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24-Bit Analog-to-Digital Converter (ADC) with Load-cell Power Supply Switch and Battery Voltage Detection for Weigh Scales
DESCRIPTION
Based on Avia Semiconductors patented technology, HX712 is a precision 24-bit analogto-digital converter (ADC) with on chip load-cell power supply switch and battery voltage detection. Its designed for weigh scales and industrial control applications to interface directly with a bridge sensor. The differential inputs connect to the lownoise programmable gain amplifier (PGA) with a gain of 128 or 256, corresponding to a full-scale differential input voltage of 20mV or 10mV respectively, when a 5V reference voltage is connected between REFP and REFN pins. Singleended battery detection input pin BAT can be connected directly to battery output. On chip load-cell power switch can be used to turn off power supply to load-cell to save system power. Clock input is flexible. It can be from an external clock source, a crystal, or the on-chip oscillator that does not require any external component. On-chip power-on-reset circuitry simplifies digital interface initialization. There is no programming needed for the internal registers. All controls to the HX712 are through the pins.
R3 0.1u Load-cell REFP INN INP
PGA Input MUX
FEATURES
Selectable differential input or battery detection input On-chip low noise PGA with selectable gain of 128 and 256 On-chip MOS power switch for turning off loadcell power supply in system power save mode On-chip oscillator requiring no external component with optional external crystal On-chip power-on-reset Simple digital control and serial interface: pin-driven controls, no programming needed Selectable 10SPS or 40SPS output data rate Simultaneous 50 and 60Hz supply rejection Current consumption: normal operation < 1.0mA, power down < 1uA Operation supply voltage range: 2.6 ~ 5.5V Operation temperature range: -40 ~ +85 14 pin SOP-14 package
APPLICATIONS
Weigh Scales Industrial Process Control
2.6~5.5V VOUT AVDD DVDD
DOUT
24-bit ADC Digital Interface
PD_SCK
To/From MCU
DGND AGND
HX712
Internal Oscillator
XI
XO
Figure 1
AVIA SEMICONDUCTOR
HX712
Pin Description
Analog Power To Load-cell power supply ADC Positive Reference Analog Ground ADC Negative Reference Signal Negative Input Signal Positive Input
1 2 3 4 5 6 7
14 13 12 11 10 9 8
Battery Voltage Detection Input Digital Power Crystal I/O and External Clock Input Crystal I/O Serial Data Output
SOP-14L Package
Pin # 1 2 3 4 5 6 7 8 9 10 11 12 13 14
Name AVDD VOUT REFP AGND REFN INN INP DGND PD_SCK DOUT XO XI DVDD BAT
Function Power Analog Output Analog Input Ground Analog Input Analog Input Analog Input Ground Digital Input Digital Output Digital I/O Digital Input Power Analog Input
Description Analog supply: 2.6 ~ 5.5V ( <= BAT ) On chip power MOS switch output (NC when not used) A/D conversion positive reference Input Analog ground A/D conversion negative Reference Input Differential negative input Differential positive input Digital ground Power down control (high active) and serial clock input Serial data output Crystal I/O (NC when not used Crystal I/O or external clock input, 0: use on-chip oscillator Digital supply: 2.6 ~ 5.5V ( <= BAT ) Battery voltage detection inputconnect to higher of AVDD or DVDD when not used Table 1 Pin Description
AVIA SEMICONDUCTOR
HX712
KEY ELECTRICAL CHARACTERISTICS
Parameter
Full scale differential input range Effective-Number-ofBits (ENBs) (1) Noise-Free Bits (NFBs) (2) Integral Nonlinearity INL Input common mode range Output data rate External clock or crystal Output data coding Power MOS switch onresistance Output settling time Input offset Input noise Temperature drift Gain = 128 Input common mode rejection Power supply rejection Crystal or external clock frequency Power supply voltage Analog supply current (AVDD=3.3V) Digital supply current (DVDD=3.3V)
(3)
Notes
V(inp)-V(inn) Gain=128, Rate=10SPS Gain=128, Rate=40SPS Gain=128, Rate=10SPS Gain=128, Rate=40SPS Differential input, endpoint fit
MIN
TYP
0.5(REFPREFN)/GAIN
19.7 18.9 17.3 16.2
MAX
UNIT
V Bits Bits
0.001
AGND+0.8 AVDD-1.3 10 or 40 fclk/1,105,92 or fclk/138,240 800000 3 400 100 0.01 40 80 15 7 100 100 1 11.0592 20 5.5 5.5 900 0.5 100 0.1 7FFFFF 5
On-chip oscillator
2s complement AVDD=3.3V Rate=10SPS Rate=40SPS Gain=128 Gain=128, Rate=10SPS Gain=128, Rate=40SPS Input offset drift Gain drift Gain=128, Rate=10SPS Gain=128, Rate=10SPS
DVDD AVDD ( < = DVDD) Normal operation Power down Normal operation Power down
2.6 2.6
A A
1(2) ENBs = ln(FSR/RMS Noise)/ln(2), NFBs = ln(FSR/Peak-to-Peak Noise)/ln(2). FSR is fullscale input or output. RMS Noise corresponds to input or output RMS noise. Peak-to-Peak Noise corresponds to input or output peak-to-peak noise. 3Settling time refers to the time from power up, reset, input channel change and gain change to valid stable output data. Table 2 Key Electrical Characteristics
AVIA SEMICONDUCTOR
HX712
TYPICAL PERFORMANCE
Test Conditions: Temperature=25AVDD=DVDD=REFP=5VREFN=AGNDInternal Oscillator
AVIA SEMICONDUCTOR
HX712
Analog Input and Battery Detection
Differential inputs are designed to interface directly with a bridge sensors differential outputs. It can be programmed with a gain of 128 or 256. When 5V reference is used, these gains correspond to a full-scale differential input voltage of 20mV or 10mV respectively. Single-ended battery input signal (BAT) can be directly connected to a battery output (2.6~5.5V). On-chip 56k and 3.2k resistors divide this input voltage to provide suitable voltage to the ADC, which has a gain of 1. When detecting battery input, AVDD is used as the ADCs data conversion reference voltage. When battery detection circuitry is not in used, a MOS switch is used to turn off the resistor divider path current.
Serial Interface
Pin PD_SCK and DOUT are used for data retrieval, input selection, gain selection and power down controls. When output data is not ready for retrieval, digital output pin DOUT is high. Serial clock input PD_SCK should be low. When DOUT goes to low, it indicates data is ready for retrieval. By applying 25~29 positive clock pulses at the PD_SCK pin, data is shifted out from the DOUT output pin. Each PD_SCK pulse shifts out one bit, starting with the MSB bit first, until all 24 bits are shifted out. The 25th pulse at PD_SCK input will pull DOUT pin back to high (Figure 8). Input and gain selection is controlled by the number of the input PD_SCK pulses (Table 3). PD_SCK clock pulses should not be less than 25 or more than 29 within one conversion period, to avoid causing serial communication error. PD_SCK Input Gain Rate pulses 25 26 27 28 29
Differential Signal BAT Differential Signal Differential Signal Differential Signal
128
10Hz 40Hz
HX712
Next Conversion
MSB T2 T1 PD_SCK 1 2 3 T4 1 2 3 4 24 4 24 T3
LSB
25
Next conversiongain=128rate=10Hz
25
26
24
25
26
27
1 1
2 2
3 3
4 4
24 24
25 25
26 26
27 27
Next conversiongain=256rate=40Hz
Symbol T1 T2 T3 T4
Note DOUT falling edge to PD_SCK rising edge PD_SCK rising edge to DOUT data ready PD_SCK high time PD_SCK low time
MIN 0.1
TYP
MAX 0.1
Unit s s s s
0.2 0.2
1 1
50
external load-cell, both HX712 and the load-cell will be powered down. When PD_SCK returns to low, chip will return back to the setup conditions before power down and enter normal operation mode. If PD_SCK pulse number is changed during the current conversion period, power down should be executed after current conversion period is completed. This is to ensure that the change is saved. When chip returns back to normal operation from power down, it will return to the set up conditions of the last change.
Power down:
PD_SCK
60 s
Power down
Normal
Application Example
Figure 9 Power down control When PD_SCK pin changes from low to high and stays at high for longer than 60s, HX712 enters power down mode (Figure 9). When internal MOS power switch is used for the
AVIA SEMICONDUCTOR
Figure 10 is a typical weigh scale application using HX712. It uses on-chip oscillator (XI=0). A single power supply (2.75.5V) comes directly from MCU power supply.
HX712
Load_cell
R1=200 C2=0.1u R2=200
BAT AVDD DVDD VOUT XI REFP XO AGND DOUT REFN PD_SCK INN DGND INP
HX712 MCU Note 1When BAT is not used, it should be connected to the higher of AVDD or DVDD 2R3 and R4 are used to reduce load-cell current.
AVIA SEMICONDUCTOR
HX712
AVIA SEMICONDUCTOR
HX712
Reference DriverC
//------------------------------------------------------------------sbit ADDO = P1^5; sbit ADSK = P0^0; unsigned long ReadCount(void){ unsigned long Count; unsigned char i; ADDO=1; ADSK=0; Count=0; while(ADDO); for (i=0;i<24;i++){ ADSK=1; Count=Count<<1; ADSK=0; if(ADDO) Count++; } ADSK=1; Count=Count^0x800000; ADSK=0; return(Count); }
Package Dimensions
8.60 8.80 8.40
6.00
6.20 5.80
3.90
1.60 1.20
SOP-14L Package
AVIA SEMICONDUCTOR