Arab Academy for Science & Technology & Maritime Transport College of Engineering & technology Electronics &

Communication Engineering Department

Course: MEMS Instructor: Prof. Hazem H. Ali Course Code: EC 530 GTA: Eng. Hesham H. Gaber

7th Week Exam

(DSAFG) Choose the most proper answer:

1. ......... is considered as the most expensive micromechanical process: a) Lithography b) Lift-off technique c) Etching d) Masking 3. Types of etching are...........: a) Wet isotropic b) Wet anisotropic c) Dry d) All of the above 5. In X-ray lithography, the X-ray absorber is usually: a) Silver b) Gold c) Aluminum d) None of the above 7. The electron gun is used in lithography because it is........ : a) Inexpensive b) Accurate c) Doesnt require high voltage d) None of the above 9. Frequency of oscillation in Microultrasonic Machining is: a) 20GHz b) 20MHz c) 20KHz d) None of the above 11. The most advantage for the sensor array design is :a) Decrease sensor size. b) Increase the system reliability and a failure of single sensor is not exist. c) Help in monolithic IC fabrication. d) All of the above. 13. .......... is a material removal method a) Surface micromachining b) Micro stereo Lithography c) LIGA d) None of the above 2. The silicon diaphragm is the basic structure used in: a) Microengineered pressure sensor. b) Voltage sensor. c) Actuators. d) Relays. 4. Applications of Piezoelectric materials : (a) High voltage sources (b) Sensors (c) a & b (d) None of the above 6. Methods of dry etching are: a) Physical sputter etching b) Chemical plasma etching c) Combined chemical/physical etching d) All of the above 8. Lithography is used for: a) Forming resist layers on the substrate b) Cutting tool c) Forming electric bonds d) None of the above

10. .........method removes material through erosive action: a) Diamond milling b) Soft lithography c) Micro-electro discharge machining d) Powder blasting 12. particle speed of powder blasting is in the range of: a) 80200 ms b) 80400 ns c) 80200 ns d) 80200 s

14. is the most used in silicon micromachining: a) Laser micromachining. b) Micro Electro-Discharge machining. c) Bulk machining. d) Powder Blasting.

15. ................process is also called spark erosion a)U ultrasonic machining b) Powder blasting c) Soft lithography d) Micro electro discharge machining

16. Telemicrosurgery is a) surgical operation used in special hospitals. b) surgical operation using controlled microrobots. c) surgical operation using stereo microscope with special microstructured tools. d) surgical operation using network protocols. 18. Combination of........... is used to form sharp points: a) Dry and isotropic wet etching b) Dry and anisotropic wet etching c) a&b d) None of the above 20. First application for piezoelectric device was................: a) SONAR. b) Radar. c) Antenna. d) None of the above. 22. RF MEMS switches are than diode switches: a) Lower power consumption b) higher power consumption c) used for high switching speed. d) a and c 24. CZOCHRALSKI process is used for: a) Prepared single crystal semiconductor ingots b) prepared amorphous crystalline shape for semiconductor. c) doping. d) a and c 26. Evaporation Method used for : a) Chemical layer deposition, b Physical Layer Deposition. c) Doping d) All of the above. 28. Excimer stands for: a) Excellent dimer b) Excelled dimer c) Excited dimer d) None of the above

17. One of the most used kinds of lasers in microfabrication is: a) Excimer b) Diamond milling c) Bulk micromachining d) None of the above 19. From the advantages of RF MEMS: a) Very wide coverage area b) Ultra high RF loss c) Low power consumption d) All of the above 21. Most of RF components are : a) Sensors. b) Actuators. c) A/D converter d) All of the above. 23. We use Silicon in MEMS Fabrication because: a) well understood and controllable electrical properties. b) Availability of existing tools c) Its desirable mechanical properties. d) All of the above. 25. Piezoelectric Ultrasonic transducers work as: a) Sensors b) Actuators c) a & b d) none of the above 27. From the properties of Wheatstone bridge: a) Good sensitivity b) Temperature independent c) Simple implementation d) All of the above

29. focused ion beam milling is............ process a) Anisotropic b) Wet isotropic c) Electromechanical d) X-ray lithography

30. System Techniques based on: a) Information Techniques b) Interconnection Technology c) Packaging d) All of the above

31. Metals such as nickel titanium aluminum, gold, etc and their alloys are used in MEMS technology because of: a) Good conductivity and ability for deposit. b) Light weight polymers they have. c) Mechanical properties. d) All of the above.

32. the full wafer thickness range is: a) 100 to 300 um b) 600 to 800 um c) 200 to 500 um d) 200 to 500 mm

33. .. is one of the Dry etching process which is done in the atomic level: a) Chemical Plasma Etching. b) Physical Sputter Etching. c) Electrochemical Process. d) All of the above

34. ..........is an Etch stop technique. a) Wet isotropic etching. b) Wet anisotropic etching. c) Electromechanical etching d) Electrochemical etching.

35 . RF frequency range: a) 3 kHz-300THz b) 3 Hz- 300Mhz c) 3 Hz- 300 Khz d) None of the above

36. Microelectronic integrated circuit can be thought as the ........of a system a) Brain b) Eyes c) Arms d) All of the above 38. It is necessary to develop materials for.microstructures. a) Communication Systems b) monolithic and hybrid. c) sensor array d) All of the above 40. ..is the etching through chemical or physical interaction between ions: a) Wet isotropic etching b) Wet anisotropic etching c) Dry etching d) None of the above 42. Etching is always anisotropic if the material is : a) amorphous. b) non-crystalline. c) crystalline. d) a and b 44. The Layer techniques is used for:a) Comprises the three-dimensional structure. b) Producing silicon layers on the substrate. c) Producing layers of different materials on the surface of the substrate. d) All of the above. 46. MEMS is very interest for military applications, like: a) display of oil b) indication speed and altitude c) monitoring the functions of the ejection seat d) All the above 48. The III-V semiconductors has excellent physical properties, specially for a) optoelectronics and microsensors. b) LIGA technology c) doping. d) None of the above 50. ............is anisotropic milling method: a) Diamond milling b) LCD milling c) a&b d) None of the above

37. Artificial pancreas one example of: a) Implantable drug delivery system b) microsurgery c) invasive surgery d) None of the above 39. To reduce MEMS development cost .should be taken into account a) System limitation. b) Layer development. c) marketing d) None of the above 41. Power electronics components are essential for :a) microactuators. b) almost any microsystems. c) Microoptics. d) Pumps. 43. The Erosion rate of powder blasting is: a) 1 mm/sec b) 1 mm/min c) 1 mm/hour d) 1mm/day 45 The piezoelectric effect can be used in.......................... a) Actuators and sensors. b) Actuators only. c) Sensors only. d) None of the above. 47. Standardization is one of the MEMS :a) System Techniques. b) Microtechniques. c) Devices. d) a and b.

49. An essential task of the interconnection technology is the: a) Manufacture of gears and motors. b) Manufacture of mechanical, electrical and optical connections. c) Manufacture of layering techniques d) All of the above.

51. The invention of a transistor in the end of.. started the microelectronics revolution: a) 1950 b) 1940 c) 1960 d)1905 53. Airbag system is based on . sensor. a) Pressure b) IR c) Accelerometer d) None of the above 55. Surface Acoustic Wave filter (SAW) can work from: a) 10MHz to 300 MHz. b) 10MHz to 3 GHz. c) 10 KHz to 300 kHz d) 10 Hz to 2 GHz. 57. Packaging concerns so that it can be used for practical applications a) the encasing of the microsystem b) the software c) the lithography technique. d) None of the above. 59. MEMS used in the trend of the inkjet printer technology to : a) enhance the paper quality. b) increase printing quality and speed. c) increasing the cost. d) none of the above. 61. Applications of microassembly: a) Wrist watches b) Micromotors and gears c) Microrobots d) All of the above 63. In hearing aids, to protect ear from loud sounds we use ................ a) Attenuator b) Insulator c) Automatic gain control device d) Non of the above 65. The restrictions of the anodic bonding are: a) Glass slightly conductive b) Surface roughness 1 micro meter c) Thermal expansion coefficients of both materials d) All of the above 67. is a disadvantage of electromechanical films: a) Light weight b) Easy to cut c) Large deformation d) Low volume

52. One of the challenges which faces MEMS technology is/are: a) Lower detection signals. b) Impurities. c) Effects of environment. d) all of the above. 54. Rf MEMS switches are used in picosatellites for: a) communication with ground based Antennas. b) Under water navigation. c) control satellites horizontal and vertical locations. d) none of the above. 56. In Moore's Law semiconductor devices shrink to: a) mille scale. b) micro scale. c) nano scale. d) none of the above. 58. .. crystals produce the most piezoelectricity: a) Quartz & Topaz b) Rochelle salt & Tourmaline c) Rochelle salt & Quartz d) Topaz & Tourmaline 60. In some new digital cameras, MEMS tilt sensor is used to ...when a photo is taken. a) light . b) monitor how the camera is held. c) measure the distance between the camera and target. d) none of the above 62. ........ crystalline semiconductor is used also as substrate: a) Germanium b) magnesium c) SiO2 d) GaAr 64. A complete micro system should:a) Detect process and evaluate external signals. b) Make decisions based on obtained information. c) Convert decisions into corresponding actuator commands. d) All of the above. 66. Actuators are subdivision of : a) Capacitors b) Transducers c) Piezoelectric d) Transistors 68. Piezoelectric transformer is a type of ............ multiplier: a) AC voltage. b) DC voltage. c) a & b. d) None of the above.

69. are based on the thermal effects of a current flowing into a conductor: a) Inductive voltage sensors b) Thermal voltage sensors c) Capacitive voltage sensors d) Semiconductor voltage sensors 71. Physical layer deposition is a type of...... a) Thick film techniques b) Deposition from a liquid phase c) Thin film techniques d) Masking

70. .................. is/are thermal energy measurement sensor: a) Infrared sensors b) Thermocouples c) Semiconductor temperature sensors d) All of the above 72. Piezoresistive materials have the property of changing their ............... under physical pressure or mechanical work. a) Resistance. b) Capacitance. c) Impedance. d) None of the above. 74. From the challenges that face MEMS technology: a) High investment costs b) Small-volume production has not been profitable c) Early stage of development d) All the above 76. ESP stands for: a) Electronic stability program b) Electric stability program c) Electronic slip program d) None of the above 78. ......... from the Properties of capacitive sensors: a) High Pressure Sensitivity. b) No-Hystersis. c) a&b. d) None of the Above. 80 . EMFI stands for................... a) Electromechanical film. b) Electromagnetic film. c) a & b. d) None of the above

73. The disadvantages of active suspension includes: a) Price b) Complexity c) Weight and high power consumption d) All of the above 75. The advantages of the Lab-On-a-Chip are: a) Inexpensive b) Fluid volume is very small (samples) c) Carry out DNA analysis d) All of the above 77. Active suspension system consists of : a) ECU b) Adjustable shocks c) Springs d) All of the above 79. The main disadvantages of piezoelectric actuation include......................... a) Complexity of fabrication. b) High price. c) Bad performance. d) None of the above.