Impact of Nanotechnology on Wireless Communications

Er-Ping Li
Abstract: The next-generation high data rate wireless communication systems are expected to offer a completely new ways to access information and services. The need of higher data transfer rate and bandwidth, along with the requirement for low-cost, high efficiency system implementation, has led to an

Electromagnetics and Nanoelectronic Research Center, Institute of High Performance Computing, Singapore
5.8GHz. Other wireless communication applications such as ultra wide band operating will be operating at the frequency range of 3.1 10.6 GHz, the wireless sensor network and wireless local area networks operating at the frequency into the millimeter-wave regime 10-100GHz. This rapid expansion of untethered communication applications has raised the requirements of high-efficiency and higher data speed RF transceivers in the next-generation communications. To realize the higher data transfer speed, a highly integrated system is expected such as the integration of all the components on a single package including antenna, filters, frequency synthesizers, monolithic microwave integrated circuits, digital processing and microprocessor control chips[3,4], which would meet the needs of more functionality, better performance, low cost and high integrity. Realization of such highly integrated system requires innovative technologies in fundamental materials, novel device and circuit design, system architecture, and fabrication process; the emerging nanotechnology could play a critical role in realization of the next generation wireless communications.
Recent years, nanotechnology is receiving a great attention across the world. It explores electrical, optical

explosion in new technology development for integrated circuit approaches in RF/microwave area, RF receiver^ transmitter, data storage and even power supply. A total solution for high system integration of various components is the trend, the 3D system-on-package
concept is considered as one of the future solutions. To realize such as complex concept, nanotechnology could play a significant role for continuing innovation in mobile devices, but it faces a lot challenges. This presentation will touch on the concepts of possible impacts of nanotechnology communication evolution. Keywords: Nanotechnology, Wireless Communication,
on

Multilayer Package Analysis

Summary
the last two decades, wireless communication services have been witnessed a tremendous growing such as paging, cellular phones and emerging personal communication services [1]. This growing is expected continuing in this new century due to the relentless demand of wireless applications in multimedia such as wireless real-time video transmission and internet access. More and more bandwidth and functionality are required for wireless applications in the future [2]. The future cellular and personal communication services are expected to be operating at the frequency bands around 2.4GHz and

During

and magnetic activities as well as structural behavior at molecular or sub-molecular level. The nanotechnology could be the premier driver of technology to boom the wireless product continuing innovations in electronics, antennas, storage, displays, battery power, and user interface. One of the key applications of nanotechnology is for nano-scale electronic devices and systems. Such nanoelectronic devices and nano-photonic devices can be incorporated into the wireless communication components such as RF integrated circuits, large scale integration digital

Invited plenary talk for the IEEE 2007 International Symposium on Microwave, Antenna, Propagation, and EMC Technologies for Wireless Communications (MAPE 2007).
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processing and microprocessor control chip which perhaps have a great impact on the communication systems in terms of signal transmission, functionality, power consumption, size of the mobile units and etc. In summary, nanotechnology applications in

Author Biographies

wireless communications are still at the infant stage, but it will make a great impact on wireless technology development. The nanophotonic techniques could provide a fast signal transfer, and the nanoelectronics with the 3D system integration technique could offer highly integrated systems with more functionality and

high performance.
[1]
RF and

References

analogy/mixed- signal technologies for wireless communications, International Technology Roadmap for Semiconductors, 2005 Edition,
/www.itrs.net/. D. Minoli, Nanotechnology applications to Telecommunications and Networking, John Wiley & Sons, Inc. 2006. R. Tummala and J. Laskar, "Gigabit Wireless:

[2] [3] [4]

Dr Li authored and co-authored over 120 papers at the referred international journals and conferences and 5 book chapters. He holds and filed number of patents at US patent office. His research interests include fast and efficient computational for electromagnetics, electromagnetics micro/nano-electronic packaging and ICs and photonic device development.

Erping Li received the Ph.D. degree in electrical engineering from Sheffield, U.K, in 1992. From 1992 to 1999, he worked as a Research Fellow, Senior Research Fellow, Principal Research Engineer Technical Director with UK and Singapore Research Institute. Since 2000, he has been with Electronic Systems and Electromagnetics Research Center at Singapore National Institute of High Performance Computing. In the last 5 years,

System-on-package Technology," Proceedings of

IEEE, vo.92, no.2, 2004. M. Feng, S. C. Shen, D. Caruth and J. J. Huang,
"Device technologies for RF front-end circuits in next generation wireless communications," Proceedings of the IEEE, vol.92, 2004. J. Laskar, A Sutono, D. Staiculescu, C. H. Lee, M.F. Davis, K. Lim, and M. Tentzeris, "Multi-layer 3D system-on-package architectures for highly integrated microwave and millimeter-wave radio front -end," 2001 International Surface Mount Technology Association Conf. Chicago, USA, 2001 P. Avouris, "Carbon nanotube electronics," Chemical Physics, 2002 Er-Ping Li, En-Xiao Liu, Zaw-Zaw OO, R. Vahldieck, "A systematic semi-numerical approach for modeling of signal and power integrity of electronic packages," 2007 IEEE International Symposium on Electromagnetic Compatibility, Hawaii, 2007 X. Shi, K. S. Yeo, J-G Ma and E.PLI, Sensitivity of coupled interconnects for RFIC applications", IEEE Transactions on EMC, vol.48, no.4, pp. 607-613, Nov. 2006
"

Dr Li received numerous prestigious awards including 2006 IEEE Technical Achievement Award, 2006 Chang]iang( Yangtze) Chair Professorship

Ministry of Education in China, an elected IEEE Distinguished Lecturer, and Symposium Chair Award from IEEE EMC Society in USA. Since January 2006, he serves as the Associate Editor for IEEE Microwave and Wireless Components Letters,
from
Guest Editor for IEEE Transactions on EMC. In 2007, he is invited to serve as the Associate Editor for IEEE Transactions on EMC. He served as the Symposium Chair for 2006 17th International Zurich Symposium on EMC in Singapore, and also serves as the General Chair for 2008 Asia-Pacific EMC Conference. Dr LI served as the Chairman for IEEE EMC Singapore Chapter for 2005-2006. He has been invited to give numerous speeches to the academic institutions and the international conferences.

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