VE-ASP-DS-0002 (Thermal Analysis and Thermal Design - I3R1)

ASPERA-4
Venus Express
Reference Issue Date Volume
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VE-ASP-DS-0002 3 Rev. : 1 2004-04-22 Page: 1
Thermal Analysis and Thermal Design
Name and function Prepared by: Verified by: Issued by: Vitaly Lugenkov Stas Barabash, Co-PI Herman Andersson, EM
Date 2004-04-22 2004-04-27 2004-04-28
Signature
ASPERA-4
CHANGE RECORD Version Issue Rev 1 1 1 2 1 3 2 0 2 1 2 2 3 1 Date Changed Paragraphs All All All All Fig 2 and 3, Table 3 All
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Remarks New document New document New document
2003-04-14 2003-11-26 2004-04-08 2004-04-22
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TABLE OF CONTENT
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1
1.1
THERMAL MODEL DESCRIPTION .................................................................... 4

Technical Basis .........................................................................................................................4
2
2.1.1 2.1.2 2.1.3 2.1.4 2.1.5
IMA THERMAL ANALYSIS CASES ..................................................................... 8

IMA Cold case 1 .......................................................................................................................8 IMA Cold case 2 .......................................................................................................................8 IMA Cold case 2A, Sensitivity analysis ...................................................................................8 IMA Hot case..........................................................................................................................10 IMA Hot case, Sensitivity to radiator ageing..........................................................................10
3
3.1.1 3.1.2 3.1.3 3.1.4 3.1.5 3.1.6
MU THERMAL ANALYSIS CASES..................................................................... 12

MU Cold case 1 ......................................................................................................................12 MU Cold case 2 ......................................................................................................................12 MU Cold case 2A, Sensitivity analysis ..................................................................................12 MU Hot case ...........................................................................................................................14 MU Hot case, Sensitivity to radiator (SSM CC/UVS) and silver tape ageing........................14 MU Hot case A .......................................................................................................................14
4 5 6 7
7.1 7.1.1 7.1.2 7.1.3 7.1.4 7.2 7.2.1 7.2.2 7.2.3 7.2.4 7.2.5 7.2.6
THERMAL DESIGN REQUIREMENTS ............................................................. 16 IMA THERMAL DESIGN AND MATHEMATICAL MODEL......................... 18 MU THERMAL DESIGN AND MATHEMATICAL MODEL .......................... 25 THERMAL CALCULATIONS RESULTS........................................................... 34
Predicted temperatures for IMA nodes. ..................................................................................34 IMA Cold case 1 (2.1.1) .........................................................................................................34 IMA Cold case 2A, Sensitivity analysis (2.1.3)......................................................................36 IMA Hot case (2.1.4) ..............................................................................................................37 IMA Hot case, Sensitivity to radiator ageing (2.1.5) ..............................................................38 Predicted temperatures for MU nodes. ...................................................................................39 MU Non-operating cold case 1 (3.1.1) ...................................................................................39 MU Non-operating cold case 2 (3.1.2) ...................................................................................40 MU Non-operating cold case 2A (3.1.3) ................................................................................42 MU Operating hot case (3.1.4) ...............................................................................................44 MU Operating hot case, Sensitivity to radiator and silver tape ageing (3.1.5) .......................46 MU Operating hot case A (3.1.6) ...........................................................................................48
CONCLUSIONS....................................................................................................... 50
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1 1.1 THERMAL MODEL DESCRIPTION Technical Basis
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Analyzer of Space Plasmas and EneRgetic Atoms (ASPERA-4) experiment consists of two units: 1. Main Unit (MU), containing Scanner Box (motor, wheel, board, housing) and rotating Sensor Head (ELS, NPI, DPU, NPD) with its mounting structure. 2. Ion Mass Analyser (IMA), containing DPU Box (boards, housing) and Sensor Head (boards, housing). Figures (next two pages): drawings of MU (ME-ASP-MD-1000) and IMA (IMA-002) from different viewing geometrys. Radiators of IMA and MU are not shown on this drawings. The following calculations were executed with finite difference computer program. The MU and IMA units were approximated by the nodes systems (17 nodes for IMA and 32 nodes for MU). The results are presented as tables with MU and IMA nodes predicted temperatures for different cases. The mission data and calculation cases are based on the Reference No. VEX/IF/0016/T.ASTR, Issue 2 Venus Express/ASPERA Thermal Interface Requirements, dated 27.06.03. The body of spacecraft is a box with 17001650 mm sides and 1600 mm height with two solar array wings stretching out on both sides. High Gain Antenna (HGA) with diameter 1630 mm is mounted on the third side of spacecraft box. External S/C Z walls surfaces are covered with Kapton MLI with (BOL) = 0.39, (BOL) = 0.64 and (EOL) = 0.50, (EOL) = 0.64 thermo-optical coefficients. Venus-EXPRESS spacecraft co-ordinate system is defined as follows: The origin is located in the center of the s/c to launcher I/F adapter The Z axis is perpendicular to the launcher I/F plane, directed positively through the S/C body The X axis is perpendicular to the Z axis and the solar array drive axis, directed positively trough the of the S/C containing the HGA The Y axis completes the right hand system (directed along the solar arrays)
The ASPERA-4 MU unit is accomodated on the lower part of s/c wall (-Y axis side) of Venus Express spacecraft so that +Xu axis is co-aligned with -Zs/c axis. IMA unit is accommodated on -Z wall of s/c. Sun Aspect angle (the angle between the s/c longitudinal +Z axis and the Sun) can be from -100 deg. to +5 deg. at the Communication phase of flight. The main parameters of Venus Observation phase are: Inclination: 90 deg. (polar orbit) Argument of pericenter: 110 deg. Pericenter altitude: 400 km Apocenter altitude: 66408 km (period 24h) during nadir pointing phase around pericenter, the s/c is maintained with the +Z face pointed towards Venus center.
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Observation phase (s/c altitude is below 10000 km)
Stop 65 min eclipse
Start 45 min eclipse
Start 65 min eclipse
Stop 45 min eclipse Start 4h high altitude imaging
Communication phase
Stop 4h high altitude imaging
Figure 1 Operation orbit timeline
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Mass IMA w/o thermal h/w Thermal h/w IMA-MU interconnection cable CoM wrt URF Xu, Yu, Zu ToI wrt URF centered at CoM Ix, Iy, Iz Materials Enclosure Aperture grids Fasteners Thermal isolators Surface treatment Flight Cover FC02
2182 g 227 g 283 g 110.5, -84, 64.7 mm, 3 mm 0.0075, 0.0135, 0.0125 kgm AA6061 and AA7075 Stainless Steel 4 of M5x25 Ti Grade 5 4+4 of GE313 fibreglass MIL-C-5541 for J02 (green)
2,
15 %
Figure 2 Ion Mass Analyser, IMA
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Mass MU w/o thermal h/w Thermal h/w CoM wrt URF in Parking position Xu, Yu, Zu CoM wrt URF in CCW position Xu, Yu, Zu ToI wrt URF centered at CoM in Parking position Ix, Iy, Iz ToI wrt URF centered at CoM in CCW position Ix, Iy, Iz Materials Enclosure Aperture grids Fasteners Thermal isolators Surface treatment Flight Cover FC04
6819 g 441 g 135, -109, 101 mm, 3 mm 109, -86, 101 mm, 3 mm 0.0553, 0.0803, 0.0686 kgm 0.0706, 0.0606, 0.0645 kgm AA6061 and AA7075 Stainless Steel 6 of M4x25 Ti Grade 5 6+6 of GE313 fibreglass MIL-C-5541 for J04 (green)
2,
15 % 15 %
2,
Figure 3 Main Unit, MU
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2 IMA THERMAL ANALYSIS CASES
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The following IMA thermal analysis cases have been considered: 2.1.1 IMA Cold case 1
Steady thermal state: cruise phase IMA unit is turn in switch OFF solar constant is 1320 W/m2 spacecraft interface temperature is 223K solar aspect angle is 0 deg. coatings are corresponded to BOL.
2.1.2
IMA Cold case 2
Transient thermal state: orbit phase IMA unit is turn in switch OFF solar constant is 2570 W/m2 spacecraft interface temperature is 223K Earth pointing phase o 50m Observation phase, IMA on the Sun o 45m Venus eclipse o 4h Observation phase (Figure 4) coatings are corresponded to BOL.
2.1.3
IMA Cold case 2A, Sensitivity analysis
Transient thermal state: orbit phase IMA unit is turn in switch OFF solar constant is 2655 W/m2 spacecraft interface temperature is 243K Earth pointing phase o 50m Observation phase, IMA on the Sun o 45m Venus eclipse o 4h Observation phase (Figure 4) coatings are corresponded to BOL.
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Observation phase Start 45 min eclipse
Communication phase
Figure 4 IMA Cold case (Venus orbit)
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2.1.4 IMA Hot case
Transient thermal state: orbit phase IMA unit is turn in switch ON solar constant is 2655 W/m2 spacecraft interface temperature is 323K Earth pointing o 19m Venus eclipse & Earth pointing o 46m Venus eclipse & Observations o 5h IMA on the Sun (Figure 5) o coatings are corresponded to EOL.
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2.1.5
IMA Hot case, Sensitivity to radiator ageing
Transient thermal state: orbit phase IMA unit is turn in switch ON solar constant is 2655 W/m2 spacecraft interface temperature is 323K Earth pointing o 19m Venus eclipse & Earth pointing o 46m Venus eclipse & Observations o 5h IMA on the Sun (Figure 5) coatings are corresponded to EOL coefficient for silver tape is 0.57 instead of 0.47.
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Observation phase Stop 65 min eclipse
Start 65 min eclipse Start 4h high altitude imaging
Communication phase
Figure 5 IMA Hot case
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3 MU THERMAL ANALYSIS CASES
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The following MU thermal analysis cases have been considered:
3.1.1
MU Cold case 1
Steady thermal state: cruise phase MU unit is turn in switch OFF solar constant is 1320 W/m2 spacecraft interface temperature is 223K solar aspect angle is 0 deg. coatings are corresponded to BOL.
3.1.2
MU Cold case 2
Transient thermal state: initial data are corresponded with steady state for cold case 1 and solar constant 2570 W/m2 orbit phase MU unit is turn in switch OFF solar constant is 2570 W/m2 spacecraft interface temperature is 223K Earth pointing phase o 50m Observation phase, MU is on the Sun o 45m Venus eclipse o 4h MU is in s/c eclipse (Figure 6) coatings are corresponded to BOL.
3.1.3
MU Cold case 2A, Sensitivity analysis
Transient thermal state: initial data are corresponded with steady state for cold case 1 and solar constant 2570 W/m2, spacecraft interface temperature 243K orbit phase (transient thermal state) MU unit is turn in switch OFF solar constant is 2570 W/m2 spacecraft interface temperature is 243K Earth pointing o 50m Observation phase, MU on the Sun o 45m Venus eclipse o 4h MU in s/c eclipse (Figure 6) coatings are corresponded to BOL
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Observation phase Start 45 min eclipse
Communication phase
Figure 6 MU Cold case (Venus orbit)
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3.1.4 MU Hot case
Transient thermal state: orbit phase MU unit is turn in switch ON solar constant is 2655 W/m2 spacecraft interface temperature is 323K Earth pointing o 19m Venus eclipse & Earth pointing o 46m Venus eclipse & Observations o 5h MU on the Sun (Figure 7) coatings are corresponded to EOL.
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3.1.5
MU Hot case, Sensitivity to radiator (SSM CC/UVS) and silver tape ageing
Transient thermal state: orbit phase MU unit is turn in switch ON solar constant is 2655 W/m2 spacecraft interface temperature is 323K Earth pointing o 19m Venus eclipse & Earth pointing o 46m Venus eclipse & Observations o 5h MU on the Sun (Figure 7) coatings are corresponded to EOL. coefficient for silver tape is 0.57 instead of 0.47. coefficient for CC/UVS covering is 0.17 instead of 0.07.
3.1.6
MU Hot case A
Transient thermal state: orbit phase MU unit is turn in switch ON and Scanner is turn in switch OFF solar constant is 2655 W/m2 spacecraft interface temperature is 323K Earth pointing o 19m Venus eclipse & Earth pointing o 46m Venus eclipse & Observations o 5h MU on the Sun (Figure 7) coatings are corresponded to EOL.
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Observation phase Stop 65 min eclipse
Start 65 min eclipse Start 4h high altitude imaging
Communication phase
Figure 7 MU Hot case
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4 THERMAL DESIGN REQUIREMENTS
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The thermal design both MU and IMA is mainly driven by constraints of their electronic parts and MU Scanner motor. Operational temperature ranges for MU and IMA units are given in Table1 and Table2.
Table 1 MU operational temperatures

Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Name ELS Top Plate ELS Housing ELS Deflector ELS HVPS (upper board) ELS HVPS (lower board) ELS MCP ELS FEE Board NPI Housing NPI Amplifier Board NPI MCP DPU Housing +Xu DPU DC/DC DPU Housekeeping Board DPU HV Board DPU Processor Board NPD1 NPD2 Motor Wheel Motor Box Motor Motor Board MLI Motor Box MLI NPD+DPU -Xu MLI NPD+DPU +Yu MLI NPD +Zu MLI NPD +DPU -Yu Radiator Mother Board DPU Housing -Zu DPU Housing +Yu DPU Housing -Yu Radiation shield Operational temp. [C] -60 to +120 -60 to +120 -80 to +100 -40 to +50 -40 to +50 -40 to +50 -40 to +50 -60 to +120 -40 to +50 -40 to +50 -60 to +200 -40 to +50 -40 to +50 -40 to +60 -40 to +60 -40 to +50 -40 to +50 -40 to +60 -60 to +120 -40 to +50 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120 -40 to +50 -60 to +200 -60 to +200 -60 to +200 -60 to +120
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Table 2 IMA operational temperatures Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Name Aperture Outer Deflector Sensor Housing + Radiator Inner Deflector Outer plate MCP Amplifier Board Digital Board HVPS Board 1 HVPS Board 2 DPU Housing CPU + HK Boards Sensor MLI (+Xs/c side) Sensor MLI (-Xs/c side) Sensor MLI (-Ys/c side) DPU MLI Ring radiator
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Operational temp. [C] -60 to +120 -60 to +200 -60 to +120 -60 to +200 -60 to +200 -40 to +50 -40 to +50 -40 to +50 -40 to +75 -40 to +75 -60 to +200 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120
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IMA THERMAL DESIGN AND MATHEMATICAL MODEL
The following main requirements for IMA thermal design have been considered in calculation: the IMA unit should be thermally decoupled with s/c with 10 mm height special fibreglasses plug and titanium screws of 4 M5 diameter using. DPU unit surface should be covered with yellow Kapton MLI according to MLI design description (Table3 and Figure 8) Sensor structure (EQM-009) and Sensor Housing radiator surfaces are not covered with MLI, the rest surface of sensor unit should be covered with MLI of the same type part of Sensor Housing outer surface (Figure 9) is used as a radiator with 0.014 m2 area and covered with Sheldahl 5 mil FEPsilverInconel 9703 Tape outer surface of Sensor structure should be also covered with the same silver tape inner surface of Sensor structure should be black anodized or painted with black paint outer surface of Sensor Unit should be black anodized (excluding of radiator area) or IRIDITED inner surface of Sensor Unit should be black anodized inner and outer surfaces of DPU Housing should be anodized black or painted with black paint on the inner surface of Sensor Unit around the MCP holder should be mounted a heater (or heaters) with 5.76W heat power one thermostat with operating temperature range -24C -28C should be installed on the Sensor Housing surface (node#3). outer surfaces of rings (EQM-022, nodes #2, #4), rings (EQM-020, EQM-023) should be covered with CuSO4 black covering. ring radiator with external diameter 148 mm, internal diameter 127 mm and thickness 1.5 mm (area is 0.0045 m2) coupling with Sensor Housing is use. external surface of ring radiator should be covered with the same silver tape
Table 3 Multilayer insulation blanket design description

External Layer Material Internal Layer Material Radiation Shield Material and number of layers Spacer Material And number of layers Additional Comments Effective thermal conductivity Yellow: 25m (1 mil) Kapton/Al, perforated Al/50m (2 mil) Kapton/Al, perforated 12m (0.5 mil) Crinckled Kapton vda, perforated, 5 layers vda 12m (0.5 mil) Kapton vda, perforated, 20 layers Dacron net, 20 layers 1) non-aluminized side of Crinckled Kapton (5 layers of yellow colour side) should be pointed to the Space direction <0.10 W*m-2*deg-1
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Space
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External Layer Crinckled Kaptonvda, 5 layers vdaKaptonvda, 20 layers Spacer (Dacron net), 20 Layers Internal Layer
Unit
Figure 8 Multilayer insulation blanket for IMA and MU
+Zu
Radiator area
60
+Yu
15
Figure 9 Area of radiator on IMA sensor housing
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Table 4 IMA node list
Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Name Aperture Outer Deflector Sensor Housing + Radiator Inner Deflector Outer plate MCP Amplifier Board Digital Board HVPS Board 1 HVPS Board 2 DPU Housing CPU + HK Boards Sensor MLI (+Xs/c side) Sensor MLI (-Xs/c side) Sensor MLI (-Ys/c side) DPU MLI Ring radiator
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The IMA thermal mathematical model was created using a finite difference representation and nodes method as detailed in Figure 10 and Table 4 to Table 10.
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2 4 5 3 6
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10
13 - 15
17
11
12
16
Figure 10 IMA unit nodes
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Table 5 IMA BOL surface properties
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Material Thermal finish AL-6062 Silver tape

AL-6062 AL-6062 AL-6062 CuSO4 black
Silver tape
CuSO4 black
Misc. Misc. Misc. Misc. Misc. Misc.

AL-6062
Misc. MLI MLI MLI MLI

AL-6062
Internal Internal Internal Internal Internal Internal Internal Internal Kapton/Al Kapton/Al Kapton/Al Kapton/Al Silver tape
s 0.10 0.84 0.10 0.84 0.39 0.39 0.39 0.39 0.10
sd 0.90 0.16 0.90 0.16 0.61 0.61 0.61 0.61 0.90
ss -
h 0.75 0.91 0.75 0.91 0.64 0.64 0.64 0.64 0.75
hd 0.25 0.09 0.25 0.09 0.36 0.36 0.36 0.36 0.25
hs -
Table 6 IMA EOL surface properties

Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Name Aperture Outer Deflector Sensor Housing + Radiator Inner Deflector Outer plate MCP Amplifier Board Digital Board HVPS Board 1 HVPS Board 2 DPU Housing CPU + HK Boards Sensor MLI (+Xs/c side) Sensor MLI (-Xs/c side) Sensor MLI (-Ys/c side) DPU MLI Ring radiator Material Thermal finish AL-6062 Silver tape
AL-6062 AL-6062 CuSO4 black
Silver tape
CuSO4 black
AL-6062 Misc. Misc. Misc. Misc. Misc. Misc.

AL-6062
Misc. MLI MLI MLI MLI

AL-6062
Internal Internal Internal Internal Internal Internal Internal Internal Kapton/Al Kapton/Al Kapton/Al Kapton/Al Silver tape
s 0.47 0.85 0.47 0.85 0.50 0.50 0.50 0.50 0.47
sd 0.53 0.15 0.53 0.15 0.50 0.50 0.50 0.50 0.53
ss -
h 0.75 0.91 0.75 0.91 0.64 0.64 0.64 0.64 0.75
hd 0.25 0.09 0.25 0.09 0.36 0.36 0.36 0.36 0.25
hs -
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Table 7 IMA node properties
Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Name Aperture Outer Deflector Sensor Housing+Radiator Inner Deflector Outer plate MCP Amplifier Board Digital Board HVPS Board 1 HVPS Board 2 DPU Housing CPU + HK Boards Sensor MLI (+Xs/c side) Sensor MLI (-Xs/c side) Sensor MLI (-Ys/c side) DPU MLI Ring radiator Material AL-6062 AL-6062 AL-6062 AL-6062 misc. misc. misc. misc. misc. misc. AL-6062 misc. MLI MLI MLI MLI AL-6062 Area [m2] 0.0110 0.0080 0.0830 0.0080 0.0500 0.0079 0.0099 0.0099 0.0099 0.0099 0.0420 0.0213 0.0540 0.0400 0.0110 0.0630 0.0059
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mCp [J/K] 61.4 4.2 358.6 4.2 954.0 88.0 100.5 56.5 15.7 15.7 320.4 45.2 39.3 22.9 8.0 45.8 52.3
Non-Op. heater [W] 5.76 -
Power diss [W] 0. 0. 0. 0. 0. 0.28 0.81 0.75 0.30 0.30 0. 1.10 0. 0. 0. 0. 0.
Table 8 IMA interface conductive couplings

Type Foot-1*M5-washer-s/c structure Foot-1*M5-washer- s/c structure Foot-1*M5-washer- s/c structure Foot-1*M5-washer- s/c structure Number 1 1 1 1 C [W/K] 0.0145 0.0145 0.0145 0.0145 Node 11 11 11 11 Conductive i/f node 1 1 1 1
Table 9 IMA internal conductive couplings

From Node 1 1 1 3 3 3 3 3 3 3 5 6 7 8 Name Aperture Aperture Aperture Sensor Housing + Radiator Sensor Housing + Radiator Sensor Housing + Radiator Sensor Housing + Radiator Sensor Housing + Radiator Sensor Housing + Radiator Sensor Housing + Radiator Outer plate MCP Amplifier Board Digital Board To Node 2 4 17 5 10 11 13 14 15 17 6 7 8 9 Name Outer Deflector Inner Deflector Ring radiator Outer plate HVPS Board 2 DPU Housing Sensor MLI (+Xs/c side) Sensor MLI (-Xs/c side) Sensor MLI (-Ys/c side) Ring radiator MCP Amplifier Board Digital Board HVPS Board 1 Coupling GL [W/K] 0.054 0.053 0.210 0.200 0.226 0.400 0.0054 0.004 0.0011 0.650 1.250 0.141 0.141 0.113
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From Node 9 11 11 Name HVPS Board 1 DPU Housing DPU Housing To Node 10 12 16
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Name HVPS Board 2 CPU + HK Boards DPU MLI
Coupling GL [W/K] 0.075 0.113 0.0063
Table 10 IMA radiative couplings

Node 1 1 1 2 2 2 3 3 3 3 3 3 3 4 4 4 5 6 7 8 9 11 13 14 15 16 17 Name Aperture Aperture Aperture Outer Deflector Outer Deflector Outer Deflector Sensor Housing + Radiator Sensor Housing + Radiator Sensor Housing + Radiator Sensor Housing + Radiator Sensor Housing + Radiator Sensor Housing + Radiator Sensor Housing + Radiator Inner Deflector Inner Deflector Inner Deflector Outer plate MCP Amplifier Board Digital Board HVPS Board 1 DPU Housing Sensor MLI (+Xs/c side) Sensor MLI (-Xs/c side) Sensor MLI (-Ys/c side) DPU MLI Ring radiator Node 2 4 4 17 5 6 7 8 9 10 5 17 6 7 8 9 10 12 Name Space Outer Deflector Inner Deflector Space Inner Deflector Ring radiator Space Outer plate MCP Amplifier Board Digital Board HVPS Board 1 HVPS Board 2 Space Outer plate Ring radiator MCP Amplifier Board Digital Board HVPS Board 1 HVPS Board 2 CPU + HK Boards Space Space Space Space Space GR [m2] 1.27*10-2 0.05*10-2 0.15*10-2 0.32*10-2 0.32*10-2 0.05*10-2 0.81*10-2 0.28*10-2 0.27*10-2 0.20*10-2 0.25*10-2 0.34*10-2 1.01*10-2 0.38*10-2 0.09*10-2 0.04*10-2 0.14*10-2 0.39*10-2 0.64*10-2 0.62*10-2 0.57*10-2 1.67*10-2 2.29*10-2 4.00*10-2 0.56*10-2 3.87*10-2 0.14*10-2
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MU THERMAL DESIGN AND MATHEMATICAL MODEL
The following main requirements for thermal design of MU have been considered: the MU should be thermally decoupled with s/c with special fibreglasses plug ME-ASP-MD5225, ME-ASP-MD-5226 and titanium screws of 6M4 diameter using the DPU housing (excluding +Zu side and +Xu side), NPD-1 and NPD-2 housings, motor box (excluding +Zu ) should be covered with yellow Kapton MLI according to MLI design description (Nable3 and Figure 8) external surfaces of DPU housing (excluding of radiator internal surface) should be Iridited internal surface of DPU housing (excluding of radiator internal surface) should be painted with paint or black anodized special radiation shield is installed on the external surface of ELS cylindrical part internal surface of radiation shield should be Iridited external surface of radiation shield should be covered with Sheldahl 5 mil FEPsilverInconel 9703 Tape external surface of DPU housing of +Xu side should be covered with Sheldahl 5 mil FEPsilverInconel 9703 Tape internal surface of DPU housing +Xu side should be painted with paint or black anodized internal surface of motor box should be painted with paint or black anodized part of external surface of motor box covered with MLI should be IRIDITED part of external surface of motor box not covered with MLI (excluding screws heads surfaces) should be covered with Sheldahl 5 mil FEPsilverInconel 9703 Tape motor box screws heads surfaces should be painted with white paint external surface of motor box bottom should be IRIDITED internal surface of motor box bottom should be painted with paint or black anodized external and internal surfaces of NPD-1&2 housings should be IRIDITED following electrical heaters with total power 17.33 W should be installed: - on the Scanner motor box surface (node #19) with powers 0.75 W + 0.95 W + 0.47 W - on the DPU housing surfaces and radiator surface (nodes #30,31,27) with power 15.16 W (5.22 W + 5.22 W+4.72 W) the ELS Top Plate external surface should be covered with Sheldahl 5 mil FEPsilverInconel 9703 Tape the ELS Top Plate internal surface should be covered with CuSO4 black covering. the ELS Housing external surface should be Iridited NPI Housing external surfaces should be covered with Sheldahl 5 mil FEPsilverInconel 9703 Tape the ELS Housing internal surface and NPI Housing internal surface should be IRIDITED two thermoswitches for heaters control are necessary one thermoswitch should be installed on NPI housing surface other thermoswitch should be installed on the Motor box surface special radiator for sensor head cooling is necessary special radiator VE-ASP-MD-6000 of 0.0186 m2 area should be coupled thermally with DPU Housing sides external surface of radiator should be covered with Low Absorptance Conductive Coated SSMs (CC/UVS/SSMs) of 150 m thickness internal surface of radiator should be painted with paint or black anodized
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Table 11 MU node list
Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Name ELS Top Plate ELS Housing ELS Deflector ELS HVPS (upper board) ELS HVPS (lower board) ELS MCP ELS FEE Board NPI Housing NPI Amplifier Board NPI MCP DPU Housing +Xu DPU DC/DC DPU Housekeeping Board DPU HV Board DPU Processor Board NPD1 NPD2 Motor Wheel Motor Box Motor Motor Board MLI Motor Box MLI NPD+DPU -Xu MLI NPD+DPU +Yu MLI NPD +Zu MLI NPD +DPU -Yu Radiator Mother Board DPU Housing -Zu DPU Housing +Yu DPU Housing -Yu Radiation shield
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The thermal mathematical model was created using a finite difference representation and nodes method as detailed in Figure 11 and Table 11 to Table 17.
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1 2 32 3 4 5
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11,29-31
27
12
13
14
15
16
17
23-26
21
20
18
19
22 6 8 10 28
Figure 11 Main Unit nodes
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Table 12 MU BOL surfaces properties
Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Name ELS Top Plate ELS Housing ELS Deflector ELS HVPS (upper board) ELS HVPS (lower board) ELS MCP ELS FEE Board NPI Housing NPI Amplifier Board NPI MCP DPU Housing +Xu DPU DC/DC DPU Housekeeping Board DPU HV Board DPU Processor Board NPD1 NPD2 Motor Wheel Motor Box Motor Motor Board MLI Motor Box MLI NPD+DPU -Xu MLI NPD+DPU +Yu MLI NPD +Zu MLI NPD +DPU -Yu Radiator Mother Board DPU Housing -Zu DPU Housing +Yu DPU Housing -Yu Radiation shield Material
AL-6062 AL-6062
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misc. misc. misc. misc. misc.

AL-6062
misc. misc.
AL-6062
misc. misc. misc. misc. misc. misc.

AL-6062 AL-6062
misc. misc. MLI MLI MLI MLI MLI

AL-6062
misc.
AL-6062 AL-6062 AL-6062 AL-6062
Thermal finish Silver tape Internal Internal. Internal Internal Internal Internal. Silver tape Internal Internal internal Internal. Internal. Internal. Internal. internal internal Silver tape Silver tape Internal. Internal. Kapton/Al Kapton/Al Kapton/Al Kapton/Al Kapton/Al SSM CC/UVS internal internal internal internal Silver tape
s 0.10 0.10 0.10 0.10 0.39 0.39 0.39 0.39 0.39 0.05 0.10
sd 0.90 0.90 0.90 0.90 0.61 0.61 0.61 0.61 0.61 0.95 0.90
ss -
h 0.75 0.75 0.75 0.75 0.64 0.64 0.64 0.64 0.64 0.80 0.75
hd 0.25 0.25 0.25 0.25 0.36 0.36 0.36 0.36 0.36 0.20 0.25
hs -
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Table 13 MU EOL surfaces properties
Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Name ELS Top Plate ELS Housing ELS Deflector ELS HVPS (upper board) ELS HVPS (lower board) ELS MCP ELS FEE Board NPI Housing NPI Amplifier Board NPI MCP DPU Housing +Xu DPU DC/DC DPU Housekeeping Board DPU HV Board DPU Processor Board NPD1 NPD2 Motor Wheel Motor Box Motor Motor Board MLI Motor Box MLI NPD+DPU -Xu MLI NPD+DPU +Yu MLI NPD +Zu MLI NPD +DPU -Yu Radiator Mother Board DPU Housing -Zu DPU Housing +Yu DPU Housing -Yu Radiation shield Material
AL-6062 AL-6062
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misc. misc. misc. misc. misc.

AL-6062
misc. misc.
AL-6062
misc. misc. misc. misc. misc. misc.

AL-6062 AL-6062
misc. misc. MLI MLI MLI MLI MLI

AL-6062
misc.
AL-6062 AL-6062 AL-6062 AL-6062
Thermal finish Silver tape Internal Internal. Internal Internal Internal Internal. Silver tape Internal Internal internal Internal. Internal. Internal. Internal. internal internal Silver tape Silver tape Internal. Internal. Kapton/Al Kapton/Al Kapton/Al Kapton/Al Kapton/Al SSM CC/UVS internal internal internal internal Silver tape
s 0.47 0.47 0.47 0.47 0.50 0.50 0.50 0.50 0.50 0.07 0.47
sd 0.53 0.53 0.53 0.53 0.50 0.50 0.50 0.50 0.50 0.93 0.53
ss -
h 0.75 0.75 0.75 0.75 0.64 0.64 0.64 0.64 0.64 0.80 0.75
hd 0.25 0.25 0.25 0.25 0.36 0.36 0.36 0.36 0.36 0.20 0.25
hs -
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Table 14 MU node properties
Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Name Material
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Area [m2] 0.010 0.013 0.002 0.005 0.007 0.001 0.009 0.024 0.039 0.019 0.022 0.033 0.019 0.033 0.033 0.043 0.075 0.024 0.101 0.004 0.009 0.041 0.040 0.032 0.024 0.032 0.018 0.023 0.041 0.019 0.019 0.020
ELS Top Plate AL-6062 ELS Housing AL-6062 ELS Deflector misc. ELS HVPS (upper board) misc. ELS HVPS (lower board) misc. ELS MCP misc. ELS FEE Board misc. NPI Housing AL-6062 NPI Amplifier Board misc. NPI MCP misc. DPU Housing +Xu AL-6062 DPU DC/DC misc. DPU Housekeeping misc. Board DPU HV Board misc. DPU Processor Board misc. NPD1 misc. NPD2 misc. Motor Wheel AL-6062 Motor Box AL-6062 Motor misc. Motor Board misc. MLI Motor Box MLI MLI NPD+DPU -Xu MLI MLI NPD+DPU +Yu MLI MLI NPD +Zu MLI MLI NPD +DPU -Yu MLI Radiator AL-6062 Mother Board misc. DPU Housing -Zu AL-6062 DPU Housing +Yu AL-6062 DPU Housing -Yu AL-6062 Radiation shield AL-6062
mCp [J/K] 21.6 78.0 14.1 126.9 126.9 56.5 56.5 107.9 415.0 114.2 111.3 37.7 70.6 122.6 122.6 695.0 695.0 247.3 333.7 46.0 24.9 29.0 28.4 22.7 17.0 22.7 166.5 96.2 143.6 88.0 88.0 94.6
Non op. heater [W] 2.17 4.72 5.22 5.22 -
Power diss [W] 0.263 0.263 0.014 0.15 0. 0. 0.437 0. 5.78 1.70 1.31 2.50 0.671 0.671 0. 0. 3.20 0.80 -
Table 15 MU Interface conductive couplings

Type Foot-1*M4-washer-s/c structure Foot-1*M4-washer- s/c structure Foot-1*M4-washer- s/c structure Foot-1*M4-washer- s/c structure Foot-1*M4-washer-s/c structure Foot-1*M4-washer-s/c structure Number 1 1 1 1 1 1 C [W/K] 0.0143 0.0143 0.0143 0.0143 0.0143 0.0143 Node 19 19 19 19 19 19 Cond. i/f node 1 1 1 1 1 1
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Table 16 MU internal conductive couplings
From Node 1 2 2 2 2 3 3 7 4 6 8 8 8 9 11 11 11 11 12 12 12 12 13 13 14 14 15 16 16 16 16 16 16 16 17 17 17 17 17 18 18 18 19 To Name Node ELS Top Plate 2 ELS Housing 3 ELS Housing 4 ELS Housing 7 ELS Housing 8 ELS Deflector 4 ELS Deflector 7 ELS FEE Board 12 ELS HVPS (upper board) 5 ELS MCP 7 NPI Housing 9 NPI Housing 10 NPI Housing 11 NPI Amplifier Board 10 DPU Housing +Xu 27 DPU Housing +Xu 29 DPU Housing +Xu 30 DPU Housing +Xu 31 DPU DC/DC 13 DPU DC/DC 28 DPU DC/DC 30 DPU DC/DC 31 DPU Housekeeping Board 14 DPU Housekeeping Board 28 DPU HV Board 15 DPU HV Board 28 DPU Processor Board 28 NPD1 17 NPD1 24 NPD1 25 NPD1 26 NPD1 28 NPD1 30 NPD1 31 NPD2 23 NPD2 24 NPD2 25 NPD2 26 NPD2 28 Motor Wheel 19 Motor Wheel 20 Motor Wheel 29 Motor Box 20
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Name ELS Housing ELS Deflector ELS HVPS (upper board) ELS FEE Board NPI Housing ELS HVPS (upper board) ELS FEE Board DPU DC/DC ELS HVPS (lower board) ELS FEE Board NPI Amplifier Board NPI MCP DPU Housing +Xu NPI MCP Radiator DPU Housing -Zu DPU Housing +Yu DPU Housing -Yu DPU Housekeeping Board Mother Board DPU Housing +Yu DPU Housing -Yu DPU HV Board Mother Board DPU Processor Board Mother Board Mother Board NPD2 MLI NPD+DPU +Yu MLI NPD +Zu MLI NPD +DPU -Yu Mother Board DPU Housing +Yu DPU Housing -Yu MLI NPD+DPU -Xu MLI NPD+DPU +Yu MLI NPD +Zu MLI NPD +DPU -Yu Mother Board Motor Box Motor DPU Housing -Zu Motor
Coupling GL [W/K] 0.150 0.970 0.034 0.075 1.030 0.035 0.014 0.026 0.172 0.210 0.190 0.660 0.850 0.201 0.410 0.512 0.512 0.512 0.281 0.048 2.040 2.040 0.281 0.051 0.449 0.048 0.021 0.900 0.00096 0.00120 0.00096 0.022 0.300 0.300 0.0032 0.00096 0.0012 0.00096 0.022 0.300 0.005 5.100 0.770
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From Node 19 19 21 27 27 28 29 29 32 Name Motor Box Motor Box Motor Board Radiator Radiator Mother Board DPU Housing -Zu DPU Housing -Zu Radiation shield To Node 21 22 28 30 31 29 30 31 8
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Name Motor Board MLI Motor Box Mother Board DPU Housing +Yu DPU Housing -Yu DPU Housing -Zu DPU Housing +Yu DPU Housing -Yu NPI Housing
Coupling GL [W/K] 1.250 0.0041 0.005 0.351 0.351 2.300 0.417 0.417 1.110
Table 17 MU radiative couplings

Node 1 1 32 2 2 2 2 3 3 3 4 5 6 7 8 8 8 9 9 10 11 11 11 11 11 11 12 12 12 12 12 Name ELS Top Plate ELS Top Plate Radiation shield ELS Housing ELS Housing ELS Housing ELS Housing ELS Inner Dome Assy ELS Inner Dome Assy ELS Inner Dome Assy ELS HVPS (upper board) ELS HVPS (lower board) ELS MCP ELS FEE board NPI Housing NPI Housing NPI Housing NPI Sensor NPI Sensor NPI MCP NPI MCP DPU Housing +Xu DPU Housing +Xu DPU Housing +Xu DPU Housing +Xu DPU Housing +Xu DPU DC/DC DPU DC/DC DPU DC/DC DPU DC/DC DPU DC/DC Node 2 3 4 5 7 4 5 6 5 7 7 8 9 10 10 12 12 27 28 30 31 13 27 28 30 31 Name Space ELS Housing Space ELS Inner Dome Assy ELS HVPS (upper board) ELS HVPS (lower board) ELS FEE board ELS HVPS (upper board) ELS HVPS (lower board) ELS MCP ELS HVPS (lower board) ELS FEE board ELS FEE board NPI Housing Space NPI Sensor NPI MCP Space NPI MCP DPU DC/DC Space DPU DC/DC Radiator DPU Housing +Zu DPU Housing +Yu DPU Housing -Yu DPU HV board Radiator DPU Housing +Zu DPU Housing +Yu DPU Housing -Yu GR [m2] 0.86*10-2 0.79*10-2 1.35*10-2 0.35*10-4 0.05*10-2 0.88*10-4 0.05*10-2 0.18*10-4 0.18*10-4 0.02*10-2 0.54*10-2 0.45*10-2 0.64*10-2 0.09*10-2 1.03*10-2 1.28*10-2 0.10*10-2 0.18*10-2 1.05*10-2 1.01*10-2 0.66*10-2 0.03 0.04*10-2 0.02*10-2 0.04*10-2 0.04*10-2 0.02 0.15*10-2 0.14*10-2 0.11*10-2 0.11*10-2
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Node 13 13 13 13 13 14 14 14 14 14 15 15 15 15 15 16 16 16 17 17 18 18 18 18 19 19 19 19 22 23 24 25 26 27 27 27 27 28 28 28 30 32 Name DPU HV board DPU HV board DPU HV board DPU HV board DPU HV board DPU Housekeeping board DPU Housekeeping board DPU Housekeeping board DPU Housekeeping board DPU Housekeeping board DPU board DPU board DPU board DPU board DPU board NPD1 NPD1 NPD1 NPD2 NPD2 Motor Wheel Motor Wheel Motor Wheel Motor Wheel Motor Box Motor Box Motor Box Motor Box MLI Motor box MLI NPD+DPU -Xu MLI NPD+DPU +Yu MLI NPD +Zu MLI NPD +DPU -Yu Radiator Radiator Radiator Radiator DPU Housing +Zu DPU Housing +Zu DPU Housing +Zu DPU Housing +Yu Radiation shield Node 14 27 28 30 31 15 27 28 30 31 16 27 28 30 31 17 18 18 19 20 21 20 21 23 28 30 31 29 30 31 31 2
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Name DPU Housekeeping board Radiator DPU Housing +Zu DPU Housing +Yu DPU Housing -Yu DPU board Radiator DPU Housing +Zu DPU Housing +Yu DPU Housing -Yu NPD1 Radiator DPU Housing +Zu DPU Housing +Yu DPU Housing -Yu Space NPD2 Motor Wheel Space Motor Wheel Space Motor Box Motor Motor board Space Motor Motor board MLI NPD+DPU -Xu Space Space Space Space Space Space DPU Housing +Zu DPU Housing +Yu DPU Housing -Yu DPU Housing -Zu DPU Housing +Yu DPU Housing -Yu DPU Housing -Yu ELS Housing
GR [m2] 0.01 0.10*10-2 0.09*10-2 0.10*10-2 0.10*10-2 2.12*10-2 0.15*10-2 0.14*10-2 0.14*10-2 0.14*10-2 0.35*10-2 0.15*10-2 0.14*10-2 0.12*10-2 0.12*10-2 0.07*10-2 0.10*10-2 0.11*10-2 0.07*10-2 0.11*10-2 0.10*10-2 1.89*10-2 0.09*10-2 0.25*10-2 0.50*10-2 0.20*10-2 0.46*10-2 0.20*10-2 1.91*10-2 1.53*10-2 1.22*10-2 1.74*10-2 1.22*10-2 1.50*10-2 0.05*10-2 0.09*10-2 0.09*10-2 1.75*10-2 0.11*10-2 0.11*10-2 0.22*10-4 0.02*10-2
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7 7.1 THERMAL CALCULATIONS RESULTS. Predicted temperatures for IMA nodes.
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The following tables give the predicted temperatures for every nodes of the model.
7.1.1
Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
IMA Cold case 1 (2.1.1)

Name Aperture Outer Deflector Sensor Housing + Radiator Inner Deflector Outer plate MCP Amplifier Board Digital Board HVPS Board 1 HVPS Board 2 DPU Housing CPU + HK Boards Sensor MLI (+Xs/c side) Sensor MLI (-Xs/c side) Sensor MLI (-Ys/c side) DPU MLI Ring radiator Predicted temp. [C] -35.92 -27.94 -28.46 -29.61 -28.47 -28.47 -28.47 -28.46 -28.46 -28.46 -32.67 -32.67 -140.73 -152.40 -142.19 -140.45 -30.60 Operational temp. [C] -60 to +120 -60 to +200 -60 to +120 -60 to +200 -60 to +200 -40 to +50 -40 to +50 -40 to +50 -40 to +75 -40 to +75 -60 to +200 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120
Thermal flux from IMA unit to s/c: Q = +1.01 W.
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7.1.2
Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
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IMA Cold case 2 (2.1.2)

Name Aperture Outer Deflector Sensor Housing + Radiator Inner Deflector Outer plate MCP Amplifier Board Digital Board HVPS Board 1 HVPS Board 2 DPU Housing CPU + HK Boards Sensor MLI (+Xs/c side) Sensor MLI (-Xs/c side) Sensor MLI (-Ys/c side) DPU MLI Ring radiator Predicted temp. in steady state [C], heaters are ON -24.23 -3.86 -24.05 -7.04 -25.14 -25.16 -25.18 -25.02 -24.70 -24.25 -29.42 -29.63 -140.01 -151.71 -141.43 -139.75 -24.41 Predicted temp. in steady state [C], heaters are OFF -25.30 -4.55 -28.02 -7.70 -25.16 -25.15 -25.11 -25.26 -25.92 -27.20 -30.09 -29.66 -140.11 -151.72 -141.46 -139.80 -27.24 Operational temp. [C] -60 to +120 -60 to +200 -60 to +120 -60 to +200 -60 to +200 -40 to +50 -40 to +50 -40 to +50 -40 to +75 -40 to +75 -60 to +200 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120
Thermal flux from IMA unit to s/c: Q = +1.15 W to +1.19 W. Node Name Min predicted temperature in transient state [C] -40.87 -44.37 -28.32 -44.89 -28.13 -28.05 -28.16 -28.18 -28.13 -28.56 -28.71 -28.57 -140.15 -151.92 -141.62 -139.81 -29.26 Maxi predicted temperature in transient state [C] +0.76 +65.67 -18.89 +56.79 -25.04 -25.06 -24.76 -24.12 -22.61 -20.05 -25.82 -26.14 +34.21 +23.63 +47.98 -24.12 -14.76 Operational temp. [C] -60 to +120 -60 to +200 -60 to +120 -60 to +200 -60 to +200 -40 to +50 -40 to +50 -40 to +50 -40 to +75 -40 to +75 -60 to +200 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
Aperture Outer Deflector Sensor Housing + Radiator Inner Deflector Outer plate MCP Amplifier Board Digital Board HVPS Board 1 HVPS Board 2 DPU Housing CPU + HK Boards Sensor MLI (+Xs/c side) Sensor MLI (-Xs/c side) Sensor MLI (-Ys/c side) DPU MLI Ring radiator
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7.1.3
Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Name Aperture Outer Deflector Sensor Housing + Radiator Inner Deflector Outer plate MCP Amplifier Board Digital Board HVPS Board 1 HVPS Board 2 DPU Housing CPU + HK Boards Sensor MLI (+Xs/c side) Sensor MLI (-Xs/c side) Sensor MLI (-Ys/c side) DPU MLI Ring radiator Predicted temp. in steady state [C], heaters are ON -24.00 -2.78 -24.00 -6.05 -25.03 -25.06 -24.96 -24.93 -24.87 -24.16 -27.54 -27.17 -140.01 -151.65 -141.30 -139.21 -24.30
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IMA Cold case 2A, Sensitivity analysis (2.1.3)

Predicted temp. in steady state [C], heaters are OFF -24.95 -3.33 -28.00 -6.58 -25.11 -25.12 -25.06 -25.22 -25.84 -27.13 -27.88 -27.48 -140.13 -151.86 -141.59 -139.28 -27.18 Operational temp. [C] -60 to +120 -60 to +200 -60 to +120 -60 to +200 -60 to +200 -40 to +50 -40 to +50 -40 to +50 -40 to +75 -40 to +75 -60 to +200 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120
Thermal flux from IMA unit to s/c: Q = +1.28 W to +1.30 W. Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Name Aperture Outer Deflector Sensor Housing + Radiator Inner Deflector Outer plate MCP Amplifier Board Digital Board HVPS Board 1 HVPS Board 2 DPU Housing CPU + HK Boards Sensor MLI (+Xs/c side) Sensor MLI (-Xs/c side) Sensor MLI (-Ys/c side) DPU MLI Ring radiator Min predicted temperature in transient state [C] -41.47 -44.95 -27.86 -45.39 -25.47 -25.71 -25.81 -25.97 -26.62 -27.75 -28.48 -28.31 -140.19 -151.99 -141.70 -139.37 -28.76 Max predicted temperature in transient state [C] +2.70 +67.64 -16.01 +58.63 -23.49 -23.43 -22.95 -22.17 -20.42 -17.38 -21.11 -21.38 +34.88 +24.97 +48.02 -23.80 -12.09 Operational temp. [C] -60 to +120 -60 to +200 -60 to +120 -60 to +200 -60 to +200 -40 to +50 -40 to +50 -40 to +50 -40 to +75 -40 to +75 -60 to +200 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120
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7.1.4
Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
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IMA Hot case (2.1.4)

Name Aperture Outer Deflector Sensor Housing + Radiator Inner Deflector Outer plate MCP Amplifier Board Digital Board HVPS Board 1 HVPS Board 2 DPU Housing CPU + HK Boards Sensor MLI (+Xs/c side) Sensor MLI (-Xs/c side) Sensor MLI (-Ys/c side) DPU MLI Ring radiator Predicted temperature in steady state [C] +13.85 +26.69 +16.49 +23.52 +21.27 +22.08 +27.12 +27.90 +24.94 +19.60 +21.07 +26.27 +86.41 -137.45 -100.76 -129.02 +15.25 Operational temp. [C] -60 to +120 -60 to +200 -60 to +120 -60 to +200 -60 to +200 -40 to +50 -40 to +50 -40 to +50 -40 to +75 -40 to +75 -60 to +200 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120
Thermal flux from s/c to IMA unit: Q = -1.68 W. Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Name Aperture Outer Deflector Sensor Housing + Radiator Inner Deflector Outer plate MCP Amplifier Board Digital Board HVPS Board 1 HVPS Board 2 DPU Housing CPU + HK Boards Sensor MLI (+Xs/c side) Sensor MLI (-Xs/c side) Sensor MLI (-Ys/c side) DPU MLI Ring radiator Min predicted temperature in transient state [C] -17.01 -25.07 +6.04 -24.42 +17.03 +17.77 +22.25 +22.23 +17.81 +18.20 +13.49 +19.01 -122.56 -142.44 -128.97 -130.06 -0.11 Max predicted temperature in transient state [C] +56.38 +115.30 +45.42 +104.27 +40.25 +41.03 +45.83 +46.58 +44.46 +45.49 +43.85 +48.41 +118.31 +64.84 +81.48 -45.77 +46.63 Operational temp. [C] -60 to +120 -60 to +200 -60 to +120 -60 to +200 -60 to +200 -40 to +50 -40 to +50 -40 to +50 -40 to +75 -40 to +75 -60 to +200 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120
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7.1.5
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IMA Hot case, Sensitivity to radiator ageing (2.1.5)

Predicted temperature in steady state [C] +17.93 +29.65 +18.85 +26.43 +23.61 +24.41 +29.40 +30.16 +27.22 +21.94 +23.11 +28.26 +86.45 -137.11 -100.51 -128.62 +18.01 Operational temp. [C] -60 to +120 -60 to +200 -60 to +120 -60 to +200 -60 to +200 -40 to +50 -40 to +50 -40 to +50 -40 to +75 -40 to +75 -60 to +200 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120
Thermal flux from s/c to IMA unit: Q = -1.56 W. Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Name Aperture Outer Deflector Sensor Housing + Radiator Inner Deflector Outer plate MCP Amplifier Board Digital Board HVPS Board 1 HVPS Board 2 DPU Housing CPU + HK Boards Sensor MLI (+Xs/c side) Sensor MLI (-Xs/c side) Sensor MLI (-Ys/c side) DPU MLI Ring radiator Min predicted temperature in transient state [C] -15.71 -23.94 +7.69 -23.23 +19.08 +19.81 +24.20 +24.11 +19.59 +11.89 +15.02 +20.52 -122.33 -142.15 -128.68 -129.73 +1.44 Max predicted temperature in transient state [C] +61.78 +118.30 +52.01 +107.22 +43.59 +45.01 +49.71 +49.82 +48.43 +44.44 +48.99 +53.40 +118.36 +64.90 +81.56 -45.50 +52.91 Operational temp. [C] -60 to +120 -60 to +200 -60 to +120 -60 to +200 -60 to +200 -40 to +50 -40 to +50 -40 to +50 -40 to +75 -40 to +75 -60 to +200 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120
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7.2 Predicted temperatures for MU nodes.
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The following tables give the predicted temperatures for every nodes of the model.
7.2.1
Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
MU Non-operating cold case 1 (3.1.1)

Name ELS Top Plate ELS Housing ELS Deflector ELS HVPS (upper board) ELS HVPS (lower board) ELS MCP ELS FEE Board NPI Housing NPI Amplifier Board NPI MCP DPU Housing +Xu DPU DC/DC DPU Housekeeping Board DPU HV Board DPU Processor Board NPD1 NPD2 Motor Wheel Motor Box Motor Motor Board MLI Motor Box MLI NPD+DPU -Xu MLI NPD+DPU +Yu MLI NPD +Zu MLI NPD +DPU -Yu Radiator Mother Board DPU Housing -Zu DPU Housing +Yu DPU Housing -Yu Radiation shield Predicted temp. in steady state [C] -35.70 -28.01 -27.95 -27.53 -27.37 -25.30 -25.29 -25.83 -26.49 -25.54 -18.77 -14.48 -14.71 -15.11 -15.19 -15.44 -15.68 -17.71 -23.19 -23.13 -23.13 -133.47 +101.44 -139.92 -134.07 -139.92 -14.94 -17.05 -17.25 -14.10 -14.10 -28.30 Operational temp. [C] -60 to +120 -60 to +120 -80 to +100 -40 to +50 -40 to +50 -40 to +50 -40 to +50 -60 to +120 -40 to +50 -40 to +50 -60 to +200 -40 to +50 -40 to +50 -40 to +60 -40 to +60 -40 to +50 -40 to +50 -40 to +60 -60 to +120 -40 to +50 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120 -40 to +50 -60 to +200 -60 to +200 -60 to +200 -60 to +120
Thermal flux from MU unit to s/c: Q = +2.31W.
ASPERA-4
7.2.2
Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
Venus Express
: : : :
VE-ASP-DS-0002 3 Rev. : 1 2004-04-22 Page: 40
MU Non-operating cold case 2 (3.1.2)

Name ELS Top Plate ELS Housing ELS Deflector ELS HVPS (upper board) ELS HVPS (lower board) ELS MCP ELS FEE Board NPI Housing NPI Amplifier Board NPI MCP DPU Housing +Xu DPU DC/DC DPU Housekeeping Board DPU HV Board DPU Processor Board NPD1 NPD2 Motor Wheel Motor Box Motor Motor Board MLI Motor Box MLI NPD+DPU -Xu MLI NPD+DPU +Yu MLI NPD +Zu MLI NPD +DPU -Yu Radiator Mother Board DPU Housing -Zu DPU Housing +Yu DPU Housing -Yu Radiation shield Predicted temp. in steady state [C], heaters are ON -33.41 -25.43 -25.40 -25.59 -25.51 -22.85 -22.79 -23.00 -23.88 -22.75 -15.40 -10.97 -11.20 -11.62 -11.72 -12.08 -12.27 -13.36 -15.83 -15.81 -15.80 -131.81 +168.72 -139.35 -127.53 -139.35 -11.60 -12.97 -13.11 -10.57 -10.57 -25.60 Predicted temp. in steady state [C], heaters are OFF -37.38 -30.16 -29.83 -28.57 -28.54 -25.22 -25.83 -29.77 -27.63 -28.67 -26.07 -23.43 -22.76 -21.13 -20.57 -17.78 -15.54 -22.66 -21.03 -20.91 -21.00 -131.88 +168.69 -139.85 -127.63 -139.89 -26.66 -22.64 -22.89 -23.51 -23.51 -31.89 Operational temp. [C] -60 to +120 -60 to +120 -80 to +100 -40 to +50 -40 to +50 -40 to +50 -40 to +50 -60 to +120 -40 to +50 -40 to +50 -60 to +200 -40 to +50 -40 to +50 -40 to +60 -40 to +60 -40 to +50 -40 to +50 -40 to +60 -60 to +120 -40 to +50 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120 -40 to +50 -60 to +200 -60 to +200 -60 to +200 -60 to +120
Thermal flux from MU unit to s/c: Q = +2.49 W to Q = +2.94 W.
ASPERA-4
Venus Express
: : : :
VE-ASP-DS-0002 3 Rev. : 1 2004-04-22 Page: 41
Min predicted temp. in transient state [C] -37.61 -30.15 -29.75 -28.54 -28.42 -28.66 -28.74 -28.52 -28.76 -28.17 -29.54 -29.32 -29.01 -28.23 -28.09 -28.52 -27.52 -29.61 -31.62 -31.58 -31.59 -135.26 -114.02 -139.70 -129.91 -142.17 -31.36 -29.37 -29.50 -29.41 -29.41 -30.89
Max predicted temp. in transient state [C] -19.68 -23.54 -22.88 -24.01 -23.73 -23.36 -23.31 -22.59 -24.93 -23.28 -19.33 -16.52 -17.15 -18.41 -18.65 -19.37 -19.22 -20.08 -22.25 -21.84 -21.69 -50.54 +168.53 +177.02 -75.72 +176.36 -16.27 -19.42 -19.50 -16.09 -16.09 -20.95
Operational temp. [C] -60 to +120 -60 to +120 -80 to +100 -40 to +50 -40 to +50 -40 to +50 -40 to +50 -60 to +120 -40 to +50 -40 to +50 -60 to +200 -40 to +50 -40 to +50 -40 to +60 -40 to +60 -40 to +50 -40 to +50 -40 to +60 -60 to +120 -40 to +50 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120 -40 to +50 -60 to +200 -60 to +200 -60 to +200 -60 to +120
ASPERA-4
7.2.3
Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
Venus Express
: : : :
VE-ASP-DS-0002 3 Rev. : 1 2004-04-22 Page: 42
MU Non-operating cold case 2A (3.1.3)

Name ELS Top Plate ELS Housing ELS Deflector ELS HVPS (upper board) ELS HVPS (lower board) ELS MCP ELS FEE Board NPI Housing NPI Amplifier Board NPI MCP DPU Housing +Xu DPU DC/DC DPU Housekeeping Board DPU HV Board DPU Processor Board NPD1 NPD2 Motor Wheel Motor Box Motor Motor Board MLI Motor Box MLI NPD+DPU -Xu MLI NPD+DPU +Yu MLI NPD +Zu MLI NPD +DPU -Yu Radiator Mother Board DPU Housing -Zu DPU Housing +Yu DPU Housing -Yu Radiation shield Predicted temp. in steady state [C], heaters are ON -33.66 -25.68 -25.67 -26.35 -26.34 -23.36 -23.23 -23.00 -24.29 -22.95 -15.20 -10.77 -11.02 -11.52 -11.67 -12.52 -12.92 -12.33 -11.89 -11.92 -11.90 -131.00 +168.79 -139.58 -127.68 -139.58 -11.45 -12.23 -12.29 -10.36 -10.36 -25.71 Predicted temp. in steady state [C], heaters are OFF -36.65 -29.33 -29.16 -26.86 -26.48 -25.24 -25.70 -28.18 -26.50 -27.16 -23.74 -20.95 -20.06 -17.93 -17.23 -16.65 -15.05 -19.17 -14.79 -14.69 -14.79 -131.14 +168.72 -139.67 -127.84 -139.67 -24.28 -19.42 -19.63 -21.07 -21.07 -30.35 Operational temp. [C] -60 to +120 -60 to +120 -80 to +100 -40 to +50 -40 to +50 -40 to +50 -40 to +50 -60 to +120 -40 to +50 -40 to +50 -60 to +200 -40 to +50 -40 to +50 -40 to +60 -40 to +60 -40 to +50 -40 to +50 -40 to +60 -60 to +120 -40 to +50 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120 -40 to +50 -60 to +200 -60 to +200 -60 to +200 -60 to +120
Thermal flux from MU unit to s/c: Q = +1.31 W to Q = +1.56 W.
ASPERA-4
Venus Express
: : : :
VE-ASP-DS-0002 3 Rev. : 1 2004-04-22 Page: 43
Min predicted temp. in transient state [C] -37.50 -30.07 -29.98 -28.46 -28.34 -28.77 -28.86 -28.80 -28.30 -27.83 -29.49 -29.03 -28.81 -28.24 -28.12 -28.80 -27.57 -28.79 -29.18 -29.03 -29.11 -134.56 -113.04 -139.28 -143.45 -142.18 -31.34 -28.78 -28.85 -29.31 -29.31 -30.96
Max predicted temp. in transient state [C] -19.41 -21.77 -21.86 -23.91 -24.29 -22.23 -22.13 -21.37 -23.43 -21.29 -18.45 -16.05 -16.70 -18.11 -18.18 -18.88 -19.56 -18.55 -20.74 -19.30 -19.21 -50.08 +168.67 +177.01 -75.58 +176.37 -15.90 -18.24 -18.28 -15.55 -15.55 -18.53
ASPERA-4
7.2.4
Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
Venus Express
: : : :
VE-ASP-DS-0002 3 Rev. : 1 2004-04-22 Page: 44
MU Operating hot case (3.1.4)

. Name ELS Top Plate ELS Housing ELS Deflector ELS HVPS (upper board) ELS HVPS (lower board) ELS MCP ELS FEE Board NPI Housing NPI Amplifier Board NPI MCP DPU Housing +Xu DPU DC/DC DPU Housekeeping Board DPU HV Board DPU Processor Board NPD1 NPD2 Motor Wheel Motor Box Motor Motor Board MLI Motor Box MLI NPD+DPU -Xu MLI NPD+DPU +Yu MLI NPD +Zu MLI NPD +DPU -Yu Radiator Mother Board DPU Housing -Zu DPU Housing +Yu DPU Housing -Yu Radiation shield Predicted temp. in steady state [C] +21.07 +38.02 +38.30 +44.18 +45.02 +42.53 +42.50 +43.17 +43.75 +44.18 +44.00 +48.93 +49.51 +56.56 +58.82 +47.37 +47.07 +48.55 +53.94 +57.87 +54.45 -117.39 -73.08 +187.65 -118.18 -128.14 +39.38 +48.52 +48.14 +47.15 +47.15 +41.27 Operational temp. [C] -60 to +120 -60 to +120 -80 to +100 -40 to +50 -40 to +50 -40 to +50 -40 to +50 -60 to +120 -40 to +50 -40 to +50 -60 to +200 -40 to +50 -40 to +50 -40 to +60 -40 to +60 -40 to +50 -40 to +50 -40 to +60 -60 to +120 -40 to +50 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120 -40 to +50 -60 to +200 -60 to +200 -60 to +200 -60 to +120
Thermal flux from MU unit to s/c: Q = +0.34 W.
ASPERA-4
Venus Express
: : : :
VE-ASP-DS-0002 3 Rev. : 1 2004-04-22 Page: 45
Min predicted temp. in transient state [C] +5.00 +18.85 +19.57 +33.91 +35.31 +28.95 +28.54 +19.69 +22.07 +22.18 +28.43 +36.19 +39.42 +45.38 +47.93 +38.69 +39.45 +35.22 +38.91 +43.01 +39.51 -119.48 -73.94 -105.69 -122.66 -128.15 +26.90 +35.52 +34.91 +34.45 +34.45 +14.97
Max predicted temp in transient state [C] +71.42 +47.91 +47.96 +50.89 +51.42 +48.06 +48.07 +43.31 +41.56 +43.57 +42.91 +47.53 +50.23 +54.98 +57.25 +46.34 +46.43 +45.91 +47.99 +51.97 +48.57 -25.33 +99.64 +188.51 -38.54 +187.46 +38.11 +46.28 +45.81 +45.72 +45.72 +41.35
ASPERA-4
7.2.5
Venus Express
: : : :
VE-ASP-DS-0002 3 Rev. : 1 2004-04-22 Page: 46
MU Operating hot case, Sensitivity to radiator and silver tape ageing (3.1.5)
Predicted temp. in steady state [C] +28.27 +46.58 +46.86 +52.64 +53.44 +51.02 +50.99 +52.44 +52.73 +53.29 +52.19 +56.86 +59.56 +64.19 +66.36 +55.13 +54.75 +56.35 +61.26 +65.18 +61.77 -116.06 -69.26 +188.34 -117.12 -126.84 +47.23 +56.37 +56.00 +55.09 +55.09 +50.77 Operational temp. [C] -60 to +120 -60 to +120 -80 to +100 -40 to +50 -40 to +50 -40 to +50 -40 to +50 -60 to +120 -40 to +50 -40 to +50 -60 to +200 -40 to +50 -40 to +50 -40 to +60 -40 to +60 -40 to +50 -40 to +50 -40 to +60 -60 to +120 -40 to +50 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120 -40 to +50 -60 to +200 -60 to +200 -60 to +200 -60 to +120
Thermal flux from MU unit to s/c: Q = +0.97 W.
ASPERA-4
Venus Express
: : : :
VE-ASP-DS-0002 3 Rev. : 1 2004-04-22 Page: 47
Max predicted temp. in transient state [C] +86.60 +53.00 +54.77 +60.26 +60.69 +57.18 +57.20 +52.22 +50.20 +52.26 +50.26 +54.49 +57.09 +61.61 +63.78 +53.02 +53.01 +52.33 +52.91 +56.90 +53.51 -24.13 +99.95 +188.51 -38.06 +188.54 +45.05 +52.87 +52.39 +52.67 +52.67 +50.50
Operational tem. [C] -60 to +120 -60 to +120 -80 to +100 -40 to +50 -40 to +50 -40 to +50 -40 to +50 -60 to +120 -40 to +50 -40 to +50 -60 to +200 -40 to +50 -40 to +50 -40 to +60 -40 to +60 -40 to +50 -40 to +50 -40 to +60 -60 to +120 -40 to +50 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120 -40 to +50 -60 to +200 -60 to +200 -60 to +200 -60 to +120
ASPERA-4
7.2.6
Node 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
Venus Express
: : : :
VE-ASP-DS-0002 3 Rev. : 1 2004-04-22 Page: 48
MU Operating hot case A (3.1.6)

. Name ELS Top Plate ELS Housing ELS Deflector ELS HVPS (upper board) ELS HVPS (lower board) ELS MCP ELS FEE Board NPI Housing NPI Amplifier Board NPI MCP DPU Housing +Xu DPU DC/DC DPU Housekeeping Board DPU HV Board DPU Processor Board NPD1 NPD2 Motor Wheel Motor Box Motor Motor Board MLI Motor Box MLI NPD+DPU -Xu MLI NPD+DPU +Yu MLI NPD +Zu MLI NPD +DPU -Yu Radiator Mother Board DPU Housing -Zu DPU Housing +Yu DPU Housing -Yu Radiation shield Predicted temp. in steady state [C] +17.03 +33.23 +33.51 +39.34 +40.17 +37.41 +37.37 +38.08 +38.73 +38.99 +37.80 +42.37 +45.12 +50.01 +52.33 +40.79 +40.50 +40.33 +41.32 +41.30 +41.30 -119.75 -79.00 +185.34 -119.11 -129.26 +33.43 +40.83 +40.34 +40.55 +40.55 +36.61 Operational temp. [C] -60 to +120 -60 to +120 -80 to +100 -40 to +50 -40 to +50 -40 to +50 -40 to +50 -60 to +120 -40 to +50 -40 to +50 -60 to +200 -40 to +50 -40 to +50 -40 to +60 -40 to +60 -40 to +50 -40 to +50 -40 to +60 -60 to +120 -40 to +50 -40 to +60 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -250 to +290 -60 to +120 -40 to +50 -60 to +200 -60 to +200 -60 to +200 -60 to +120
Thermal flux from s/c to MU unit: Q = -0.74 W.
ASPERA-4
Venus Express
: : : :
VE-ASP-DS-0002 3 Rev. : 1 2004-04-22 Page: 49
Max predicted temp in transient state [C] +68.01 +43.09 +43.13 +46.01 +46.52 +42.49 +42.55 +38.20 +36.49 +38.35 +36.66 +40.92 +43.58 +48.36 +50.69 +39.71 +39.83 +37.63 +35.12 +35.15 +35.16 -25.13 +99.72 +188.30 -38.04 +187.21 +32.11 +38.53 +37.96 +39.07 +39.07 +36.67
ASPERA-4
8 CONCLUSIONS
1. 2.
Venus Express
: : : :
VE-ASP-DS-0002 3 Rev. : 1 2004-04-22 Page: 50
The IMA unit thermal control allows good results on keeping representative IMA nodes in their required temperature range for the all its cold cases. For the hot case (2.1.4) all temperatures of the IMA nodes are corresponded to its operational levels on the Communication phase. On the Observation phase all temperatures of the IMA nodes are corresponded to its operational levels but temperatures of nodes ## 6,7,8 are not satisfied to margin requirements (10 deg.). For the hot case (2.1.5) all temperatures of the IMA nodes are also corresponded to its operational levels on the Communication phase. On the Observation phase all temperatures of the IMA nodes are corresponded to its operational levels but temperatures of nodes ## 6,7,8,12 are not satisfied to margin requirements (10 deg.). The MU unit thermal control allows good results on keeping representative MU nodes in their required temperature range for the all cold cases. For the hot operational case (3.1.4) temperature of scanner motor (57.87) is great than required (50) on steady state before beginning of the Observation phase. At the same state temperatures of electronics boards are some lower than their operational limits but not satisfy to margin requirements (10 deg.). On the Observation phase temperatures of nodes #4(50.89), #5(51.42), #13(50.23), 20(51.97) are great than required (50) and temperatures of nodes ## 6,7,9,10,12,14,15,16,17,21,28 are lower than their operational limits but not satisfy to margin requirement (10 deg.). In hot operational case (3.1.6 / scanner motor is OFF) on steady state at the Communication phase temperatures of nodes ##5,12,13,15,16,17,28 are lower than their operational limits but not satisfy to margin requirements (10 deg.). On the Observation phase temperatures of nodes ## 4,5,6,7,12,13 are also lower than their operational limits but not satisfy to margin requirements (10 deg.). In hot operational case (sensitivity to radiator and silver tape aging) temperatures of motor and electronic boards are get out of their required temperature range both steady state and transient state on the all phases of orbital flight.
3.
4. 5.
6.
7.

VE-ASP-DS-0002 (Thermal Analysis and Thermal Design - I3R1)

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ASPERA-4

Reference Issue Date Volume

VE-ASP-DS-0002 3 Rev. : 1 2004-04-22 Page: 1

Thermal Analysis and Thermal Design

Date 2004-04-22 2004-04-27 2004-04-28

Reference Issue Date Volume

VE-ASP-DS-0002 3 Rev. : 1 2004-04-22 Page: 2

Remarks New document New document New document

2003-04-14 2003-11-26 2004-04-08 2004-04-22

Reference Issue Date Volume

VE-ASP-DS-0002 3 Rev. : 1 2004-04-22 Page: 3

THERMAL MODEL DESCRIPTION .................................................................... 4

IMA THERMAL ANALYSIS CASES ..................................................................... 8

MU THERMAL ANALYSIS CASES..................................................................... 12

Reference Issue Date Volume

VE-ASP-DS-0002 3 Rev. : 1 2004-04-22 Page: 4

Reference Issue Date Volume

VE-ASP-DS-0002 3 Rev. : 1 2004-04-22 Page: 5

Observation phase (s/c altitude is below 10000 km)

Stop 65 min eclipse

Start 45 min eclipse

Start 65 min eclipse

Stop 45 min eclipse Start 4h high altitude imaging

Stop 4h high altitude imaging

Figure 1 Operation orbit timeline

Reference Issue Date Volume

VE-ASP-DS-0002 3 Rev. : 1 2004-04-22 Page: 6

Figure 2 Ion Mass Analyser, IMA

Reference Issue Date Volume

VE-ASP-DS-0002 3 Rev. : 1 2004-04-22 Page: 7

Figure 3 Main Unit, MU

Reference Issue Date Volume

VE-ASP-DS-0002 3 Rev. : 1 2004-04-22 Page: 8

IMA Cold case 2

IMA Cold case 2A, Sensitivity analysis

Reference Issue Date Volume

VE-ASP-DS-0002 3 Rev. : 1 2004-04-22 Page: 9

Observation phase Start 45 min eclipse

Stop 45 min eclipse Start 4h high altitude imaging

Stop 4h high altitude imaging

Figure 4 IMA Cold case (Venus orbit)

Reference Issue Date Volume

VE-ASP-DS-0002 3 Rev. : 1 2004-04-22 Page: 10

IMA Hot case, Sensitivity to radiator ageing

Reference Issue Date Volume

VE-ASP-DS-0002 3 Rev. : 1 2004-04-22 Page: 11

Observation phase Stop 65 min eclipse

Start 65 min eclipse Start 4h high altitude imaging

Stop 4h high altitude imaging

Figure 5 IMA Hot case

Reference Issue Date Volume

VE-ASP-DS-0002 3 Rev. : 1 2004-04-22 Page: 12

The following MU thermal analysis cases have been considered:

MU Cold case 2A, Sensitivity analysis

Reference Issue Date Volume

VE-ASP-DS-0002 3 Rev. : 1 2004-04-22 Page: 13

Observation phase Start 45 min eclipse

Stop 45 min eclipse Start 4h high altitude imaging

Stop 4h high altitude imaging

Figure 6 MU Cold case (Venus orbit)

Reference Issue Date Volume

VE-ASP-DS-0002 3 Rev. : 1 2004-04-22 Page: 14

Reference Issue Date Volume