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2005-10

NEW FEATURES OF SOFTWARE VERSION 2.0 SERIES

Fully Automatic Dicing Saw

DFD6240 DFD6340 DFD6361


SOFTWARE VERSION 2.0 SERIES

Copyright of this document is owned by Disco Corporation ("Disco"). No part of this document may be copied or reproduced in any form or by any means, without the express written permission of Disco. Also, this document may not be disclosed or transferred to third parties. This document is printed on recyclable Lint-Free Paper. - The blue paper is recyclable as used paper just like plain paper. - The cover paper and adhesive portions are non-recyclable. (Remove the cover and adhesive portions before recycling. Recycle the blue paper only.)

UJ6SVE*020A

INTRODUCTION
About this manual This document is an instruction manuals for Disco Fully Automatic Dicing Saw 6000 series model, DFD6240, DFD6340, and DFD6361 and explains new features of the software version 2.0 series for data maintenance personnel and maintenance personnel.
Chapter Title When using USB 1 memory 2 Functions that can be used on the screens on which the microscope image is displayed Contents Applicable personnel USB memory can be used as an external memory Data maintenance device. personnel/ Maintenance personnel Data maintenance Major features: personnel/ XIS Mode The four operations below can be performed on Maintenance personnel the microscope image currently displayed without changing the screen. - Light intensity adjustment - Focus adjustment - Microscope image transfer (axis transfer) - Target window size change Wafer Map - Line Mode - Progress of cutting operation for each axis can be checked on the workpiece image. - The information of the cut line can be checked. - The image moves above the specified line. Wafer Map - Workpiece Mode - If you touch a position on the workpiece image, the image moves to the position. The change of the analogue sensor values recorded by the machine is displayed as a line graph. Data maintenance personnel/ Maintenance personnel

ANALOGUE TIME SERIES GRAPH

Added new kerf recognition method to the KERF Data maintenance Added new kerf personnel/ recognition method CHECK PARAMETER 3 screen (during stop correction) and KERF CHECK DATA 2 screen Maintenance personnel for kerf check [screen 3.1.8.8] to prevent misrecognition of kerfs. New method can be used under such conditions as below. - When using the V-shaped blade - When using the wide blade - When cut depth is shallow Added new conditions to start auto setup To the SETUP DATA 1 screen [screen 4.7], added new conditions to start auto setup. - When the difference between the spindle rotation speed at the time of set up operation and the rotation speed at the time of cutting operation is bigger than the specified value - During workpiece transportation at the time of start of full automation. - After dressing - After device data change Data maintenance personnel/ Maintenance personnel

Intro-1

About this manual (Continued)


Chapter Title Z2-axis individual 6 cut position alignment Contents [DFD6340 and DFD6361 only] Added the following functions to the DUAL cut and STEP cut. These functions can be activated in the USER DEFINE DATA 2 screen [screen 7.4.2]. - Perform the Z2-axis individual target check at the time of the kerf check during full automation. - Perform individual alignment for the Z1 and Z2-axes at the time of the cut position adjustment during stop correction. Applicable personnel Maintenance personnel

To ensure safety In order to use this machine safely, perform the work after reading this manual thoroughly and sufficiently understanding the contents. Be sure to perform the operation and data settings in accordance with the procedures in this manual as well as the Manuals included with the standard machine.
WARNING

Safety Precaution of this specification This is a supplemental manual explaining the operation and data settings for the special specification of the Disco Fully Automatic Dicing Saw 6000 Series Model DFD6240, DFD6340 and DFD6361. To perform the operation properly and safely, follow the Manuals included with the machine as well as this manual. About our company logo button at the upper left of the screen

When the locks.

button located at the upper left of the screen is pressed, the touch panel

In this document, the

button is used to explain the safety precautions. Depending

on the software version, however, the button may be displayed on the touch panel of the machine. Although these two buttons have a different appearance, they have the same function, which is to lock the touch panel. Before using the machine, please note the above things.

Intro-2

CONTENTS
READ CAREFULLY BEFORE USING THIS MANUAL INTRODUCTION ................................................Intro-1 CONTENTS ................................................ Contents-1 1. When using USB memory....................................... 1 2. Functions that can be used on the screens on which the microscope image is displayed ............ 7
2-1. Overview of each Mode......................................................................................10 2-2. Switching between XIS Mode and Wafer Map Mode and Reminder ..................14 2-3. XIS Mode ...........................................................................................................15 2-4. Wafer Map - Line Mode ......................................................................................20 2-5. Wafer Map - Workpiece Mode............................................................................26

3. Analogue Time Series Graph ................................ 29


3-1. Overview of Analogue Time Series Graph..........................................................30 3-2. Graph Display ....................................................................................................32 3-3. Screen Description .............................................................................................33 3-4. Event Data Selection and Sensor Value Display ................................................46 3-5. Graph Data Saving.............................................................................................47

4. Added New Kerf Recognition Method For Kerf Check ................................................................. 48

Contents-1

CONTENTS
5. Added New Conditions To Start Auto Setup.......... 50 6. Z2-axis Individual Cut Position Alignment............. 52 ADDRESS LIST IN AN EVENT OF AN ACCIDENT

Contents-2

1. When using USB memory


About USB memory The machine is equipped with the USB port. When a USB memory is connected to the USB port, the USB memory can be used as an external memory device for the functions described below: - Functions of External Memory Unit Operation Screen [Screen 5.4] - Load, save and deletion of the device data - Formatting of external memory device - Load and save of the precut data - Log viewer - Log analyzer - Screen copy On the screens from which external memory devices can be used, the type of the external memory device used (USB memory or floppy disk) is displayed at the upper right of the screen, "External Unit".

As an external memory device - When a USB memory is used, "USB" is displayed. - When a floppy disk is used, "FLOPPY" is displayed.

Note: When a USB memory is connected to the port and a floppy disk is in the floppy disk drive, the USB memory has the higher priority to floppy disk.

About USB memory (Continued) When you carry out data loading from an external memory device or data saving to the external memory device while a USB memory or floppy disk is connected to the machine, one of the confirmation dialog below will open.

When pressing "OK", the process continues using the USB memory or floppy disk. If pressing "CANCEL", the process will be stopped. USB port and floppy disk drive The location of the USB port and floppy disk drive of the machine is the position indicated in the figure below.

Floppy disk drive USB port

USB port and floppy disk drive (Continued)

USB port

Floppy disk drive

DFD6340

Floppy disk drive

USB port DFD6361

USB port specification The specification of the USB port installed in the machine is as follows.
Connector type Electrical/mechanical specification Transfer speed USB mass storage class supported Number of ports Verified USB memory for use USB "A" connector (receptacle) USB Rev. 1.1 Compliant 12 Mbps (maximum) Flash memory which supports USB mass storage class 1 Maker: BUFFALO Model: RUF-C128ML/U2 Maker: BUFFALO Model: RUF-C128ML/U2

Automatic starting of Explorer Explorer may start automatically when connecting a USB memory to the USB port. If Explorer starts, push at the upper right of the window to close Explore.

The dialog box to be displayed When USB memory is used for this machine for the first time, or when a new USB memory is used, the dialog box below is displayed occasionally.

Dealing with the dialog box When being asked the question, "What do you want Windows to do when connecting USB?", select the options for "Always take no action". Select the dialog box options following the procedure below. Once you complete the selection, you can use USB memory without selecting options in the dialog box from next time. - The dialog box might be displayed again when using a USB memory whose capacity or the manufacturer is different.
Step No.

Procedure The dialog box is displayed. Select "Take no action".

1 2

Step 2

Step 3 Step 4

3 4

Check the check box, "Always do the selected action.". Click "OK" button. - The selection is completed. The dialog box will not be displayed again.

2. Functions that can be used on the screens on which the microscope image is displayed
Summary of this section This section describes how to use the functions that can be used on the screens on which the microscope image is displayed. Section No. 2-1 Description Overview of functions in each mode - XIS (Extended Interface System) mode - Wafer map - line mode - Wafer map - workpiece mode Switching between XIS mode and Wafer Map Mode and Reminder XIS Mode Major features The four operations below can be performed on the microscope image currently displayed without changing the screen. - Light intensity adjustment - Focus adjustment - Microscope image transfer (axis transfer) - Target window size change Wafer Map Major features Line Mode [During cutting operation] - Progress of cutting operation for each axis can be checked on the workpiece image. [When cutting operation is halted or after auto cut or semi-auto cut is complete] - The information of the cut line can be checked (such as feed speed, blade height, kerf check result and timing of replacement of the blade). - Just by specifying a cut line, the image (axis) moves above the specified line. This mode is useful when you want to check the cut result or microscope image of a specific line. Wafer Map Major features - If you touch a position on the workpiece Workpiece Mode image, the image (axis) moves to the position. This mode is useful when finding a target during teaching or moving the axis from one edge of a workpiece to the other edge. Title Overview of each Mode

2-2 2-3

2-4

2-5

Screens on which the microscope image is displayed The XIS mode and wafer map function can be used on the screens on which the microscope image is displayed.
- STOP CORRECTION screen - STOP CORRECTION2 screen - KERF CHECK DATA1 screen - KERF CHECK DATA2 screen - KERF CHECK DATA3 screen - KERF CHECK SPECIAL DATA screen - LIGHTNING ADJUSTMENT screen - FOCUS ADJUSTMENT screen - MANUAL ALIGNMENT screen [2.3] - ALIGNMENT screen [2.3.1] - AUTO CUT screen [2.4] - SEMI AUTOMATIC CUTTING screen [2.5] - SINGLE CH ALIGNMENT screen [2.5.4] - STOP CORRECTION (DRESS) screen - HAIRLINE ADJUSTMENT screen [4.5] - HAIRLINE ADJUSTMENT (EXECUTION) screen [4.5.1] - TAPE HAIRLINE ADJUSTMENT screen - MACRO TARGET TEACH screen [2.2.1] - MICRO TARGET TEACH screen [2.2.2] - MICRO STREET ADJUST screen [2.2.3] - AUTO TEACH screen [2.2.6] - AUTO TEACH STREET ADJUST screen [2.2.8] - TARGET WINDOW ADJUSTMENT screen - MEASURE screen [5.2] - ROTATION ALIGNMENT screen [6.2] - ROTATION ALIGNMENT (EXECUTION) screen [6.2.2] - PIXEL SIZE MEASURE screen [6.3]

Wafer map - line mode only


- FULL AUTOMATION screen [1.3] - CUT STATUS screen

XIS mode only


- FOCUS MAINTENANCE screen [6.4]

XIS setting When using XIS (the XIS mode and wafer map mode), tick off the check box in USER DEFINE DATA2 screen [Screen 7.4.2]. of [XIS]

2-1. Overview of each Mode


XIS mode

Operations that can be performed on the XIS mode - Adjust the focus. - Adjust light intensity. - Move the microscope image (move the axis). - Adjust the size of the target window. Example of use of the XIS mode - Move the currently displayed image to the desired position (the touch centering function to move the touched position of the image to the center of the screen). - Adjust light intensity and the focus when the microscope image is hard to see. - Adjust the size of the target window during teaching. Other - When you want to acquire the information of each cut line or display a specific position of a workpiece, use the wafer map mode instead of the XIS mode. - The wafer map - line mode is displayed during cutting operation. The XIS mode cannot be used during the operation.

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Wafer map - Line mode

Operations that can be performed on the wafer map - line mode [During cutting operation] - Check the progress of cutting operation for each axis on the workpiece image. - Display the list of operations performed on each line on the cut line image. [When cutting operation is halted, or after cutting operation is complete] - Move the screen image (move the axis) by specifying a cut line position (touch the line on the touch panel or use the key). - Display detailed information of the specified line. [After cutting operation completion] - Rotate the -axis.

11

Wafer map - Line mode (Continued) Example of use of the wafer map - line mode [During cutting operation] - Check the progress of cutting operation. - [6340/6361] Check cut area for each axis (The area cut by the Z1-axis is blue, the area cut by the Z2axis is green). [When cutting operation is halted, or after cutting operation is complete] - Check the operation result (kerf check, blade replacement) or execution status for each line. - Check the list (icon) that shows which operation was performed on which line. - Check the kerf check result of the line on which the kerf check was performed. - Check detailed information of cut lines (the position from which the X-axis started cutting operation, position where the X-axis completed cutting operation, Y-axis position during cutting operation, blade height and cutting speed). - Check the kerf status on the microscope image by specifying a cut line. - [6340/6361] Check cut area for each axis (The area cut by the Z1-axis is blue, the area cut by the Z2axis is green). [After cutting operation completion] - Check the cutting result of the other channels.

12

Wafer map - Workpiece mode When touching a position on the workpiece image displayed on the wafer map - workpiece mode, the axis moves to the position.

Operations that can be performed on the wafer map - workpiece mode - Move the axis to a position on the workpiece. - Check the microscope image after moving the position. Example of use of the wafer map - workpiece mode - Check the microscope image of a specific area on the workpiece. - Search a target from a position on the workpiece during teaching. - Move the microscope image (axis) from one edge of the workpiece to the other edge. Other - The wafer map - workpiece mode cannot be used during cutting operation. - The microscope image (axis) can be moved only within the range of the workpiece image. Even if you touch a position outside of the workpiece image, the image (axis) doesn't move.

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2-2. Switching between XIS Mode and Wafer Map Mode and Reminder
Switching between the XIS mode and wafer map mode Press the button at the upper right on the screen to switch between the XIS mode and wafer map mode. The mode of which the button is indicated in white is displayed on the screen.
Wafer map mode XIS mode

Reminder - When the wafer map mode won't be displayed during cutting operation When the XIS mode is displayed, the button of the XIS mode is white. When the wafer map mode is displayed, the button of the wafer map mode is white. If you push either one of the buttons again when it is displayed in white, indications other than those two buttons will disappear from the screen and the both buttons will turn green. If you start cutting operation when the both buttons are green, the wafer map won't be displayed during cutting operation. Also, if you press the wafer map mode button during cutting operation, the display of the wafer map will disappear. If you want to display the wafer map again, press the wafer map mode button.

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2-3. XIS Mode


XIS Mode
[2] [3] [1]

[8]

[6]

[4]

[7] [5]

Item No. Description Switch the mode for display. The mode of which the button [1] is white is 1 displayed on the screen. If starting the cutting operation when the both buttons are green, the wafer map mode won't be displayed during the cutting operation. Switch to the XIS mode. Switch to the wafer map mode. 2 Switch between display, non-display of the focus adjustment button [3], light intensity adjustment button [4] and target window size change button [8].

15

XIS Mode (Continued) Item No. Description The buttons to adjust the focus. They are used when the image is hard to see. The 3 adjusted focus position is used only for the workpiece currently displayed. Perform auto focus with the position away from the chuck table upper surface by "tape thickness + workpiece thickness" as the center. "Tape thickness" and "workpiece thickness" are the values specified in the device data currently used. When to use the button - When workpiece thickness doesn't vary. Perform auto focus. Perform auto focus on the wide area (approx. 4 mm width). When to use the button - When the focus is off even after the focus adjustment of "Small Stroke" is performed. Perform auto focus on the narrow area (approx. 0.4 mm width). When to use the button - When you want to perform focus adjustment in a short time. The buttons to adjust light intensity. They are used when the image is hard to see. The adjusted light intensity is used only for the workpiece currently displayed.
[4-1] [4-2] [4-3] [4-4] [4-5]

[4-3]

4-1 4-2 4-3 4-4 4-5

DIR: Direct light intensity OBL: Oblique light intensity Reduce light intensity by 1%. When dragged, light intensity changes. Increase light intensity by 1%. Current light intensity is indicated.

16

XIS Mode (Continued) Item No. Description The buttons to move the image horizontally. They are not displayed during 5 cutting operation. [6240/6361] The chuck table moves horizontally. [6340] The chuck table moves back and forth. The image moves to the left by one index. Chuck table movement 6240/6361 Left 6340 Backside The image moves to the left at high speed. Chuck table movement 6240/6361 Left 6340 Backside The image moves to the left at low speed. Chuck table movement 6240/6361 Left 6340 Backside The image moves to the right at low speed. Chuck table movement 6240/6361 Right 6340 Front side The image moves to the right at high speed. Chuck table movement 6240/6361 Right 6340 Front side The image moves to the right by one index. Chuck table movement 6240/6361 Right 6340 Front side

17

XIS Mode (Continued) Item No. Description The buttons to move the image back and forth. They are not displayed during 6 cutting operation. [6240]The Y-axis moves back and forth. [6340]The Y1-axis moves horizontally. (The Y2-axis moves under certain conditions) [6361]The Y1-axis moves back and forth. (The Y2-axis moves under certain conditions) The image moves upward by one index. Y- or Y1-axis movement 6240 Backside 6240 Right 6361 Backside The image moves upward at high speed. Y- or Y1-axis movement 6240 Backside 6340 Right 6361 Backside The image moves upward at low speed. Y- or Y1-axis movement 6240 Backside 6340 Right 6361 Backside The image moves downward at low speed. Y- or Y1-axis movement 6240 Front side 6340 Left 6361 Front side The image moves downward at high speed. Y- or Y1-axis movement 6240 Front side 6340 Left 6361 Front side The image moves downward by one index. Y- or Y1-axis 6240 Front side 6340 Left 6361 Front side

18

XIS Mode (Continued) Item No. Description Indicates the position of the microscope image relative to the workpiece using 7 points on the axes. The axis position is indicated by relative position with respect to the center of the chuck table ("0"). The unit used is either mm or inch. [6240/6361]

Chuck table center

Y= Minus (-) display Y=0

Y= Plus display (without sign)

X= Minus (-) display

X=0

X= Plus display (without sign)

Machine front

[6340]

Y= Minus (-) display Chuck table center Y=0 Y= Plus display (without sign)

X= Minus (-) display

X=0

X= Plus display (without sign)

Machine front

When the target window is displayed If dragging this button while pushing it, you can change the size of the target window.

19

2-4. Wafer Map - Line Mode


Wafer map - Line mode During cutting operation, the background color of the screen turns black, and the buttons other than
[3] [2]

are not displayed.


[10]

[1] [6340/6361] Z1 cut area= blue [9]

[8]

[6340/6361] Z2 cut area = green [7] [4] Selected line = red [6] [5]

20

Wafer map - Line mode (Continued) Item No. Description Displays the image of cut lines relative to the workpiece. Also, the line on which 1 the operation selected in [2] was performed is displayed as an icon. When cutting operation is not performed When touching a line on the workpiece image, the microscope image (axis) moves to the line touched. - When touching a position outside of the workpiece image on the screen

1) If you touch here

2) The image (axis) moves to this line.

- [6340/6361] When pushing the "Disp Change" button on STOP CORRECTION or STOP CORRECTION2 screen Ex: When changing the "Now Axis" from the Z1-axis to Z2-axis by pushing "Disp Change", the image (axis) moves to the last line cut by the Z2-axis. [6240] Cut area [6340/6361] Area cut by the Z1-axis When cutting a line with 2 axes (when the cut mode is "STEP"), the color of the cut area will be the color of the last axis used for Blue cutting. Ex: When executing the step cut in the order of the Z1-axis Z2axis, the color of the cut area will be the color of the Z2-axis (green). Green [6340/6361] Area cut by the Z2-axis Gray Uncut line Line currently selected - When the background is the microscope image, the line selected Red is displayed on the image. - Line selection can be made by touching a line on the workpiece image or using Button [8].

21

Wafer map - Line mode (Continued) Item No. Description Select an operation to display on the line displayed in [1]. 2 The background color of the button of the selected operation turns blue. If pressing the button again when its background color is blue, the selection is canceled and the display disappears. When pressing this button, the operation button is displayed. When pressing the button again, the operation button disappears. Display on the line on which the kerf check was performed.

Display on the first line cut after the blade replacement. Display all the information. Hide all the information. 3 Switch between display and non-display of the microscope image at the background of the screen. When hiding the microscope image, the background color turns black. The color remains black during cutting operation. During cutting operation, this button is not displayed. Only when cutting operation is complete Rotate the -axis. Rotate the -axis in the order of CH4 CH3 CH2 CH1. Rotate the -axis in the order of CH1 CH2 CH3 CH4.

22

Wafer map - Line mode (Continued) Item No. 5 Description Indicate the detailed information of the selected line. Even when pressing the button during cutting operation, the information is not displayed. 5-2

5-1

5-3

5-1

5-2
[Displayed only in 6340/6361]

5-3

Indicates the kerf check result if the check was performed on the selected line. When cutting 1 line with 2 axes (when the cut mode is "STEP") Select either the Z1-axis or Z2-aixs to show the cut result on 5-3. The information of the axis of the button displayed in blue is indicated in 5-3. Other Indicates whether the information displayed on 5-3 is the result for the Z1 or Z2-axis. Indicates the cut result. Line : What cut line number X-start : The position of the X-axis when cutting operation was started (the relative position with respect to the center of the chuck table ("0")) X-end : The position of the X-axis when cutting operation was complete (the relative position with respect to the center of the chuck table ("0")) Y : The position of the Y-axis during cutting operation (the relative position with respect to the center of the chuck table ("0")) Height : Blade height Speed : Feed speed

23

Wafer map - Line mode (Continued) Item No. Description Indicates the information of the selected line. 6 Indicates the channel during cutting operation or the channel of the CH* image currently displayed on the screen. Indicates what cut line number the selected line is. (Z1/Z2) Line* (Z1/Z2 are displayed only in 6340/6361) Indicates the kind of operation performed on the selected line as an icon. EVENT Line on which the kerf check was performed First line cut after the blade replacement Indicates the position of the microscope image relative to the workpiece using points on the axes. The axis position is indicated by relative position with respect to the center of the chuck table ("0"). The unit used is either mm or inch. [6240/6361]
Y= Minus (-) display Chuck table center Y=0

Y= Plus display (without sign)

X, Y
X= Minus (-) display X=0 X= Plus display (without sign) Machine front

[6340]

Y= Minus (-) display Chuck table center Y=0

Y= Plus display (without sign)

X= Minus (-) display

X=0

X= Plus display (without sign)

Machine front

24

Wafer map - Line mode (Continued) Item No. 7 Description This button can be used only when cutting operation is halted. When cutting operation is complete, the axis doesn't move even when pressing this button. Also, the button is not displayed during cutting operation. [6240] The microscope image (axis) moves to the position of the last cut line. [6340/6361] The microscope image and Z-axis move to the position of the last line cut by the axis displayed on "Now Axis" at the right of the screen. Move the selected line from line to line vertically. The button is not displayed during cutting operation. The line just above the line currently selected is selected. The line just below the line currently selected is selected. 9 Switch between the line mode and workpiece mode of the wafer map. The mode of which Button [9] is white is currently displayed on the screen. Switch to the workpiece mode. Switch to the line mode. 10 Switch the mode for display. The mode of which Button [10] is white is currently displayed on the screen. If starting cutting operation when both of the buttons are green, the wafer map mode is not displayed during the operation. Switch to the XIS mode. Switch to the wafer map mode.

25

2-5. Wafer Map - Workpiece Mode


Wafer map - workpiece mode This mode cannot be displayed during cutting operation.
[4] [3]

[9] [1]

[2]

[5]

[8]

[7] [6]

Item No. Description When touching a position on the workpiece image on the screen, the axis moves 1 to the position. The microscope image (axis) can be moved only within the range of the workpiece image. Even if you touch a position outside of the workpiece image, the image (axis) doesn't move. Indicates the current position of the microscope image relative to the whole 2 workpiece area. Switch the mode for display. The mode of which Button [3] is white is currently 3 displayed on the screen. If starting cutting operation when both of the buttons are green, the wafer map mode is not displayed during the operation. Switch to the XIS mode. Switch to the wafer map mode. 4 Switch between display and non-display of the microscope image at the background of the screen. When hiding the microscope image, the background color turns black.

26

Wafer map - workpiece mode (Continued) Item No. Description 5 Only when cutting operation is complete Rotate the -axis. Rotate the -axis in the order of CH4 CH3 CH2 CH1. Rotate the -axis in the order of CH1 CH2 CH3 CH4. 6 7 This button cannot be used in this screen. Indicates the information of the selected line. Indicates the channel during cutting operation or the channel of the CH* image currently displayed on the screen. Indicates the position of the microscope image relative to the workpiece using points on the axes. The axis position is indicated by relative position with respect to the center of the chuck table ("0"). The unit used is either mm or inch. [6240/6361]
Y= Minus (-) display Chuck table center Y=0

Y= Plus display (without sign)

X, Y
X= Minus (-) display X=0 X= Plus display (without sign) Machine front

[6340]

Y= Minus (-) display Chuck table center Y=0

Y= Plus display (without sign)

X= Minus (-) display

X=0

X= Plus display (without sign)

Machine front

27

Wafer map - workpiece mode (Continued) Item No. 8 Description When cutting operation is complete, the axis doesn't move even when pressing this button. [6240] The microscope image (axis) moves to the position of the last cut line. [6340/6361] The microscope image and Z-axis move to the position of the last line cut by the axis displayed on "Now Axis" at the right of the screen. Switch between the line mode and workpiece mode of the wafer map. Switch to the workpiece mode. When the workpiece mode is displayed, the button of the mode is white. Switch to the line mode. When the line mode is displayed, the button of the mode is white.

28

3. Analogue Time Series Graph


Summary of this section This section describes the analogue time series graph. Section No. 3-1 3-2 3-3 3-4 Title Overview of Analogue Time Series Graph Graph Display Screen Description Event Data Selection and Sensor Value Display Graph Data Saving Content - Overview of the analogue time series graph - Description of the procedure to be used to display the graph - Screen Description - Description of the display of the sensor values of the time indicated by the event data - Description of the procedure to be used to save the graph data

3-5

29

3-1. Overview of Analogue Time Series Graph


Overview The change of the analogue sensor values recorded by the machine is displayed as a line graph (hereinafter refereed as "graph"). When selecting the "Graph" tab at the right side of the LOG VIEWER screen, the analogue time series graph is displayed. The graph is used by maintenance personnel to analyze the machine status based on the sensor values when an error occurs. This is a useful tool to examine the cause of an error in order to prevent the same error from reoccurring.

Analogue time series graph

Number of data The sensor values are saved for approx. three days. When the number of data exceeds the saving capacity, the oldest data is deleted in order to save the latest data.

30

Type of analogue sensor The below list indicates the types of analogue sensor value which can be indicated as the graph. The types of analogue sensor differ depending on the type of machine and the optional accessories installed in the machine.
Analogue sensor name Main air Clean air Water pressure C/T work vacuum S/T work vacuum High pressure pump C/T table vacuum Upper arm vacuum Lower arm vacuum BBD level (Z1/Z2) Spindle current (Z1/Z2) Spindle Rev. (Z1/Z2) NCS level (Z1/Z2) Blade cooler (Z1/Z2) Shower (Z1/Z2) Spray (Z1/Z2) Holder upper (lower) temp. NCS (Z1/Z2) temp. Column temp. Table base temp. Theta base temp. Cutting water temp. Atomizing nozzle clean air UV irradiance 1 to 8 (10) DCI TotalFlow DCI Resistivity What is to be detected Main air pressure Clean air pressure Deionized water pressure Chuck table workpiece vacuum Spinner table workpiece vacuum Spinner high pressure pump pressure Chuck table vacuum Upper arm vacuum Lower arm vacuum (Z1/Z2) Blade breakage detector transmission level (Z1/Z2) Spindle current load value (Z1/Z2) Spindle revolution (Z1/Z2) Non-contact setup sensor voltage level (Z1/Z2) Blade cooler flow rate (Z1/Z2) Shower flow rate (Z1/Z2) Spray flow rate Spindle holder upper section (lower section) temperature (Z1/Z2) Non-contact setup water temperature Column (a part of the main body base) temperature Table base temperature -axis base temperature Cutting water temperature Cut section atomizing nozzle clean air pressure UV irradiation level CO2 injector deionized water (processing water) total flow amount Mcm CO2 injector resistivity Unit MPa MPa MPa kPa kPa MPa kPa kPa kPa % A min-1 V L/min L/min L/min C C C C C C MPa mW L

31

3-2. Graph Display


Procedure to display the graph Step No. 1 Procedure Press <Select...> button. - Select Analog Sensor box is displayed.

Press button at the right of the color (rectangular) you want to use. - The pull down menu is displayed.

3 4 5

Select an analogue sensor name from the pull down menu. Select analogue sensor names repeating Steps 2 and 3. - The analogue sensors can be selected up to ten. Press button. - Select Analog Sensor box closes. - The graph of the analogue sensor selected is displayed.

32

3-3. Screen Description


Analogue time series graph

[2]

[1]

[3] [4] [5] [6]

Item No. Content Graph selection button: 1 The values of the analogue sensor selected here are displayed on the vertical axis and horizontal axis. Up to ten graphs can be displayed at once. The graphs are displayed in the same color as the buttons.

33

Analogue time series graph (Continued) Item No. Graph display area: 2
[2-3] Maximum value [2-6]

Content
[2-2]

Unit [2-4] Center line

[2-5]

Minimum value [2-1]

[2-6]

2-1 2-2 2-3 2-4 2-5

2-6

Sensor name: The name of the analogue sensor selected in [1] is displayed. Horizontal axis (Time): Time is displayed. The time and sensor value of the center line are displayed. Vertical axis (Sensor value): The sensor values of the analogue sensor selected in [1] are displayed. Area within the acceptable value range (gray): The area displayed in gray is within the acceptable value range of the analogue sensor selected in [1]. When the graph is within this area, it means the values are within the acceptable range. The values specified in SENSOR THRESHOLD DATA [6.6] screen and TEMPERATURE THRESHOLD DATA [6.6.2] screen are used to determine the acceptable value range. Area outside of the acceptable value range (black): The area displayed in black is outside of the acceptable value range of the analogue sensor selected in [1].

34

Analogue time series graph (Continued) Item No. 2 Note:


(Continued)

Content is a mark used to indicate the positions of the graph before and after the graph is moved. The mark is not displayed in the actual screen.

When you want to move the horizontal axis to the right (to the current) Touch the area at the right of the center line.
The horizontal axis moves to the right

Touch this area Center line

When you want to move the horizontal axis to the left (to the past) Touch the area at the left of the center line.
The horizontal axis moves to the left

Center line Touch this area

- The area touched moves to the center line, and then the sensor value is displayed. Note: The screen stops moving when the latest (oldest) data reaches the center line. The screen doesn't move to the area where there is no data recorded.

35

Analogue time series graph (Continued) Item No. 3 Content button Display Select Analog Sensor dialogue box. Up to ten types of the analogue sensors can be selected to display the graph.

4 button Save the data of the graph displayed in the graph display area to a USB memory or FD. The data is saved in CSV format.

36

Analogue time series graph (Continued) Item No. 5 Content : Adjust the scale of the horizontal axis (Time). Make the scale bigger. Every time scale gets bigger. button is pressed, the
The scale gets bigger

Make the scale smaller. Every time scale gets smaller.

button is pressed, the


The scale gets smaller

37

Analogue time series graph (Continued) Item No. 6 Content : Adjust the scale of the vertical axis (Sensor value). Make the scale bigger. Every time scale gets bigger.
The scale gets bigger

button is pressed, the

Make the scale smaller. Every time scale gets smaller.


The scale gets smaller

button is pressed, the

Call up Edit Vertical Axis dialogue box. Edit the vertical axis so as to make the graph easy to read.

38

Edit Vertical Axis dialogue box Edit Vertical Axis dialogue box is used to change the display range of the graph. The vertical axis can be edited in the box so as to make the graph easy to read.
[2] [3] [4] [7] [5] [1]

[6]

Item No. Content The analogue sensor name and color of the graph to be edited are displayed. The 1 graph to edit can be selected with the graph selection button while leaving Edit Vertical Axis dialogue box open.

2.The vertical axis of the graph selected is going to be edited.

1. Graph selection Choose a button

39

Edit Vertical Axis dialogue box (Continued) Item No. Content The maximum and minimum values used for the SENSOR STATUS screen are 2 used as those of the vertical axis for the sensor displayed in [1]. - When selecting a graph with the graph selection button, the maximum and minimum values of the vertical axis change to those of the analogue sensor.

The maximum and minimum values of the sensor values displayed in the graph display area are used as those of the vertical axis for the sensor displayed in [1]. - If the maximum value or the minimum value of the sensor values changes after the graph is moved to the right or the left, the maximum value or the minimum value of the vertical axis will also change automatically.

40

Edit Vertical Axis dialogue box (Continued) Item No. Content Specify values for the maximum and minimum values of the vertical axis. [5] to 4 [7] are valid only when [4] is selected.

5 : Specify the maximum value of the vertical axis. Increase the maximum value.

Decrease the maximum value.

41

Edit Vertical Axis dialogue box (Continued) Item No. 6 Content : Specify the minimum value of the vertical axis. Increase the minimum value.

Decrease the minimum value.

42

Edit Vertical Axis dialogue box (Continued) Item No. Content Adjust the graph display position. 7 Apply the adjustment to the graph displayed in [1]. All Items All Items Note: Apply the adjustment to all the graphs. is a mark used to indicate the positions of the graph before and after the graph is moved. The mark is not displayed in the actual screen. Move the vertical axis upward while the scale remains constant. When moving the vertical axis by pushing the button, the values of [5] and [6] also change automatically. [When the check box "All Items" is ]
Vertical axis moves upward

Main air

[When the check box "All Items" is


Vertical axis moves upward

43

Edit Vertical Axis dialogue box (Continued) Item No. 7


(Continued)

Content Move the vertical axis downward while the scale remains constant. When moving the vertical axis by pushing the button, the values of [5] and [6] also change automatically. ] [When the check box "All Items" is
Vertical axis moves downward

[When the check box "All Items" is


Vertical axis moves downward

44

Edit Vertical Axis dialogue box (Continued) Item No. 7


(Continued)

Content Move the horizontal axis to the right (to the current) while the scale remains constant. Note: This button is applied to all the graphs regardless of the status of the check box "All Items" ( / ).
The horizontal axis moves to the right

Move the horizontal axis to the left (to the past) while the scale remains constant. Note: This button is applied to all the graphs regardless of the status of the check box "All Items" ( / ).
The horizontal axis moves to the left

45

3-4. Event Data Selection and Sensor Value Display


Sensor value display When selecting event data from the event data table window box, the sensor values of the time indicated by the event data are displayed.

Sensor value

46

3-5. Graph Data Saving


Procedure to save the graph data Step No. 1 Procedure When saving the data to a USB memory Insert a USB memory to the USB port. When saving the data to a FD Insert a FD to the FD drive. Press button. - The message "The USB (or FLOPPY) drive will be used. Press OK to confirm." is displayed. - When both the USB memory and FD are inserted, the USB memory is prioritized.
Message when saving the data to a USB

4 5

Press <OK> button. - Data saving starts. - When data saving starts, the message "PLEASE WAIT." is displayed. - The data of the graph displayed in the graph display area is saved. - The data is saved in CSV format. - Do not take out the USB memory or FD until you make sure that data saving is completed. When data saving is completed, the message "PLEASE WAIT." disappears. Take out the USB memory or FD.

47

4. Added New Kerf Recognition Method For Kerf Check


Summary of this section This section describes the new kerf recognition method for kerf check that is added to the KERF CHECK PARAMETER 3 screen (during stop correction) and KERF CHECK DATA screen [screen 3.1.8.8]. Added parameter "Algorithm" parameter is added to the following screens.

48

Added parameter (Continued) [Setting Item] Item No. Algorithm Descriptions Specify the kerf recognition method. Standard The kerf check is conducted by the standard recognition method. If the kerf check cannot be conducted normally by the "Standard" method, use the "Reflection" method. Reflection This method prevents misrecognition of kerfs displayed in white on the screen under such conditions as below. - When using the V-shaped blade - When using the wide blade - When cut depth is shallow

49

5. Added New Conditions To Start Auto Setup


Summary of this section This section describes the new conditions to start auto setup that is added to SETUP DATA 1 screen [screen 4.7]. Added parameters "Change in RPM to trigger Setup", "Perform Setup before starting FullAuto", "Perform Setup after Dressing", and "Perform Setup when device is changed" are added to the following screen.

[Setting Item] Item No. Change in RPM to trigger Setup

Descriptions The setup is performed when the difference between the spindle rotation speed at the time of set up operation and the rotation speed at the time of cutting operation is bigger than the specified value. The timing of the setup is before the cut operation is started at the time of full auto, auto cut and semi-auto cut operation. When the specified value is 0, the setup is not performed. The value specified here prevents the blade from expanding or contracting due to rotation speed variation in order to avoid cut depth variation.

50

Added paramters (Continued) Item No. Perform Setup before starting FullAuto Descriptions The setup is performed during workpiece transportation at the time of start of full automation.

Activate the setup at the time of start of full automation. Deactivate the setup at the time of start of full automation. Perform Setup after The setup is performed after the dressing operation is complete. Dressing The timing of the setup is as follows. - At the time of fully automatic operation: The setup is performed during workpiece transportation. - At the time of auto cut, semi-auto cut operation: The setup is performed before the cut operation is started. Activate the setup after dressing. Deactivate the setup after dressing. Perform Setup when The setup is performed when the device data to be used for the next cut operation is changed (switched) from the device data used device is changed for the just-completed cut operation for the single device full automation, multiple device full automation, auto cut or semi-auto cut. Activate the setup after device data change. Deactivate the setup after device data change.

51

6. Z2-axis Individual Cut Position Alignment


Overview of the Z2-axis individual cut position alignment function This feature performs the Z2-axis individual cut position alignment during DUAL cut or STEP cut. This function is used when cutting the appropriate position of a warped workpiece. To perform the cut position alignment operation, either one of the functions below is used. Re-recognizing the alignment target during kerf check Cut position adjustment during stop correction (cut operation in halt state) Z2-axis individual cut position alignment setting When using Z2-axis individual cut position alignment, tick off the check box [Individual Cut Adj (Z2)] in USER DEFINE DATA2 screen [Screen 7.4.2]. of

52

Z2-axis individual cut position alignment setting (Continued) Also, specify the settings of the KERF CHECK DATA screen [screen 3.1.8] referring to the screen below to use the Z2-axis individual cut position alignment function during kerf check.

TIMING

TIMING TIMING

Step No. 1 2

Procedure Specify "TIMING" for the <Z2 check mode>. - This is to check kerf for the Z2-axis at the same time as the Z1-axis. Specify "TARGET" or "KERF_TARGET" for the <Check mode>. - This is to re-recognize the alignment target during kerf check.

53

Z2-axis individual cut position alignment The following is an example operation for using this feature. Contents Step No. The cut position alignment for the Z1-axis is 1 performed when the cut position of the Z1axis is out of alignment and that of the Z2-axis is in the right position. - During kerf check, the cut position is aligned automatically by target re-recognition function. - During stop correction, the cut position is aligned by operator. Cutting position of Z1/Z2
Target Kerf of Z1-axis

Street Kerf of Z2-axis

Fig. 1

The Z1-axis performs cut position alignment. At this time, the adjusted value of the Z1-axis is applied to the Z2-axis, causing the cut position of the Z2-axis to be out of alignment (Fig. 2).

Target Kerf of Z1-axis

Kerf of Z2-axis

Fig. 2

The Z2-axis performs cut position alignment individually (Fig. 3). Since the adjusted value of the Z2-axis is not applied to the Z1-axis, the cut positions of both the Z1- and Z2-axes are adjusted correctly as shown in Fig. 3. Note: When the check box [Individual Cut Adj (Z2)] in USER DEFINE DATA2 screen [screen 7.4.2] is , step 3 is not performed.

Kerf of Z1-axis

Target Kerf of Z2-axis

Fig. 3

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ADDRESS LIST
Japan
Japan Head Office 13-11 Omori-Kita 2-chome, Ota-ku, Tokyo 143-8580, Japan (Overseas Sales Department) Phone: 81-3-4590-1100 Fax: 81-3-4590-1075 Kyushu Branch Office 16-14, Kamisuizenji 2-chome, Kumamoto 862-0951 Japan (Sales Department) Phone: 81-96-385-3411 Fax: 81-96-384-1410 Nagoya Regional Office 464-0850 4-1-29, Imaike, Chikusa-ku, Nagoya-shi, Aichi 464-0850 Japan Phone: 81-52-745-7763 Fax: 81-52-745-7764 Osaka Branch Office 3-12, Nishi-Nakajima 6-chome, Yodogawa-ku, Osaka-shi,Osaka 532-0011 Japan (Sales Department) Phone: 81-6-6390-0388 Fax: 81-6-6302-0258 Sendai Regional Office 1-17, Itsutsubashi 1-chome, Aoba-ku, Sendai-shi Miyagi 980-002 Japan (Sales Department) Phone: 81-22-262-3345 Fax: 81-22-262-3346 Suwa Regional Office Okita-machi 3-12, Suwa-shi, Nagano 392-0013 Japan Phone: 81-266-52-0814 Fax: 81-266-52-0815

USA
(Disco Offices) DISCO HI-TEC AMERICA, INC. USA Head Office Sales & Service Office 3270 Scott Blvd., Santa Clara, CA 95054-3011, U.S.A. Phone: 1-408-987-3776 Fax: 1-408-987-3785 DISCO HI-TEC AMERICA, INC. Eastern Regional Sales & Service Office 360 Harvey Road, Building B, Unit 202 Manchester, NH 03103, U.S.A. Phone: 1-603-656-9019 Fax: 1-603-656-9018 DISCO HI-TEC AMERICA, INC. Southwestern Regional Sales & Service Office 4411 South 40th Street, Suite D-5, Phoenix, AZ 85040-2950. U.S.A. Phone: 1-602-431-1412 Fax: 1-602-431-1437 DISCO HI-TEC AMERICA, INC. Southeastern Regional Sales & Service Office 3000 Aerial Center Executive Park Suite 140, Morrisville, N.C. 27560, U.S.A. Phone: 1-919-468-6003 Fax: 1-919-468-6004 DISCO HI-TEC AMERICA, INC. Central Regional Sales & Service Office 4392 Sunbelt Drive, Addison, TX 75001, U.S.A. Phone: 1-972-267-9500 Fax: 1-972-267-5612 DISCO HI-TEC AMERICA, INC. Northwest Regional Sales & Service Office 7931 SW Cirrus Drive, Beaverton, OR 97008-5971, U.S.A. Phone: 1-503-644-0323 Fax: 1-503-643-8108

Europe
(Disco Offices) DISCO HI-TEC EUROPE. GmbH Liebigstrasse 8 D-85551 Kirchheim b. Muenchen, Germany Phone: 49-89-90903-0 Fax: 49-89-90903-199 DISCO HI-TEC U.K. LTD. 151 London Road, East Grinstead/West Sussex RH19 1ET United Kingdom Phone: 44-1342-313165 Fax: 44-1342-313177 DISCO HI-TEC FRANCE SARL Espace Beauvalle-Bt. C, 6, rue Mahatma Gandhi F-13090 Aix-en-Provence, France Phone: 33-4-42-91-00-20 Fax: 33-4-42-91-00-29 DISCO HI-TEC MOROCCO SARL 219, Boulevard Zerktouni Rsidence EI Bardai 1 r tage-Appt No1 20100 Casablanca, MOROCCO Phone: 212-6-136-94-04 Fax: 212-6-22-97-38-88

Asia
(Disco Offices) DISCO HI-TEC (SINGAPORE) PTE LTD Singapore Head Office Blk 2 Kaki Bukit Ave 1, #03-06/08 Kaki Bukit Industrial Estate Singapore 417938, Singapore Phone: 65-6747-3737 Fax: 65-6745-0266 DISCO HI-TEC (MALAYSIA) SDN. BHD. Kuala Lumpur Office Suite 7.05, 7th Floor Menara Summit, Persiaran Kewajipan, USJ 1 47600 UEP Subang Jaya, Selangor Darul Ehsan, Malaysia Phone: 60-3-8024-6588 Fax: 60-3-8024-1311 DISCO TECHNOLOGY (SHANGHAI) CO., LTD. Shanghai head office Area E, 3rd Floor Building A, No.381 Fu-Te-Xi-Yi Road WaiGaoQiao Free Trade Zone, Shanghai 200131 P.R. CHINA Phone: 86-21-58662516 Fax: 86-21-58662517 DISCO TECHNOLOGY (SHANGHAI) CO., LTD. Guangdong Service & Technical Support Center 12th Floor, Fengshen Mansionm, No.2 Middle Xinfeng Road, Shijie Town, Dongguan, Guangdong, P. R. China Phone: 86-769-6334981 Fax: 86-769-6334559 DISCO TECHNOLOGY (SHANGHAI) CO., LTD. ChengDu Office The First City Plaza, No.308, ShunCheng Street, ChengDu 610017 P.R. China Phone: 86-28-86268592 Fax: 86-28-86268591 (Agent Offices) AUROTECH SYSTEMS (PHIL'S), INC. 121 Buencamino Street, Alabang, Muntinglupa, Philippines Phone: 63-2-809-0155 Fax: 63-2-807-7419 HAPPY POLE, LTD. Taipei Office 8F-1, No.41 Section 2, Roosevelt Road, Taipei, Taiwan R.O.C. Phone: 886-2-23960651, 886-2-23960652, 886-2-23966717 Fax: 886-2-23943943 HAPPY POLE, LTD. Hsin Chu Office No.4, Lane 7, Alley 452, Pao-Shan Road, Hsin Chu, Taiwan, R.O.C. Phone: 886-3-5798445, 886-3-5783394 D.I CORPORATION Disco Sales & Service Department D.I Building, 58-6, Nonhyun-Dong, Kangnam-ku, Seoul, Korea Phone: 82-2-546-5501 Fax: 82-2-3446-8087 HAPPY POLE, LTD. Kaohsiung Office 9598 6F-1, No.755 Jiangung Road Kaohsiung, Taiwan 807, R.O.C Phone: 886-7-3970598 Fax: 886-7-3970362 HAPPY POLE, LTD. Taichung Office 11th Floor, No. 276, Shengli Road Tantz Shiang, Taichung, Taiwan, R.O.C. Phone: 886-4-25317860 Fax: 886-4-25344205 DISCO HI-TEC (THAILAND) CO., LTD. Floor 16-D1, Lao Peng Nguan Tower 1, 333 Viphavadi-Rangsit Road Lard Yao, Chatuchak, Bangkok 10900, Thailand Phone: 66-2-618-8441 Fax: 66-2-618-8440 DISCO HI-TEC (MALAYSIA) SDN. BHD. Penang Regional Office 1-4-9 & 10, Krystal Point Corporate Park, Jalan Tun Dr Awang, 11900 Sungai Nibong, Penang, Malaysia Phone: 60-4-644-5502 Fax: 60-4-645-2285 DISCO TECHNOLOGY (SHANGHAI) CO., LTD. Tianjin Service & Technical Support Center Room 2810.Riverfront Building.No 81 Shi-yi-jing Rd. Hedong District, Tianjin 300171 P. R. China Phone: 86-022-24381973 Fax: 86-022-24381637 DISCO TECHNOLOGY (SHANGHAI) CO., LTD. SuZhou Office Room402, Building 1A, Singa Plaza, No.8, Jinji Hu Road, SuZhou Industrial Park 215021 P.R. China Phone: 86-512-67629081 Fax: 86-512-67629082

Fax: 886-3-5798442]

NEW TRONICS CO., LTD. Flat F, 11th Floor, Valiant Ind. Bldg. 2-12 Au Pui Wan Street, Fotan, Shatin, N.T., Hong Kong Phone: 852-26871431 Fax: 852-26874283

IN AN EVENT OF AN ACCIDENT
Be sure to contact us Immediately get in touch with the nearest DISCO or DISCO Service Office if a situation arises where an accident has occurred or might occur that involves injury or death during the operation of DISCO equipment. Sales representative Attach the business card of the DISCO sales representative you contact with, in the dotted lines below.

Attach the business card of your DISCO sales representative.

The contact list is subject to change without notice. The latest list is available on the Internet. DISCO home page http://www.disco.co.jp/