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Electromagnetic Bandgap Power/Ground Planes for Wideband Suppression of Ground Bounce Noise and Radiated Emission in High-Speed Circuits
Tzong-Lin Wu, Senior Member, IEEE, Yen-Hui Lin, Ting-Kuang Wang, Chien-Chung Wang, and Sin-Ting Chen
AbstractA power/ground planes design for efciently eliminating the ground bounce noise (GBN) in high-speed digital circuits is proposed by using low-period coplanar electromagnetic bandgap (LPC-EBG) structure. Keeping solid for the ground plane and designing an LPC-EBG pattern on the power plane, the proposed structure omnidirectionally behaves highly efciently in suppression of GBN (over 50 dB) within the broad-band frequency range (over 4 GHz). In addition, the proposed designs suppress radiated emission (or electromagnetic interference) caused by the GBN within the stopband. These extinctive behaviors of low radiation and broad-band suppression of the GBN is demonstrated numerically and experimentally. Good agreements are seen. The impact of the LPC-EBG power plane on the signal integrity for the signals referring to the power plane is investigated. Two possible solutions, differential signals and an embedded LPC-EBG power plane concept, are suggested and discussed to reduce the impact. Index TermsElectromagnetic bandgap (EBG), electromagnetic interference (EMI), ground bounce noise (GBN), high-speed digital circuits, radiation, signal integrity (SI), simultaneously switching noises (SSN).

I. INTRODUCTION

ITH the trends of fast edge rates, high clock frequencies, and low voltage levels for the high-speed digital computer systems, the ground bounce noise (GBN) or simultaneously switching noise (SSN) on the power/ground planes is becoming one of the major challenges for designing the highspeed circuits. Because of the parallel-plate waveguide structure between power and ground planes in the advanced high-speed packages, the resonance modes of the parallel-plate waveguide can be excited by the GBN. Research has shown the resonance noise propagating between the power and ground planes could cause serious signal integrity (SI) or power integrity (PI) problems for the high-speed circuits [1][3]. Moreover, due to the cavity resonance effect between the power/ground planes, the GBN also results in signicant radiated emissions or electromagnetic interference (EMI) issues [3].

Manuscript received November 29, 2004; revised May 18, 2005. This work was supported by the National Science Council, Taiwan, R.O.C., under Grant NSC 93-2213-E-110-010. T.-L. Wu is with the Department of Electrical Engineering and Graduate Institute of Communication Engineering, National Taiwan University, Taipei 106, Taiwan, R.O.C. (e-mail: wtl@cc.ee.ntu.edu.tw). Y.-H. Lin, T.-K. Wang, C.-C. Wang, and S.-T. Chen are with the Department of Electrical Engineering, National Sun Yat-sen University, Kaohsiung 80424, Taiwan, R.O.C. Digital Object Identier 10.1109/TMTT.2005.854248

Several researchers have contributed to the mitigation of the GBN. Adding decoupling capacitors between power and ground planes is a typical way to eliminate the GBN and reduce the EMI, but they are not effective above a few hundred megahertz due to the unavoidable lead inductance. Although using the isolation moat [3] on the power or ground plane or selecting the location of the via ports to eliminate the excitation of the GBN [4] could suppress the GBN at higher frequencies, these approaches are suitable only to suppress the GBN at specic locations. Recently, a new idea for eliminating the GBN is proposed by using a photonic bandgap (PBG) [5] or electromagnetic bandgap (EBG) structure on the ground plane to form a high-impedance surface (HIS) [1], [2]. By designing the forbidden bandgap of the EBG structure within the resonant mode frequencies of the power and ground planes, this structure offers an efcient suppression of the GBN propagating in omnidirection of the planes. However, multilayer substrates with specially designed via are required in the EBG structure for achieving the HIS on the ground plane [2]. This paper proposes a novel power/ground planes design using a low-period coplanar EBG structure (LPC-EBG). Although a similar EBG structure designed on the ground plane has been used in lter or antenna design in the microwave range (above 10 GHz) [6], it has not been applied in the elimination of the GBN on the power/ground planes of the high-speed digital circuits. The key features of this new concept is keeping solid or continuous for the ground plane and designing the LPC-EBG structure on the power plane. Due to the periodic inductor and capacitor (LC) networks realized by the combining effect of the solid ground and the LPC-EBG power plane, the bandstop behavior can be achieved. This design is suitable for applying in high-speed circuits with GBN dominantly existing in the low-frequency range below 6 GHz [1]. The advantages of this design are broad-band suppression of the GBN due to the combining effect of the LPC-EBG structure on the power plane and the continuous plane on the ground plane, low EMI caused by the GBN because of the continuous ground reference, and low cost due to the compatibility with the conventional printed circuit board (PCB) or package substrate manufacturing process. This paper is organized as follows. Section II describes the design concept and corresponding theoretical model of the proposed LPC-EBG structure. In Section III, the distinctive behavior of GBN elimination, both in frequency and time domains, is measured and compared with simulation by the three-dimensional (3-D)-nite-difference time-domain (FDTD) method. The broad-band EMI suppression performance is also

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of one square metal pad and four connecting narrow bridges. The corresponding geometrical parameters of the unit cell are , where is the unit cell period, is denoted as the bridge length, is the bridge width, is the half-gap beis the gap between the metal tween adjacent unit cells, and pad and the bridge. The corresponding parameters for the designs in Fig. 1(a) and (b) are (30, 5, 1, 1, and 1 mm) and (18, 3, 1, 1, and 1 mm), respectively. The main differences of these and the bridge length . two designs are the cell period It is noted that these ve geometrical parameters signicantly inuence the bandstop behavior. The parameters of these two designs are obtained through an optimal process for achieving wider stopband bandwidth. As will be shown in the next section, these two examples perform broader stopband than our previous design [5]. B. Equivalent Model and Stopband Prediction
Fig. 1. Schematic diagram of proposed test boards. (a) 9-cell LPC-EBG board. (b) 25-cell LPC-EBG board.

Fig. 2. (a) Two unit cells of the LPC-EBG and its corresponding parameters. (b) Equivalent circuit model for the two connecting unit cells in Fig. 2(a).

presented in this section. The impact of the LPC-EBG structure on the SI is discussed, and corresponding solutions are suggested in Section IV. Conclusions are drawn in Section V. II. DESIGN AND MODEL OF THE LPC-EBG POWER PLANE A. Structure Design In high-speed digital circuit design, power and ground planes are embedded in multilayer substrate of PCB to provide the return current for the high-speed signals and supply the necessary dc voltage. From the SI point of view, keeping the reference planes continuous is important, to have a good signal quality. Therefore, in our design, the ground plane is kept continuous, and the LPC-EBG structure is applied on the power plane. Fig. 1(a) and (b) show two power/ground plane designs with 9 (3 by 3) and 25 (5 by 5) unit cells on a two-layer FR4 PCB substrate. The dimension of the substrate is 90 mm 90 mm with 0.4 mm thickness. Fig. 2(a) shows two unit cells of the LPC-EBG connected by the bridges. Each unit cell consists

Although the proposed structure is constructed under a two-dimensional (2-D) concept, a simple 1-D wave propagation model is developed to efciently predict the bandwidth and center frequency of the stopband for the LPC-EBG structure. Fig. 2(b) shows the equivalent circuit model for two connecting unit cells shown in Fig. 2(a). Each unit section of the equivalent model consists of two parts. The rst part describes the propagation characteristics between the square metal pad on the power plane and the continuous ground plane, using an equivalent inductance and capacitance . The second part describes the connecting characteristics of the two adjacent unit cells, which include the bridging effect with the bridge inductance , bridge capacitance , and the capacitive gap coupling effect between two adjacent unit cells. It is assumed that innite unit sections are periodically cascaded, as shown in Fig. 2(b), to represent the EBG structure. Next, the dispersion behavior for the current on this periodic circuit is derived. As shown in Fig. 2, the current on the rst and the second part (sum of the current on and ) part and . The electric charges of section are denoted as and of section are denoted as and . The on relations between the currents and node charges can be derived as (1) (2) (3) (4) Differentiating (3) and (4) with time, and combining with (1) and (2), yields

(5)

(6)

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TABLE I ESTIMATED PAD/BRIDGE/GAP INDUCTANCE AND CAPACITANCE OF THE LPC-EBG STRUCTURE

Considering the periodic conditions of the EBG, it is assumed and in (5) and (6) have the that the wave solutions for same frequency and wave number but different amplitudes, and are expressed as (7) (8) . where Substituting (7) and (8) into (5) and (6), and setting the deand to be zero, we obtain terminant of the coefcients of the dispersion relation between and as

(9) The values of the parameters , and are easily obtained by the transmission line theory for the microstrip is calculated as line. The gap-coupling capacitance , where is the width of the square corner pad, and is the distance between the centers of the neighboring corner pads [7]. The corresponding parameter values for the 9-cell and 25-cell LPC-EBG boards are listed in Table I. Employing (9), Fig. 3(a) and (b) show the dispersion diagrams ( as a function of ) for 9-cell and 25-cell LPC-EBG boards, respectively. As shown in Fig. 3, there are two modes solved by (9), and a bandgap is clearly seen between these two modes. The bandwidth of the stopband predicted by the 1-D circuit model for the 9-cell board is 4.2 GHz, ranging from 1 to 5.2 GHz, and for the 25-cell board is 5.7 GHz, ranging from 2 to 7.7 GHz. Validity of this simple model will be checked by the measurement in the next section. III. NUMERICAL AND EXPERIMENTAL RESULTS A. GBN Suppression 1) Frequency Domain: We rst see the bandstop behavior for eliminating the GBN in frequency domain. Fig. 4(a) and for the 9-cell (b) show both the measured and simulated and 25-cell LPC-EBG boards, respectively. The behaviors of the reference board with both power and ground plane being solid (or continuous) are also included in these two gures for comparison. The 3-D-FDTD approach is used to simulate the GBN behavior for all power/ground plane structures. As shown in Fig. 4(a) and (b), good agreement between the measurement

Fig. 3. Dispersion diagrams (f as a function of k ). (a) 9-cell LPC-EBG board. (b) 25-cell LPC-EBG board.

and 3-D-FDTD prediction is obtained. Slight discrepancy between them occurs at resonant peaks and at higher frequencies, where the numerical prediction is higher than the measured results. The reasons are that the dispersion property of the FR4 structure and the conductor loss due to skin effect is not considered in our FDTD modeling. Comparing both LPC-EBG boards with the reference board, it is clearly seen that the proposed LPC-EBG power/ground planes signicantly eliminate the GBN with, on average, an over-50-dB suppression in a broad-band frequency range. Here, the bandwidth is dened lower than dB. The simulated and as the range of the measured stopband bandwidth for 9-cell board is 3.9 and 4.1 GHz, respectively, and is 5.7 and 6.3 GHz, respectively, for the 25-cell board. The simulated and measured center frequency is 2.9 and 3.0 GHz, respectively, for the 9-cell board, and is 5.2 and 5.3 GHz for the 25-cell board. It is seen that the measured bandwidth and center frequency of the stopband are slightly higher than the simulated one for both boards. The reason could

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Fig. 5. Measured GBN suppression behavior for the noise excited at different locations; ports 2, 3, and 4, respectively.

Fig. 4. Comparison of jS j obtained by 3-D-FDTD and measurement. (a) 9-cell LPC-EBG board. (b) 25-cell LPC-EBG board. TABLE II BANDWIDTH
AND CENTER FREQUENCY COMPARISON FOR THE PROPOSED LPC-EBG STRUCTURE

mm), and port4 (48 mm, 12 mm). The left lower corner of the board is dened as the zero point of the coordinate. It is seen that the proposed design provides the similar broad-band GBN suppression behavior for different positions of the noise. This behavior demonstrates that the proposed power/ground planes can omnidirectionally eliminate the GBN on the power plane. 2) Time Domain: Next, we try to understand the GBN suppression capability in the time domain for the proposed power plane. The power/ground planes of those test boards are excited by a pulse-pattern generator (Anritsu MP1763C) to emulate the GBN on the power plane, and the coupling noise at the receiving port is measured in the time domain by the a signal analyzer (Tektronix CSA8000). All test boards, including the reference, 9-cell, and 25-cell boards are measured. Fig. 6(a) shows the waveform of the excitation waveform launched from the pattern generator. It is a periodic square-like wave with frequency 2.25 GHz and amplitude 125 mV. The locations of the excitation ports are (45 mm, 45 mm) for all test boards, and receiving ports are (15 mm, 75 mm) for both reference and 9-cell boards and (27 mm, 63 mm) for 25-cell board. Fig. 6(b), (c), and (d) show the measured GBN at the receiving port for the reference, 9-cell, and 25-cell boards, respectively. It is seen that peak-to-peak amplitude of the coupling noise is about 44, 7, and 11 mV, respectively, for these three boards. Compared with the reference board, the GBN can be reduced about 84% and 75%, respectively. It is clearly seen that the GBN is signicantly reduced by the proposed LPC-EBG power planes. B. Radiation (or EMI) Elimination Previous literature showed that the microstrip line on the EBG structure may cause signicant leakage radiation on the stopband, due to an imperfect reference plane [8]. Low radiation or EMI is important in high-speed circuits for the compliance of the strict electromagnetic compatibility (EMC) regulations. This subsection numerically and experimentally investigates the EMI performance of the proposed LPC-EBG power/ground plane structure by comparing with the reference board. Fig. 7 shows the EMI measurement setup in an EMC fully anechoic chamber. The test board is put on the wooden table,

also be that the conductor loss and the dielectric dispersion broaden the stopband at a higher frequency range, i.e., near 5 GHz for the 9-cell board and near 8 GHz for the 25-cell board. Table II compares the bandwidth and center frequency obtained by the 3-D-FDTD, the measurement, and the 1-D equivalent circuit model. It is found that the 1-D circuit model has good accuracy in predicting the stopband behavior of the LPC-EBG structure. As shown in Table II, the difference from either the 3-D-FDTD approach or the measurement is all , and for below 8%. Fig. 5 shows the measured the 9-cell board, where the receiving port (port1) is located at (15 mm, 76 mm), and the noise is, respectively, excited at different locations, port2 (45 mm, 72 mm), port3 (48 mm, 45

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Fig. 6. Measured GBN suppression behavior in the time domain for the proposed power plane. (a) The waveform of the excitation source launched from a pattern generator. (b) Coupling GBN at the receiving port for the reference board. (c) Coupling GBN at the receiving port for 9-cell LPC-EBG board. (d) Coupling GBN at the receiving port for 25-cell LPC-EBG board.

Fig. 7. Measurement setup for EMI in 3 m fully anechoic chamber.

and the RF signal of 20 mV generated by the signal source (HP 8324) is launched into the power plane of the board through the high-frequency connector. The height of the receiving antenna and test board is xed at 1.2 m from the oor of the chamber, and the distance between them is 3 m. The radiated E-eld below 1 GHz is measured by a bi-log antenna (Chase

CBL611 B), and above 1 GHz, the horn antenna (R&S HF906) is employed. The wooden table with test board is rotated in 360 at the speed of 4.5 /s for each excited frequency point, and the maximum radiated E-eld is recorded by the spectrum analyzer (R&S FSP) with 100 kHz resolution bandwidth. The simulated radiated E-eld in 3-D-FDTD modeling is obtained by the near-eld and far-eld transformation of Kirchhoffs surface integral [9] and Fourier transforms with source normalization method [3]. Fig. 8(a) and (b) show the simulated and measured EMI radiation at 3 m distance for the 9-cell and 25-cell LPC-EBG boards, respectively. The reference board with both power and ground plane being solid is also included in both gures for comparison. Only the EMI behaviors below 4 GHz are measured, due to the limitation of our signal generator. It is seen that the agreement between the measurement and the simulation is reasonably good. For the reference board, there are several radiation peaks with strength over 55 dB V/m at 1.6, 2.3, 3.3, and 3.7 GHz, which are corresponding to the resonance frequencies of the cavity modes for the 9 cm board. However, for the 9-cell and 25-cell boards, all of the radiation peaks have been suppressed with the average radiation strength under 40 dB V/m. It is clearly seen that the proposed power/ground plane design performs with signicantly low EMI behavior at the designed bandgap frequency ranges, although several etched slots are designed on the power planes.

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Fig. 9. Four-layer structure with transmission line transient between the 9-cell LPC-EBG power plane and solid ground plane. (a) Single-ended trace. (b) Differential traces.

Fig. 8. Simulated and measured EMI radiation at 3 m. (a) 9-cell LPC-EBG board. (b) 25-cell LPC-EBG board.

IV. IMPACT ON THE SI AND POSSIBLE SOLUTIONS Although the proposed power/ground planes designs show excellent performance on eliminating the GBN and corresponding EMI at broad-band frequency ranges, the power planes with etched slots would degrade the signal quality for the signal traces referring to the imperfect power plane [10]. This section will discuss the impact of the proposed LPC-EBG power plane on the SI, and two possible solutions to improve the SI are discussed. A. Single-Ended and Differential Signals Fig. 9(a) and (b) show the single-ended and differential traces, respectively, of 60 mm passing from the rst (top) layer to the fourth (bottom) layer and back to the rst layer, with two via transitions along the signal path. The second and third layers are the 9-cell power plane and solid ground plane, respectively. It is known that via transitions and imperfect reference plane are two of the main factors to inuence the signal quality for the highspeed signals. This setup in Fig. 9 tries to evaluate the impact of the LPC-EBG power plane on the signal quality for the signals, both referring to the power plane and with via transitions. The traces are designed as 50 for the single-ended signal, and 100 for the differential impedance. Eye patterns for evaluating the

signal quality are obtained following three steps. First, the twoport and four-port -parameters for the single-ended and differential cases, respectively, are simulated by the 3-D-FDTD. The broad-band SPICE-compatible models are then extracted by the commercial tool SPEED2000 (the boardband SPICE module) using the solved -parameters. According to the broad-band SPICE models, the eye patterns at the output side are nally generated in the HSPICE environment by launching a pattern source of - pseudorandom bit sequence (PRBS), nonreturn to zero (NRZ), coded at 2.5 GHz. The bit-sequence swing and the nominal rise/fall time are 500 mV and 120 ps, respectively, for the single-ended case, and 250 mV and 100 ps for the differential cases. Fig. 10(a) and (b) show the simulated eye patterns for the reference board with continuous power plane and the 9-cell board, respectively. Two parameters, maximum eye open (MEO) and maximum eye width (MEW), are used as metrics of the eye pattern quality. It is seen that for the reference board, MEO mV and MEW ps, and for the 9-cell board, MEO mV and MEW ps. Compared with the reference board, the degradation of the MEO and MEW for the 9-cell board is about 17% and 4.6% in the single-ended case. It is believed that this mild degradation is acceptable in practical high-speed circuits. Furthermore, through suitable components placement and layout designs, such as routing lower speed signals on the top layer and keeping high-speed traces on the bottom layer, keeping high-speed traces shorter, or avoiding the high-speed signals crossing the cells, the overall SI performance will be signicantly better than the previously simulated case. However, if long and high-speed signals are still necessary on the rst layer, the differential signaling approach is a good solution in the LPC-EBG power/ground planes design. Fig. 10(c) shows the eye patterns of the differential signals at the outside of the conguration in Fig. 9(b). The MEO and MEW are 471 mV and 389 ps, respectively. Compared with the single-ended case on the 9-cell LPC-EBG board, the improvement of the MEO and MEW is about 30% and 5% in the differential-signal case. It is seen that the SI performance of the differential approach is signicantly better than the single-ended cases, both in the 9-cell boards.

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Fig. 11. Schematic of embedded 9-cell LPC-EBG power plane with ground via stitching structure.

Fig. 12. Comparison of jS j between embedded 9-cell LPC-EBG power plane and embedded solid power-plane structure obtained by 3-D-FDTD and HFSS.

Fig. 10. Simulated eye patterns. (a) Reference board (continuous power plane) with single-end trace. (b) 9-cell LPC-EBG board with single-end trace. (c) 9-cell LPC-EBG board with differential traces.

As shown in Fig. 11, an embedded 9-cell LPC-EBG board is designed with the added substrate thickness being 0.4 mm. There are 16 vias on each unit cell; each corner pad has four via uniformly distributed with distance 7.5 mm. Fig. 12 shows the frequency-domain response of the embedded LPC-EBG power plane. The reference board with the continuous embedded power plane is also presented for comparison. The results are simulated both by the 3-D-FDTD method and the HFSS, based on the nite-element method. The agreement between these two approaches shows the validity of the simulated GBN-suppression behavior. It is seen that the designed embedded LPC-EBG power plane still maintains broad-band GBN suppression in the frequency range from 900 MHz to 4.8 GHz. Compared with the performance using a two-layer design (one EBG power and one ground plane) shown in Fig. 5, the embedded power plane using three layers still keep excellent GBN elimination capability. The main advantage of this design is that the signal quality will be better than the previous design, because both reference planes are now continuous, but the design cost will be increased because one more layer is needed. V. CONCLUSION A novel power/ground planes design using an LPC-EBG structure is proposed to eliminate the GBN or SSN in high-speed circuits. Two example designs, 9-unit cell and 25-unit cell LPC-EBG boards, are implemented, and their extinctive performance of efcient and wideband GBN suppression is theoretically and experimentally demonstrated both in time and frequency domains. It has been shown the LPC-EBG power plane behaves over a 4-GHz stopband with an average

B. Embedded LPC-EBG Power Planes Another idea to solve the SI issues for the EBG-power plane is adding one more ground plane above the EBG power plane. As shown in Fig. 11, the LPC-EBG power plane is embedded between two solid ground planes with the vias electrically connecting these two planes. To keep the performance of the broad-band GBN suppression, a suitable design for the vias distribution and the substrate thickness between the added ground plane and the power plane is needed.

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of over 50-dB reduction of the GBN. A simple 1-D equivalent circuit model with the periodic boundary conditions is also developed to predict their stopband characteristics. In addition, the proposed design suppresses low radiated emission (or EMI) resulting from the GBN at the designed stopband, although there are several etched slots on the power plane. The impact of the LPC-EBG power plane on the SI for the signal traces referring to the power plane is investigated. Two possible solutions, differential signals and embedded LPC-EBG power planes, are proposed to decrease the inuence on the SI. REFERENCES
[1] R. Abhari and G. V. Eleftheriades, Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits, IEEE Trans. Microw. Theory Tech., vol. 51, no. 6, pp. 16291639, Jun. 2003. [2] T. Kamgaing and O. M. Ramahi, A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface, IEEE Microw. Compon. Lett., vol. 13, no. 1, pp. 2123, Jan. 2003. [3] T. L. Wu, S. T. Chen, J. N. Huang, and Y. H. Lin, Numerical and experimental investigation of radiation caused by the switching noise on the partitioned dc reference planes of high-speed digital PCB, IEEE Trans. Electromagn. Compat., vol. 46, no. 1, pp. 3345, Feb. 2004. [4] G.-T. Lei, R. W. Techentin, and B. K. Gilbert, High frequency characterization of power/ground-plane structures, IEEE Trans. Microw. Theory Tech., vol. 47, no. 5, pp. 562569, May 1999. [5] T. L. Wu, Y. H. Lin, and S. T. Chen, A novel power planes with low radiation and broadband suppression of ground bounce noise using photonic bandgap structures, IEEE Microw. Compon. Lett., vol. 14, no. 7, pp. 337339, Jul. 2004. [6] R. Coccioli, F. R. Yang, K. P. Ma, and T. Itoh, Aperture-coupled patch antenna on UC-PBG substrate, IEEE Trans. Microw. Theory Tech., vol. 47, no. 11, pp. 21232130, Nov. 1999. [7] D. F. Sievenpiper, High-impedance electromagnetic surfaces, Ph.D. dissertation, Dept. Elect. Eng., Univ. California at Los Angeles, Los Angeles, CA, 1999. [8] N. Shino and Z. Popovic, Radiation from ground-plane photonic bandgap microstrip waveguide, in Dig. IEEE MTT-S Int. Microw. Symp., Jun. 2002, pp. 10791082. [9] O. M. Ramahi, Near-eld and far-eld calculation in FDTD simulations using Kirchhoff surface integral representation, IEEE Trans. Antennas Propag., vol. 45, no. 5, pp. 753759, May 1997. [10] Y. H. Lin and T. L. Wu, Investigation of signal quality and radiated emission of microstrip line on imperfect ground plane: FDTD analysis and measurement, in Proc. IEEE Int. Symp. Electromagn. Compat., Montreal, QC, Canada, Aug. 2001, pp. 319324.

Yen-Hui Lin was born in Chiayi, Taiwan, R.O.C., on February 8, 1977. He received the B.S.E.E. degree in 1999, and the Ph.D. degree in 2005, both from National Sun Yat-Sen University, Kaohsiung, Taiwan, R.O.C. His research interests include the signal integrity (SI) and EMI designs in high-speed digital circuits and numerical EM eld analysis for EMC problems. Dr. Lin received the Best Paper Award from the Taiwan Print Circuit Association (TPCA) in 2004.

Ting-Kuang Wang was born in Tainan, Taiwan, R.O.C., on December 27, 1980. He received the B.S.E.E. degree from National Sun Yat-Sen University, Kaohsiung, Taiwan, R.O.C., in 2003, and is currently working toward the Ph.D. degree at the same university. His current research interest is the power-integrity design in high-speed circuits.

Tzong-Lin Wu (S93M98SM04) received the B.S.E.E. and Ph.D. degrees from National Taiwan University, Taipei, Taiwan, R.O.C., in 1991 and 1995, respectively. From 1995 to 1996, he was a Senior Engineer with Microelectronics Technology, Inc., Hsinchu, Taiwan, R.O.C. From 1996 to 1998, he was with the Central Research Institute, Tatung Company, Taipei, Taiwan, R.O.C., where he was involved with the analysis and measurement of EMC/EMI problems of high-speed digital systems. From 1998 to 2005, he was with the Electrical Engineering Department, National Sun Yat-Sen University (NSYSU), Kaohsiung, Taiwan, R.O.C. He is currently an Associate Professor with the Department of Electrical Engineering amd Graduate Institute of Communication Engineering, National Taiwan University, Taipei, Taiwan, R.O.C. His research interests include design and analysis of ber-optic components, EMC and signal-integrity design, and measurement for high-speed digital/optical systems. Dr. Wu received the Excellent Research Award and Excellent Advisor Award from NSYSU in 2000 and 2003, respectively, the Outstanding Young Engineers Award from the Chinese Institute of Electrical Engineers in 2002, and the Wu Ta-You Memorial Award from the National Science Council (NSC) in 2005. He was also listed in Marquis Whos Who in the World in 2001. He is a member of the Chinese Institute of Electrical Engineers.

Chien-Chung Wang was born in Tainan, Taiwan, R.O.C., in 1979. He received the B.S.E.E. degree from National Sun Yat-Sen University, Kaohsiung, Taiwan, R.O.C., in 2003, and is currently working toward the Ph.D. degree in electrical engineering at the same university. His research interests include the EMI/SI measurement for high-speed digital circuits and numerical EM eld analysis for EMC problems.

Sin-Ting Chen was born in Pingtung, Taiwan, R.O.C., in 1980. He received the B.S.E.E. degree from National Sun Yat-Sen University, Kaohsiung, Taiwan, R.O.C., in 2002. He is currently working toward the Ph.D. degree in electrical engineering at the same university. His research interests are modeling and measurement for the power integrity of high-speed package and printed circuit boards.