Micro Machining: An Introduction

Dr.R.Edison Chandraseelan

Contents

Introduction Micro Machining (Advanced Micro Machining Processes,AMMPs) Mechanical AMMPs Thermal AMMPs Electro Chemical AMMPs Advanced Nano Finishing Processes (ANFPs) ANFPs with no external control of forces (Abrasive Flow Finishing AFF, Chemo Mechanical Polishing CMP & Elastic Emission Machining EMM) ANFPs with external control of forces (Magnetic Abrasive Finishing MAF ,Magneto Rheological Finishing MRF, Magneto Rheological Abrasive Flow Finishing MRAFF & Magnetic Float Polishing MFP) Selective Applications of Micro Machining Summary Future Project Work

1.Introduction-Why Micro Machining?

Present day High-tech Industries ,Design requirements are stringent Extraordinary Properties of Materials (High Strength, High heat Resistant, High hardness, Corrosion resistant etc) Complex 3D Components (Turbine Blades) Miniature Features (filters for food processing and textile industries having few tens of microns as hole diameter and thousands in number) Nano level surface finish on Complex geometries (thousands of turbulated cooling holes in a turbine blade ) Making and finishing of micro fluidic channels (in electrically conducting & non conducting materials, say glass, quartz, &ceramics)

1.Introduction-What is Micro Fabrication?

Fabrication of products deals with making of machines, structures or process equipment by casting,forming,welding,machining,& assembling Classified into :Macro & micro Macro: fabrication of structures /parts/products that are measurable /observable by naked eye(1mm in size) Micro: fabrication of miniature structures /parts/products that are not visible with naked eye(1 m dimension 1000 m in size) Methods of Micro Fabrication: Material deposition & Material Removal

1.Introduction-Classification of Micro fabrication

Figure 1.Classification of Micro Machining

1.Introduction :MEMS

Microscopic mechanical structures and devices integrated in silicon or other substrates such as quartz, polymers and dielectrics to achieve certain engineering functions by electro mechanical or electro chemical means Very small in size ,mass ,and volume Very low power consumption Low cost Easy to integrate in system Highly resistant to shock,vibration,and radiation Batch fabrication in large arrays

1.Introduction-Micro electronics Vs Micro systems

Micro Electronics 1.Uses single crystalline silicon die, silicon compounds and plastics 2.Stationary structure 3.Primary 2D structure 4.Fewer components in Assembly Micro Systems Uses single crystalline silicon die and few other materials such as Ga As ,Quartz, polymers and metals May involve moving components Complex 3D Structures Many components to be assembled

5.Mass Production
6.Mature IC design methodology 7.Complex pattern over substrate 8.IC Die is completely protected from contact media 9.Industrial standards available 10.Packaging technology is well established

Batch Production
Lack of engineering methodology Simple pattern over substrate Sensor Die is integrated with contacting media No industrial standard to follow Packaging technology is at infant stage

1.Introduction: Micro Machining over Photo fabrication

Photo fabrication achieve atomic level dimension and extreme precision but most suitable for 2D processing of MEMS/NEMS Newly developed IBMM can remove material at the atomic level ,more important is that it can fabricate 2.5 D and 3D nano/micro components which are not feasible by LIGA

2.Micro Machining

Machining of micro parts is not literally correct Removal of material in the form of chips or debris having the size in the range of microns Creating micro features or surface characteristics (especially surface finish) in the micro/nano level Definition: material removal at micro/nano level with no constraint on the size of the component being machined

Figure 2.Micro Machining Definition

2.Micro Machining

Main purposes:

Shaping and sizing a part (AMMPs) Surface finishing a part (ANFPs)

Main classification: Processes which use Mechanical force (abrasion:abasive particles as tools, removing material in the form of micro / nano chips): Mechanical AMMPs Direct energy of beam or plasma (ablation: removal by melting /vaporization): Thermal AMMPs Electro Chemical or Chemical Reaction (removal by chemical reaction): Electro Chemical AMMPs Hybrid / Nano Machining To take advantage of merits of two or more processes ,hybrid processes have been developed by combining them

 machining

Figure3.Classification of Micro Machining

2. machining: Hybrid Technology

Figure4.Hybrid Technology

2.Micro Machining: Mechanical AMMPs

Figure5.Working Principle of Mechanical USMM

a) Ductile Material b) Brittle Material

2.Micro Machining: USMM

Figure6.Ultrosonic Micro Machining

2.Micro Machining: Thermal AMMPs

Figure 7.Thermal Micro Machining Processes a) MEDM b) MEBM c) MLBM

2.Micro Machining: Electro Chemical AMMPs

Figure 8 .Micro tools fabricated using Micro ECM a) straight sided tool 28 m tip radius b) tapered tool

3.Advanced Nano Finishing Processes

Figure 9.Stages in material removal from the work surface (i),(ii),(iii) show slowly shearing off the irregularities (iv) critical surface finish achieved (v) cross section A-A

3.Advanced Nano Finishing Processes: ANFPs with no external control of forces

Figure 10.AFF medium acts as a self deformable stone for finishing complex shaped components (i) internal octagonal cylinder (ii) internal concave shape (iii) external concave shape (iv) turbulated cooling holes

3.Advanced Nano Finishing Processes: ANFPs with no external control of forces

Figure 11. Nano Finishing Processes a) Abrasive flow finishing b) Chemo Mechanical Polishing c) Elastic Emission Machining

3.Advanced Nano Finishing Processes: ANFPs with external control of forces

Figure 11 Nanofinishing Processes d) Magnetic Abrasive Finishing e) Magneto Rheological Finishing f) Magneto Rheological Abrasive Flow Finishing g) Magnetic Float Polishing

4.Selective Applications of Micro Machining

Figure 12.Selective Applications of Micro Machining Processes

5.Summary

AMMPs are developed to meet stringy designers requirements Extraordinary Properties of Materials Complex 3D Components Miniature Features Nano level surface finish on Complex geometries Making and finishing of micro fluidic channels Fabrication of miniature structures /parts/products that are not visible with naked eye(1 m dimension 1000 m in size) Main purposes: Shaping and sizing a part (AMMPs) Surface finishing a part (ANFPs)

6.Future Work: Research Team Identified for funded projects at DRDL,hydrabad,Ministry of Defence ,Government of India

Field :MEMS/Nano Technology Researchers Identified: Dr.Manickvasagam,Scientist G :Optimization techniques-optimal path of missile trajectory Dr.Manoj Kumar, Scientist F :Hydraulics &Pneumatics Dr.Rajasingh,Scientist F :Missile integration Anantha Narayanan,Scientist F :Computational Fluid Dynamics V.Shunmugam,Scientist F :Wind Tunnel Simulation Gobi.K,Scientist E :Sensors and its Applications-Performance evaluation of rocket engines S.Balaji,Scientist E :Application of Smart Structure in Aerospace Applications

7.References

Jain.V.K(2002).,Advanced Machining Processes, Allied Publishers ,New Delhi. Kumar A, Dutta A. Electro photographic layered manufacturing. Journal of Manufacturing Science and Engineering 2004; 126: 571 576. Kunieda M, Kobayashi T. Clarifying Mechanism of Determining tool electrode wear ratio in EDM using spectroscopic measurement of vapour density. Journal of Material Processing Technology 2004; 149: 248 288. Shankar P, Jain VK, Sundarajan T. Analysis of spark profiles during EDM process. Machining Science and Technology 1997; 1-2: 195-217.