2SK1304

Silicon N Channel MOS FET

REJ03G0923-0200 (Previous: ADE-208-1262) Rev.2.00 Sep 07, 2005

Application
High speed power switching

Features
Low on-resistance High speed switching Low drive current 4 V gate drive device Can be driven from 5 V source Suitable for motor drive, DC-DC converter, power switch and solenoid drive

Outline
RENESAS Package code: PRSS0004ZE-A (Package name: TO-3P)
D G 1. Gate 2. Drain (Flange) 3. Source

S 2 3

Rev.2.00 Sep 07, 2005 page 1 of 6

2SK1304

Absolute Maximum Ratings

(Ta = 25C)
Item Drain to source voltage Gate to source voltage Drain current Drain peak current Body to drain diode reverse drain current Channel dissipation Channel temperature Storage temperature Notes: 1. PW 10 s, duty cycle 1% 2. Value at TC = 25C Symbol VDSS VGSS ID ID(pulse) IDR Pch Tch
*1

Ratings 100 20 40 160 40 100 150 55 to +150

Unit V V A A A W

*2

Tstg

C C

Electrical Characteristics
(Ta = 25C)
Item Drain to source breakdown voltage Gate to source breakdown voltage Gate to source leak current Zero gate voltage drain current Gate to source cutoff voltage Static drain to source on state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Body to drain diode forward voltage Body to drain diode reverse recovery time Note: 3. Pulse test Symbol V(BR)DSS V(BR)GSS IGSS IDSS VGS(off) RDS(on) |yfs| Ciss Coss Crss td(on) tr td(off) tf VDF trr Min 100 20 1.0 22 Typ 0.025 0.03 35 3500 1400 340 25 170 730 300 1.2 300 Max 10 250 2.0 0.03 0.04 Unit V V A A V S pF pF pF ns ns ns ns V ns IF = 40 A, VGS = 0 IF = 40 A, VGS = 0, diF/dt = 50 A/s Test conditions ID = 10 mA, VGS = 0 IG = 100 A, VDS = 0 VGS = 16 V, VDS = 0 VDS = 80 V, VGS = 0 ID = 1 mA, VDS = 10 V ID = 20 A, VGS = 10 V * 3 ID = 20 A, VGS = 4 V * ID = 20 A, VDS = 10 V * VDS = 10 V, VGS = 0, f = 1 MHz ID = 20 A, VGS = 10 V, RL = 1.5
3

Rev.2.00 Sep 07, 2005 page 2 of 6

2SK1304

Main Characteristics
Power vs. Temperature Derating
120 500 200

Maximum Safe Operation Area

Operation in this Area is Limited by RDS (on)

Channel Dissipation Pch (W)

Drain Current ID (A)

100 50

10
D C

10

80

PW
O pe

1
= 10
n

20 10 5 2 1.0 0.5

ra

m
(T

tio

(1
=

40

Sh o

25

t)
)

Ta = 25C

50

100

150

10

30

100

300

1,000

Case Temperature TC (C)

Drain to Source Voltage VDS (V)

Typical Output Characteristics

100 10 V 5V 7V 4V Pulse Test 50

Typical Transfer Characteristics

VDS = 10 V Pulse Test

Drain Current ID (A)

60 3.5 V 40 3V 20 VGS = 2.5 V

Drain Current ID (A)

80

40

30

20 75C 10 TC = 25C 25C

12

16

20

Drain to Source Voltage VDS (V) Drain to Source Saturation Voltage vs. Gate to Source Voltage
2.0 Pulse Test 50 A 1.2

Gate to Source Voltage VGS (V) Static Drain to Source on State Resistance vs. Drain Current
0.5 Pulse Test 0.2 0.1 0.05 VGS = 4 V 10 V 0.02 0.01 0.005 2 5 10 20 50 100 200

Drain to Source Saturation Voltage VDS (on) (V)

1.6

0.8 20 A 0.4 ID = 10 A

10

Gate to Source Voltage VGS (V)

Static Drain to Source on State Resistance RDS (on) ()

Drain Current ID (A)

Rev.2.00 Sep 07, 2005 page 3 of 6

2SK1304
Static Drain to Source on State Resistance vs. Temperature
0.10 Pulse Test ID = 50 A 0.06 VGS = 4 V 20 A 10 A 0.04 50 A 20 A 10 A VGS = 10 V

Static Drain to Source on State Resistance RDS (on) ()

Forward Transfer Admittance vs. Drain Current

Forward Transfer Admittance yfs (S)
50

0.08

20 10 5

25C TC = 25C 75C

2 1.0

0.02

VGS = 10 V Pulse Test

0 40

40

80

120

160

0.5

1.0

10

20

50

Case Temperature TC (C) Body to Drain Diode Reverse Recovery Time

500 10,000 di/dt = 50 A/s, Ta = 25C VGS = 0 Pulse Test

Drain Current ID (A) Typical Capacitance vs. Drain to Source Voltage

Reverse Recovery Time trr (ns)

Ciss

Capacitance C (pF)

200 100 50 20 10 5 0.5

1,000

Coss

Crss 100

VGS = 0 f = 1 MHz 10 1.0 2 5 10 20 50 0 10 20 30 40 50

Reverse Drain Current IDR (A)

Drain to Source Voltage VDS (V)

Dynamic Input Characteristics

Drain to Source Voltage VDS (V)
100 VDS VDD = 25 V 50 V 80 V 60 VDD = 80 V 50 V 25 V 20 ID = 40 A 4 VGS 12 20 1,000

Switching Characteristics
Gate to Source Voltage VGS (V)
td (off) 500

Switching Time t (ns)

80

16

tf 200 100 50 td (on) 20 10 0.5 VGS = 10 V VDD = 30 V PW = 2 s, duty < 1%

40

tr

0 0 40 80 120 160 200

1.0

10

20

50

Gate Charge Qg (nc)

Drain Current ID (A)

Rev.2.00 Sep 07, 2005 page 4 of 6

2SK1304
Reverse Drain Current vs. Source to Drain Voltage
50

Reverse Drain Current IDR (A)

40

Pulse Test

30

10 V 5V

20

10 VGS = 0, 5 V 0 0.4 0.8 1.2 1.6 2.0

Source to Drain Voltage VSD (V)

Normalized Transient Thermal Impedance S (t)

Normalized Transient Thermal Impedance vs. Pulse Width

3 TC = 25C 1.0 D=1 0.5 0.3 0.1 0.2 0.1 0.05 0.02 0.01 chc (t) = S (t) chc chc = 1.25C/W, TC = 25C PDM D = PW T

0.03

1S 0.01 10

ul ot P

se
T 100 1m 10 m 100 m

PW 1

10

Pulse Width PW (S)

Switching Time Test Circuit

Vin Monitor Vout Monitor D.U.T RL Vin Vout 10 %

Waveforms
90 %

10 % 90 % tr 90 % td(off)

10 %

50 Vin = 10 V . VDD = 30 V . td(on)

tf

Rev.2.00 Sep 07, 2005 page 5 of 6

2SK1304

Package Dimensions
JEITA Package Code
SC-65

RENESAS Code
PRSS0004ZE-A

Package Name TO-3P / TO-3PV

MASS[Typ.] 5.0g

5.0 0.3

Unit: mm
4.8 0.2 1.5

15.6 0.3

0.5

1.0

3.2 0.2

14.9 0.2

19.9 0.2

1.6 1.4 Max 2.0 2.8

2.0

1.0 0.2 3.6 0.9 1.0

18.0 0.5

0.6 0.2

5.45 0.5

5.45 0.5

Ordering Information
Part Name 2SK1304-E 30 pcs Quantity Plastic magazine Shipping Container

Note: For some grades, production may be terminated. Please contact the Renesas sales office to check the state of production before ordering the product.

Rev.2.00 Sep 07, 2005 page 6 of 6

0.3

Sales Strategic Planning Div.

Keep safety first in your circuit designs!

Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan

1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.

RENESAS SALES OFFICES

Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> 2-796-3115, Fax: <82> 2-796-2145

http://www.renesas.com

Renesas Technology Malaysia Sdn. Bhd. Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510

2005. Renesas Technology Corp., All rights reserved. Printed in Japan.

Colophon .3.0