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Product specification
BT139 series E
PINNING - TO220AB
PIN 1 2 3 tab DESCRIPTION main terminal 1
PIN CONFIGURATION
tab
SYMBOL
T2
main terminal 2 gate main terminal 2
1 23
T1
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134). SYMBOL VDRM IT(RMS) ITSM PARAMETER Repetitive peak off-state voltages RMS on-state current Non-repetitive peak on-state current I2t for fusing Repetitive rate of rise of on-state current after triggering full sine wave; Tmb 99 C full sine wave; Tj = 125 C prior to surge; with reapplied VDRM(max) t = 20 ms t = 16.7 ms t = 10 ms ITM = 20 A; IG = 0.2 A; dIG/dt = 0.2 A/s T2+ G+ T2+ GT2- GT2- G+ CONDITIONS MIN. -40 -500 5001 MAX. -600 6001 16 140 150 98 50 50 50 10 2 5 5 0.5 150 125 -800 800 UNIT V A A A A2s A/s A/s A/s A/s A V W W C C
I2t dIT/dt
Peak gate current Peak gate voltage Peak gate power Average gate power Storage temperature Operating junction temperature
1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the triac may switch to the on-state. The rate of rise of current should not exceed 15 A/s. February 1996 1 Rev 1.100
Philips Semiconductors
Product specification
BT139 series E
TYP. 60
Thermal resistance full cycle junction to mounting base half cycle Thermal resistance in free air junction to ambient
STATIC CHARACTERISTICS
Tj = 25 C unless otherwise stated SYMBOL IGT PARAMETER Gate trigger current CONDITIONS VD = 12 V; IT = 0.1 A T2+ G+ T2+ GT2- GT2- G+ T2+ G+ T2+ GT2- GT2- G+ MIN. 0.25 TYP. 2.5 4.0 5.0 11 3.2 16 4.0 5.5 4.0 1.2 0.7 0.4 0.1 MAX. 10 10 10 25 30 40 30 40 30 1.6 1.5 0.5 UNIT mA mA mA mA mA mA mA mA mA V V V mA
IL
Latching current
VD = 12 V; IGT = 0.1 A
IH VT VGT ID
Holding current On-state voltage Gate trigger voltage Off-state leakage current
DYNAMIC CHARACTERISTICS
Tj = 25 C unless otherwise stated SYMBOL dVD/dt tgt PARAMETER Critical rate of rise of off-state voltage Gate controlled turn-on time CONDITIONS VDM = 67% VDRM(max); Tj = 125 C; exponential waveform; gate open circuit ITM = 20 A; VD = VDRM(max); IG = 0.1 A; dIG/dt = 5 A/s MIN. TYP. 50 2 MAX. UNIT V/s s
February 1996
Rev 1.100
Philips Semiconductors
Product specification
BT139 series E
25
Ptot / W
BT139
Tmb(max) / C = 180
95
20
IT(RMS) / A
BT139
20
1
120 90
101
99 C 15
15
60 30
107
10
113
10
5
5 119
10 IT(RMS) / A
15
125 20
0 -50
50 Tmb / C
100
150
Fig.1. Maximum on-state dissipation, Ptot, versus rms on-state current, IT(RMS), where = conduction angle.
BT139
Fig.4. Maximum permissible rms current IT(RMS) , versus mounting base temperature Tmb.
BT139
1000
ITSM / A
50
IT(RMS) / A
40
30
100 dI T /dt limit T2- G+ quadrant IT T 10 10us I TSM time
20
10
0 0.01
10
Fig.2. Maximum permissible non-repetitive peak on-state current ITSM, versus pulse width tp, for sinusoidal currents, tp 20ms.
ITSM / A BT139 IT T 100 ITSM time
Fig.5. Maximum permissible repetitive rms on-state current IT(RMS), versus surge duration, for sinusoidal currents, f = 50 Hz; Tmb 99C.
VGT(Tj) VGT(25 C)
150
BT136
50
0.8 0.6
1000
0.4 -50
50 Tj / C
100
150
Fig.3. Maximum permissible non-repetitive peak on-state current ITSM, versus number of cycles, for sinusoidal currents, f = 50 Hz.
Fig.6. Normalised gate trigger voltage VGT(Tj)/ VGT(25C), versus junction temperature Tj.
February 1996
Rev 1.100
Philips Semiconductors
Product specification
BT139 series E
3 2.5 2 1.5
IGT(Tj) IGT(25 C)
50
IT / A Tj = 125 C Tj = 25 C
BT139
40
typ
Vo = 1.195 V Rs = 0.018 Ohms
max
30
20
1 0.5 0 -50
10
50 Tj / C
100
150
0.5
1.5 VT / V
2.5
Fig.7. Normalised gate trigger current IGT(Tj)/ IGT(25C), versus junction temperature Tj.
IL(Tj) IL(25 C)
3 2.5 2 1.5 1
TRIAC
10
BT139
unidirectional bidirectional
0.1
P D tp
0.01
0.5 0 -50
0.001 10us 0.1ms 1ms 10ms tp / s 0.1s 1s
50 Tj / C
100
150
10s
Fig.8. Normalised latching current IL(Tj)/ IL(25C), versus junction temperature Tj.
IH(Tj) IH(25C)
Fig.11. Transient thermal impedance Zth j-mb, versus pulse width tp.
dVD/dt (V/us)
TRIAC
1000
100
10
0 -50
50 Tj / C
100
150
50 Tj / C
100
150
Fig.9. Normalised holding current IH(Tj)/ IH(25C), versus junction temperature Tj.
Fig.12. Typical, critical rate of rise of off-state voltage, dVD/dt versus junction temperature Tj.
February 1996
Rev 1.100
Philips Semiconductors
Product specification
BT139 series E
3,7 2,8
5,9 min
15,8 max
3,0
13,5 min
1,3 max 1 2 3 (2x)
2,54 2,54
0,6 2,4
February 1996
Rev 1.100
Philips Semiconductors
Product specification
BT139 series E
This data sheet contains target or goal specifications for product development. This data sheet contains final product specifications.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V. 1996 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights.
February 1996
Rev 1.100