Contents 1. Acknowledgement 2. Declaration 3. Preface 4. Company Profile and Organization Structure i. History ii. Redington Motorola Service iii.

Company Products iv. Impact of Indian Market on Service Industry v. Motorola India at a Glance vi. India Firsts vii. Motorola Achievements and History 5. Industrial Training and Importance 6. What I have learned 7. BGA Rework Process i. ESD Handling ii. BGA Rework, Part Removal, Replacement and Inspection iii. Reflow 8. IR Rework i. Lead Free Rework ii. Advantages 9. Various Tools Used in Service i. Hakko ii. Magnifying Lens iii. RF Tester 10. Different Models Available 11. Technical Description of L6 12. Common Faults and their Diagnoses detail Calibration and testing 13. Software Up gradation Procedure 14. Analysis and Conclusion 15. Bibliography 16. Annexure ATTACHED

17. 18. 19. 20.

Service Manual of L6 Field Service Bulletin Presentation Slides CD for Soft copy of Report and Presentation

List of Diagrams 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. Various Tools Used in Service Picture of Motorola A1200, C118, V3, MPX 200 Exploded diagram of L6 Chipset/Circuit L6 ATI Charging Circuit Atlas Software Up gradation Process Diagram Software Tools Diagram DM Tool RSD Lite Radio Comm

ACKNOWLEDGEMENT I Ashwani Dhiman a student of esteemed University Kurukshetra University have unde rgone 6 weeks training at Redington India Ltd. (Motorola Service) as a part of my curriculum. I am very thankful to Mr. Umesh Kadam Engineer-Technical Support and Mr. Hemraj Sharma Manager-Customer Support providing me this opportunity. I have no words t o acknowledge the encouragement, guidance, invaluable direction and meticulous a ttention during this training without the help of which it would have been diffi cult to complete my training in such a fine way. I am highly indebted to Ms. Rita Tamak & Mr. Puneet Bansal, of University Institute of Engineering and Te chnology, for his invaluable suggestions to make this training successful. I cer tainly would not have accomplished what I have without his guidance, support and cooperation. Last but not the least I would like to thank, Ms. Anu Batra Service Coordinator, Ms. Charu Seth Service Coordinator Redington service for their efforts and con stant cooperation throughout my training. I am also thankful to Mr. Alokdeep Hea d-Service Operations North India, Motorola India Gurgaon.

Ashwani Dhiman B Tech E CE 2505162 DECLARATION I here by declare that the work done during training and training report is of my own effort. I here by declare that the report of the industrial training entitled Mo torola Mobile Service and BGA Rework has not been presented as a part of any oth er degree or any other academic work except to University Institute of Engineeri ng and Technology for fulfillment of the requirement for the award of B.Tech deg ree. This is an original work done by me and there is nothing confidential in th is project report.

Ashwani Dhiman 2 505162 ECE

PREFACE Project/Dissertation work is a major part of our course. It is a period in which we are introduced to the industrial environment .The objective of Project/Disse rtation work is to raise the level of performance in by providing new knowledge and information relevant to a job by teaching new trends, by imbuing an individu al with new attitudes, motives and other personality characteristics. Practical training is an important part of theoretical studies. It covers all th at remains uncovered in the classroom i.e. without it our studies remains ineffe ctive and incomplete. It explores a student to an invaluable treasure of experi ence and offers an exposure to real management in a business organization.

It is a well-known fact that practical training plays a very important role in f uture building of an individual. Only gaining theoretical knowledge is just not sufficient for success in life, practical training is a must and I have been giv en an opportunity to gain practical experience at Redington Motorola Service. I avail this instance in a very satisfactory manner and think it will be very bene ficial for me in building my future.

Company Profile Organization Structure Motorola Mobile Service Organizations Are Known By The Company They Keep Motorola Service partner global leader Redington, in their commitment to providi ng world-class service to their customers, across the Indian sub-continent. An organizations heritage is its unwritten asset for life Redington Service, an integral division of Redington (India) Limited, was establ ished at Chennai, India, in 1993 with the objective of providing comprehensive s ervice support for IT products including technical help desks, repair and refurb ishment services, warehousing support, facility management service and logistics services. Within a short span of 14 years the Company has successfully transformed itself from a pure IT products distribution firm with traditional cash and carry model to a leading integrated Supply Chain Solution Provider Service Partnership Redington Service Partners are global leaders including Hewlett Packard, IBM, Co mpaq, Presario, Samsung, APC, Motorola, Huawei, Jinpeng, UT Starcom, Krome. Service provided by Redington Warranty Post Warranty Accessories Sales Company Policy We, at Redington Service, are committed, to satisfy, the mutually agreed needs o f our customers and principals in the areas of service delivery, to meet the rep

air standards cost effectively and to strive continuously for improving service deliverables.

Organization Structure Redington Motorola Service Provide comprehensive service support IT products as well as Telecom products Effective Supply Chain infrastructure Management Efficient Utilization of Management Information System Technical help desks, repair and refurbishment service Warehousing support, facility management service Logistics services. 40 Leading Manufacturer Principles 12000 Channel Partner In India 15000 channel partners globally Rs.90614 million turnover for FY 2006-07

Mr. M. Raghunandan Executive Director Mr.S.V.Rao Head - Strategic Business Unit (Services)

Redington (India) Ltd. SPL Guindy House 95 Mount Road, Guindy, Chennai 600 032 Tel: +91 44 4224 3353 Redington India Ltd. SCO 5, 1st Floor Sec 20D Chandigarh

Motorola Excellence Centre 415/2 Mehrauli-Gurgaon Road Sector 14, Gurgaon 122001

Motorola India at a Glance Headquarters: Gurgaon Sales Offices: Delhi, Mumbai and Bangalore 5 R&D centres in India Bangalore Motorola Labs, Global Software Group, Core Network Division Hyderabad Motorola Software Group Manufacturing plant at Sriperumbudur near Chennai in 2007 Amit Sharma: County President, Motorola India Founded : 1928, Sep 25 as Galvin Manufacturing Corporation in Chicago by Paul V . Galvin & Joseph Galvin Headquarters :USA CEO : Edward Zander Industry : Telecommunication Revenue : $41.2 billion USD

Net Income : $4.578 billion USD Employees : 66000

Motorola India Products Embedded Systems Microprocessors Two Way Radios Networking Systems Mobile Phones Motorola is a Fortune 100 global communications leader that provides Seamless Mo bility products and solutions across broadband, embedded systems and wireless ne tworks. Seamless Mobility harnesses the power of technology convergence and enab les smarter, faster, cost-effective and flexible communication to reach the peop le, things and information you need at your home, auto, workplace and all spaces in between. Motorola is structured into the following three businesses: Mobile Devices Malcolm Dawe Vice President & General Manager-Mobile Devices (India) Sudhir Agarwal: Director Sales, India, Nepal & Sri Lanka Lloyd Mathias: Marketing Director India Offers market-changing icons of personal technology - transforming the device fo rmerly known as the cellphone into a universal remote control for life. A leader in multi-mode, multiband communications products and technologies, Mobile Devic es division designs, sells and services wireless subscriber and server equipment for cellular systems, portable energy storage products and systems, servers and software solutions, related software and accessory products. India: R&D Hub Mohan Kumar Vice President & General Manager Motorola has developed India as a global hub for cutting edge R&D work, includin g technologies and applications of the future, enabling the Seamless Mobility ex perience. India is also a major centre for sourcing software sol sol. Motorola opened its first R&D facility in India in 1991 and has 5 R&D centers in the country now. The R&D centers at Bangalore and Hyderabad are engaged in creating the technolog y, applications and unifying architecture to realize Motorola s vision of Seamle ss Mobility, and software development for the various communications solutions t hat Motorola offers globally. India is the hub for creating products for regional and emerging markets. Motorola s investment in technology and R&D in India has grown to US $85 million in the year 2005, up from approximately US $50 million in 2002. It plans to gro w this investment by 10-15% each year. Motorola Labs in India was launched in April 2005. The Lab is involved in six ar eas of excellence including Wireless Access Research, Networks Research, Human I nteraction Research, Applications Research, Embedded Systems Research and Physic al Realization Research R&D centre of Core Networks Division (CND) a part of Motorola Networks & Enterpr ise works on new telecom switching technologies, and products across CDMA and GS M/UMTS networks. Over 3500 engineers India Firsts First to launch sub US $40 handsets in India (April 2005) Deployed India s first commercial GPRS network in Mumbai in 2002 Set up the country s first WLL based CDMA network in MP in 1998. Deployed India s single largest end-to-end GSM network for a region in South Ind ia in 2002-03 Commissioned India s first Tetra System with Delhi Metro Rail in 2002. Motorola Radios inducted by the Indian Army in 2002.

 Partnered with the state of Rajasthan to build a wireless broadband grid using i ts MOTOwi4 Canopy platform First to launch sub-US$ 40 handset in the country Sub-US$ 30 MOTOFONE premiered in November 2006 Motorola Achievements & History 1930 : First Motorola Car Brand Radio 1936 : Police cruiser Radio Receiver 1940 : Handie-talkie SCR 536 Radio 1941 ; First Motorola Commercial FM Two Way Radio System 1943 : First Motorola Public Stock Offering 1943 : Worlds First FM Portable Two Way Radio 1946 : Car Radio Telephone 1947 : Motorolas First TV 1955 : First Commercial High Power Transmitter 1955 : Stylized M Motorola Logo 1956 : Robert W. Galvin, President 1958 : Motrac Vehicular Two Way Radio 1963 : Worlds First Truly Rectangular Color TV tube 1969 : First Words From The Moon 1973 : Prototype DynaTac Portable Cellular System 1983: Worlds First Commercial Portable Cellular Phone 1986 : Six Sigma Quality Process 1990 : First HDTV Technical Standard 1991 : First GSM Cellular System 1994 : iDEN Digital Radio 1995 : Worlds First Two Way Pager 1996 : StarTac Wearable Phone 1999 : iDEN i1000 Plus Handset 2000 : Worlds First GPRS Cellular System 2000 : Mission Critical Wireless Data 2002 : Worlds First Wireless Cable Modem Gateway 2003 : A760 PDA Phone 2004 : Edward J Zander, Chairman and CEO 2004 : MOTORAZR V3 Cellular Phone 2005 : MOTOMESH Broadband Radio Network 2006 : National Medal Of Technology Ceremony 2006 : MOTOSLVR (RED) Cellular Phone 2007 : Symbol Technologies 2007 : Best Corporate Citizen Award Introduction to Industrial Training And Its Importance Why Training is necessary Better interaction between Technical institutions and industry is the need of th e hour. This will have great bearing on the Engineering Curriculum, exposure of industrial atmosphere to engineering students and subsequent placement of young graduating engineers in industries across the country. With the advent of global ization and opening up of Indian economy to outside world, competitions among in dustries have become stiff. To solve their engineering problems they look up now to engg. Institutions. Similarly, there is an urgent need to prepare engineerin g students for jobs in multinational companies, by exposing them to newer techno logies and engineering methodologies. These objectives can only be achieved well by bridging the gap between industry and the academic institute. Academics are not generally interested in the application of the results of thei r research but a simple idea can sometimes give rise to a multi-billion dollar i ndustry as a spin-off. Hence there is an urgent need for developing good links b etween academia and industry for a symbiotic relationship. An institutional link

age, a departmental linkage and an individual linkage with special reference to a developing country like India are presented. This model may successfully be ad opted in other developing countries. Nature Of Training Servicing of Electronic Equipments play important role in Electronic Industry. M obile Phones are need of every person. Now a person cant imagine his life without Mobile Phones. Mobile Phones are 24 hrs. running devices and nobody wants to pu t them switch off for a single moment. So servicing of Mobile Phones is necessary and a good management in servicing is more necessary to fulfill the requirement of a mobile customer. During Training I have learned 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. Customer Technical Support To resolve product related queries as well as technical support. Troubleshooting of Mobile Station. Fault finding. Cell phone Repair. BGA Rework Process Servicing and repair of cell phones. Service Online. CRM Module for call management. Online stock management. Management of work, skill, time.

During training period I gained a lot about technical and non technical work, I have learned operations of MNCs, their management structure and a good managemen t of the work. This will help me in understanding the organization structure and management of both time as well as skill when I will go to an organization for working. Soft Skills are necessary to be a good manager and to tackle problems f acing in a service industry. BGA (Ball Grid Array) ICs are the technology of high density chips, Handling of these chips and rework will help me to develop a skill of working in production and R&D departments. Servicing of Mobile Phones means maintenance, troubleshooting and fault finding of the circuitry of todays advanced Mobile Stations which are having a 7 layer or more layer PCB.

BGA Rework Process Proper PCB Preheating One of the keys to insuring a proper reflow cycle is getting to and maintaining

the proper preheat temperature. This is accomplished with a PCB preheater which heats the board to between 75 and 125 C prior to the application of heat to the p art area requiring rework. This part of the rework process is a critical compone nt as done properly it minimizes PCB warpage during component removal while at t he same time limiting the thermal shock to the PCB. The maximum temperature is d etermined by the thermal expansion of the PCB. In order to maintain the integrit y of the PCB laminate the maximum preheat temperature is set approximately 10C or below the Tg (glass transition temperature) of the PCB material. Higher thermal preheat temperatures minimize the potential thermal distortion and shock to the PCB during the reflow process. ESD Handling ESD Safe Work Areas BGAs should be handled in ESD safe work areas in order to prevent damage to sens itive components from electrostatic discharges. These areas must be designed and maintained to prevent ESD damage. Proper Handling and Storage of ESD Sensitive Devices and PCBs The following practices should be adhered to when working with BGA components an d PCB assemblies: PCBs should be handled at properly designated work areas only. Designated ESD safe work areas must be checked periodically to ensure their cont inued safety from ESD. The areas should be monitored for the following: Proper grounding methods. Static dissipation of work surfaces. Static dissipation of floor surfaces. Operation of ion blowers and ion air guns. Designated work areas must be kept free of static generating materials such as S tyrofoam, vinyl, plastic, fabrics or any other static generating materials. Work areas must be kept clean and neat in order to prevent contamination of the work area. Circuit board assemblies should be handled by the edges. Avoid touching the circ uits or components. (Figure 1) Components should be handled by the edges when possible. Avoid touching the comp onent leads. When not being worked on, sensitive components and circuit boards must be enclos ed in shielded bags or boxes. There are three types of ESD protective enclosure materials including: Antistatic - Provides antistatic cushioning for electronic assemblies. Static Shielding - Prevents static electricity from passing through the package. Static Dissipative - An "over-package" that has enough conductivity to dissipate any static buildup. Whenever handling a circuit board assembly the operator must be properly grounde d by one of the following: Wearing a wrist strap connected to earth ground (figure 2). Wearing 2 heel grounders and have both feet on a static dissipative floor surfac e. Stacking of circuit boards and assemblies should be avoided to prevent physical damage. Special racks and trays are provided for handling. (Figure.3) Figure 1

Figure 2

Figure 3

MSD Control-Preparation of Area Array Devices Adjacent Components Areas near the area array device being reworked require their temperature to be controlled and limited to less than 150C or to the manufacturer s specifications paying special attention to "heat sensitive" devices such as connectors, plastic housing or similar lower melt temperature components. Heat shielding may be req uired in some cases to prevent temperature extremes from being developed. BGA Rework Process - Develop Profile

Thermal Profilin Thermal profiling is required for several operations in the reflow process inclu ding device removal and reflow. Each specific BGA site to be reworked must be in dividually profiled as each site has variations which affect the reflow process including the location of adjacent components and heat-sinking variations of the PCB internal layers. By individually profiling each site the risk of over or un der heat exposure to components, lifted pads, damaged solder mask as well as imp roperly soldered joints is minimized. Several Profiling Methods There are several methods available to correctly identify and build a PCB profil e. The method used is a function of the availability of a sample or test profile PCB and component reworked. One method assumes that a profile PCB and part is a vailable, while another assumes that no dedicated profile PCB exists. Whatever t he method used it is critical to read the joint temperature. Floating air thermo couples or thermocouples attached next to the part being reworked are NOT accura te solder temperature indicators. Figure 4 Representative Profile of Hot Air BGA Rework System Profiling Without a Dedicated Profile PCB In this method it is critical to measure the temperature under the center of the BGA to be reworked. Insulated thermocouples are pushed underneath the center of the BGA to approximate joint temperatures. It has been shown that thermocouple readings are affected by hot air nozzles of rework stations if they are placed n ear the outside rows of the of the solder joints. Thus the center BGA solder joi nts, which tend to be lower in temperature than the outside rows, need to be mea sured. In this technique the reflow profile is established during the removal pr ocess. In both profiling methods there are several points which should be monitored: BGA part center joint temperature BGA part edge joint temperatures Adjacent component nearest body temperature (if applicable) PCB temperature BGA Rework Process - Part Removal

The objective of this step is to remove the component while minimizing the impac t to the PCB. The most common PCB defects that should be avoided include lifted pads and site warping. The basic requirements of this operation are the followin g: Preheat the entire PCB between 75 C and 125C

Insure that all joints have a temperature greater than 190C Make sure that all joint temperatures are less than 220C. Insure no solder is smeared on the part bottom or edge which might aid in part r eclamation Maintain adjacent component temperatures to less than 180C in order to minimize t he heat impact on these parts *Note these temperatures assume standard Pb/Sn soldering temperatures BGA Rework Process - Site Preparation

After removal of the BGA from the PCB the removal site must be dressed. Since th e balls are eutectic alloy soldered to both the part and the PCB, some of the ba ll will likely remain on the PCB after part removal. The remaining solder may be nonuniform in both composition and volume. The volume varies due to how the mol ten solder separates between the ball and the carrier pad surface. This operatio n entails removing all the solder balls and removing all of the solder residue. Only then can the site be dressed. The dressing of the pads can be done by one of several methods. The methods for solder removal include the solder wick or solder vacuum techniques. The solder v acuum process has less chance of damaging the pads while being somewhat slow. Th e braid technique, while faster, can lead to lifted pads or otherwise damaged so lder mask areas if not done properly or with the right size of wick. After solder removal from the pads of the BGA site cleaning is performed or not performed depending on whether a water-soluble or no-clean paste flux has been u sed. Cleaning parameters would follow those used in the initial assembly of the product. Applying Solder Solder must be selectively applied to the PCB site of the BGA in order to attach the solder balls of the BGA to the PCB. Solder paste is preferred as it provide s "tacking" functionality for the device placement. In addition it provides comp ensation for height differentials while assisting to minimize warpage of the PCB . Numerous studies have also concluded that the application of solder paste in B GA rework is critical in obtaining a highly reliable product. There are several methods which can be used to apply solder paste as they are explained in detail below: SELECTIVE SOLDER PASTE DEPOSITION METHODS

Metal Stencils

Metal stencils for depositing solder paste have been in use for decades. Metal s tencils for selective (a particular device, not the entire PCB) solder paste dep osition have been in use almost as long. One of the greatest yield detractors in the SMT manufacturing process is the solder paste application process and the s ame holds true for the solder paste application process for rework. The process steps for using a component specific stencil for selective solder paste depositi on for rework and a full PCB stencil for the original SMT manufacturing are almo st identical. The major difference between the original stencil printing process

and the selective solder paste printing process used for rework is the amount o f process control. During the original solder paste stenciling process there are machine controls for the squeegee speed and pressure, snap-off distance, remova l of the stencil from the board, and in some cases stencil alignment. The select ive solder paste stenciling process is very dependent on the skill level of the technician to manually control these same variables. The metal stencil printing process begins with the stencil being aligned with the land patterns on the PCB, then the stencil must be held in place in a manner that ensures intimate contac t with the PCB. Next, a squeegee is used to roll a bead of solder paste across a nd down through the apertures of the stencil. Finally, the stencil is lifted fro m the PCB surface resulting in finely defined solder paste deposits. If the sten cil printing operation runs perfectly, the cycle time is very fast. Cleaning the stencil is a critical process step to ensure the stencil will provide acceptabl e results on the next BGA to be reworked. One variation on the metal stencil pro cess is to print the solder paste directly onto the solder balls instead of the BGA lands on the PCB. This method provides the advantage of printing solder past e where placing a stencil on the board would be impossible due to space consider ations. Flexible Removable Stencils

A relatively new material/process for deposition of solder paste is the use of f lexible solder paste stencils. These stencils are laser cut from a polymer film with a residue-free adhesive backing that allows for easy removal. The first ste p to using the flexible stencil is to remove the paper to expose the adhesive ba cking. The stencil must then be manually aligned with the land patterns on the P CB and firmly pressed down in place on the PCB surface. A squeegee is then used to roll a bead of solder paste across and down through the apertures of the sten cil. The stencil must then be carefully removed from the PCB surface. There is n o cleaning step as the stencil is disposable BGA Rework Process - BGA / LGA Part Placement

Once the proper solder paste volume has been applied to the pads and cleaned off properly, the device can be placed onto the PCB. When the device is placed using a modern area array rework system, ptics can be used to assist in the proper placement of the device. , optical images of both the solder balls on the device as well as are superimposed in a stereomicroscope field of view on a monitor. s can then be aligned by X, Y and rotational adjustments. split prism o Using a prism the PCB pads The two image

Placement accuracy criteria is the same as the initial placement at the time of initial assembly. The device should be placed with a force per the manufacturers specifications such that the solder paste contacts 50% of the PCB pad and not be in contact with the vias. For test boards the placement accuracy can be confi rmed using double-sided tape adhered to the PCB BGA site. The BGA can then be pl aced onto this site, firmly held in place and examined at an angle under a stere omicroscope for accuracy. The BGA can be hand-placed when using the StencilQuik process for larger pitch si zes (1.00 and 1.27mm). Care must be taken in handling the parts at the edges whi le making sure the operator is properly grounded.

BGA Rework Process - Part Reflow

After part placement, the applied solder must be reflowed to attach the BGA to t he PCB pads. Preheating the entire PCB to between 70C and 125C is critical to mini mizing PCB distortion during the heat cycle. The thermal profile already develop ed should have the following basic characteristics: Peak joint temperature to minimize Pb dissolution Minimum joining temperature high enough to ensure good wettability All joints to be in the solder manufacturer s specified reflow range Ensure dwell time above reflow as per the solder paste manufacturer s specificat ions In addition care must be taken to ensure that adjacent components are not damage d during the reflow process. This care must be extended to components with low m elting points such as connectors or standoffs or adjacent moisture-sensitive dev ices. Care should also be taken to not overheat any internal thermal grease if t he BGA is capped. After successfully attaching the BGA to the PCB, and allowing the board to be co oled down, the perimeter row of solder joints should be visually examined. The s older joint between the ball and the PCB pad should be similar in size and shape to the ball/part joint. If a water-soluble paste is used, the reworked area nee ds to be cleaned. Cleaning parameters should those be used in the original assem bly process. Card warping and bowing should be minimized by the BGA rework process. This can be a serious problem in the case of very thin PCBs. The bowing can be exacerbate d by the proximity of other components such as pin-in-hole connectors that may a nchor the PCB, thereby enhancing the localized bowing under the BGA. If the PCB is bowed or warped they might not be able to properly fit into the final assembl y or opens may be formed. BGA Rework Process - Inspection

Visual inspection of 100% of the BGA joints is not possible on area array device s. However there are two techniques, which if used in combination with one anoth er, can greatly reduce the amount of defects which "pass" BGA rework inspection. With a combination of both transmissive XRAY and endoscopic inspection, very fe w defects of BGA rework cannot be identified. Transmissive XRAY can be used to document several potential defects. Solder brid ges are the most common defect which can be detected by this technique. Gross vo ids can be seen at greater power and magnification levels. However XRAY has limi ted ability to detect opens. A strong supplemental tool to XRAY, an endoscopic inspection tool, allows hidden solder joints or joints that are in close proximity to other nearby parts to be inspected and characterized. The ability to "see" whether the reflow process de livers a defective or a target joint condition can be accomplished with this ins pection tool. One of the major benefits of using an endoscope is its ability to "see" underneath the grid array and the surface of the individual solder balls. Clues to the quality of joints including its texture, uniformity, smoothness, co lor and brightness and surface characteristics can be documented with this tool. A poor solder joint with micro cracks on its surface could be "seen" with the e

ndoscopic inspection tool while not showing up on XRAY Yields for reworked BGAs have been established at greater than 95%. SIR testing has shown that reworked components can have the same surface insulation resistan ce. When using the StencilQuik rework process SIR testing has shown an increase i n surface resistance value by a factor of ten. Testing has shown that properly r eworked BGAs joints exhibit the same resistance to thermal fatigue as product th at has gone through initial assembly.

IR Rework Advantages of IR Rework Systems Infrared rework systems offer several advantages to the rework process. Due to t he computer controlled heat and time sources the profiles stored in the rework s ystem are highly repeatable and more precisely controlled compared to their hot air counterparts. Since the lens focuses the spot size, a few lenses replace the costs and maintenance associates with the multitude of different rework nozzles required in convection heating systems. Due the localized heating the problems associated with bringing the neighboring components into reflow or damaging neig hboring components using an IR source rework system. The IR method comes into it s own on applications where tooling heads and irons cannot reach. (Components ne ar or in between plastic connector sockets typically cause access problems). In addition masking of nearby components, due to the focused nature of the heating source, is not required with IR rework systems. Focused IR rework systems also a llow the operator to view all four sides of the component at all times during re work processing. This feature helps to avoid removing a component too soon, whic h can result in pad damage or bent leads. Lastly, small or lightweight component s cannot be "blasted away" as no air is required in an IR system thereby insurin g a higher reliability rework process. The aforementioned advantages of an IR-ba sed rework system make it well-suited for many applications. The IR Source The focused IR is a non-contact, rework tool free and employing IR from both abo ve and below as its source of heating. Medium wave IR is used underneath to preh eat the PCB and reduce the amount of energy and time required for top heating. S hort wave IR energy. derived from a UV-free tungsten Halogen spot lamp is collim ated and managed through a lens system which allows the control of the heating a rea. It also produces the red color for operator targeting. Simulating a Reflow Oven Profile In a reflow oven a PCB is passed through many zones creating a temperature profi le so that interconnection between components and the PCB can take place in a co ntrolled fashion. Focused IR technology treats a component and the PCB to very s imilar thermal conditions and, as such, produces high quality solder joints. Thu s, in practice, any component that can safely pass through an IR oven can be rew orked using Focused IR. Limitations of IR Rework While this technology offers several advantages over convection heating approach es it has its drawbacks. For instance the total rework cycle time tends to be lo

nger. While this may not be an issue for a few component replacements it will be a large issue if there are hundreds or thousands of boards being reworked. In a ddition, thicker boards will be too massive for the IR systems in terms of being able to reach a time-temperature profile in an acceptable amount of time. Bulbs for such systems are costly thereby increasing the operating costs of the rewor k systems. Since this technology is not widely used, the number of highly traine d technicians being able to operate the system is low, resulting in poor transfe rability of profile information between the rework client and the rework provide r. Outside of these shortcomings IR rework systems have their place in various a pplications. Lead Free Rework Successful rework and PCB assembly methods have been developed with lead-free so lders for all types of components. During the transition period to lead-free man ufacturing rework practices have to be developed that deal with the issues relat ed to handling, reworking, tracking and inspecting lead free PCB assemblies. Example 0603 Resistor Soldered Using SAC lead-free alloy. Lead-free solder rework is different than Sn63 solders as the lead-free solder a lloys typically do not wet or wick as easily. Example J-Lead Soldered Using SAC lead-free alloy. Successful rework methods have been developed with lead-free solders (including Sn/Ag/Cu or Sn/Ag alloys) including components removal/replacement, j umper wires, trace and pad repairs and BGAs. Most of your existing rework equipm ent for Sn63-based alloys can still be used for the lead-free solder. The solder ing parameters must be adjusted to accommodate the higher melting temperature an d lesser wettability of the lead-free solder. Studies have shown that reliable l ead-free solder joints, with proper grain structures and intermetallic formatio n, can be produced using appropriate rework processes. Example Gull Wing Lead Soldered Using SAC lead-free alloy. Care must be taken to minimize any potential negative impact of the rework proce ss on the reliability of the solder interconnects, the components and the PCB. A s the soldering temperature increases, the coefficient of thermal expansion (CTE ) mismatch between the laminate material, the glass fiber and copper will exert greater stresses on the copper, potentially causing failures by cracking of the copper traces or plated vias. The propensity of the rework operation to cause th is cracking is a function of variables such as the PCB layer count and thicknes s, the laminate material, the rework temperature profile, the copper distributio n, the via geometry as well as others. Alternative higher glass transition temp erature, lower coefficient of thermal expansion laminate materials may need to b e specified for lead-free soldering. Higher rework processing temperatures (appr oximately 30-40C higher) may impact other components that are close to their melt ing or softening points such as connectors, batteries and labels. The issue of "component mixing" warrants special concern, especially during the transition period. Preliminary studies on the impact of lead in lead-free solder on long-term reliability indicate that the impact varies with the amount of lea d in the solder joint, and the impact may be the greatest when the amount of lea d is within some intermediate range because of the formation of segregated phase s (e.g., coarse lead grains) in the last-to-solidify interdendritic tin grain bo

undaries, where cracks may initiate and propagate under cyclic loading. For exam ple, it has been shown that 2 to 5 percent lead can be detrimental to the fatigu e life of lead-free solder, but it probably is no worse than the Sn63 solder. Fo r example, if a PCB fabricated with Sn63 is to be repaired with lead-free solder , from the solder point of view, the reliability of mixed lead-free solder and S n/Pb solder will likely not be inferior to the Sn63 solder. However, the tempera ture impact on the components would be a concern. On the other hand, repairing a lead-free soldered board with Sn63 solder would create solder joints that are n ot as reliable as the lead-free solder joints on the rest of the board.

Various Tools used in Servicing Hardware Tools IR REWORK STATION Explained complete detail of IR Rework

BGA Rework Hakko

Magnifying Lens

Opening Tools and Tweezers

T6-T5 Screw Driver Kit Liquid Flux Solder Paste, Wire

Software Tool RF Tester Used In RF Power Calibration and other RF testing

Different Motorola Mobile Phone Models Available and technical description 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. 26. 27. 28. 29. 30. 31. 32. 33. 34. 35. 36. 37. 38. 39. A760 A768i A780 A840 CDMA A1200 MOTOMING C113 C115 C116 C117 C118 C123 C131 CDMA C138 C139 C155 C156 C157 C168 C200 C201 C210 CDMA C257 C261 C300 C330 C350 350e C375 C550 C650 E6 MOTOROKR E360 E365 E380 E398 F3 L2 L6 L6i

40. 41. 42. 43. 44. 45. 46. 47. 48. 49. 50. 51. 52. 53. 54. 55. 56. 57. 58. 59. 60. 61. 62. 63. 64. 65. 66. 67. 68. 69. 70. 71.

L7 L7i L9 MPX 200 MPX 220 MOTO Q T190 T191 T720 U6 V3 MOTORAZR V3i V3c V3X V6 MAX V60 V66 V70 V171 V220 V300 V303 V600 V730 V878 W209 W215 W220 W375 W510 Z3 Z6

Motorola L6 MOTOSLVR

Motorola L2/L6 Bands/Modes: Size: Weight: Display res: Battery: Tri-band 900/1800/1900 GPRS 113 x 49 x 10.9mm, 56cc ~86g 128 x 160 65K colours CSTN (1.77 viewable diagonal) 720 mAh LiIon up to 350 mins (talktime) up to 380 hrs (standby time

Key Features Bluetooth Class 2 Integrated handsfree speakerphone Push to Talk over cellular with GPRS

Downloadable java apps, images & ringtones Picture Messaging with MMS Wireless Village Instant Messaging MP3 Ringtones GPRS Class 10 Video playback (MPEG4/H.263) Up to 10MB of end user embedded memory Dynamic Idle (Motorola/4th Pass server)

Enablers Browser: MIB2.2 WAP 2.0 (WSP/HTTP1.1, WTCP/IP, xHTML Mobile profile, WCSS, Cook ies, WTLS Class 2, TLS 1.0/SSL 3.0) Messaging: MMS, WV, EMS 5.0, SMS J2ME MIDP 2.0 Enhanced Mini USB connector (EMU) GPRS Class 10 (2U/4D) SyncML Device Management Video playback (H.263-MPEG 4, .3GPP) 22 KHz polyphonic speaker FOTA DRM OMA 1.0 Bluetooth Class 2 Common Faults 1. Phone is Dead

a) Check Battery (Fully Charged battery voltage is 3.7V) b) Contacts may not be proper c) Check Battery Connector d) On/Off Switch may be faulty or contacts of On/ Off button can be cleaned with cleanser, thinner e) Problem may be due to software, phone can be updated with new version of software in some cases. f) If Problem not solved then check hardware part through Phone Manual or F ield Service Bulletin. Supply section should be checked for proper supply. Circu it will be traced for fault. Problem may be due to Dry Soldering of IC, First of all reflow the Power IC for removing dry soldering. If problem not resolved the n replace IC through BGA rework process. 2. SIM card detection error.

a) Check SIM card well inserted for error b) Check contacts of 6 Pin SIM connector. c) SIM connector may be faulty. d) Check if Signal Level at VRSIM=1.8/3.0V, SIMRST,SIMCLK=3.25 MHZ, SIMIO a re correct 3. Phone Auto Off, Reboot

a) If Phone automatically switched off then problem is due to software, upd ate the software with new version if available otherwise with same one. b) If Battery is not OK then also problem persists. c) If Problem not resolved then Power section can be checked for dry solder ing. d) Sometimes Liquid is the possible cause, A liquid damage/Water Damage may short circuit the PCB.

e) 4.

Flash IC can be checked if Problem Persist after all remedies. No Network/Cant Access Network

a) Antenna may be responsible for bad reception or no reception of signal. Poor contact are the cause, b) Then RF section is responsible for any type of fault related to network. c) PFO Power Amplifier or Antenna Switch can be checked. d) Phone Service Manual Can be referred for Network related faults. e) RF Tester is used in these Problems. f) Calibration can be done through RF tester.

5. a) b) c) 6. a) b) c) 7. a) b) c) 8. a) b) c) 9.

Keypad No Function Moisture may be the possible cause, can be cleaned with thinner. Replace the Keypad Dom. Keypad Driver IC can be checked. Buzzer No Function Visually Inspect the Buzzer for component shift. Replace the Buzzer. Refer Service Manual. Vibrator No Function Visually Inspect the Vibrator for component shift. Replace the Vibrator. Refer Service Manual. Speaker Not Working. Disassembly to visually inspect connection with PCB. Voice IC may be faulty. Refer Service Manual of the Phone. Microphone not working

a) b) c) 10. a) b) 11.

Disassembly to visually inspect connection with PCB. Voice IC may be faulty. Refer Service Manual of the Phone. LCD no Display LCD may be faulty. Refer to service manual some capacitors may be defective. Phone Hangs.

a) Problem is due to Software, Corrupted software or illegal software appli cation, Can be upgraded with new version. b) Flash IC can be checked. 12. a) b) Not Charging Battery and charger can be checked. Check charging connector for proper voltage, refer service manual.

Exploded diagram of L6

Chipsets / Circuits Compared with E398 Same as E398 Neptune U800 Eagle U50 Algae U150 Nearly similar ATI Chip Circuit Blue Tooth U300 New /updated Circuits compared with E398 ATI circuit (Camera, Display) (L2 has no Camera) Atlas U900 (with intregrated EMU interface) Charger Inter Board to Board Connection No TransFlash Memory Cardreader Inter Board to Board Connection

ATI Circuit

ATI circuit is Graphic Accelerator, camera/display and Tri Flash support. Communication of LCD is directly through this ATI i.e. Display is connected dire ctly to ATI and a connector is provided for this purpose. Graphics are produced in this ATI, it produces RGB data. Camera and Flash Memory is also connected to ATI.

Charging Circuit

Here is Power Management circuit, which controls charging, temperature and suppl y power to all segments in the mobile device. Battery connector is having 4 pins named GND, +ve, Thermal Bias and Bias to Nept une. In case of present of external charger some extra lines are provided, which comes in picture only when charging is ON. A RTC (Real Time Clock Chip) battery is for 24hrs continuous supply of power to some blocks even if main battery is removed.

Atlas

Atlas is Interface IC which provide interface to various devices like USB, Audio jack, and provide control for various circuitry. Audio amplifier and stereo cir cuit is in within this chip. It provides signals to various ICs. It generate Con trol Logic

SOFTWARE UPGRADATION PROCEDURE Procedure explained here is for C650 and can be applied same for all PST phones

To check software version in your handset View If the s/w shown in the handset is below than R364_G_0B.D0.27R then proceed othe rwise leave it. Same way you can also check Flex and language Pack. Installing PST Download PST tool from http://compass.mot.com/go/pst692 in your machine and doub le click on the PST_6.9.2_GENERAL.exe file to install locally. Downloading software, LP, flex, Java pack from the compass site Download C650 Config.zip from http://compass.mot.com/go/138136095?func=ll&objId= 138136095&objAction=browse in your machine and unzip it to get the software, LP, flex and java pack Getting Started Insert USB cable in USB port of the computer and other end in the butt plug of t he handset and make handset ON. Check the software version in your handset: Menu => Settings => Phone Status => Other information => S/W Version =>

USB Cable to be used: Part No. SKN6371A Enlarge View of connector at the other end of USB cable to be inserted into Butt plug of the handset: Pop-up message in computer will prompt for New Hardware Found and will start ins talling automatically. If it prompts for the setup file to be entered then brows e for .inf file from the PST folder in your machine that was installed while ins tallation of PST tool. Once Installed machine will prompt for the Hardware installed successfully. Note: This is only a one-time activity and the handset once installed in the sys tem will not prompt again to install. Perform as per below to open the PST tool

Browse for the software to be installed from your machine R364_G_0B.D0.27R_reflash.shx

Select the icon rounded below from the cursor of your mouse at once

Flash tab will be highlighted. Press the same button

Proper selection of pop-up messages in the computer Pop-up message in your machine will prompt for Code group * same (for 2 or 3 tim es consecutively)- - - Choose Yes Once flashing is complete m/c will prompt for a message that Flash another phone with options Yes/ No. Choose No.

Close PST. Flashing Language Pack Open PST, to select R364_G_0B.D0.27R_lang004B_reflash.shx to reflash the lang pa ck and perform steps as per slide 5 till 9. Finalization Remove the USB cable from the handset and press END key for long time (if MS doe snt power up remove battery and insert again) and after MS has been powered up pe rform the below steps: 1. Menu=> Settings => Initial Setup=> Master Reset => Security Code: 00000 0 OK and then Reset All Phone Settings? Choose YES MS will power cycle. 2. Menu=> Settings => Initial Setup=> Master Clear => Security Code: 00000 0 OK and then Clear All Phone Data? Choose YES MS will power cycle. Done!

Other Software Tools DM tool for C115, C113, C116, C117, C118, C139, C138, C157, C257, C261, E365

RSD Lite For V Series Handsets like V3, V303, V600 L series like L6, L7, L7 etc And E398, C350 etc can also be upgraded through RSD.

Radio Comm

Analysis & Conclusions

After learning a lot from servicing I found that servicing of mobile phones is n ot only to repair the phone but it is a state of art of experience. Some problems may persist only in chandigarh and some may persist only in kuruks hetra. The reason is that environment is the major factor. The climate of some p lace can affect the functioning of a device. Some day a service centre may recei ve no. of calls only for a battery problem and another day they can face all pro blem related with LCD. Mobile servicing is a task of continuous learning, every day we faces some new p roblems which havent faced by anyone, now it is the time to show the experience a nd talent. Soft Skills and some managerial skills are necessary in the service industry. Wi thout these service cant be imagine. BGA rework process will help me a lot, the latest technology trends in VLSI and other chips, handling various components. Mobile Communication is the future of wireless communication, various organizations are working on the technology and India is a good market for all companies.

Bibliography 1. 2. Motorola Confidential Proprietary of Service Manuals. Motorola Internal Data Through emails

Websites 1. 2. Motorola Phones Software and Service Manuals web https://pcs-service.motorola.com Motorola Warranty and Software web https://serviceone1.motorola.com

3. Service Online 203.197.158.188/newprocess 4. Motorola Handset Swap web 202.138.126.90/brm 4. 5. www.motorola.com www.redingtonservice.com

Abbreviation Used and Meaning of Some Words 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. BGA - Ball Grid Array TAT - Turned Around Time VGA Video Graphic Display SOL Service On Line CRM Customer Relationship Module LCM/LCD Liquid Crystal Display Mobile Station Mobile Phone RTC Real Time Clock BT Blue Tooth FSB Field Service Bulletin