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P1 Describe typical processes used in the design of both a single and a multi-layer PCB for electronic circuits of different complexity. Task1. Describe the steps necessary to design a basic circuit shown in Figure 2 using a single sided PCB. For the following a SPICE software such as Proteus is needed and the steps required in order to design a basic circuit on a single sided PCB comes as follows:
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routing or either by auto routing. For the manual routing one should go on track mode so that the route track width would be selected according to the current flowing in the circuitry as illustrated in Figure 3 and then the routes are placed accordingly. Or all of this process could be in a way skipped by selecting auto routing as so the ARES would place the tracks as it believes that would be the best of course there might be unresolved spider webs in the process and therefore some manual routing would take place. Figure 4 illustrates some of the good and bad connections that could be made while design a PCB. For example a bad connection would be by bridging from one point to another, and the short path is
Figure 4: Good & Bad types of connections
recommended as to prevent unwanted resistance from the circuit. When it comes in choosing between metric and imperial sizes, the metric unit system would be preferred since one of the greatest secret to PCB design perfection today is the use of the metric unit system, as said by Mr. Tom Hausherr on the 23rd March 2011. Finally regarding the clearance requirements we can say that they are highly important to be thought well when designing a PCB, for
Figure 3: Current vs Track Width
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Task 4. What additional stages are required if both circuits were produced using a multi-layer PCB?
When it comes to a multi-layer PCB board a few additional stages are required. Like copper pads are printed on two separate transparency paper for both sides (bottom and top). A multi-layer board needs the double sided board to be alined as to no misplace is present. Also the negative layer transperancy are placed on top and bottom of the PCB board during the exposure process. Vias are used to make electrical connections between layers on a printed circuit board. They can carry signals or power between layers.
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Task 7. SMD Technology versus Through Hole Components SMD Technology Through Hole Components The size of the SMD components is very small The size of the TH components is way bigger and compact and therefore the design on the than that of the SMDs so therefore the PCB PCB would be rather small in nice and more design should be bigger in size as to fit all the neater. components in and so the result would be that the final product would be bigger in size when compare to the same circuit which is made up from SMD components. Not drill holes are needed we installing the The PCB design would need further work components on the PCB since everything is after the etching is done, since the soldered directly. components are not soldered directly but holes have to be done as to insert the corrisponding component into it place before soldering take place. So the cost when it come to the PCB would be abit more expensive when compared to that of SMDs. They have a better performance when it TH components like for example a resistor comes to shocks and vibrations since we can has its leads as to make contact with the say that they are shock-proof. tracks, and if these leads are broken the resistor would not work which also leads to an open circuit and therefore I believe that the TH components are not shock-proof like SMDs are. SMDs might be more cheaper to buy. But my TH components are very cheap in price. believe is that still SMD is much worth it since the final product would be nicely finished. As to do repair on the components it would be When it comes to do maintance on a TH rather difficult since they are small in size and designed circuit, it is much each to navigate therefore difficult to handle. with the tools and so disassemble and replace the faulty component.
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Basically the process of manufacturing of SMT components consists of: 1. Once the PCB board is ready designed, printed and the necessary holes are drilled, the PCB board is inserted in a semi automatic paste machine, were paste is applied on the array of the board were the SMT components are doing to be placed.
2. As the paste is applied on all sections of the board were the SMT are going to be soldered, the PCB board is placed in what is called a Automatic Pick & Place Machine. Once the board is inside, the machine chooses the SMT components from the SMT component tray and literally picks them and places them on the selected area given on the input of the user via a computer.
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3. Once all the SMT components are placed on the printed component board (PCB) the next step would be that of the reflow oven. This process basically consist of inserting the board, with the soldering paste and the placed SMT components in this 4 heat zones + 1 liquid
illustrated on
this figure. Were the board would pass for a 4 stage heating zones and finalizing the process with a cooling zone. The board would run on a conveyer which will start from zone 1 and then passes to zone 2 and then to zone 3 which these are the pre-heating zones. In these three zones the heating is applied gradually. Zone 4 is next, were in the zone an excessive heat is applied as to make all soldering paste melts and mates with SMT components. Once it trespass zone 4, the board would be cooled out as to cool the board so that the soldering would be in a solid-state with the components and also so that the operator would be able to handle the board. 4. Now that the reflow oven process is ready a visual inspection of the final result would be the wiser thing to do. This process is called Automated Optical Inspection or AOI, was a camera autonomously literally scans the device under test for variety of surface feature defects such as scratches and stains, open circuits, short circuits, thinning of the solder as well as missing components, incorrect components, and incorrectly placed components.
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