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Indigent Group of UIT

M.Talha Meraj Abdul Aleem Siddiqui Faizan Hanif M.Saad Abbas

Content s
Dual in-line package (DIP) Small-outline integrated circuit (SOIC) Thin Small-outline Package (TSOP) Thin Very Small-outline Package (TVSOP) Quad Flat Package (QFP) Thin Quad Flat Package (TQFP) Plastic Leaded Chip carrier (PLCC)

Dual in-line package (DIP)


In microelectronics, a dual in-line package (DIP or DIL) is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board or inserted in a socket.

Where dip encased?


DIP is a chip encased in a hard plastic casing with pins along each of the sides of the plastic casing. In the picture to the right, is an example of a DIP found on a computer motherboard that has been soldered into place.

I C PA C K A G E S
Some DIPs use a small dot on the top surface of the package to locate pin 1. The spacing between pins (lead pitch) is typically 100 mils( a mil is a thousandth of an inch). Dip packages are still the most popular package for breadboarding and educational experimentation.

Dual in-line package (DIP)


A DIP is usually referred to as a DIPn, where n is the total number of pins.
Height: 200mils(5.1mm) Lead pitch: 100mils(2.54mm)

Small-outline integrated circuit


A small-outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 3050% less than an equivalent DIP, with a typical thickness that is 70% less. They are generally available in the same pin outs as their counterpart DIP ICs. The convention for naming the package is SOIC or sometimes just SO followed by the number of pins.

Small-outline integrated circuit

Thin Small-outline Package


Thin small-outline packages, or TSOPs are a type of surface mount IC package. They are notably very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm). They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume.

Thin Small-outline Package

Thin Small-outline Package

Thin Small-outline Package

Thin Very Small-outline Package

Height : 1.2 mm

Lead Pitch: 0.4mm

Quad Flat Package


A QFP or Quad Flat Package is a surface mount integrated circuit package with "gull wings" leads extending from each of the four sides. Versions ranging from 32 to 304 pins with a pitch ranging from 0.4 to 1.0 mm are common.

Quad Flat Package


A package related to QFP is PLCC which is similar but has pins with larger pitch, 1.27 mm (or 1/20 inch), curved up underneath a thicker body to simplify socketing (soldering is also possible). It is commonly used for NOR Flash memories and other programmable components.

Quad Flat Package

Thin Quad Flat Package


Height : 1.6 mm Lead Pitch: 0.5mm

Plastic Leaded Chip Carrier


Height : 4.5 mm Lead Pitch: 1.27mm