-6622 Fax
sales@lecroy.com
http://www.lecroy.com
LeCroy Corporation
CONTACT INFORMATION
Scan Engineering Telecom GmbH
Elisabethstrasse, 91
Munich, 80797
Germany
+49 89 5908 2347 Telephone
+49 89 5908 1200 Fax
sales@setdsp.com
www.setdsp.com
AVAILABILITY
now
APPLICATION AREAS
Telecom Edge applications, WiMAX and LTE base sta-
tions
Industrial Control&Management systems, Data acqui-
sition systems
Medical Imaging, X-Ray, Ultrasound
Instrumentation Test & Measurement systems
Aerospace Avionics and ship-board platforms, Com-
munication systems
SMCH-102 Cost-effective MCH
for MicroTCA systems
Specication Compliance: MTCA.0 R1.0
Scan Engineering Telecom MCH (Management Carrier
Hub) SMCH-102 is a perfect solution for cost-sensitive
applications based on MicroTCA ecosystem.
SMCH-102 provides without switch management and
complex control software. Compare to rich-featured
MCH SMCH-100 it has only one MCH tongue. SMCH-102
provides two Gigabit Ethernet uplinks (through RJ-45
connectors) on the front panel and one serial interface to
access the management controller (MCMC). On the edge
connector there are 12 x GbE channels for AMC mod-
ules. In addition SMCH-102 supports some features from
SMCH-100 like supporting two MCHs in one system,
ash for failover and microcode rollback for both IPMI
and GbE switch, RMCP support, Real Time Clock.
SMCH-102 gives OEMs in an effective solution for building
cost-sensitive application. Scan Engineering Telecom
can also provide customization, turnkey integration and
support to ensure that OEMs can focus where they prefer
to add their own unique value.
FEATURES & BENEFITS
V Cost-optimize solution for MicroTCA systems
V Capability for using two MCHs in one system
V For cost-sensitive applications in telecom, industrial,
medical test & measurement and aerospace industries
V Customization welcomed
TECHNICAL SPECS
V System management and Ethernet switching for up
to 12 AMC modules via unmanaged Ethernet switch
V Supports HPM.1, IPMI v1.5 and RMCP interface
V Fash for failover and rollback for both IPMI system
and GbE switch
V Capability for using two MCHs in one MicroTCA
system
V 2 x GbE uplinks and 1 x serial on front panel
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CONTACT INFORMATION
Munich, 80797
Germany
+49 89 5908 2347 Telephone
+49 89 5908 1200 Fax
sales@setdsp.com
www.setdsp.com
TECHNICAL SPECS
V Four SSD sub-systems operating via SATAII channel,
each with its own power supply
V 1024GB (1TB) for data storage
V Data read/write rates up to 270MB/s
V 2 x SATAII channels and 1 x PCIe x1 bus
V Supports different RAID options
AVAILABILITY
now
APPLICATION AREAS
Telecom Edge applications, next-generation conver-
gent media gateways, media servers, messaging servers,
storage systems
Datacom/Enterprise computing network security/re-
wall appliances, storage systems, gateways
Industrial storage subsystems, transport applications
Instrumentation test & measurement systems
munication systems, Real-Time Intelligence systems,
Simulators
SAMC-203 High-performance
AdvancedMC storage module
Compatible Operating Systems: Windows, Linux, FreeBSD
Specication Compliance: PICMG AMC.0 R2.0
Scan Engineering Telecom presents second generation
of its SAMC-203, high-efcient storage module with
RAID support implemented as a AdvancedMC Module
for use in AdvancedTCA and MicroTCA systems.
Designed around RAID controller and based on Flash
memory (MLC or SLC) SAMC-203 have maximum
capacity of 1024 GB (1TB) for data storage, data
read/write rates up to 270MB/s and provides excep-
tional performance in the convenient and versatile
AdvancedMC form factor.
On-board RAID controller support different RAID
modes including but not limited to RAID0, RAID10,
Concatenation SAFE30 and SAFE50. SAMC-203 has
two SATAII channels for systems without PCI Express
switching logic inside MCH, required channel can be
selected manually/automatically and SATAII-PCIe
bridge for systems with PCI Express interconnection.
For high reliability each of storage subsystems has
its own power supply as well as power supply for the
entire module.
SAMC-203 gives OEMs in a broad range of industries
a higher performance and cost effective solution. Scan
Engineering Telecom can also provide customization,
turnkey integration and support to ensure that OEMs can
focus where they prefer to add their own unique value.
FEATURES & BENEFITS
V High-performance AdvancedMC Storage module
V Storage capacity up to 1024GB (1TB)
V SATAII channels and PCI Express bus for operating in
any kind of xTCA systems
V For OEMs in telecom, datacom, industrial, medical,
test & measurement and aerospace industries
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CONTACT INFORMATION
Munich, 80797
Germany
+49 89 5908 2347 Telephone
+49 89 5908 1200 Fax
sales@setdsp.com
www.setdsp.com
V Up to 128 Gbyte on-board SSD drive via internal
SATA channel
V PCI Express x8 lane or two PCI Express x4/x1 lanes,
two SATA/SAS channels and two Gigabit Ethernet
channels via AMC connector
V Front panel interfaces 2 x USB 2.0, 1 x Serial
AVAILABILITY
now
APPLICATION AREAS
Telecom Edge applications, next-generation convergent
media gateways, media servers, messaging servers, ses-
sion border controllers, WiMAX and LTE base stations
Datacom/Enterprise computing Routers/gateways,
network security/rewall appliances, switches
Industrial Embedded controllers, co-processor appli-
cations
Medical Imaging, X-Ray, Ultrasound
Instrumentation Test & Measurement systems
munication systems, Real-Time Intelligence systems,
Simulators
SAMC-504 Quad-Core
AdvancedMC Processor module
Compatible Operating Systems: Windows, Linux, FreeBSD
Specication Compliance: PICMG AMC.0 R2.0
The Scan Engineering Telecoms SAMC-504 is a Intel-
based AdvancedMC Processor Module.
SAMC-504 is a high performance computing module
for use in AdvancedTCA and MicroTCA systems.
Designed around Intels x86-based Core2 Quad pro-
cessors, it provides exceptional computing power
and performance in the convenient and versatile
AdvancedMC form factor.
The SAMC-504 complies with the most current PICMG
specications for operation in ATCA and MicroTCA
applications. This module supports sub-specications
to insure compatibility with the broad set of interface
options presented by AMC carriers including SAS/SATA,
Ethernet and PCI-Express. It also features an onboard
SATA SSD disk drive for extend typical application areas.
SAMC-504 gives OEMs in a broad range of industries a
higher performance and cost effective solution. Scan
SAMC-504 gives OEMs in a broad range of industries
a higher performance and cost effective solution. Scan
FEATURES & BENEFITS
V High-performance AdvancedMC processor module
offers new way in performance-per-watt
V High-performance Intel Core2 Quad architecture
doubles the performance of a typical dual-core
solution, demonstrates maximum power efciency,
provides excellent computing power and supports up
to 4 simultaneous computing threads
V A very cost-effective computing platform for
AdvancedTCA and MicroTCA solutions
V For OEMs in telecom, datacom, industrial, medical
test & measurement and aerospace industries
TECHNICAL SPECS
V Intel Core2 Quad CPU running at 2.20GHz
V Up to 4 Gbyte DDR2 memory with ECC support run-
ning at 400MHz
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CONTACT INFORMATION
CONTACT INFORMATION
Tempe, AZ 85282
USA
1 602 438 5720 Telephone
1 800 759 1107 Toll Free
Emerson.com
FEATURES
V 3U, 19 dual server platform based on ATCA technology
V Supplied with one or two server blades
V Front-to-rear cooling
V Support for power saving features
V SpiderWare
M
3
graphical system management
software
Katana
2000 Commercial
ATCA Bladed Server
Compatible Operating Systems: Red Hat Enterprise Linux,
Microsoft Windows XP
Specication Compliance: ATCA, AMC
The Katana
2000 bladed server offers scalable, high-

performance computing for tasks that store, process and
forward large amounts of data for applications where
reliability or bill-per-minute are critical. Katana 2000 is
based on open-standards ATCA
technology to provide
commercial IT applications with improved serviceability,
power and space efciency over typical rack mount server-
based solutions. The low-prole system can be supplied
with one or two high performance server blades, each
featuring two of the latest quad-core Intel
Xeon
5500
series processor devices with up to 48GB DDR3 memory
and two individually hot-swappable mass storage units.
Target applications include Internet-based media/content
provisioning; data processing & logging in installations;
security surveillance infrastructure; server platforms for
electronic warfare; image processing & data management
in medical applications; and data retrieving/processing/
storing in scientic or large physics experiments.
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CONTACT INFORMATION
44350 Grimmer Blvd.
Fremont, CA 94538
USA
510-656-3783 Fax
sales@elma.com
www.elma.com
TECHNICAL SPECS
V 2U - 6U horizontal congurations with AC & DC
options; 13U vertical conguration (DC only)
V Up to 300W slot cooling
V N+1 redundant power entry modules (PEMs)
V Optional, redundant shelf manager
V Designed to meet FCC & NEBS EMC require-
ments
AVAILABILITY
Shipping now
APPLICATION AREAS
Edge of the Network; transport and data centers, wire-
less/WiFi, wireline, and optical network elements.
Ground based mission communications in military
deployments.
AdvancedTCA System Platforms
Compatible Operating Systems: Linux, VxWorks, Windows
Specication Compliance: PICMG 3.0
Elmas ATCA platforms are compliant to PICMG 3.0 and
are based on a modular design offering a wide range of
chassis congurations. The 2U - 6U horizontal congura-
tions support 90 235 VAC and 48 VDC inputs; the 13U
vertical chassis supports 48 VDC for telco related appli-
cations. A choice of backplane fabric topologies (star,
dual star, mesh full & replicated) include support of
up to 40 Gbs. Elmas platforms can support up to 300W
per slot cooling; each unit is shipped with N+1 redundant
power modules; an optional redundant shelf manager is
also available.
Elmas ATCA System Platforms are based on a proven
design concept which reduces program risk (time and
cost). Typical applications in which Elmas platforms are
ideally suited are: edge core, transport and data center;
wireless, wireline, and optical network elements.
Customers take advantage of Elmas well established
partnerships with premier industry suppliers to develop
and deploy integrated and pre-congured ATCA systems
with processors, storage, switch blades, and other I/O
requirements. The company can supply an integrated
platform all the way up to the cabinet level. Extensive
thermal testing is conducted at the main manufacturing
facilities. Elma is also well suited to work with companies
considering deploying ATCA based communications
systems in the mil/aero space.
FEATURES & BENEFITS
V Wide range of chassis congurations based on a
modular design enables faster time to market
V Proven design concept reduces program risk by
offering time and cost savings
V Choice of backplane fabric topologies (star, dual star,
mesh full & replicated; support for up to 40 Gbs
backplane options
V Superior thermal performance qualied through
extensive in-house testing
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CONTACT INFORMATION
Schroff
Schroff
170 Commerce Drive
Warwick, RI 02886
USA
(401) 732-3770 Telephone
401) 738-7988 Fax
www.schroff.us
AVAILABILITY
Units in stock for immediate delivery
APPLICATION AREAS
Military, Medical, Security, Test & Measurement,
Electronic OEM, Telecom, Enterprise, Industrial and
Transportation
MicroTCA Enclosures
Schroff has developed a wide range of small innovative
MicroTCA enclosures that will accelerate your time-to-
market and balance the performance-to-cost ratio that
allow system integrators to deliver an overall solution
with a distinct competitive advantage.
The unique mechanical and tested design of Schroffs
card guides, subracks, EMC gasket, and struts allow
for maximum flexibility and consistent performance
in every application. From this, many products have
been developed to meet the enterprise, telecom, mili-
tary, industrial and medical markets. Cost effective
backplane routing designs and innovative cooling
and power management solutions are helping system
integrators in all of these markets achieve their cost
and performance objectives for next generation
equipment. Compliance engineering expertise along
with Global manufacturing and support will ensure
that your products are released on schedule.
Schroff has been leading the MicroTCA specication
development since its conception and provides all
the components, hardware, development, production
through hardened enclosures that you would require.
Contact an Applications Engineer to learn more about
how Schroffs MicroTCA products can help you achieve
your Next Generation Systems requirements. Schroff
is committed to provide the best engineered and
quality enclosure for your specic application.
FEATURES & BENEFITS
V Proven MicroTCA hardware, card guides, EMC
gasket, subrack assembly
V Table-Top and Side-Mount Cube Systems
V 1U thru 8U rackmount systems with redundant
cooling solutions and EMMC on-board
V Solutions with xed AC Power Entry and other
power conguration options
V Backplane design and manufacturing for lower
layer count and high performance. Customization
for point-to-point routing for cost and performance
optimization
V Proof-of-Concept ruggedized AMC hardware and
hardened MicroTCA Enclosures, including conduc-
tion-cooled ATR
V Modular power management schemes for full
compliant and options for low featured, cost
effective power management.
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CONTACT INFORMATION
MicroBlade
MicroBlade
567 DOnofrio Drive
Suite 150
Madison, WI 53719
USA
(608) 729-5370 Telephone
(866) 249-2499 Fax
sales@micoblade.us
www.microblade.us
Dual Ring Option
Provides two fat pipe rings between AMC 2, 4 &
6 and AMC 1, 3 & 5
Port 2 & 3 SATA /SAS connectivity to the adjacent
slot
Ports 4-7, 8-11, 12-15 and 17-20 fat pipe connectivity
is point to point with support for PCIe, XAUI or SRIO
V Cooling Unit:
Excellent thermal prole providing over 100 CFM
of airow
4 push-pull fans per CU with each fan rated at 20 CFM
Individually controlled with variable fan speed
Straight through side-to-side cooling
Fully managed, redundant and hot swappable
Air lter removed detection
Mini-USB diagnostic port
V Environmental /Regulatory/Compliance:
Standard operating temperature: -5 C to +45 C
Storage temperature: -45 C to +85 C
Shock and vibration: Level DL1, IEC 61587-1
FCC Part 15, Class A Compliant
EN 55022
EN 55024
EIA Compliant
RoHS Compliant
PICMG MicroTCA.0 R1.0
AVAILABILITY
Now
APPLICATION AREAS
Commercial Communications, military communications,
telecom, enterprise telecom, wireless telecom, automated
test equipment, medical, video demand, security, industrial
machine control and other clustered computing applications.
MicroBoxPlus 1U
Specication Compliance: PICMG MicroTCA R1.0, RoHS Compliant
MicroBoxPlus 1U offers the performance benet of
MicroTCA in a space-saving horizontal-mounted 1U height.
Six AdvancedMC (AMC) slots provide users the exibility
to congure the system for a wide range of applications
including telecom, wireless telecom, enterprise communica-
tion, security and industrial automation/machine control.
If your applications demand the highest computing per-
formance with space and power constraint, MicroBoxPlus
1U is your solution.
FEATURES & BENEFITS
V Horizontal-mounted 1U 19 rack-mounted enclosure
V Flexible 6 slot design that can be congured for full,
mid or compact AMCs
V 300W/600W/900W AC or 380W/760W DC managed
power supply
V Two redundant hot swappable managed cooling units
V IPMI system management
TECHNICAL SPECS
V Chassis:
1U 19-inch EIA rack mount
6 AMC slots providing up to 60W per slot.
1 MCH slot
1 Power module slot
1 2HP JTAG switch module slot
2 hot swappable cooling units
1 Removable air lter
3 eld replaceable backplane options
A service to address custom backplane congurations
is offered
V Backplane:
Single Fat Pipe with Point to Point Option
Ports 4-7 fat pipe connectivity via the MCH Fabric
to each AMC with support for PCI-e, XAUI or SRIO
Ports 8-11 provide fat pipe point-to-point connec-
tions between AMC 1 and AMC 3
Port 2 & 3 SATA /SAS connectivity to the adja-
cent slot
Ports 19 and 20 provide alternate SATA /SAS
connection
Dual Fat Pipe Option
Ports 4-7 and 8-11 fat pipe connectivity via MCH
fabric to each AMC with support for PCIe, XAUI
or SRIO
Port 2 & 3 SATA /SAS connectivity to the adjacent slot
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CONTACT INFORMATION
MicroBlade
MicroBlade
567 DOnofrio Drive
Suite 150
Madison, WI 53719
USA
(608) 729-5370 Telephone
(866) 249-2499 Fax
sales@micoblade.us
www.microblade.us
Dual Fat Pipe Option
Ports 4-7 and 8-11 fat pipe connectivity via MCH
fabric with support for PCIe, XAUI or SRIO
Port 2 & 3 SATA /SAS connectivity to the next
adjacent slot number
V Cooling Unit:
Excellent thermal prole providing over 200 CFM
of airow
8 push-pull fans per CU with each fan rated at 20 CFM
Individually controlled with variable fan speed
Straight through side-to-side cooling
Fully managed, redundant and hot swappable
Air lter removed detection
Mini-USB diagnostic port
V Environmental /Regulatory/Compliance:
Standard operating temperature: -5 C to +45 C
Storage temperature: -45 C to +85 C
Shock and vibration: Level DL1, IEC 61587-1
FCC Part 15, Class A Compliant
EN 55022
EN 55024
EIA Compliant
RoHS Compliant
PICMG MicroTCA.0 R1.0
AVAILABILITY
Now
APPLICATION AREAS
telecom, enterprise telecom, wireless telecom, auto-
mated test equipment, medical, video demand, security,
industrial machine control and other clustered computing
applications.
MicroBoxPlus 2U
Specication Compliance: PICMG MicroTCA R1.0, RoHS Compliant
MicroBoxPlus 2U offers the performance benet of
MicroTCA in a space-saving horizontal-mounted 2U height
that provides the highest performance per U in a fully redun-
dant conguration that is available in the market. Twelve
AdvancedMC (AMC) slots provide users the exibility to con-
gure the system for a wide range of applications including
telecom, wireless telecom, enterprise communication, secu-
rity and industrial automation/machine control.
If your applications demand the highest computing per-
formance with space and power constraint, MicroBoxPlus
2U is your solution.
FEATURES & BENEFITS
V Horizontal-mounted 2U 19 rack-mounted enclosure
V Flexible 12 slot design that can be congured for full,
mid or compact AMCs
V Two redundant hot swappable managed cooling units
V Support for up to 2 power modules that provide dual
redundant managed AC or DC power
V 300W/600W/900W AC or 380W/760W DC managed
power supply
V Support for up to two MicroTCA Carrier Hubs for
redundancy
V IPMI system management
TECHNICAL SPECS
V Chassis:
2U 19-inch EIA rack mount
12 AMC slots providing up to 60W per slot
Complete redundant system conguration
2 MCH slots
2 power module slots that can be congured as AC
or DC
1 Removable air lter
1 2HP JTAG switch module slot
2 hot swappable cooling units
2 eld replaceable backplane options
A service to address custom backplane congurations
is offered
V Backplane:
Scope Compliant Option
Ports 4-7 provide fat pipe point-to-point connec-
tions between all adjacent AMCs
Ports 8-11 fat pipe connectivity via MCH Fabric to
each AMC supporting PCI-e, XAUI or SRIO
Port 2 & 3 SATA /SAS connectivity to the adjacent
slot
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CONTACT INFORMATION
44350 Grimmer Blvd.
Fremont, CA 94538
USA
510.656.3400 Telephone
sales@elma.com
www.elma.com
FEATURES & BENEFITS
V All Elma ATCA/MTCA chassis conform to latest
PICMG specications.
V AdvancedTCA system platforms are available in 2U,
4U, 5U, 13U and custom sizes.
V Modular MicroTCA solution is unique in industry
allows exibility.
V MicroTCA subracks in 1U-8U heights, 4U wide cube, and
Ruggedized MicroTCA ATRs and rackmount enclosures.
V Unique redundant Push-Pull cooling for 6U and 8U
MicroTCA subracks, and 1U and 3U MicroSlim shelves.
V All backplanes are optimized via signal integrity stud-
ies to predict the performance of a backplane design
and eliminate trial and error.
V Elma specializes in customization and offers a range
of services including Simulation, 3D solid modeling,
NEBS Certication, Manufacturing and Integration.
V Thermal simulation software is used to design an
ideal cooling solution.
V A variety of accessories are offered including ATCA
and MicroTCA handles, panels, and other com-
ponents. Accessories include load, extender, air
extender, air bafe/blocker, and SerDes test boards.
AdvancedTCA
and MicroTCA

System Platforms
Elma has the industrys widest selection of AdvancedTCA
and MicroTCA system platform solutions. This includes
ATCA modular enclosures in 2U, 4U, 5U, and 13U heights
and MicroTCA subracks in 1U-8U heights. Elma also
offers portable cube MicroTCA chassis and Rugged
MicroTCA enclosures in ATR and Rackmount styles.
Elma pioneered AC versions of AdvancedTCA enclosures
with its 2U and 5U horizontal-mount offerings. These
chassis are also available in 48V DC. The 4U and 13U
versions are DC-only. The 2nd-generation 13U carrier-
grade chassis meets the requirement of at least 20-30%
airow in each of the 4 regions of the ATCA blade. This
ensures even airow distribution and helps to prevent
hot spots. The chassis is cooled via three individually
removable fan trays. Each tray has two 250 to 420 CFM
(cubic feet per minute) airow fans with PWM (pulse
width modulation) control. A honeycomb air lter below
the fans maximizes air intake while a NEBS-compliant air
lter above the fans ensures even air distribution. The
fans are also positioned to provide up to 140 CFM airow
over the RTMs (rear transition modules).
All Elmas ATCA chassis include a wide range of back-
plane, shelf management solutions, and many other
options. The chassis have been optimized via backplane
signal integrity studies and thermal simulation. Elma has
actively participated in nearly all of the AdvancedTCA
Interoperability Workshops (AIW), assuring our products
work effectively with other products in the market.
Elmas MicroTCA enclosures come in a unique mod-
ular-based solution. This allows easy modication and
customization in the wide range of possibilities of the
architecture. The various chassis facilitate both single
and double modules in the full size. Versions are avail-
able with push-only cooling or with redundant push-pull
cooling. The fan trays are pluggable with a removable
air lter. A portable development cube-style chassis is
also available. This unit allows both single and double
modules to be used in the same chassis.
The 1U and 3U MicroSlim Shelves from Elma optimize
performance density in low-prole designs. The 1U
design holds 6 AMCs (mid size), 1MCH, 1 PM, and 1 JSM
(J-Tag Switch Module) slots. The 3U holds 12 AMCs, 2
MCH, 2 PM, 1 JSM, and 2 spare slots. Cooling perfor-
mance is excellent with a redundant push-pull airow
design with intelligent Cooling Units.
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CONTACT INFORMATION
MicroBlade
MicroBlade
567 DOnofrio Drive
Suite 150
Madison, WI 53719
USA
(608) 729-5370 Telephone
(866) 249-2499 Fax
sales@microblade.us
www.microblade.us
TECHNICAL SPECS
V Input Power: Two -36 to -72 VDC power inputs with a
common VRTN.
V Power inputs provide input protection, input isolation,
inrush current control, EMI ltering, holdup circuit and
high efciency power conversion. The input voltage is
continuously digitized and monitored with 0.5V accuracy.
V 16 management and payload channels that are
digitized and monitored for under-voltage,
over-voltage, transient over-current and average
over-current detection. Individual channel indica-
tors are provided at the front panel.
V Output Power: 120W / 10 A maximum per AMC at 95%
efciency.
V JTAG interface for diagnostics and rmware upgrades
V USB interface provides detailed status and operating
information via MicroBlades SW console known as
Dashboard. This port also provides users the ability
to monitor power module boot sequencing and IPMI
messaging.
AVAILABILITY
Now
APPLICATION AREAS
telecom, enterprise telecom, wireless telecom, automated
test equipment, medical, video demand, security, industrial
machine control and other clustered computing applications.
Panther 380 and 760 MicroTCA
DC Power Module
Specication Compliance: PICMG MicroTCA R1.0, RoHS
The Panther 380 and 760 DC power modules are
MicroTCA.0 R1.0 specication compliant and provide
16 pairs of management and payload outputs that are
digitally monitored for over or under voltage and over
current. Panther is a highly efcient power module that
is fully redundant, hot swappable and supports a wide
operating temperature range. The unit is packaged as a
Full-Size/Single-Width module and is fully enclosed for
electrical protection.
Payload power channels provide individually pro-
grammed current limits with load specic values. This
feature promotes a high power system MTBF, more
tightly managed power budgeting as well as the ability
to provide a highly accurate power consumption history
for each component in the system.
Hot swappable and fully redundant operation coupled
with extremely high efciency and wide temperature
range operation make Panther power modules ideally
suited for all air cooled MicroTCA applications requiring
DC Power.
FEATURES & BENEFITS
V A Full-Size/Single-Width MicroTCA.0 R1.0 RoHS
compliant DC power module providing support for
380 and 760 Watts.
V Each payload channel voltage and current is digitized
and monitored to a user dened reference.
V Hot swappable and fully redundant operation coupled
with extremely high efciency over a wide tempera-
ture range
V Panthers on board FPGA handles system critical
functions such as current limiting or channel failover
control independently from an on-board microproces-
sor giving the system a robust redundant capability.
V Single-board design with digitized payload channel
voltage and current allows Panther to be the most
cost effective, best thermal performance, and highly
accurate MicroTCA power solution in the market.
V Panther provides a JTAG port which supports JTAG
diagnostics and rmware upgrades.
V A front panel USB port allows users to monitor
Panthers boot sequence and IPMI messaging as well
as other detailed power and system information via
MicroBlades SW console called Dashboard.
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CONTACT INFORMATION
MicroBlade
MicroBlade
567 DOnofrio Drive
Suite 150
Madison, WI 53719
USA
(608) 729-5370 Telephone
(866) 249-2499 Fax
sales@microblade.us
www.microblade.us
TECHNICAL SPECS
V Input Power: 105 to 264 VAC nominal with a 20ms
hold-up capability at 100% load. A 5.0 to 5.5V standby
power input voltage at 150mA max.
V Output Power: 300W, 600W and 900W at 120VAC
with a nominal payload output of 12.5V that is
programmable from 0 to 10.2A and a nominal
management output of 3.3V at a minimum of 165mA
at 90% efciency.
V 16 management and payload channels that are
digitized and monitored for over current under-volt-
age, over-voltage, transient over-current and average
over-current detection.
V JTAG and USB Ports: The JTAG port provides sup-
port for JTAG diagnostics and rmware upgrades.
The USB port can be used to monitor power module
boot sequencing and IPMI messaging. The USB port
also interfaces to MicroBlades SW console known as
Dashboard to provide detailed status and operating
information of the power system.
AVAILABILITY
Now
APPLICATION AREAS
telecom, enterprise telecom, wireless telecom, auto-
mated test equipment, medical, video demand, security,
industrial machine control and other clustered computing
applications.
Puma 300, 600 and 900
MicroTCA AC Power Module
Specication Compliance: PICMG MicroTCA.0 R1.0, RoHS
Compliant
The Puma 300, 600 and 900 MicroTCA AC power modules
are MicroTCA.0 R1.0 specication compliant and provide 16
pairs of management and payload outputs that are digitally
monitored for over or under voltage and over current. Puma
is a highly efcient power module that is fully redundant,
hot swappable and supports a wide operating temperature
range. The unit is packaged as a Full-Size/Single-Width
module and is fully enclosed for electrical protection.
Payload power channels provide individually programmed
current limits with load specic values. This feature pro-
motes a high power system MTBF, more tightly managed
power budgeting as well as the ability to provide a highly
accurate power consumption history for each component
in the system.
Hot swappable and fully redundant operation coupled with
extremely high efciency and wide temperature range
operation make Puma power modules ideally suited for all
air cooled MicroTCA applications requiring AC power.
FEATURES & BENEFITS
V A Full-Size/Single-Width MicroTCA.0 R1.0 RoHS
compliant AC power module that provides versions
that support 300, 600 and 900 Watts. Each payload
channel voltage and current is digitized and monitored
to a user dened reference.
V An international power input supports all typical fea-
tures such as input protection, power factor correction,
input isolation, inrush current control., EMI ltering ,
holdup circuit and high efciency power conversion.
V Hot swappable and fully redundant operation coupled
with extremely high efciency and wide temperature
range operation make Puma power modules well
suited for most applications.
V Based on state-of-the-art FPGA and advanced technol-
ogies for energy management and remote monitoring,
diagnostics, software updating and reconguration.
Each output channel is individually congurable as
primary, backup or disabled.
V The Puma utilizes an on-board microprocessor for the
EMMC, IPMI and power module control features. For
added safety and exibility the power module does not
rely on the microprocessor for system critical functions
such as current limiting or channel failover control.
P
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r

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y

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48 Engineers Guide to ATCA

VIEWPOINT
For equipment manufacturers wanting to get LTE bases-
tations in the hands of customers for demos and trials
as quickly as possible, recent technology advances now
enable a better, faster way to a small footprint, cost-
effective eNodeB. New silicon developments can reduce
a wireless basestation to a single card with baseband
processors replacing DSPs, FPGAs, and NPUs. Such pro-
cessors can have an entire basestation application layer
on a single System on a Chip (SoC), thus greatly reducing
system latency. The single card modules can also include
the latest, industry-standard common public radio inter-
face (CPRI) functionality, plus high-speed serial RapidIO
(sRIO) and PCI Express I/O. On-chip hardware acceleration
for forward error correction (FEC) and encryption further
reduce overall system cost.
Such new modular basestation solutions address many
factors important to both equipment manufacturers and
their customers as well.
Advantages for the equipment manufacturer:
Simplied design, both electrically and mechanically, which
reduces basestation costs
Use of bundled hardware/software/API enables focused
investment of resources in applications software and value-
add features vs. re-inventing the underlying wheel
Accelerated development cycle for shorter time to market
and a competitive edge
Extended market reach with technology for solutions that
were not previously feasible
Advantages for the LTE service provider:
Reduced plant space required due to smaller basestation
footprint
Substantially reduced basestation power and cooling
requirements
Ability to combine basestations with other functions rather
than requiring separate racks
Increased price performance
Enablement of new money-making services
Beyond the development and cost benefits, consider the
applications and services these new basestations can
enable across single and multiple sectors using Long Term
Evolution (LTE FDD and TDD), WiMAX air-interface stan-
dards, wideband code-division multiple access (W-CDMA),
and time-division synchronous code division multiple
access (TD-SCDMA, in China).
Private Applications
Rapidly deployable networks for public safety and the military
Closed enterprise usage on cruise ships, oil platforms, and
aircraft, and in prisons
Machine to machine usage beyond meter reading to asset
management and media downloads
Remote Radio Heads
Basestation/radio head integrated device
Public Carriers
Microcell
Picocell
Enterprise femtocell
In summary, the new highly-integrated basestation tech-
nology rolls formerly separate elements into a single
package, enabling a highly scalable, cost-effective, small
footprint basestation solution. Evolution is to the point
that initial models are available that reduce the size and
cost by at least half compared to currently deployed bases-
tation solutions. This game-changing technology will help
redefine wireless infrastructure economics during what is
expected to be a major basestation upgrade cycle.
Marc DeVinney, VP of Engineering at In-
terphase, mdevinney@iphase.com.
by Marc DeVinney
Winning Technology for Small
Footprint Wireless Basestation Designs

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Annual Industry Guide

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