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BY CLOVER DISPLAY LTD. (HONG KONG S.A.R, CHINA) AN LCD MANUFACTURER SINCE 1983 URL http://www.cloverdisplay.com & DATE : Sept 29, 2005 SPEAKER Mr. JOHNNY C. L. CHOU
<Topics> 1. FLAT PANEL DISPLAY 2. INTRODUCTION TO LCD TECHNOLOGY. 3. HOW LCDs ARE MADE. 4. COLOR LCD 5. TODAYS LCD 6. CUSTOM DESIGN LCD & LCM (MODULES). 7. TOUCH PANEL, Bi-STABLE LCD & ORGANIC LED. 8. QUESTION & ANSWER. Edition #7 (2005)
High DC
Low
Yes
Yes Yes Yes
High DC
Low DC High DC High DC Low AC Low DC
Low
Medium Low Low Low Lowmedium
Medium
Low Low High High High
NO
Yes
P.1.
Liquid State
High Temp
Electrodes
No potential field
AC potential
P.2.
2.2. COMMON STRUCTURAL PHASES in the Liquid Crystal State Smectic Phase Nematic Phase Cholesteric phase
2.3. Two other components to make a Liquid Crystal Display Panel 2.3.1. Transparent Electrodes ---- Glass with conductive ITO layer which is etched to form a pattern. 2.3.2. The Polarizer Film
P.3.
NO power supply
Light
Incident Light
At higher Temp.
0 volt
% Light Absorption
Depending on how the LCD fluid is formulated. The smaller the cell gap, the faster response.
P.6.
% Light Absorption
% Light Absorption
Volts
STN LCD Yellow Green background color In the positive mode P.7.
1st Minimum TN Little wider View Angle than TN (see later pages)
DSTN (Double STN Cells) Old way when NO Retardation film 1st Cell with patterns Same as usual STN 2nd Cell without pattern But in reverse twisting
2.9. COMPARISON AMONG TN, HTN, STN & FSTN 2.9.1. Positive Mode (Pattern on a Clear Background)
Either
Deg Twisted Background Color Pattern Color Temp Range Multiplex Ratio View Angle View Direction Voltage
TN
90 Grey
HTN
110 Grey
STN
180 Yellow Green or Grey Dark Blue or Blue -20C to +70C =<1/32 duty 120 deg May specify 6 or 12 Oclock 3v min 5v typical
STN
240 Grey or Yellow Green Blue or Dark Blue -20C to +70C =<1/240 duty 120 deg May specify 6 or 12 Oclock 5v typical, (higher duty, higher volts)
FSTN
240 Grey
Black
Black
Black
-40C to +85C =< 1/8 duty 60 deg At 6 or 12 Oclock ONLY 2.5v min 5v typical
HTN
110 deg Black Clear
STN
180 deg (Seldom used) (Seldom used)
STN
240 deg Dark Blue Clear
FSTN
240 deg Black Clear
8%
4%
d n (um)
P.10.
4 pairs of electrodes 8 connectors needed. No time sharing for the input signals The STATIC Design
5 electrodes 5 connectors needed. 1/4 time sharing for the input signals to each of the top electrode. No time sharing for the bottom glass. We call the top electrodes the SEGMENT while the bottom electrodes the COMMON.
4 electrodes in matrix 4 connectors needed. 1/2 time sharing for the input signals to both the top and bottom electrodes---The MULTIPLEX Design. We call it 1/2 duty if the 1/2 time sharing is used on the Common.
PROBLEM: The higher the duty ratio, the shorter time the power signal goes into each electrode pair. Finally the power rms value may NOT be enough to fully drive the LC twisting properly. P.11.
Y1
Y2
Time Signal
X2 An ACTIVE Component ; MIM (metal insulator metal) Diode Or TFT (thin film transistor) The LCD Pixel
Time
The TFT method is commonly used today on the large DOT MATRIX LCD, we call it the ACTIVE MATRIX LCD, or AMLCD The LCD built together with the Active Component is not only the TFT LCD. The LCOS is also an LCD built on a silicon wafer with active components to control the LCD. In general, the duty ratio over 1/256 may not give a good contrast in the Passive design. But there are still some special design to work in the Passive way, such as; Dual Scan STN (DSTN), High Performance Addressing (HPA), . etc P.12.
Hamlin Inc (USA) in TN LCD mass production. E. Merck introduced Biphenylcyclohexanes LC for higher multiplex. Motorola built LCD on 4 x 4 glass substrates Microma (USA) further improved the mass production technique and Fairchild Semiconductor Inc. moved LCD production to Hong Kong. Timex (USA) bought RCA LCD facility and merged with Fairchild. The Japanese developed a Chemical Sealing process for cost reduction. P.13.
P.14.
3.0. HOW LCDs ARE MADE 3.1. THE FRONT END PROCESS
ITO Glass ITO = Indium Tin Oxide, a transparent conductive layer coated on the Sodium Lime Glass. Its resistance is from 10 Ohms to 120 Ohms/square. Glass area usually in 14x16. Thickness in 1.1, 0.7, 0.5, 0.4, 0.3mm Artwork & Mask Design
Methods: Photo Masking, Resist Ink Printing, ITO Ink direct Printing, Laser Cutting.
Alignment Layer
To form the cell and the inter-connections between the top and bottom glasses
P.15.
Testing & Inspection Polarizer Cutting Polarizer Fixing Metal Pin or Heat Seal Connector fixing Cosmetic Check Optional Process LCD Module Assembly (COB, TAB, COG, COF)
Shipments
P.16.
Common
Common
In order to give a better color mixing, the RGB line widths are usually less than 30 micron in width per color. Hence the same for the ITO electrodes.
The color LCD can be built as a Passive LCD. But most large size Dot Matrix Color LCDs are built in the Active design.
P.17.
V
No pure color, 50% Green + 25% Red + 25% Blue at this point
P.18.
4.5. LCD WITH COLOR POLARIZER, COLOR FILM OR COLOR REFLECTOR IN CERTAIN AREA (fixed color)
Pre-printed color polarizer is expensive.
4.6. COLOR INK PRINTING ON THE BOTTOM GLASS SURFACE (fixed color)
This is the cheapest way to make LCD with fixed colors. The LC image & color area may not coincide well due to the glass thickness. P.19.
Active LCD
LCD TV & Monitors
Passive LCD
Projector
STN TN
Data Bank Film Camera Calculator 100 Pixels Time pieces Hand Held Games 1K Pixels
6.0. CUSTOM DESIGN LCD & LCM --- The factors to consider 6.1. LCD PANEL DIMENSIONS
Outer Dimensions (Be economical size)
View Area (normally 2mm from the edges) End Seal (0.5mm thick) Active Area (Area with patterns) Pinout or Connection Area (2 to 2.5mm) Glass Thickness (1.1, 0.7, 0.5, 0.4 or 0.3mm/one side) ( Glass Material: Sodium Lime Glass with SiO2 barrier, surface polished for STN use ) Economical Panel Size: The outer dimension may use up most the raw glass sheet area. or Raw Glass Sheet 7x8 inches (178x203mm) 14x16 inches (355x406 mm) (The usable area is 7mm off the edge) For small order size or pilot run, 7x8 inches sheets are used to boost up the yield and save the tool cost.
P.21.
The thick lines representing the pinout areas. Connectors suitable: Zebra (Silicone Rubber) A, B, Heat Seal or TAB A, B, C, D, Metal Pins C, D,
All the above 4 models required Ag (silver) connections inside the LCD cell. If such Ag connection not to be used or unable to be used, the configurations will be as follows;
Models E, F & G are good for combination use of Zebra and Heat Seal connectors together. Most TAB connections are also applying on such models. For TN LCD, dont forget to specify the View Direction 45+deg 15+deg 15+deg 45+deg 6 Oclock P.22. 40+deg 40+deg
12 Oclock
Cross Over
P.23.
Pitch: (Conductor/Insulator Layers) Low Cost Type --- 0.25+-0.05mm General Type ----- 0.18+-0.04 mm Dot Matrix Type 0.10+-0.03 mm Graphic Type ------0.05+-0.025 mm
PCB Contact Resistance: 1000 1500 ohms at 10%-15% compression LCD Zebra
LCD Zebra
Assembly
Precautions in Assembly
Pre-clean Zebra Three or more conductors in contact PCB wraping <0.375mm / 50 mm Bezel has opening gaps with PCB 0.3mm or 10%-15% compression Dummy zebra use with single side contact LCD. Insulation side wall quality. P.24.
Mis-aligned Good
Contact Resistance & Graphite Type --- 35 to 100 ohms/sq Silver Graphite Type ---- 0.5 ohm/sq Silver Type ------ 0.05 ohm/sq
Hot Press
PET film
Welded
Precautions in Assembly
The Hot Press head temperature 120-140 deg C at joint 32 Kg/sq cm pressure is recommended Leveling the press for even pressure along the joint. Properly select the sealing time to prevent uneven flow or wash away the conductor particles. 100pcs/mm2 particles at contact area is suggested. Peeling off strength be >200gm (Vertical) & >500gm (Horizontal) P.25.
PCB
PET side
Standard Pitch: 1.27mm, 1.8mm, 2.0mm, 2.54mm Pin Length: 20mm, 30mm, & 45mm max Clip Depth 2.0mm to 2.4mm max Contact Resistance: <0.05 ohm Precautions in Assembly:
Prolong soldering may damage the Pin contact to glass ---- A good LCD will add carbon cushion between pin clip and glass contact area. Care on bending the pins ---- LCD maker provides pin lead forming. Pin length under 4.0mm is not recommended. Wave solder is not recommended ---- Polarizer is weak Mechanical stress on pin or temperature changes may cause LCD background color changed.
All the above connections may have IC on PCB by SMT, Wire Bonding (COB) or Insert & Solder.
P.26.
ACF* film is used to fix the COG chip onto the glass. The ACF film is similar to Heat Seal but with much finer Pitch and conductive particles.
IC Chip
P.27.
6.10. TRICKS ON THE LCD PANEL DESIGN 6.10.1. THE BIAS VOLTAGE
% LIGHT ABSORPTION Applied to Segment Applied to Common 10% 0 volt Vth Volts Volts Resulting Waveform to LCD
On
Off
Off
P.28.
Vd
Voff Von Von Voff
3 volts
1.06 v 2.37 v 1.31 v
3 volts
1.22 v 2.12 v 0.90 v
3 volts
1.00 v 1.73 v 0.73 v
3 volts
0.88 v 1.27 v 0.39 v
5 volts
1.22 v 1.58 v 0.36 v
P.29.
Ag Dot Connection
P.30.
10 deg C lower
10 deg C higher
The STN temp is 10 deg narrower than TN Problem when exceeds rated temp. Black Spots Slow response Background blackened Cross Talk
All the above defects are reversible at room temp Possible design Specific for Low Temp Specific for High Temp
Descriptions
Wedge diffuser (Light Guide) and reflector are needed. Poor illumination for large panel Consuming more power and generating more heat. Beware the difference in supply voltages of each model. Easy assembly The best in even brightness and light weight. But less brighter than LED Backlight. High voltage and EMC consideration. The strongest illumination. High voltage and EMC consideration.
Common Color
Yellow Green, Blue, White Yellow Green, Red. Green, Blue, White. White.
Important: The Transmissive and the Transflective Type LCD absorb the different light intensity. Light Light Diffuser Paper Light Guide
LEDs
Fig. 1. Reflector domes Reflector Paper
The above two textures are switch-able under 30V to 180V pulse of 10ms to 100ms, and stable in zero electric field. By properly adjust the pitch of the Twisted Planar Texture, it can reflect R, G, B lights.
P.33.
Metal Cathode Electron Transport Layer Re-combination and Emission Layer Hole Transport Layer ITO Layer (Anode) Glass Substrate Light emits
P.34.
b.
Some people now call the OLED made under polymer process the PLED. The small molecule process is also applying to making the ACTIVE OLED. Pioneer, Japan seems the first one in mass production for the OLED. It is expected the OLED will replace the LCD step by step from 2005. CLOVER DISPLAY GROUP has started a joint venture with the University of Hong Kong to research and develop the materials and process for OLED. The newly formed joint venture company is named COLED DISPLAY LTD., established Sept 2002.
P.35.
P.36.
NRE payment in advance ** normally 10-20 LCD or 3-5 LCM samples will be free. For more qty, please notice us in advance when confirm the NRE order.
PCB & Circuit 1 week Circuit diagram & PCB Layout 3-10 weeks
Primary Sample
Final Sample
Total development time; LCD Panels 4-7 weeks, LCM Modules 4-10 weeks; With External Case 7-18 weeks
P.37.
1. 2. 3.
Prepared by; Johnny C. L. Chou, Clover Display Ltd. Room 1006, 26 Hung To Road, 10/F, Kwun Tong, Hong Kong Tel: 23428228, 23413238 Fax: 23418785, 23574237 email: cdl@cloverdisplay,com URL: http://www.cloverdisplay.com (in English) http://www.cloverdisplay.com.hk (in Japanese) http://www.cloverchina.com (in Chinese)