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DATA SHEET
M3D176
Philips Semiconductors
specification
Diodes rapides
Caracteristiques Encapsulees hermetiquement dans un boitier SOD27 (DO-35) Commutation rapide : max. 4 ns Application generale Tension continue inverse : max. 75 V Tension de pointe repetitive inverse: max. 75 V Courant direct de pointe repetitif : max. 450 mA. APPLICATIONS Commutation rapide.
handbook, halfpage k
MAM246
Valeurs limites En accord avec les valeurs maximums absolues du systeme (IEC 134). Symbole VRRM VR IF IFRM IFSM Parametre Tension de pointe repetitive inverse Tension continue inverse Courant direct continu Courant direct de pointe repetitif Courant direct de pointe non repetitif Onde carree ; T = 25 C j t = 1 s t = 1 ms t=1s Ptot Tstg Tj Note 1.Composant monte sur un circuit imprime avec des longueurs de broches de 10mm Puissance totale dissipee Temperature de stockage Temperature de jonction Tamb = 25 C; note 1 65 4 1 0.5 500 +200 200 A A A mW C C voir Fig.2; note 1 Conditions MIN. MAX. 75 75 200 450 V V mA mA UNITE
1996 Sep 03
Philips Semiconductors
Specification
Diodes rapides
CARACTERISTIQUES ELECTRIQUES Tj = 25 C; sauf information contraire. Symbole VF Parametre Tension directe 1N4148 1N4446 1N4448 IR IR Cd trr Courant inverse Courant inverse ; 1N4448 Capacite de la diode Temps de recouvrement inverse IF = 10 mA IF = 20 mA IF = 5 mA IF = 100 mA VR = 20 V Conditions
MIN. 0.62
UNITE V V V V nA A A pF ns
VR = 20 V; Tj = 150 C VR = 20 V; Tj = 100 C f = 1 MHz; V R = 0 Avec commutation : I F = 10 mA a IR = 60 mA; RL = 100 ; mesure a IR = 1 mA Avec commutation IF = 50 mA; tr = 20 ns
Vfr
2.5
CARACTERISTIQUES THERMIQUE Symbole Rth j-tp Rth j-a Note 1.Composant monte sur circuit imprime sans trou metallise Parametre Resistance thermique jonction boitier Resistance thermique jonction air ambiant Conditions longueur des broches 10 mm longueur des broches 10 mm ; note 1 Valeur 240 350 Unite K/W K/W
1996 Sep 03
Philips Semiconductors
Product specication
Diodes Rapides
GRAPHICAL DATA
handbook, halfpage
300
MBG451
handbook, halfpage
600
MBG464
IF (mA) 200
IF (mA) 400
(1) (2) (3)
100
200
0 0 (1) Tj = 175 C; typical values. (2) Tj = 25 C; typical values. (3) Tj = 25 C; maximum values. 1 VF (V) 2
Fig.2
Fig.3
MBG704
10
102
103
tp (s)
104
Fig.4 Maximum permissible non-repetitive peak forward current as a function of pulse duration.
1996 Sep 03
Philips Semiconductors
Product specication
High-speed diodes
MGD290
MGD004
handbook, halfpage
1.2
10
Cd (pF) 1.0
(1) (2)
10 0.8 1
101
0.6
0.4 0 10 VR (V) 20
f = 1 MHz; Tj = 25 C.
Fig.5
Fig.6
1996 Sep 03
Philips Semiconductors
Product specication
High-speed diodes
tp t
RS = 50 V = VR I F x R S
IF
IF
t rr t
(1)
MGA881
input signal
output signal
(1) IR = 1 mA.
1 k
450
I 90%
R S = 50
D.U.T.
OSCILLOSCOPE R i = 50 10%
MGA882
V fr
t tr tp
input signal
output signal
1996 Sep 03
Philips Semiconductors
Product specication
High-speed diodes
PACKAGE OUTLINE
0.56 max 1.85 max 25.4 min 4.25 max 25.4 min
MLA428 - 1
Dimensions in mm.
DEFINITIONS Data Sheet Status Objective specication Preliminary specication Product specication Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specication is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specication. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale This data sheet contains target or goal specications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains nal product specications.
1996 Sep 03