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Профессиональный Документы
Культура Документы
DTT6530
January 1996
Published by Technical Publications and Training, Intel Corporation Copyright Intel Corporation 1996
Document requests:
http://ats.intel.com/Docs/
Phil Sandoval, 356-6348, FM5-43, psandova@pcocd2 Mary Sullivan, 765-5576, RN4-43, msulliv@scdt
CMOS 1
Table of Contents
Chapter 2: Introduction to CMOS 1 Drawing CMOS Layout for IC Design Beginning Level
Chapter Overview .............................................................................................. 2-2 What is an IC?.................................................................................................... 2-3 How Is an IC Designed? .................................................................................... 2-4 Basic Layout Design Tasks................................................................................ 2-5 What Are the Design Data Representations? .................................................... 2-6
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Lesson 5-2: How to Identify Process Design Rules on the Transistor Cross Section
Lesson Overview.............................................................................................. 5-14 What Is a Design Rule? ................................................................................... 5-15 Basic Process Design Rules ............................................................................ 5-16 How Are Process Design Rules Identified on the Transistor Cross Section? .. 5-17
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Lesson 5-4: How to Get Better Layout Density with Node Sharing
Lesson Overview.............................................................................................. 5-34 What Is Node Sharing? .................................................................................... 5-35 How Is Node Sharing Achieved? ..................................................................... 5-36 Lab 5-4: Use Node Sharing to Increase Density .............................................. 5-38
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Appendix A: Glossary
Terms .................................................................................................................A-2
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Structure
Interpret Logic-Level Schematics Convert Logic-Level Schematics to Transistor-Level Schematics Create Layout Drawings from Transistor-Level Schematics
Chapters are divided into lessons, the number of lessons depending on the complexity and scope of the topic being taught. Each lesson has a practice or lab, which gives hands-on experience. Objectives Every chapter and lesson has a clearly stated objective so that you will know exactly what you are expected to learn. The course material is presented in a mapped-page format.
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Format
Information is categorized as follows. Concept: Provides denitions and examples Process: Explains how something works Procedure (practice/lab): Tells how to perform a task Guidelines: Provide suggestions for performing a task or tackling a problem
Margin labels (labels on the left side of the page) provide visual cues to help increase information access and retrieval time. The labels refer to the contents of that paragraph or block of information.
The foils follow the sequence of the student material but contain only key points. A page number on the upper left corner of the foil indicates the corresponding page in your course guide.
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Practice: Reinforces material for general knowledge building. Lab: Reinforces material directly related to a job task.
Acknowledgments
Special thanks go to Phil Sandoval, who created the class that this one is based on. Also, thanks to all who helped with the content of this class: Brian Cyphert, Mark Drake, Barbara Drummer, Gell Gellman, Myrna Irwin, Brent Jensen, Mary Kamprath, Lynn Olson, Manhaz Padash, Phil Sandoval, and Seema Shafajoo.
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Chapter Overview
Introduction This class covers the major job tasks for creating basic CMOS layout. Additional knowledge is presented to aid in the understanding of the layout design process. In this class, you will learn how to convert logic-level schematics to transistor-level schematics to layout drawings, and how to create layout drawings to design specications. The following topics are covered in this chapter: Topics Page
Objectives
Topics
What is an IC? .................................................................................. How Is an IC Designed? .................................................................. Basic Layout Design Tasks .............................................................. What Are the Design Data Representations? ...................................
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What is an IC?
Introduction Integrated Circuits (ICs) are used in millions of applications. Producing ICs is the primary business of Intel, which holds 75% of the marketplace. An IC is a single piece of silicon that performs various electronic functions. Examples of ICs, along with their applications, include the following:
Denition
Examples
Use
data storage and retrieval communication between ICs printers, anti-lock brakes
CMOS Technology
Complementary Metal Oxide Semiconductor (CMOS) is the name of the technology used to create ICs. The graphic below shows a silicon wafer and one IC in the wafer.
Silicon Wafer IC
Example
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How Is an IC Designed?
Introduction Process There are many phases required in the creation of an IC. The following gure shows the IC design process, an example of each process step, and who implements that step:
Engineer
Engineer
Mask Designer
Mask Generation
Vendor
Manufacturer
Manufacturer
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Logic Design and Verication Basic Layout Design Tasks Interpret Logic-level Schematics
Convert Logic-level to Transistor-level Schematics Create Layout Drawings from Transistor-level Schematics
Mask Generation
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Denition
Examples
Transistor-level Schematic
Convert Logic-level to Transistor-level Schematics Create Layout Drawings from Transistor-level Schematics Layout Drawing
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Chapter Overview
Introduction Logic-level schematics are a standard way for the engineers to communicate the functions of an IC to other project members. In this chapter, you will learn to identify the parts of logic-level schematics and describe the function of the logic symbols. The following topics are covered in this chapter: Topic Page
Objective
Topics
Lesson 3-1: How to Identify the Parts of a Logic-level 3-3 Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lesson 3-2: How to Describe the Function of a Logic Symbol 3-13 Chapter Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-36
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Objective
Topics
What Is a Logic-level Schematic? . . . . . . . . . . . . . . . . . . . . 3-5 Lab 3-1.a: Identify the Nodes of the Logic-level Schematic 3-6 Logic Symbols of the Basic Logic Functions . . . . . . . . . . . 3-8 Lab 3-1.b: Identify the Logic Symbols of the Logic-level Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9 Logic-level Schematic Drawing Conventions . . . . . . . . . . . 3-10 Lesson 3-1: How to Identify the Parts of a Logic-level Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-12
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Denition
Logic symbol: a short-hand representation for basic or complex logic functions. Node: an electrical path between logic symbols or the inputs and output of the logic symbols. Nodes are drawn as lines. There are three types of nodes on a logic-level schematic, as follows: Input: Supply information to the logic symbol. Output: Carry information away from the logic symbol. Internal: Carry information between logic symbols.
Example 1
The following gure is a logic-level schematic containing a single logic symbol with the logic symbol and nodes labeled.
Logic Symbol
OUT
Nodes
Example 2
The following gure is a logic-level schematic containing two logic symbols with the logic symbols and nodes labeled.
Logic Symbols
OUT
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Instructions for Lab 3-1.a 1. Given the following logic-level schematic, complete the exercises.
a. b. c. d. e. f.
How many logic symbols are in the logic-level schematic? Color each of the nodes in the logic-level schematic a different color. How many nodes are in the logic-level schematic? How many input nodes are in the logic-level schematic? How many internal nodes are in the logic-level schematic? How many output nodes are in the logic-level schematic?
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Instructions for Lab 3-1.a 2. Given the following logic-level schematic, complete the exercises.
a. b. c. d. e. f.
How many logic symbols are in the logic-level schematic? Color each of the nodes in the logic-level schematic a different color. How many nodes are in the logic-level schematic? How many input nodes are in the logic-level schematic? How many internal nodes are in the logic-level schematic? How many output nodes are in the logic-level schematic?
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By inverting the output of the AND logic symbol (represented by the bubble on the output node), the NAND logic symbol is created. The 2-input NAND logic symbol is as follows:
A B OUT
OR Logic Symbol
By inverting the output of the OR logic symbol (represented by the bubble on the output node), the NOR logic symbol is created. The 2-input NOR logic symbol is as follows:
A B OUT
There can be more than two input nodes on the AND, NAND, OR, and NOR logic symbols. However, the inverter can only have one input node. There is only one output node on the basic logic symbols used in this class.
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Instructions for Lab 3-1.b 1. Given the following logic-level schematic, ll in the table below with the names of logic symbols and the number of input nodes each logic symbol has.
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Connecting Nodes
Nodes to be connected are drawn with a dot connecting the lines. When nodes cross without a dot, they are not connected. Connected Nodes:
A A
A A
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Vss
Example: A NAND logic symbol with one input node connected to Vcc and the other input node connected to Vss.
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Instructions for Lab 3-1.c 1. Given the following logic-level schematic, complete the following exercises.
1 2
3 4
a.
b.
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Objective
Topics
What Are the Standard Logic Functions? . . . . . . . . . . . . . . 3-15 Practice 3-2.a: Evaluate Boolean Algebra Equations . . . . . 3-18 What Are Truth Tables? . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-19 How Is the Number of Rows for a Truth Table Determined? 3-20 Practice 3-2.b: Determine the Number of Columns and Rows for a Truth Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-21 How Are Input Values for a Truth Table Filled In? . . . . . . . 3-23 Practice 3-2.c: Fill in the Input Values for a Truth Table . . . 3-26 Output Values of the Truth Tables . . . . . . . . . . . . . . . . . . . . 3-27 Practice 3-2.d: Describe Logic Functions with Truth Tables 3-29
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Denition
Logic Functions
The basic logic functions are dened by Boolean algebra. Boolean algebra uses the following symbols for the logic functions:
Boolean Symbol
* +
AND OR
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Inverse function: The Inverse function output is always a 0 when the input is a 1 and always a 1 when the input is a 0. A = OUT
Value A=0
A
G
OUT
A=1
AND function: the output is 1 only when all inputs are 1s.
A * B = OUT
A B OUT
A + B = OUT
A B OUT
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NAND function: the output is 0 only when all inputs are 1s.
A * B = OUT
A B OUT
NOR function: the output is 1 only when all inputs are 0s.
A + B = OUT
A B OUT
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Instructions for Practice 3-2.a 1. For the following Boolean algebra equations, provide the name of the logic function and the output value.
Equation 1+1= 1+0= 0*1= 1*1= 1*0= 0+0= 0*0= 1*1= 1+1+1= 1+1+0= 0*0*0= 0*1*0= 1*1*1= 1+1+0= 0*0*1= 1+1+1+0= 0*0*0*1= Function Name Output Value
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Denition
Which logic function does the logic symbol represent? How many input nodes does the logic symbol have?
The parts of the truth table are as follows. 1. Input/Output Rows: A row for each combination of input values and the output value. The maximum number of rows is equal to the maximum number of input combinations. 2. Input/Output Node Values: The value of the input or output node. The node values are either 0s or 1s. 3. Input Columns: A column for each input node. The number of input columns is equal to the number of input nodes of the logic symbol. 4. Output Column: A column for the output node. There is always one output column for a logic symbol.
3. Input Columns 4. Output Column
A 0 1 0 1
OUT 0 0 0 1
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Procedure
Step 1. 2.
Action Identify the number of input nodes for the logic symbol you are describing. Calculate the maximum number of combinations for the input nodes with the following formula: Maximum Combinations = 2(number of input nodes)
Examples
An example using the formula with a 2-input NAND logic symbol is as follows:
A B
OUT
Maximum Combinations = 22 = 2 * 2 = 4 An example using the formula with a 3-input NOR logic symbol is as follows:
A B C
OUT
Maximum Combinations = 23 = 2 * 2 * 2 = 8
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Practice 3-2.b: Determine the Number of Columns and Rows for a Truth Table
Introduction Now that you know how to determine the number of columns and rows that are needed to create a truth table, determine the number of columns and rows for the following logic symbols.
Instructions for Practice 3-2.b 1. For an Inverter, complete the following. a. Draw the logic symbol.
b. 2.
How many inputs columns does the truth table for this logic symbol have?
For a 4-input AND, complete the following. a. Draw the logic symbol.
b. 3.
How many input columns does the truth table for a 4-input logic symbol have?
For a 4-input OR, complete the following. a. Draw the logic symbol.
b.
Calculate the maximum number of input combinations for a 4-input logic symbol. Show your work.
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Instructions for Practice 3-2.b 4. For a 5-input NOR, complete the following. a. Draw the logic symbol.
b.
Calculate the maximum number of input combinations for a 5-input logic symbol. Show your work.
c.
d.
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Procedure
Step 1. 2. 3. 4.
Action Draw the truth table with the correct number of rows and columns. For the right-most input column, ll in each box down this column with alternating 0s and 1s. Start with a 0 in the top box. For the next column to the left, ll in this column with alternating groups of two 0s then two 1s. For each column to the left, continue to alternate between groups of 0s and 1s. In each column, double the number of 0s and 1s in each group.
continued...
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How Are Input Values for a Truth Table Filled In? (continued)
Example Using the above procedure ll in the input values for a 3-input NAND logic symbol.
Step 1. Action Draw the truth table with the correct number of rows and columns. Three inputs = three input columns 23 = 2 * 2 * 2 = 8 rows
OUT
2.
For the right-most input column, ll in each box down this column with alternating 0s and 1s. Start with a 0 in the top box.
A 0 1 0 1 0 1 0 1
OUT
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How Are Input Values for a Truth Table Filled In? (continued)
Example (continued)
Step 3. Action For the next column to the left, ll in this column with alternating groups of two 0s, then two 1s.
B 0 0 1 1 0 0 1 1
A 0 1 0 1 0 1 0 1
OUT
4.
For each column to the left, continue to alternate between groups of 0s and 1s. In each column, double the number of 0s and 1s in each group. For this column, there are four 0s and 1s in each group. If there was another column, there would be eight 0s and 1s in each group.
C 0 0 0 0 1 1 1 1
B 0 0 1 1 0 0 1 1
A 0 1 0 1 0 1 0 1
OUT
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Instructions for Practice 3-2.c 1. Complete the following steps to create a truth table for a 3-input logic symbol; the inputs are A, B, C, and the output is OUT. a. b. c. Calculate the number of rows for the truth table. Calculate the number of columns for the truth table. Draw the truth table.
d.
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OUT
1=0 0=1
For the AND function, if any of the inputs are 0, then the output is 0.
G
B 0 1 0 1
OUT 0 0 0 1
A * B = OUT A B
0
OUT
0 1 1
OR Truth Table
B 0 1 0 1
OUT 0 1 1 1
A + B = OUT A B
0
OUT
0 1 1
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B 0 1 0 1
OUT 1 1 1 0
A * B = OUT A B
0
OUT
0 1 1
For the NOR function, if any of the inputs is 1, then the output is 0.
G
B 0 1 0 1
OUT 1 0 0 0
A + B = OUT A B
0
OUT
0 1 1
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Instructions for Practice 3-2.d 1. Complete the following truth table for a room light that is controlled by two switches, one at each door. If either of the switches is on, then the light is on.
1 0
A 0
Switch A
Switch B
Light
a.
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Instructions for Practice 3-2.d 2. Complete the following steps to create a truth table for a 3-input AND logic function. a. Draw the logic symbol.
b. c. d. e.
Write the Boolean algebra equation for the logic function. Determine the number of input columns. Determine the maximum number of rows. Draw the truth table. Fill in all input combinations and the output values.
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Instructions for Practice 3-2.d 3. Complete the following steps to create a truth table for a 3-input OR logic function. a. Draw the logic symbol.
b. c. d. e.
Write the Boolean algebra equation for the logic function. Determine the number of input columns. Determine the maximum number of rows. Draw the truth table. Fill in all input combinations and the output values.
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Instructions for Practice 3-2.d 4. Complete the following steps to create a truth table for a 4-input AND logic function. a. Draw the logic symbol.
b. c. d. e.
Write the Boolean algebra equation for the logic function. Determine the number of input columns. Determine the maximum number of rows. Draw the truth table. Fill in all input combinations and the output values.
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Instructions for Practice 3-2.d 5. Complete the following steps to create a truth table for a 4-input NAND logic function. a. Draw the logic symbol.
b. c. d. e.
Write the Boolean algebra equation for the logic function. Determine the number of input columns. Determine the maximum number of rows. Draw the truth table. Fill in all input combinations and the output values.
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Instructions for Practice 3-2.d 6. Create a truth table for a 4-input NOR logic function.
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Instructions for Practice 3-2.d 7. Complete all missing input and output values in the following table.
A 0
B 0
C 0
INV A
NOR A, B
NOR A, B, C
NAND A, B
NAND A, B, C
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Chapter Summary
Introduction In this chapter, you learned how to identify the parts of logic-level schematics and to describe the functions of the logic symbols with Boolean algebra and truth tables. This is the rst task of basic layout design. In this chapter, you learned to,
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Summary
identify the parts of the logic-level schematic. Logic symbol: short-hand representation for basic or complex logic functions. Node: electrical path between logic symbols or the inputs and output of the logic symbols. Nodes are drawn as lines.
describe the function of the logic symbols with Boolean algebra. Inverter: A = OUT AND: A * B = OUT OR: A + B = OUT NAND: A * B = OUT NOR: A + B = OUT create truth tables that chart the output values of a logic function when all possible combinations of 1s and 0s are applied as inputs. A summary of the logic functions is as follows:
B 0 0 1 1 A 0 1 0 1 A 1 0 1 0 A*B 0 0 0 1 A*B 1 1 1 0 A+B 0 1 1 1 A+B 1 0 0 0
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Chapter Overview
Introduction The layout designer needs more detail than the logic-level schematic provides, so the logic-level schematic must be converted into a transistor-level schematic. In this chapter, you will learn to convert a logic-level schematic to transistor-level schematic. The following topics are covered in this chapter: Lesson Page
Objective
Topics
Lesson 4-1: How to Identify the Parts of a Transistor-level Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3 Lesson 4-2: How to Verify the Transistor-level Function of a Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-16 Lesson 4-3: How to Convert a Logic-level Schematic to a Transistor-level Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . 4-27 Chapter Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-45
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Objective
Topics
What Is a Transistor-level Schematic? . . . . . . . . . . . . . . . . . 4-5 What Is a Transistor? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-6 Nodes of a Transistor-level Schematic . . . . . . . . . . . . . . . . . 4-9 Transistor Representations of the Logic-level Schematics . 4-10 Lab 4-1: Identify the Parts of Transistor-level Schematics . 4-12
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Denition
Transistors: representation of the actual layout transistors. Node: an electrical path between transistors or the inputs and output of the transistors. Nodes are drawn as lines.
Example
The following gure is a transistor-level schematic of an inverter with the nodes labeled, and just the power supplies and transistors pulled apart.
Vcc Nodes
Transistors
Vss
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What Is a Transistor?
Introduction There are different types of technologies used to create transistors; Intel uses the Complementary Metal Oxide Semiconductor (CMOS) technology. The transistor is the basic building block of all functions on any IC. CMOS technology uses two types of Metal Oxide Semiconductor Field Effect Transistors (MOSFET)
G G
Denition
gate: input terminal source: terminal closest to Vcc or Vss drain: output terminal bulk: material that the transistor sits in
The complementary part of CMOS means that pairs of p-type and ntype transistors are used to create the functions of the logic symbols. Analogy The source, gate, and drain of a transistor are similar to the circuits in your home.
Transistor Source Gate Drain Your Home Power Company Light switch Lamp
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Orientation
The orientation of the transistor does not affect the performance or function of the transistor. All of the following n-type transistors are equivalent.
The source and drain regions are interchangeable and from this point on are referred to as source/drain (S/D). continued...
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Hole
Electron
Current
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Internal Nodes
There will be times when a node is not an input, output, Vcc, or Vss node as follows.
Internal Node
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Inverter Representations
Truth Table
NAND Representations
The NAND logic, transistor-level representation, and truth table are as follows:
A B Logic-level A 0 0 1 1 B 0 1 0 1 OUT 1 1 1 0 A
C B OUT
Truth Table
Transistor-level
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C A
A 0 0 1 1
B 0 1 0 1 Truth Table
A dot drawn on the logic symbol indicates how the series transistors are drawn. For this class, the convention is that the dot indicates which series transistor is drawn closest to the output node. The dot affects only the drawing of the series transistors. The placement of the dot is determined by the design engineer to address any timing issues. Logic symbols with dots drawn are as follows:
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Instructions for Lab 4-1 1. Given the following logic and transistor-level schematic, complete the exercises.
OUT
OUT
a. b. c. d. e.
How many nodes does the logic-level schematic have? Color each node of the transistor-level schematic with a different color. How many nodes does the transistor-level schematic have? How many p-type transistors does the transistor-level schematic have? How many n-type transistors does the transistor-level schematic have?
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Instructions for Lab 4-1 2. Given the following logic and transistor-level schematic, complete the exercises.
B A A B OUT OUT
a. b. c. d. e. f.
What type of logic symbol is this? How many nodes does the logic-level schematic have? Color each node of the transistor-level schematic with a different color. How many nodes does the transistor-level schematic have? How many p-type transistors does the transistor-level schematic have? How many n-type transistors does the transistor-level schematic have?
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Instructions for Lab 4-1 3. Given the following logic and transistor-level schematic, complete the exercises.
A B
OUT
OUT
a. b. c. d. e.
What type of logic symbol is this? Color each node of the transistor-level schematic with a different color. How many nodes does the transistor-level schematic have? How many p-type transistors does the transistor-level schematic have? How many n-type transistors does the transistor-level schematic have?
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Instructions for Lab 4-1 4. Given the following logic and transistor-level schematic, complete the exercises.
OUT A B C 30 OUT 15 B
a. b. c. d. e.
What type of logic symbol is this? Color each node of the transistor-level schematic with a different color. How many nodes does the transistor-level schematic have? How many p-type transistors does the transistor-level schematic have? How many n-type transistors does the transistor-level schematic have?
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Objective
Topics
Values that Turn a Transistor On or Off . . . . . . . . . . . . . . . . 4-18 How Are Truth Table Values Veried? . . . . . . . . . . . . . . . . 4-19 Practice 4-2: Verify the Transistor-level Function of the Logic Symbols . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-22
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Procedure
If a path is found from Vss, then the output value is 0. If a path is found from Vcc, then the output value is 1.
4. 5.
Note that the value at the output node matches the truth table. Repeat for each row of the truth table.
Reminders
Remember the values that turn the p-type and n-type transistors on and off.
P-Type Logical value to turn transistor on Logical value to turn transistor off Memory aid 0 1 Bubble N-Type 1 0 No Bubble
Remember that Vcc and Vss have the following logical values:
G G
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A A B 0 1
OUT 1 0
Use the procedure for the rst line of the truth table, as follows:
Step 1. 2. Action Apply the rst row of the truth table to the input nodes. Determine which transistor gates are on and off. Write on or off for each transistor. a. the p-type transistor is on b. the n-type transistor is off
3.
Trace a path through the transistors from Vss to the output node and from Vcc to the output node. Determine which path is complete.
G G
If a path is found from Vss, then the output value is 0. If a path is found from Vcc, then the output value is 1. A path is found from Vcc to the output node, so a logical 1 is at the output.
4.
Note that the value at the output node matches the truth table. The input of a logical 0 is inverted to a logical 1.
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A A B 0 1
OUT 1 0
Repeat the procedure for the next line of the truth table, as follows:
Step 1. 2. Action Repeat for the next row of the truth table. Determine which transistor gates are on and off. Write on or off for each transistor. a. the p-type transistor is off b. the n-type transistor is on
3.
Trace a path through the transistors from Vss to the output node and from Vcc to the output node. Determine which path is complete.
G G
If a path is found from Vss, then the output value is 0. if a path is found from Vcc, then the output value is 1. A path is found from Vss to the output node, so a logical 0 is at the output.
4.
Note that the value at the output node matches the truth table. The input of a logical 1 is inverted to a logical 0.
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Instructions for Practice 4-2 1. Given the following 2-input NAND transistor-level schematic and truth table, use the outlined procedure to verify the truth table values, as directed.
B B A OUT 0 0 1 1 A 0 1 0 1 OUT 1 1 1 0
Step 1. 2. 3.
Action Apply the rst row of the truth table to the input nodes. Determine which transistor gates are on and off. Write ON or OFF for each transistor. Trace a path through the transistors from Vss to the output node and from Vcc to the output node. Determine which path is complete.
G G
If a path is found from Vss, then the output value is 0 if a path is found from Vcc, then the output value is 1
4. 5.
Note that the value at the output node matches the truth table. Repeat for each row of the truth table.
4-22
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Instructions for Practice 4-2 2. a. Apply the rst row of the truth table to the following transistor-level schematic.
B A OUT
b.
Apply the second row of the truth table to the following transistor-level schematic.
B A OUT
c.
Apply the third row of the truth table to the following transistor-level schematic.
B A OUT
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Instructions for Practice 4-2 3. d. Apply the fourth row of the truth table to the following transistor-level schematic.
B A OUT
4.
Given the following 2-input NOR transistor-level schematic and truth table, use the outlined procedure to verify the truth table values.
B A 0 0 B OUT 1 1 0 1 0 1 1 0 0 0 A OUT
Step 1. 2. 3.
Action Apply the rst row of the truth table to the input nodes. Determine which transistor gates are on and off. Write ON or OFF for each transistor. Trace a path through the transistors from Vss to the output node and from Vcc to the output node. Determine which path is complete.
G G
If a path is found from Vss, then the output value is 0 if a path is found from Vcc, then the output value is 1
4. 5.
Note that the value at the output node matches the truth table. Repeat for each row of the truth table.
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Instructions for Practice 4-2 5. a. Apply the rst row of the truth table to the following transistor-level schematic.
OUT
b.
Apply the second row of the truth table to the following transistor-level schematic.
OUT
c.
Apply the third row of the truth table to the following transistor-level schematic.
OUT
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CMOS 1
Instructions for Practice 4-2 6. d. Apply the fourth row of the truth table to the following transistor-level schematic.
OUT
7.
For the 3-input NAND logic symbol, complete the following. a. b. c. Draw the transistor-level schematic. Draw and ll in the truth table. Using the same procedure as in the previous exercises, verify the truth table values.
8.
For the 3-input NOR logic symbol, complete the following. a. b. c. Draw the transistor-level schematic. Draw and ll in the truth table. Using the same procedure as in the previous exercises, verify the truth table values.
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Objective
Topics
Logic Functions Dened with Transistors . . . . . . . . . . . . . . 4-29 How Is a Logic-level Schematic Converted to a Transistorlevel Schematic? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-30 Practice 4-3: Convert a Logic-level Schematic to a Transistorlevel Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-32 What is Complex Logic? . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-33 Order of the Series Transistors . . . . . . . . . . . . . . . . . . . . . . . 4-34 How Is a Complex Logic-level Schematic Converted to NType Transistors? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-35 Lab 4-3.a: Convert Complex Logic-level Schematics to NType Transistors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-38 How Is a Complex Logic-level Schematic Converted to PType Transistors? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-40 Lab 4-3.b: Convert Complex Logic-level Schematics to PType Transistors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-43 Lab 4-3.c: Convert Complex Logic-level Schematics to Transistor-level Schematics . . . . . . . . . . . . . . . . . . . . . . . . . 4-44
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Logic Functions
NAND function based on the AND function n-type transistors are in series p-type transistors are parallel
parallel transistors A A B OUT series transistors
B OUT
NOR function based on the OR function n-type transistors are parallel p-type transistors are in series
OUT
parallel transistors
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Procedure
5.
6.
continued...
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NAND; the n-type transistors are in series. 2. Draw the output node as a horizontal line. OUT 3. Create the n-type transistors according to the logic function of the logic symbol and label all transistor nodes according to the logic-level schematic. OUT A B
4.
Add the p-type transistors as the complement to the n-type transistors and label all nodes according to the logic-level schematic. OUT A B
5.
B OUT
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Instructions for Practice 4-3 1. Using the described procedure, convert the following logic-level schematics to a transistor-level schematic. a.
A B OUT
b.
A B Out
c.
A B N1 OUT
d.
A N1 B OUT
e.
A B C D E F
N1 OUT N2
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Denition
Non-Inverted Functions
Internal Nodes
There are internal nodes in complex logic where the logic symbols touch, as follows:
A B C D Internal Node OUT Internal Node
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A dot on the parent indicated the box closest to the output node. A dot on the logic symbol in a box indicates the transistor of the logic symbol that must be closest to the output node.
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Procedure
4. 5.
continued...
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CMOS 1
OUT
continued...
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Box 1
Box 2
7.
Draw the n-type transistors into the corresponding boxes for each logic symbol and label all the input nodes. Box 1: OR function. The transistors are parallel. Box 2: AND function. The transistors are in series. OUT
Box 1
C D Box 2
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Instructions for Lab 4-3.a Use a full page of paper for each drawing. Put the n-type transistors at the bottom of the page and leave room at the top to later add the p-type transistors. 1. Given the following logic-level schematic, complete the following.
A B OUT C D
a. b.
How many n-type transistors are needed? Draw the n-type transistors for the logic-level schematic; pay attention to the dot notation.
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Instructions for Lab 4-3.a 2. Given the following logic-level schematic, complete the following.
A B C D E F OUT
a. b. 3.
How many n-type transistors are needed? Draw the n-type transistors for the logic-level schematic; pay attention to the dot notation.
a. b.
How many n-type transistors are needed? Draw the n-type transistors for the logic-level schematic; pay attention to the dot notation.
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Procedure
3.
continued...
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CMOS 1
OUT
B Box 1
C D Box 2
continued...
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4-41
CMOS 1
Box 2
Box 1 B A
Box 2 C
Box 1 B A
OUT A
Box 1
D Box 2
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Instructions for Lab 4-3.b Use the drawings you made in the previous lab and add the p-type transistors for the following exercises. 1. For the following logic-level schematic, add the p-type transistors to the transistor-level schematics you drew in the last practice.
A B OUT C D
2.
For the following logic-level schematic, add the p-type transistors to the transistor-level schematics you drew in the last practice.
A B C D E F OUT
3.
For the following logic-level schematic, add the p-type transistors to the transistor-level schematics you drew in the last practice.
A B C OUT
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Instructions for Lab 4-3.c 1. For the following logic-level schematic, draw the transistor-level schematic.
A B C D OUT
2.
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Chapter Summary
Introduction In this chapter, you learned how to identify the parts of a transistorlevel schematic, how to verify the transistor-level function of the logic symbols, and how to convert logic-level schematics to transistor-level schematics. In this chapter, you learned to
G
Summary
identify the parts of the transistor-level schematic. Transistors: transistor-level schematic transistors represent the actual layout transistors. pFET (p-type) nFET (n-type) The p-type and n-type transistors differ as follows:
P-type Majority Current Carrier Gate Bubble Logical On Bulk hole yes 0 n-well N-type electron no 1 epitaxial
Node: an electrical path between transistors or the inputs and output of the transistors. Nodes are drawn as lines. The input and output nodes, the connections between two transistors, Vcc and Vss, are all nodes on a transistor-level schematic.
G
verify the transistor-level function of the logic symbols How to turn a transistor on:
P-Type Logical value to turn transistor on Logical value to turn transistor off Memory aid 0 1 Bubble N-Type 1 0 No Bubble
continued...
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CMOS 1
convert logic-level schematics to transistor-level schematics The logical function of a logic symbol is always dened by the n-type transistors. NAND symbols based on the AND function n-type transistors are in series p-type transistors are parallel
A B OUT A
B OUT
NOR symbol based on the OR function n-type transistors are parallel p-type transistors are in series
A B OUT A OUT
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Chapter Overview
Introduction To create the masks for IC fabrication, the actual geometry size and spacing is needed. The transistor-level schematic must therefore be converted into a layout drawing. To convert a transistor-level schematic to a layout drawing. The following topics are covered in this chapter: Lesson Page
Objective Topics
Lesson 5-1: How to Identify a Transistor on the IC Cross Section. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3 Lesson 5-2: How to Identify Process Design Rules on the Transistor Cross Section . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-13 Lesson 5-3: How to Convert a Transistor-level Schematic to a Stick Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-19 Lesson 5-4: How to Get Better Layout Density with Node Sharing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-33 Lesson 5-5: How to Estimate Area . . . . . . . . . . . . . . . . . . . . 5-39 Lesson 5-6: How to Calculate Resistance. . . . . . . . . . . . . . . 5-49 Lesson 5-7: How to Convert a Stick Diagram to a Layout Drawing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-59 Lesson 5-8: How to Draw Layout with a Standard Cell Template . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-67 Lesson 5-9: How to Draw Layout to Meet Layout Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-73 Chapter Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-80
5-2
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Objective
Topics
What Is a Cross Section? . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-5 Layers of the Transistor Cross Section . . . . . . . . . . . . . . . . 5-6 Layers of the Die Cross Section . . . . . . . . . . . . . . . . . . . . . . 5-7 What Is a Diode? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-8 How Is a Transistor Turned On or Off? . . . . . . . . . . . . . . . . 5-10
5-4
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Denition
Analogy
The die is made up of many layers of different materials that are used to achieve the various functions an IC is capable of. The following is the cross section of an n-type and a p-type transistor.
n-type transistor p-type transistor
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P-Type Transistor
N-Type Transistor
Epitaxial Wafer
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Fabrication Process
Layers
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What Is a Diode?
Introduction Inherent in the fabrication of the CMOS transistor is the creation of a parasitic diode. A diode is a semiconductor device that allows current to ow in one direction only. A diode is created when the p-type and n-type diffusions physically touch. Diodes can be
G
Denition
intentional: purposely added to the circuit to function as an Electro-static Discharge (ESD) device parasitic: occurring naturally when p-type and n-type materials touch
The normal operating condition of a diode in CMOS is reverse biased, which prevents electrical current from owing between opposite polarity diffusions when they are abutting. Parts of a Diode The terminals of a diode are the anode and the cathode.
G G
The anode is the p-type diffusion. The cathode is the n-type diffusion. ++ ++ ++
Anode
------Cathode
continued...
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Nwell
Epitaxial
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Process
Nwell Epitaxial
continued...
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Nwell
Epitaxial
Memory Aid
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5-12
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Lesson 5-2: How to Identify Process Design Rules on the Transistor Cross Section
Lesson 5-2: How to Identify Process Design Rules on the Transistor Cross Section
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Lesson 5-2: How to Identify Process Design Rules on the Transistor Cross Section
CMOS 1
Objective
Topics
What Is a Design Rule? . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-15 Basic Process Design Rules . . . . . . . . . . . . . . . . . . . . . . . . . 5-16 How Are Process Design Rules Identied on the Transistor Cross Section? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-17
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Lesson 5-2: How to Identify Process Design Rules on the Transistor Cross Section
Denition
the smallest geometry and spacing that can accurately be fabricated the smallest geometry and spacing that maintains electrical isolation and/or functionality the minimum overlap of two materials
To avoid these process design violations, rules must be followed when drawing the layout. What you draw directly affects what is created on silicon.
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Lesson 5-2: How to Identify Process Design Rules on the Transistor Cross Section
CMOS 1
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Lesson 5-2: How to Identify Process Design Rules on the Transistor Cross Section
How Are Process Design Rules Identied on the Transistor Cross Section?
Introduction Some of the basic process design rules can be identied in a cross section of the layout. In the following example, the following rules can be identied: 1. minimum metal overlap of contact 2. minimum polysilicon width 3. contact width 4. minimum S/D width 5. minimum diffusion spacing 6. minimum Nwell width
1. metal overlap of contact 2. min polysilicon width 4. min S/D width 5. min diffusion spacing
Example
3. contact width
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CMOS 1
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Objective
Topics
What Is a Stick Diagram? . . . . . . . . . . . . . . . . . . . . . . . . . . 5-21 Legend for a Stick Diagram . . . . . . . . . . . . . . . . . . . . . . . . . 5-22 Series and Parallel Transistors in a Stick Diagram . . . . . . . 5-23 How Is a Stick Diagram Created? . . . . . . . . . . . . . . . . . . . . 5-24 Lab 5-3.a: Create a Stick Diagram . . . . . . . . . . . . . . . . . . . . 5-26 How Is the Width of a Layout Drawing Estimated from a Stick Diagram? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-29 Lab 5-3.b: Estimate the Width of a Layout Drawing from a Stick Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-31
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Denition
S/D (p-type)
Gate (polysilicon)
S/D (n-type)
Gate (polysilicon)
Practice
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5-21
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Legend
Example
OUT
Vcc A OUT
Vss
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Series Transistors
OUT
Parallel Transistors
Parallel transistors are drawn with multiple paths from Vcc/Vss to the output node, as follows:
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CMOS 1
Procedure
Guidelines
When creating parallel transistors in the stick diagram, minimize the number of connections to the output node. Both S/D of a transistor cannot be connected to the same node. All common nodes must be connected. When polysilicon crosses diffusion a transistor is always created. Do not connect to S/D regions with polysilicon. All metal connections to polysilicon and diffusions must have at least one contact.
G G G G G
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OUT
3.
Convert the transistor-level schematic. a. Draw horizontal lines for the p-type and n-type diffusion. For this class, plan to have the p-type devices above the n-type devices.
b.
Draw vertical polysilicon lines to create the correct number of gates. Label the gates. A OUT
c.
Trace the transistor-level schematic and label the stick diagram to match. A Vcc OUT
Vss
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CMOS 1
Instructions for Lab 5-3.a 1. Using the procedure described, create a stick diagram for a 2-input NOR function.
Step 1. Action Determine how many transistors are needed, from the logic-level schematic. # of transistors = 2 (# of inputs) 2. 3. Draw the transistor-level schematic of the logic-level schematic. Convert the transistor-level schematic. a. Draw horizontal lines for the the p-type and n-type diffusion. For this class, plan to have the p-type devices above the n-type devices. b. c. d. Draw vertical polysilicon lines to create the correct number of gates. Label the gates. Trace the transistor-level schematic and label the stick diagram to match. Make sure that all S/D nodes of each transistor match between the transistor-level schematic and the stick diagram.
2. 3. 4.
Using the procedure described, create a stick diagram for a 2-input NAND function. Using the procedure described, create a stick diagram for a 3-input NOR function. Using the procedure described, create a stick diagram for a 3-input NAND function.
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Instructions for Lab 5-3.a 5. Using the procedure described and the following logic-level schematic, draw the stick diagram.
A B C OUT
6.
Using the procedure described and the following logic-level schematic, draw the stick diagram.
A B OUT C D
7.
Using the procedure described and the following logic-level schematic, draw the stick diagram.
IN OUT
8.
Using the procedure described and the following logic-level schematic, draw the stick diagram.
A B OUT
9.
Using the procedure described and the following logic-level schematic, draw the stick diagram.
OUTB OUTA A B C
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CMOS 1
Instructions for Lab 5-3.a 10. Using the procedure described and the following logic-level schematic, draw the stick diagram.
A B OUTA
OUTB
11.
Using the procedure described and the following logic-level schematic, draw the stick diagram.
A B C
OUT
12.
Using the procedure described and the following logic-level schematic, draw the stick diagram.
A B C OUT
13.
Using the procedure described and the following logic-level schematic, draw the stick diagram.
A OUT B C
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Procedure
2. 3.
continued...
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How Is the Width of a Layout Drawing Estimated from a Stick Diagram? (continued)
Example Use the procedure to estimate the width of the Inverter layout drawing.
Step 1. Action Starting at one end of the stick diagram, add up the minimum width and spacing requirements for all objects for the p-type transistors in the diagram. This gives you the width for the p-type transistors. 2 2 2 2 2 2 2 2 Vcc A OUT 2
Vss 2 + 2 + 2 + 2 + 2 + 2 + 2 + 2 + 2 = 18 2. Repeat the above step for all objects for the n-type transistors. This gives you the width of the n-type transistors.
Vcc A OUT
Vss 2 2 2 2 2 2 2
2 + 2 + 2 + 2 + 2 + 2 + 2 = 14 3. Compare the width of the p-type and n-type transistors. The larger value is the estimated width for the layout drawing. Since 18 is larger than 14, this cell is 18 wide.
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Lab 5-3.b: Estimate the Width of a Layout Drawing from a Stick Diagram
Introduction Now that you know how to estimate the width of a layout drawing from a stick diagram, you will use your previous stick diagrams to estimate the layout drawing width and compare this value to the actual layout drawing width.
Instructions for Lab 5-3.b 1. Use the stick drawing and layout drawing you drew for the 2-input NOR and 3-input NAND. Complete the following exercises for both logic functions. a. Use your stick drawing and estimate the width of the layout drawing.
Step 1. Action Starting at one end of your stick diagram, add up the minimum width and spacing requirements for all of the objects for the p-type transistors in the diagram. This gives you the width for the p-type transistors. Repeat the above step for all of the objects for the n-type transistors. This gives you the width of the n-type transistors. Compare the width of the p-type and n-type transistors. The larger value is the width of your cell.
2. 3.
b.
Measure the actual width of the layout drawing. Compare the estimated value to actual value. Are the values close?
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Lesson 5-4: How to Get Better Layout Density with Node Sharing
Lesson 5-4: How to Get Better Layout Density with Node Sharing
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Lesson 5-4: How to Get Better Layout Density with Node Sharing
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Objective
Topics
What Is Node Sharing? . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-35 How Is Node Sharing Achieved? . . . . . . . . . . . . . . . . . . . . . 5-36 Lab 5-4: Use Node Sharing to Increase Density . . . . . . . . . 5-38
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Lesson 5-4: How to Get Better Layout Density with Node Sharing
Denition
Example
ZANG
ZING
ZANG
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Lesson 5-4: How to Get Better Layout Density with Node Sharing
CMOS 1
Procedure
3.
4.
reduces the breaks in diffusion better density shorter wire lengths fewer routing lines minimizes routing
continued...
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Lesson 5-4: How to Get Better Layout Density with Node Sharing
Action Identify the internal nodes on the transistor-level schematic and label them with unique names.
B A OUT ZING N1
2.
Identify the internal nodes on the stick diagram and able each internal node with the same name you gave it on the transistor-level schematic.
OUT B N1 A ZING
3.
Look at the n-type and the p-type transistors on the stick diagram and identify any common nodes that are not drawn next to each other. Try to rearrange the common nodes so that they are next to each other.
4.
OUT
N1
ZING
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Lesson 5-4: How to Get Better Layout Density with Node Sharing
CMOS 1
Instructions for Lab 5-4 Use the node-sharing procedure to create a layout drawing for each of the following logic-level schematics. 1. a. A B Out
b.
N17 Do It PHZ
c.
C
Out
D E d.
BING BANG BOOM ZAP
e.
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Objective Topics
Area Calculation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-41 Lab 5-5.a: Calculate Area . . . . . . . . . . . . . . . . . . . . . . . . . . 5-42 Units of Measure Conversion . . . . . . . . . . . . . . . . . . . . . . . 5-43 Lab 5-5.b: Convert Units of Measure . . . . . . . . . . . . . . . . . 5-44 Average Area per Transistor Calculation . . . . . . . . . . . . . . . 5-46 Lab 5-5.c: Calculate the Average Area per Transistor . . . . . 5-47
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Area Calculation
Introduction Area estimation is used to forecast the space needed for your circuit which is an important part of planning. Area is the actual space that the layout will occupy. There is a simple formula to determine area. The formula to calculate area is: area = width x length area = X * Y If X = 4 inches and Y = 2 inches, then the area is calculated as follows: Area = 4 in * 2 in = 8 in2
Calculation
X Area Units The units for area are square units. If the length and width are measured in microns (), then the area units are square microns (2).
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Calculate the area, given the following width and length values. a. b. c. d. 20 x 100 = 85 x 34 = 56 x 135 = 97 x 210 =
2.
Given the area and one of the sides, calculate what the other side must be. a. b. c. 58 x ____ = 5626 2 13 x ____ = 312 2 56 x ____ = 1900 2
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Units of Measure
To convert mils to microns, multiply by 25.4 /mil mil * (25.4 /mil) = Example: 2 mil * (25.4 /mil) = 50.8
To convert microns to mils, divide by 25.4 mil/ / (25.4 mil/) = mil Example: 28 / (25.4 mil/) = 1.1 mil
m2 * (645.16 2/m2) = 2 Example: 120 m2 * (645.16 2/m2) = 77419.22 Rounding All results must be rounded to two digits to the right of the decimal point.
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Instructions for Lab 5-5.b 1. Fill in the correct values for the micron column in the following table: mil
1 354 443 138
Conversion
* 25.4 * 25.4 * 25.4 * 25.4 = = = =
micron
2.
Fill in the correct values for the mil column in the following table: micron
25.4 5435 8943 138
Conversion
/ 25.4 / 25.4 / 25.4 / 25.4 = = = =
mil
3.
Fill in the correct values for the mil2 column in the following table: mil2
1 123 321 645
Conversion
* 645.16 * 645.16 * 645.16 * 645.16 = = = =
micron2
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Instructions for Lab 5-5.b 4. Fill in the correct values in the mil2 column in the following table: Device Area (mil2)
12 10.4 18.3 14.7 33
# of Devices
8 7 11 15 23 = = = = =
Area/Transistor
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Calculation
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Instructions for Lab 5-5.c 1. Given the following information, complete the calculation. a. If the layout of a circuit contains 20 transistors and is 100 by 90, then what are the total area and density values?
b.
If the layout of a circuit contains 75 transistors and is 100 by 90, then what are the total area and density values?
c.
If the total area of the layout of a circuit is 3502 and the average area per transistor is 502, then how many transistors are in the layout?
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Objective Topics
What Is Resistance? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-51 Lab 5-6.a: Calculate Resistance Values . . . . . . . . . . . . . . . . 5-53 How Is Sheet Resistance Calculated? . . . . . . . . . . . . . . . . . 5-56 Lab 5-6.b: Calculate Sheet Resistance . . . . . . . . . . . . . . . . . 5-58
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What Is Resistance?
Introduction Resistance has a direct and measurable effect on the performance of a circuit. It can be either intentional or parasitic. You must be able to increase and decrease the resistance in a circuit to obtain the correct circuit functionality. Resistance is the opposition of current ow. Each material has a different resistive value that represents how much that material opposes current ow. The unit of measure for resistance is the ohm (). Resistors are drawn to show resistance. The orientation of the resistor does not affect the resistor.
Denition
The effects of resistance in series or parallel interconnect are described below. Series Resistance Calculation The current has only one path to follow, so the total current ows through all of the resistors (R1 and R2 ... and Rn). The total resistance is equal to the sum of the individual resistances. R Total = R 1 + R 2 + + R n
For the above resistors the total resistance is as follows: R Total = 20 + 40 = 60 continued...
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R2=40
For the above resistors the total resistance is as follows: 1 R total = ---------------------------------- = 13.33 1 1 ---------- + ---------- 20 40
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Instructions for Lab 5-6.a 1. Given the following resistors, complete the exercises.
R1 = 30 R1 = 40 R1 = 50
a. b.
2.
R2 = 65
R3 = 105
a. b.
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Instructions for Lab 5-6.a 3. Given the following resistors, complete the exercises.
R1 = 85 R5 = 1000
R2 = 620
R3 = 330
R4 = 100
a. b.
4.
R2 = 20
R3 = 30
a. b.
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Instructions for Lab 5-6.a 5. Given the following resistors, complete the exercises.
R1 = 100
R2 = 100
a. b.
6.
R1 = 1000 R2 = 880
R3 = 316
a. b.
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Denition
The dimensions of a square can be 3 x 3 or 20 x 20, but each square of the same material will have the same amount of resistance. Each of the following shapes represent one square of diffusion, so both are 30 ohms.
3 x 3 30
20 x 20 30
Practice
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Example
A piece of polysilicon is 2 wide and 30 long. If polysilicon has a sheet resistance of 25/square, then how much resistance does this piece of polysilicon have?
2 30 Step 1. Action Calculate the number of squares. Number of squares = ST = 30 / 2 = 15 squares 2. Calculate the total resistance; multiply the number of squares by the sheet resistance. Total Resistance = RT = ST * Sheet Resistance 15 squares * 25/square = 375
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Instructions for Lab 5-6.b 1. An engineer wants a 5000 diffusion resistor that is 10 wide. If diffusion has a sheet resistivity of 30/square, how long must the resistor be?
2.
If polysilicon has a sheet resistivity of 22.3/square, what is the total resistance of a polysilicon line that is 300 long and 2.5 wide?
3.
An inverter needs to have some delay added to its output. If polysilicon has a sheet resistivity of 30/square, how much polysilicon should be added if the polysilicon width is 20 and you need 30 of resistance?
4.
A Metal1 line is 2.4 wide and runs 44000 across the chip. If Metal1 has a sheet resistivity of 0.084/square, what is the total resistance of the node?
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Objective
Topics
What Is a Layout Drawing? . . . . . . . . . . . . . . . . . . . . . . . . . 5-61 What Is Transistor Size? . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-62 How Is a Stick Diagram Converted to a Layout Drawing? . 5-63 Lab 5-7.a: Convert a Stick Diagram to a Layout . . . . . . . . . 5-64 Visually Verifying a Layout Drawing . . . . . . . . . . . . . . . . . 5-65 Lab 5-7.b: Visually Verify a Layout Drawing . . . . . . . . . . . 5-66
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Denition
Transistors are created with diffusion for the source and drain regions and with polysilicon for the gate region. Routing is created with metal, polysilicon, and contacts.
Example
The following graphics illustrate the logic-level schematic, transistor-level schematic, stick diagram, and layout drawing of an Inverter.
Logic-level Schematic Transistor-level Schematic A
OUT
OUT
Vss
Vcc
Layout Drawing
OUT
Vss
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Denition
the more energy the gate uses the more devices it can drive
The z/l values are drawn on the logic-level schematic as follows. When there is only one number, the l value is assumed to be the default for the design process. 16 8 Example 10/3
5/3
z= width
diffusion l = length
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Procedure
2.
Example
Use the procedure to convert the Inverter stick diagram to a layout drawing.
Step 1. Action Get an idea of what the layout will look like by fattening the lines on your stick diagram. Do this by creating rectangles of the correct minimum width for each material.
2.
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Instructions for Lab 5-7.a 1. Use a stick diagram and the following procedure to create the layout drawing that reects the following logic functions. Draw all materials to the correct minimum width process design rules, however do not be concerned about the spacing design rules at this time.
Step 1. Action Get an idea of what the layout will look like by fattening the lines on your stick diagram. Do this by creating rectangles of the correct minimum width for each material. Redraw the stick diagram as a layout drawing, labeling all nodes. At this time, do not be concerned about the spacing process design rules.
2.
a. b. c. d. 2.
Use the design rules provided by your instructor and draw the layout drawings for the following logic functions with the correct width and spacing design rules. a. b. c. d. 2-input NOR 2-input NAND 3-input NOR 3-input NAND
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Checklist
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Instructions for Lab 5-7.b 1. 2. Use the simplied process design rule checklist to verify the layout drawings your instructor provides. Use the simplied process design rule checklist to verify the layout drawings you drew in prior labs.
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Objective
Topics
What Is a Standard Cell Template? ....................................... 5-69 How Is a Layout Drawing Drawn with a Standard Cell Template? .............................................................................. 5-70 Lab 5-8: Draw a Layout Drawing with a Standard Cell Template ................................................................................ 5-71
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Denition
Vcc
10 m
NWELL
3 m 2 m
Vss
10 m
NAC Region
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Procedure
Example
With your instructor, use the above procedure and the template provided to create a layout drawing for an Inverter.
10/2 IN 8/2 OUT
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Instructions for Lab 5-8 1. 2. Given the following logic-level schematics, calculate how many transistors are needed for each layout function. Use the template provided by your instructor to draw a standard cell layout drawing for the following logic functions. a. Inverter
10/2 IN 8/2 OUT
b.
2-input NOR
A B 12/1 OUT 6/1
c.
3-input NAND
C D E 12/1 OUT 6/1
d.
Complex logic
F G H J 12/1 OUT 8/1
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Objective
Topics
How Is a Transistor Drawn with Multiple Legs? . . . . . . . . . 5-75 How Is a Transistor Drawn with a Bent Gate? . . . . . . . . . . 5-77 Lab 5-9: Draw Layout to Meet Layout Restrictions . . . . . . 5-79
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Denition
continued...
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A OUT Vss
A Vss
A OUT
Example 1
Each leg is 30 / 3 = 10. Example 2 If z/l = 30/2 and the maximum z value is 8 then,
Number of legs = (total z) / (maximum z) = 30 / 8 = 3.75 Number of legs = round (3.75) = 4
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Procedure
Guidelines
When drawing bent gates in this class, determine the total z value of the gate as follows:
G G
Do not count corners when calculating the total z value. When both corners overlap, do not count the overlap.
continued...
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Metal 1
Diffusion Contact 6
14
6 6
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2.
2-input NOR
A B 12/2 OUT 10/2
3.
3-input NAND
C D E 20/2 OUT 12/2
4.
Complex logic
F G H J 12/2 OUT 8/2
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Chapter Summary
Introduction In this chapter, you learned how transistors are created in silicon, how to estimate area, how to calculate resistance, and how to create a layout drawing from a stick diagram. In this chapter, you learned to do the following:
G G G G G G G G G
Summary
identify a transistor and a diode on the IC cross section identify process design rules on the transistor cross section identify the parts of a stick diagram estimate area calculate resistance convert a stick diagram to a layout drawing get better layout density with node sharing draw layout with a standard cell template draw layout to meet layout restrictions
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Appendix A: Glossary
Appendix A: Glossary
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Terms
Alternating Current (AC) Aluminum An electrical current that continuously changes in magnitude and in direction of ow. The metal most often used in semiconductor processing to form the interconnects between the devices on an integrated circuit chip. The unit of measurement for electrical current in coulombs per second. One ampere ows in a circuit that has one ohm resistance when one volt is applied to the circuit. A signal that varies in amplitude continuously and without interruption. Also called linear. Contrast with digital. The unit used to depict the wavelength of light or other electromagnetic radiation. Two hundred fty-four million angstroms equals one inch. Ten angstroms equals one nanometer. The p-type diffusion of a semiconductor diode. The n-type dopant commonly used for the source and drain of nchannel MOS integrated circuits. In a bipolar transistor, the terminal that controls the current ow. A source of electromotive force (voltage and current) obtained from chemical reaction in an assembly called a cell. The voltage produced by a fresh cell depends on the materials used, but it is usually between one and two volts. Cells are connected in a series to obtain a higher voltage or in parallel to obtain greater current capacity. A numbering system with only two digits, 0 and 1. A type of transistor where a ow of both conduction electrons and holes determines the device characteristics.
Ampere
Analog
Angstrom
Anode Arsenic
Base Battery
Binary Bipolar
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Appendix A: Glossary
Bi-CMOS
A technology in which the advantages of bipolar transistors (speed) and of CMOS devices (low power consumption) are combined in the fabrication of a single IC. A square or rectangular area on the die that is used to attach the die to the package by wire bonding. A p-type dopant commonly used for the source and drain of pchannel MOS integrated circuits. A circuit element formed by placing an insulating layer between two conducting layers. This structure is often fabricated in the manufacturing of integrated circuits. The negative electrode of a semiconductor diode. 1. A complete path that allows electrical current from one terminal of a voltage source to the other terminal. 2. An interconnection of electrical or electronic components to accomplish a specic function.
Bonding Pads
Boron
Capacitor
Cathode Circuit
A semiconductor that has low power drain. It is produced by an integrated-circuit fabrication technique using both P-channel and N-channel MOS transistors. Each transistor is made of three elements: gate, drain, and source. A design technique (using a computer and special software) that can be used in the design of a product and in the verication of its performance by simulation. A measure of the ease of conducting current. The reciprocal of resistance in DC circuits or of the real part of impedance in AC circuits. Expressed in mho (ohm spelled backwards.) The inverse of resistivity. A substance through which electrons ow with relative ease.
Computer-AidedDesign (CAD)
Conductance
Conductivity Conductor
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Contact
A vertical hole cut into the eld oxide and allowing connection of two vertical materials of an IC. The movement of electrons through a circuit. Current is measured in amperes. A single piece of silicon cut from a wafer and containing the complete device. The insulating material between the plates of a capacitor. 1. Another name for the impurities implanted into silicon devices. 2. The movement of particles away from regions of high concentration (caused by the random thermal motion of atoms and molecules).
Current
Die
Dielectric Diffusion
Digital
Representing information in discrete or quantized form or in the form of pieces such as bits or digits. A semiconductor device made of n+ and p+ diffusions abutting. The diode is used to control current ow. Current that ows in only one direction, usually without change in magnitude. A process used to change the electrical characteristics of the wafer by ion implantation (diffusion). In a MOS transistor, the terminal to which the carriers ow. The basic atomic particle having a negative charge. The deposition of a single crystal layer on the silicon wafer. This is the rst layer added to the new wafer and usually has a higher resistance than the raw wafer.
Diode
Doping
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Appendix A: Glossary
Gate Hole
In a MOS transistor, the terminal that controls the current ow. A vacancy within the valence band of a semiconductor material caused by the deciency of an electron. It appears as if it were a moving positive charge. A cylindrical crystal grown from polysilicon material that is sliced into wafers. A tiny slice or chip of material on which a complex electrical circuit is etched or imprinted. ICs are made from semiconductor material and work according to semiconductor physics. A process in which engineering schematics are transposed into graphic symbols that will by used to make a mask. A unit of length equal to one millionth of a meter. The central processor of a computer fabricated as an integrated circuit. It performs semi-intelligent functions based on software instructions. Fundamentally, a microprocessor is a hardware device that can be electrically rewired by using software instructions. It is considered the brain of a circuit or a computet. The unit of electrical resistance. A circuit component has a resistance of one ohm when one volt applied to the component produces a current of one ampere. The process of growing a layer of silicon dioxide onto the wafer. A process in which a thin layer of nitride is deposited over the metal layer to protect it. Current path that divides from a single source into two or more separate paths that will later rejoin.
Ingot
Layout
Micron () Microprocessor
Ohm ()
Oxidation Passivation
Parallel Circuit
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Phosphorus
The n-type dopant commonly used for the emitter diffusion in standard bipolar integrated-circuit technology and for the n-channel source and drain of MOS integrated circuits. A light sensitive material used during the photolithography process. Silicon composed of many (poly) crystals. Raw silicon comes in ingots of poly prior to crystal growth. Polysilicon may be deposited accidentally during epitaxial deposition by depositing it too fast or at too low a temperature. Chemical vapor deposition (CVD) of polysilicon usually occurs on a layer of silicon dioxide. A type of electronically programmable semiconductor memory device which is programmed after manufacture, but whose contents are unalterable once programmed. In computer or digital systems, a memory system in which any memory location can be directly accessed as easily and as quickly as any other. The contents of random access memory can be readily changed. A semiconductor memory which is programmed during manufacture. The contents can be read but cannot be altered. The opposition to current ow. It results in loss of energy in a circuit and is dissipated as heat. A type of material, such as silicon, that exhibits characteristics between a good conductor and a poor conductor. Current that ows through one or more devices in a single path. A measurement (in ohms per square cm) that is frequently used to evaluate predispositions and drive-ins. It is related to the number of n-type donor, or p-type acceptor donor, or acceptor atoms in a semiconductor.
Semiconductor
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Appendix A: Glossary
Silicon Dioxide
The oxide of silicon that is used (either deposited or thermally grown) in chip fabrication as an insulating layer and as a barrier to unwanted impurities. In a MOS transistor, the terminal from which the carriers ow. A three-terminal circuit element manufactured using semiconductor material. The transistor provides signal amplication. The process of creating an integrated circuit (IC) that contains 1000 - 10,000 transistors. The substrate, made usually from semiconductor material such as silicon, that is used as the foundation on which integrated circuits are built. Unused area on the die.
Source Transistor
White Space
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