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VSK.56.. Series
Vishay High Power Products

ADD-A-PAK Generation VII Power Modules Standard Diodes, 60 A

FEATURES
High voltage Industrial standard package UL pending 3500 VRMS isolating voltage Low thermal resistance Totally lead (Pb)-free
ADD-A-PAK

Designed and qualified for industrial level

BENEFITS PRODUCT SUMMARY

IF(AV) 60 A

Excellent thermal performances obtained by the usage of exposed direct bonded copper substrate Up to 1600 V High surge capability

MECHANICAL DESCRIPTION
The ADD-A-PAK generation VII, new generation of ADD-A-PAK module, combines the excellent thermal performances obtained by the usage of exposed direct bonded copper substrate, with advanced compact simple package solution and simplified internal structure with minimized number of interfaces.

Easy mounting on heatsink

ELECTRICAL DESCRIPTION
These modules are intended for general purpose high voltage applications such as high voltage regulated power supplies, lighting circuits, temperature and motor speed control circuits, UPS and battery charger.

MAJOR RATINGS AND CHARACTERISTICS

SYMBOL IF(AV) IF(RMS) IFSM I2 t I2t VRRM TJ TStg Range 50 Hz 60 Hz 50 Hz 60 Hz CHARACTERISTICS 114 C VALUES 60 94 1300 1360 8.44 7.68 84.5 400 to 1600 - 40 to 150 kA2s kA2s V C A UNITS

Document Number: 94625 Revision: 17-Dec-08

For technical questions, contact: ind-modules@vishay.com

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VSK.56.. Series
Vishay High Power Products ADD-A-PAK Generation VII Power Modules
Standard Diodes, 60 A
ELECTRICAL SPECIFICATIONS VOLTAGE RATINGS
TYPE NUMBER VOLTAGE CODE 04 06 08 VSK.56 10 12 14 16 VRRM, MAXIMUM REPETITIVE PEAK REVERSE VOLTAGE V 400 600 800 1000 1200 1400 1600 VRSM, MAXIMUM NON-REPETITIVE PEAK REVERSE VOLTAGE V 500 700 900 1100 1300 1500 1700 10 IRRM MAXIMUM AT TJ = 150 C mA

FORWARD CONDUCTION
PARAMETER Maximum average forward current at case temperature Maximum RMS forward current SYMBOL IF(AV) IF(RMS) TEST CONDITIONS 180 conduction, half sine wave DC at 90 C case temperature t = 10 ms Maximum peak, one-cycle forward, non-repetitive surge current IFSM t = 8.3 ms t = 10 ms t = 8.3 ms t = 10 ms Maximum I2t for fusing I2t t = 8.3 ms t = 10 ms t = 8.3 ms Maximum I2t for fusing Low level value of threshold voltage High level value of threshold voltage Low level value of forward slope resistance High level value of forward slope resistance Maximum forward voltage drop I2t VF(TO)1 VF(TO)2 rf1 rf2 VFM No voltage reapplied 100 % VRRM reapplied No voltage reapplied 100 % VRRM reapplied VALUES 60 114 94 1300 1360 1090 Sinusoidal half wave, intitial TJ = TJ maximum 1140 8.44 7.68 5.97 5.43 84.5 0.74 0.86 3.94 m (I > x IF(AV)), TJ = TJ maximum IFM = x IF(AV), TJ = 25 C, tp = 400 s square wave 3.43 1.6 V kA2s V kA2s A UNITS A C

t = 0.1 ms to 10 ms, no voltage reapplied (16.7 % x x IF(AV) < I < x IF(AV)), TJ = TJ maximum (I > x IF(AV)), TJ = TJ maximum (16.7 % x x IF(AV) < I < x IF(AV)), TJ = TJ maximum

BLOCKING
PARAMETER Maximum peak reverse leakage current RMS insulation voltage SYMBOL IRRM VINS TJ = 150 C 50 Hz, 1 s TEST CONDITIONS VALUES 10 3500 UNITS mA V

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Document Number: 94625 Revision: 17-Dec-08

VSK.56.. Series
ADD-A-PAK Generation VII Power Modules Vishay High Power Products Standard Diodes, 60 A
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER Junction and storage temperature range Maximum internal thermal resistance, junction to case per leg Typical thermal resistance, case to heatsink per module to heatsink Mounting torque 10 % busbar Approximate weight Case style JEDEC SYMBOL TJ, TStg RthJC RthCS DC operation Mounting surface flat, smooth and greased A mounting compound is recommended and the torque should be rechecked after a period of 3 hours to allow for the spread of the compound. TEST CONDITIONS VALUES - 40 to 150 0.33 C/W 0.1 4 Nm 3 75 2.7 g oz. UNITS C

TO-240AA compatible

R CONDUCTION PER JUNCTION

DEVICES VSK.56 SINE HALF WAVE CONDUCTION 180 0.115 120 0.136 90 0.173 60 0.236 30 0.346 180 0.09 RECTANGULAR WAVE CONDUCTION 120 0.145 90 0.185 60 0.243 30 0.349 UNITS C/W

Note Table shows the increment of thermal resistance RthJC when devices operate at different conduction angles than DC

Document Number: 94625 Revision: 17-Dec-08

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VSK.56.. Series
Vishay High Power Products ADD-A-PAK Generation VII Power Modules
Standard Diodes, 60 A
Maximum allowable case temperature (C) Maximum average forward power loss (W)

150
RthJC (DC) = 0.33C/W

120 100 80 60 40 20
Per leg, Tj = 150C

140

180 120 90 60 30

130

DC RMS limit

120
180 120 90 60 30

110

100 0 10 20 30 40 50 60 70
Average forward current (A)

0 0 20 40 60 80 100
Average forward current (A)

Fig. 1 - Current Ratings Characteristics

Fig. 4 - Foward Power Loss Characteristics

Maximum allowable case temperature (C)

Peak half sine wave forward current (A)

150
RthJC (DC) = 0.33C/W

1200
At any rated load condition and with rated Vrrm applied following surge Initial Tj = Tj max @ 60 Hz 0.0083 s @ 50 Hz 0.0100s

140

1000

130

800

120
180 120 90 60 30

600

110

400

Per leg

100 0 20 40 60 80 100
Average forward current (A)

200 1 10 100
Number of equal amplitude half cycle current pulses (N)

Fig. 2 - Current Ratings Characteristics

Fig. 5 - Maximum Non-Repetitive Surge Current

Maximum average forward power loss (W)

90 80 70 60 50 40 30 20 10 0 0 10 20 30 40 50 60 70
Average forward current (A)
Peak half sine wave forward current (A)
180 120 90 60 30

1400 1200 1000 800 600 400 200 0.01

Maximum Non-repetitive Surge Current Versus Pulse Train Duration. Initial Tj = 150C No Voltage Reapplied Rated Vrrm reapplied

RMS limit

Per leg

Per leg, Tj = 150C

0.1
Pulse train duration (s)

Fig. 3 - Forward Power Loss Characteristics

Fig. 6 - Maximum Non-Repetitive Surge Current

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Document Number: 94625 Revision: 17-Dec-08

VSK.56.. Series
ADD-A-PAK Generation VII Power Modules Vishay High Power Products Standard Diodes, 60 A
120
Maximum total forward power loss (W)

0 0
180 (Sine)
RthSA = 0.5 C/W 0.7 C/W 1 C/W 1.5 C/W 2 C/W 3 C/W 7 C/W

100 80 60 40 20 0 0 20 40 60 80
Total RMS output current (A)

0
DC

0 0
VSK.56 Series 0 Per leg, Tj = 150C

0 100 20 0

40

60

80 100 120 140 160

Maximum allowable ambient temperature (C)

Fig. 7 - Forward Power Loss Characteristics

500
Maximum total power loss (W)
180 (sine) 180 (rect)
RthSA = 0.1 C/W 0.2 C/W 0.3 C/W 0.5 C/W 1 C/W

400

300

200

100

2 x VSK.56 Series single phase bridge connected Tj = 150C

0 0 20 40 60 80 100 120 140 160 20 0

40

60

80 100 120 140 160

Total output current (A)

Maximum allowable ambient temperature (C)

Fig. 8 - Forward Power Loss Characteristics

500
Maximum total power loss (W)

400
120 (rect)

300

RthSA = 0.3C/W 0.4 C/W 0.5 C/W 0.7 C/W 1 C/W 1.5 C/W 3 C/W

200

100

3 x VSK.56 Series three phase bridge connected Tj = 150C

0 0 20 40 60 80 100 120 140 160 20 0

40 60 80 100 120 140 160
Total output current (A) Maximum allowable ambient temperature (C)

Fig. 9 - Forward Power Loss Characteristics

Document Number: 94625 Revision: 17-Dec-08

For technical questions, contact: ind-modules@vishay.com

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VSK.56.. Series
Vishay High Power Products ADD-A-PAK Generation VII Power Modules
Standard Diodes, 60 A
1000
Instantaneous forward current (A)
Per leg

100

10 Tj = 150C Tj = 25C 1 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
Instantaneous forward voltage (V)

Fig. 10 - Forward Voltage Characteristics

Transient thermal impedance Z thJC (C/W)

1 Steady state value RthJC = 0.33 C/W (DC operation)

0.1 Per leg

0.01 0.001

0.01

0.1
Square wave pulse duration (s)

10

Fig. 11 - Thermal Impedance ZthJC Characteristics

ORDERING INFORMATION TABLE

Device code

VSK
1 1 2 3 4 -

D
2

56
3

16
4

Module type Circuit configuration (see end of datasheet) Current code (60 A) Voltage code (see Voltage Ratings table)

Note To order the optional hardware go to www.vishay.com/doc?95172

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Document Number: 94625 Revision: 17-Dec-08

VSK.56.. Series
ADD-A-PAK Generation VII Power Modules Vishay High Power Products Standard Diodes, 60 A
CIRCUIT CONFIGURATION
VSKD...
(1)

VSKE...
(1)

VSKJ...
(1)

VSKC...
(1)

~
1

D = 2 diodes in series

E = Single diode

+
(2)

(2)

+
(2)

+
(2)

J = 2 diodes/common anode C = 2 diodes/common cathode

(3) (3)

(3)

+
(3)

LINKS TO RELATED DOCUMENTS Dimensions http://www.vishay.com/doc?95369

Document Number: 94625 Revision: 17-Dec-08

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Outline Dimensions
Vishay High Power Products

ADD-A-PAK Generation VII - Diode

DIMENSIONS in millimeters (inches)
Viti M5 x 0.8 Screws M5 x 0.8 18 (0.7) REF. 6.7 0.3 (0.26 0.012)

30 0.5 (1.18 0.020)

35 REF.

29 0.5 (1 0.020)

80 0.3 (3.15 0.012) 22.6 0.2 (0.89 0.008)

2 3
7 6

6.3 0.2 (0.248 0.008)

15 0.5 (0.59 0.020) 20 0.5 (0.79 0.020) 20 0.5 (0.79 0.020) 92 0.75 (3.6 0.030)

4 5

24 0.5 (1 0.020)

Document Number: 95369 Revision: 11-Nov-08

For technical questions concerning discrete products, contact: diodes-tech@vishay.com For technical questions concerning module products, contact: ind-modules@vishay.com

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V I S H AY H I G H POW E R P R O D U C T S

Modules

Application Note

Mounting Instructions for ADD-A-PAK Generation VII

Generation VII ADD-A-PAK (AAP) power modules combine the excellent thermal performance enabled by a direct bonded copper (Al2O3) substrate, superior mechanical ruggedness, and an environmentally friendly manufacturing process that eliminates the use of hard molds, thus reducing direct stresses on the leads. To prevent axial pull-out, the electrical terminals are co-molded to the module housing. The VSK series of AAP modules uses glass passivated and Schottky power diodes and thyristors in circuit configurations including common anode, common cathode, half-bridge, and single switch. The semiconductors are internally connected through wire-bonding and electrically isolated from the bottom baseplate, allowing the use of a common heatsink and enabling a more compact overall assembly.

SPECIFYING THE HEATSINK

The heat generated by the module has to be dissipated with a heatsink. Typically natural or forced air cooling is used. To optimize the device performance, the contact surface of the heatsink must be flat, with a recommended flatness of 0.03 mm ( 1.18 mils) and a levelling depth of less than 0.02 mm ( 0.79 mils), according to DIN/ISO 1302. A milled or machined surface is generally satisfactory if prepared with tools in good working condition. The heatsink mounting surface must be clean, with no dirt, corrosion, or surface oxide. It is very important to keep the mounting surface free from particles exceeding 0.05 mm (2 mils) in thickness, provided a thermal compound is used.

INTRODUCTION
Major AAP Generation VII module features High blocking voltage up to 1600 V Industrial standard package style, fully compatible with TO-240AA High isolation capability up to VRMS = 3500 V High surge capability with IFSM up to 3000 A No toxic material: Completely lead (Pb)-free, RoHS and UL compliant Elimination of copper base plate reduces weight to 75 g Elimination of process steps requiring usage of chemicals and related waste treatment promotes a cleaner and more environmentally friendly manufacturing process These features allow AAP Generation VII modules to fit into existing standardized assembly processes. Important factors in the assembly process include Heatsink design PCB, busbar, and cable design Power leads size/area Distance from adjacent heat-generating parts The implications of these items and the requirements for assembly of AAP Generation VII modules are discussed over the following pages.

MOUNTING OPERATIONS
The AAP Generation VII modules are designed with an exposed DBC Al2O3 substrate. This is used to optimize the thermal behavior of the module. To reduce the risk of damage during mounting, the ceramic has been given additional mechanical ruggedness in the form of two separate 15.8 mm by 21.1 mm (0.62" by 0.83") pieces of DBC substrate, which can be seen in the photo below.

APPLICATION NOTE

Before mounting, inspect the module to insure that the contact surface of the bottom substrate is clean and free of any lumps or bulges that could damage the device or impede heat transfer across its surface.

Document Number: 95043 Revision: 17-Dec-08

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Application Note
Vishay High Power Products

Mounting Instructions for ADD-A-PAK Generation VII

Next, make a uniform coating on the heatsink mounting surfaces and module substrate with a good quality thermal compound. Screen printing of the compound is recommended, as well as direct application through a roller or spatula. The datasheet values for thermal resistance assume a uniform layer of thermal compound with a maximum thickness of 0.08 mm. The thermal conductivity of the compound should be no less than 0.5 W/mK. Apply uniform pressure on the package to force the compound to spread over the entire contact area, and check the device bottom surface to verify full and uniform coverage. Bolt the module to the heatsink using the two fixing holes.

SOLDERING TO THE PCB

The signal terminal (gate and auxiliary cathode) pins of AAP Gen VII modules based on thyristors can be soldered to the PCB using hand iron or wave soldering processes. The PCB should be designed with appropriate tolerances on the hole diameters, and soldering must be done without imposing any mechanical stress on the module pins (pulling and tensioning the pins). To prevent overheating of the device, the soldering time should not exceed 8 to 10 seconds at a temperature of 260 C. Alternatively, a fast-on cable connector can be used to contact the signal pins.

An even amount of torque should be applied for each individual mounting screw. An M6 screw should be used with lock washers. A torque wrench, which is accurate in the specified range, must be used in mounting the module to achieve optimum results. The first mounting screw should be tightened to one third of the recommended torque; the second screw should then be tightened to the same torque. Full tightening of both the screws can then be completed by applying the recommended torque (see data in bulletins). Over-tightening the mounting screw may lead to deformation of the package, which would hence increase the thermal resistance and damage the semiconductors. After a period of three hours, check the torque with a final tightening in opposite sequence to allow the spread of the compound.

APPLICATION NOTE

Power terminals can be screwed to busbars and/or flexible cables with eyelets. We recommend the use of M5 screws with spring washers. Users should consult published datasheets to determine the optimal torque. AAP Generation VII modules are designed to guarantee a good and reliable contact even at 3 10 % Nm on a busbar, so there is no need to apply an especially high level of force to obtain a good and reliable connection.

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Document Number: 95043 Revision: 17-Dec-08