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1140/epje/e2004-00014-7
1 Introduction
Thin polymer lms are of growing importance with respect to an increasing number of high-tech applications. Caused by the progressive miniaturization, typical spatial sizes have to be decreased. With reducing lm thickness the long- and short-range interactions between the polymer and the solid [1,2] become important. While macroscopically thick lms are stable, thin lms can be unstable or metastable. A relaxation towards the thermodynamical equilibrium can occur, e.g. caused by heat load exposed on the polymeric layer. The corresponding destabilization process destroys the initially homogeneous polymer lm. The lm dewets from the substrate and rearranges into an assembly of polymeric drops replacing the continuous layer. Because the assembly of drops has inferior properties with respect to typical application characteristics such as dielectric constant or resistance a prediction of the dewetting is highly demanded. Therefore unstable thin polymer lms are interesting from a basic research as well as from an applied science point of view. The model system polystyrene (PS) on top of silicon substrates (Si) covered with an oxide layer (SiOx ) turned out to be preferentially examined [323]. With respect to the long-ranged part of the eective interface potential as long as only van der Waals contributions are taken into account, PS is stable on Si and unstable on SiOx . For Si covered with a thin oxide layer of thickness d, PS lms with thicknesses smaller than a critical thickness hc are unstable and with a thickness h > hc are expected to be stable. However, experimental results on the destabia
e-mail: muellerb@ph.tum.de
lization and the related dewetting mechanism (spinodal dewetting versus nucleation) partly yielded contradictory results. In contrast, the model system (PS on SiOx /Si) itself seems well dened. PS is widely used in applications, easily synthesized with a narrow molecular weight distribution and readily purchased from suppliers. Soluble in many standard solvents such as toluene or tetrahydrofurane PS is well suited for thin lm preparation via the spin-coating technique. The applicability of the spin-coating technique is of great importance since spin-coating enables the preparation of thin homogeneous polymer lms also on non-wetting surfaces [24,25]. As a consequence the lm thickness is tuneable from values below the radius of gyration of the unperturbed molecule up to many micrometers and thus covers the interesting range with respect to dewetting. PS is glassy at room temperature, but has a moderate glass transition temperature, which can be achieved with standard heating set-ups. In atactic PS no complications due to crystallization occur. PS is chemically inert and has a low vapor pressure in the melt like most polymers. Also Si is extremely important for industrial applications and readily purchased from suppliers with very high purity. Its crystallographic orientation, doping (p- or ntype), resistivity, thickness and diameter can be chosen. The polished surface exhibits a very small surface roughness typically below 1 nm. Thus as compared to typical feature heights resulting from the dewetting of a thin polymer lms, the Si surface can be assumed to be at and smooth. However, the surface of Si is commonly covered with a native oxide layer. This native oxide layer results from the manufacturing of the substrates and has a typical thickness of 12 nm. To increase the oxide layer thickness
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the substrates are thermally oxidized which typically resulted in values on the order of 200 nm [35,17,18]. Within this commentary the inuence of preparation conditions on the dewetting of thin PS lms is focused. The inuence of surface cleaning in the thin lm preparation is discussed and turned out to be a central part with respect to dewetting.
2 Surface cleaning
After exposure to air the bare Si surface is usually covered with a thin native oxide layer and various impurities, such as particulates, organic residues, metal residues and ionic species. For Si based device fabrication a variety of dierent cleaning procedures has been established to remove these impurities. With each new device generation, the cleaning requirements become more stringent, and the number of cleaning steps increases. For example, for 64 Mb 0.25 m dynamic random access memory (DRAM) fabrication, 60 to 70 cleaning steps are usually required [26]. Common cleaning procedures can be grouped in aqueous cleaning, dry wafer cleaning, ultraviolet-ozone cleaning, vapor phase wafer cleaning and plasma cleaning processes [27]. Prominent examples of aqueous cleaning processes are RCA-1 clean (based on 5 parts deionized water, 1 part 27% ammonium hydroxide and 1 part 30% hydrogen peroxide), RCA-2 clean (based on 6 parts deionized water, 1 part 27% hydrochloric acid and 1 part 30% hydrogen peroxide), piranha clean (based on 1 part deionized water, 3 parts 98% sulfuric acid and 1 part 30% hydrogen peroxide) or BOE clean (based on 1 part deionized water, 1 part hydrouoric acid and 1 part ammonium uoride) [28]. A typical example of dry wafer cleaning is cryogenic cleaning using either a CO2 or an argon/nitrogen gas source (frequently called snow-jet). RCA-1 and piranha are used as a procedure for removing organic residues and certain metals, RCA-2 for removing atomic and ionic contaminants and BOE for stripping the oxide. If wrongly applied, cleaning is replaced by etching and from the aqueous cleaning processes a surface roughening can result. CO2 cleaning removes micron and submicron particulates and hydrocarbon-based contamination. It is nondestructive, nonabrasive and residue-free and mainly used for specic spot cleans. Limiting problems with recontamination are overcome by special ultra-clean environmental control [26]. In contrast to multiple-step cleaning, most likely investigations concerning the dewetting of thin polymer lms make use of one single cleaning step only. In addition, in dierent experimental groups, dierent cleaning procedures have established, e.g. [6,18,29,30]. As a consequence, although the systems under investigation are nominately equal, by dierent surface cleaning small differences can be introduced. Having a closer look on the inuence of the dierent cleaning processes with respect to the resulting oxide layer, X-ray reectivity measurements turned out to be very eective [3135]. Native oxides formed by aqueous cleaning processes were reported to have a lower mass
density as compared to Si (Si = 2.33 g/cm3 ). From ammonium hydroxide (SiOx = 2.11 g/cm3 ) and hydrochloric acid (SiOx = 2.07 g/cm3 ) based cleaning even lower densities result as compared to oxides formed by sulfuric acid (SiOx = 2.23 g/cm3 ) [31,34]. In contrast thermally oxidized SiOx typically exhibited densities larger than bulk Si (SiOx = 2.41 g/cm3 ) [32]. In addition the density depends on the oxidation temperature applied. Some measurements even showed evidence for the presence of a density gradient through the thick oxide layer, which was attributed to a possible temperature gradient within the sample during the oxidation process [35]. The density decreased from the surface to the Si/SiOx interface. The structure of the amorphous SiOx (a-SiO2 ) is similar to that of a quartz, which consists of tetrahedral SiO4 units [36]. The macroscopic density variation of the native oxides was gured out not to result from the densication of a-SiO2 , but to be originated by inhomogeneities of the layer. Si hydrides and hydroxyl was considered to be present, depending on the cleaning process chosen. Native oxides prepared in presence of hydrochloric acid had a large amount of Ox Si-Hy and Si-Hz imperfections, prepared with ammonium hydroxide had little Ox Si-Hy but large Si-Hz contributions and prepared with sulfuric acid only very little of both [34]. As a consequence native oxide and thermally induced oxide dier in their chemical composition and a deviation in the short and long-ranged part of the interface potential might be expectable. With respect to the wettability of the surface the contact angle is of interest. On silicon substrates, as received from the manufacturer, the top oxide layer is hydrophilic or hydrophobic, depending on the chemicals used during the polishing of the surface. In principle, after polishing the wafers were demounted and subjected to a nal clean. However, the surface chemistry is uncontrolled due to this unknown cleaning, which explains the rather large scatter of contact angle values reported (e.g. contact angle against water up to 31 [37]). After application of the RCA-1 clean the surface is rather hydrophilic with a typical contact angle against water of = 2 . The subsequent application of RCA-2 does not modify this value [37]. An additional storage time of 5 days increases the value up to = 16 . Applying only RCA-2 creates a hydrophilic surface with = 0 which is less stable. A storage under vacuum for 1 hour only results in a surface modication yielding = 36 [38]. Replacing water by a Langmuir lipid monolayers such as L--dimyristoylphosphatidyl-ethanolamone DMPE [39] results in higher sensitivity and dierences of the contact angle between the application of the RCA-1 clean and a subsequent RCA-2 clean. The value of the contact angle in the liquid-expanded phase increases from 11.5 to 26 if the second cleaning step was added. Using a sequence of RCA-1, RCA-2, RCA-1 clean results in values equal to the single RCA-1 clean which underlines the reproducibility of the surface chemistry introduced by the chosen clean [40]. During aging by storage in the Langmuir trough slight changes of the contact angle value were detected after one hour already.
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Fig. 1. Optical micrographs of the surface of a 30 nm 8.9 k PS lm after annealing for 24 h at 140 C. The substrates were cleaned by a) piranha, b) piranha + 12 h storage, c) RCA-1, d) RCA-1 + 12 h storage, e) RCA-2, f) RCA-2 + 12 h storage, g) 24 h storage in Milli-Q water and h) wiping with a toluene soaked wipe immediately before spin-coating the PS layer. While the PS lm looks gray, the Si surface reects more light and is looking white. Each micrograph shows a surface size of 625 469 m2 .
areas act as nucleation sites for a dewetting of the PS lm. The dierent stages of the dewetting which were reached by a modied surface treatment can be transformed into a time span after the onset of destabilization. Indicating the density and strength of the nucleation sites, obviously PDMS, usually used as a dewetting agent, is most eective. The acid piranha clean is sensitive to aging similar to the acid RCA-2 clean. Small holes of uniform diameter are visible. The short-ranged part of the interaction is modied resulting in a strong change of the contact angle by more than 30 . Causing a deep minimum in the eective interface potential close to the wall the short ranged interaction can introduce dewetting. The comparison with dewetting experiments of other research groups is restricted to examples which provided a detailed description of the surface cleaning by the authors. Reiter [14] used native oxide covered Si substrates as obtained by the supplier and observed dewetting pattern similar to Figure 1h. Stange et al. [20] used Si wafers as received from the manufacturer to keep a contamination layer of airborne hydrocarbons as detected with X-ray photoelectron spectroscopy. Removing the contaminations by ozone or acid cleaning virtually eliminated dewetting. Subsequently to cleaning contaminated wafers exhibited the same process of nucleation and dewetting as the received wafers, although the rate of hole growth diered [20]. An acid cleaning based on sulfuric acid with varying details of the applied solution was performed by several groups [6,12,13,17,18,21]. Dewetting of a 30 nm 4k PS lm was observed by Feng et al. [6] after storage of the cleaned substrates in a vacuum furnace for approximately 30 min at room temperature. Xie et al. [21] stored the cleaned surface for 24 h under vacuum at room temperature. After 25 h annealing of the 35 nm 4k PS lm holes comparable to the ones shown in gure 1b were reported. Seemann and coworkers [17,18] applied the acid cleaning step prior to coating of the PS layer. PS lms in the lm thickness regime on the order of 30 nm were stable. Thus the observed behavior is well explainable within the applied surface clean.
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Fig. 2. AFM pictures and related Fourier transforms of ultrathin PS lms on ad) piranha cleaned Si and on e, f) toluene soaked wipe cleaned Si. The initial lm thicknesses were a) 2.5 nm and d, e) 3 nm. In c) no initial homogeneous lm was obtained. The used molecular weights were a, c) 207 k and d,e) 27.5 k. Scan size (2 2 m2 for a, c, d and 8 8 m2 for e) and height scaling (color bar covers approximately a) 4, c) 2, d) 2, e) 4 nm) are individually adapted to emphasize on the resulting topography. High surface regions are shown in white, low ones in black. AFM measurements were performed in non-contact mode to minimize a tip induced surface modication.
lated lm are visible. RCA-1 and RCA-2 cleaned surfaces exhibit comparable features with slightly modied density of holes whereas the toluene soaked wipe cleaned surface is spangled with holes. Transferring the two shown snap shots into a time dependence yields dierent characteristic rupture times. In the framework of the spinodal dewetting model the dierent rupture times = 48h5 /A2 would correspond to changes in the Hamaker constant A, because the other parameters such as surface tension , viscosity and lm thickness h are constant. Unfortunately, the exact detection of a rupture time by AFM is rather dicult and inconvenient. In Fourier space the rst small holes do not give rise to a ring-like intensity distribution as it is present for the wipe cleaned Si (Fig. 2f). Consequently, the pattern is described by one characteristic wavelength qmax obtained from the position of the intensity maximum. Typical spinodal like surface pattern evolve during further annealing. A similar observation was reported by Xie et al. [21] in case of 4k PS lms with thicknesses below 10 nm on acid cleaned Si. Due to the smaller molecular weight these lms
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were not that conned as compared to the ones presented in Figure 2. In contrast, Seemann et al. [17] restricted the spinodal regime to a PS layer thickness below 2 nm in case of a 1 nm oxide layer thickness. With increasing oxide layer thickness the value of the PS lm thickness being unstable against spinodal dewetting increases in their investigation. However, due to the small molecular weight chosen (Rg = 1.2 nm for 2k) the connement regime was not touched in the investigation of Seemann et al. [17]. Rehse et al. [43] observed an instability-stability transition of PS (molecular weights between 5.6k and 1000k) on corrugated as well as on at Si substrates at a critical thickness. The critical thickness was reported to scale with the radius of gyration of the unperturbed chain. Films with thicknesses larger than 0.55 Rg remained stable and ones with thicknesses smaller than 0.55 Rg dewetted [43]. Aubouy [44] identied one single process, namely the competition between the entropy of the set of loops, which favors a dense state of the polymer layer, and the repulsive loop-loop interaction, which favors a dilute state of this layer, to result in a critical lm thickness. As a consequence ultra-thin polymer lms dewet surfaces that thick lms wet [44]. With respect to the late stages the resulting droplet pattern of dewetted conned PS lms do not obey a polygonal assembly but are distributed with one most prominent nearest neighbor distances [12,45]. As a consequence, only the generally applied clean is not sucient to overcome the apparently dierent observations with respect to dewetting. Due to the extreme sensitivity of these ultra-thin PS lms on the short ranged part of the interface potential, additional work on this particular topic will be required to install a relation between cleaning and interface potential.
References
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5 Summary
In summary, the substrate surface cleaning marks a central step of the complete dewetting experiment. Cleaning changes the chemistry of the oxide layer. Due to the chosen cleaning the lm stability can be varied from a stable homogeneous lm into a dewetting of the polymer lm. In addition, the time between cleaning the surface and spin-coating the polymeric layer on top turned out to be an important parameter. Taking into account the dierent cleans applied, the contradictory experimental observations with respect to the stability of thin PS lms on Si with an oxide surface are explainable. For ultra-thin PS lms still discrepancies remain. As a consequence, a detailed description of the applied surface cleaning should be part of each experimental description related to dewetting.
This work had beneted from discussions with K. Graf, M. Mller, O. Wunnicke and M. Stamm and was supported by u the DFG in the framework of the priority program wetting and structure formation at interfaces (Sta324/8). A Gtzendorfer o and E. Bauer assisted with the AFM investigations.
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