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t
c
u t u K e t e d
(
= + +
(
}
Case 1. The set point is constant, or only adjusted manually on an
infrequent basis.
For this situation, y
sp
is considered to be a parameter instead of a
variable.
Introduction of the control law adds one equation but no new
variables because u and y are already included in the process
model.
Thus, N
E
increases by one, N
V
is unchanged, and Eqs. 10-1 and
10-2 indicate that N
F
and N
FC
decrease by one.
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Case 2. The set point is adjusted frequently by a higher level
controller.
Guideline 1.
All variables that are not self-regulating must be controlled.
Guideline 2.
Choose output variables that must be kept within equipment and
operating constraints (e.g., temperatures, pressures, and
compositions).
Selection of Controlled Variables
The set point is now considered to be a variable. Consequently,
the introduction of the control law adds one new equation and
one new variable, y
sp
.
Equations 13-1 and 13-2 indicate that N
F
and N
FC
do not change.
The importance of this conclusion will be more apparent when
cascade control is considered in Chapter 16.
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Figure 13.3 General representation of a control problem.
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Guideline 3.
Select output variables that are a direct measure of product
quality (e.g., composition, refractive index) or that strongly affect
it (e.g., temperature or pressure).
Guideline 4.
Choose output variables that seriously interact with other
controlled variables.
Guideline 5.
Choose output variables that have favorable dynamic and static
characteristics.
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Guideline 6.
Select inputs that have large effects on controlled variables.
Guideline 7.
Choose inputs that rapidly affect the controlled variables.
Guideline 8.
The manipulated variables should affect the controlled variables
directly rather than indirectly.
Guideline 9.
Avoid recycling of disturbances.
Selection of Manipulated Variables
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Guideline 10.
Reliable, accurate measurements are essential for good control.
Guideline 11.
Select measurement points that have an adequate degree of
sensitivity.
Guideline 12.
Select measurement points that minimize time delays and time
constants
Selection of Measured Variables
Example 13.4: Evaporator Control
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Figure 13.5 Schematic diagram of an evaporator.
MVs: P
s
, B and D DVs: x
F
and F
CVs: ??
Case (a): x
B
can be measured
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Case (b): ): x
B
cannot be measured
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Distillation Column Control
(a 5 x 5 control problem)
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Challenges for Distillation Control
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1. There can be significant interaction between process
variables.
2. The column behavior can be very nonlinear, especially for
high purity separations.
3. Distillation columns often have very slow dynamics.
4. Process constraints are important.
5. Product compositions are often not measured.
cf. Distillation Process Control Module (Appendix E)
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Process Control Module:
Fired-Tube Furnace
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The major gaseous combustion reactions in the furnace are:
4 2 2
2 2
3
CH O CO 2H O
2
1
CO O CO
2
+ +
+
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Process Control Module: Fired-Tube Furnace
Table 3.1
Key Process Variables for the PCM Furnace Module
Measured Output Variables Disturbance Variables
HC outlet temperature HC inlet temperature
Furnace temperature HC flow rate
Flue gas (exhaust gas) flow rate Inlet air temperature
O
2
exit concentration FG temperature
FG purity (CH
4
Manipulated Variables concentration)
Air flow rate
FG flow rate
Control Objectives for the Furnace
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1. To heat the hydrocarbon stream to a desired exit
temperature
2. To avoid unsafe conditions due to the
interruption of fuel gas or hydrocarbon feed
3. To operate the furnace economically by
maintaining an optimum air-fuel ratio.
Safety Considerations?
Control Strategies?
Catalytic Converters for Automobiles
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Three-way catalytic converters (TWC) are designed to
reduce three types of harmful automobile emissions:
1. carbon monoxide (CO),
2. unburned hydrocarbons in the fuel (HC)
3. nitrogen oxides (NO
x
).
Desired oxidation reactions (1000-1500 F, residence
times of ~ 0.05 s):
n 2n+2 2 2 2
2 2
3 1
C H ( ) O CO +(n+1) H O
2
1
CO O CO
2
n
n
+
+
+
Desired reduction reaction:
x 2 2
2NO O +N x
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Figure 13.10 TWC efficiency as a function of air-
to-fuel ratio (Guzzella, 2008).
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TWC Control Strategy
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Plasma Etching in Semiconductor Manufacturing
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Pre-process Measurement
Integrated
Metrology
Etch Process
Integrated
Metrology
Resist
BARC
Polysilicon
Silicon
Substrate
Oxide
Gate oxide
Resist
BARC
Polysilicon
Oxide
Gate oxide
in
CD
in
CD
in
Silicon
Substrate
Post-process Measurement
out
in
(center)
CD
in
(center, edge)
out
(center)
CD
out
(center, edge)
Figure 13.12 Inputs and outputs for polysilicon gate etch process in semiconductor manufacturing.
The measured inputs (CD
in
and
in
) in the incoming wafer can be used in feedforward control, while
the measured outputs (CD
out
and
out
) are used in feedback control. BARC is bottom anti-reflective
coating.