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What is Ball Grid Array ?

A ball grid array (BGA) is a type of surface-mount

packaging used for integrated circuits.

BGA packages are used to permanently mount

devices such as microprocessors.

The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered)

with pins in a grid pattern.

These pins conduct electrical signals from the integrated

circuit to the printed circuit board (PCB) on which it is placed.

In a BGA, the pins are replaced by balls of solder stuck to the

bottom of the package.

These solder spheres can be placed manually or with

automated equipment.



High density


Heat conduction

High density
The BGA is a solution to the problem of producing a miniature package for

an integrated circuit with many hundreds of pins.

Pin grid arrays and dual-in-line surface mount (SOIC) packages were being

produced with more and more pins, and with decreasing spacing between the pins,

But this was causing difficulties for the soldering process. As package pins

got closer together,

The danger of accidentally bridging adjacent pins with solder grew. BGAs do

not have this problem when the solder is factory-applied to the package.

Heat conduction
A further advantage of BGA packages over

packages with discrete leads (i.e. packages with legs) is the lower thermal resistance between the package and the PCB.
This allows heat generated by the integrated

circuit inside the package to flow more easily to the PCB, preventing the chip from overheating.

Removing a defective BGA

The defective BGA can be peeled off using

tweezers or the like by hot-blowing the BGA from its top with a local heater such as a heat gun (approx. 270-280C),
Be careful not to apply heat for an prolonged

Pinpoint the heat so as not to affect the other

Be careful to avoid damaging the other


Removing a defective BGA

BGA Reballing Process

There are many tools on the market which

will remove residual solder from BGA components. These include hot air vacuum tools, solder wick, and low temp wave solder
Any of these tools, if used properly, work well

with our Solderquik BGA Preforms.

Tools and materials Reballing

Flux Solder wick IPA Wipes (isopropyl alcohol) Conductive mat

Flux package
With the package pad side up on top of the

conductive mat, apply a small amount of flux onto the balls of the BGA package. Too little flux makes ball removal difficult.

Ball removal
Using the desoldering braid and soldering iron

remove the solder balls from the pads of the package.

Clean package
Immediately clean the package with an

isopropyl alcohol wipe.Prompt cleaning of the part will make flux residue easier to remove.
Using a rubbing motion over the surface of

the package, remove the paste flux. Keep moving the package to a cleaner portion of the wipe. Always support the opposite side of the package while cleaning. Do not bend package corners.

Apply flux to packag

Use the paste flux syringe to apply a small

amount of flux to the package.

NOTE: Make sure package is clean before you


Spread flux
Use the acid brush from the kit to spread the

paste evenly over the entire pad side of the package. Cover each pad with a thin layer of flux.
Be sure all pads are covered with flux. A

thinner layer of flux works better than a thicker layer.

Set the stencil and Applying the solder past or ball

Set the stencil on the ic packag Use the match stencil with his matching ic Carefully apply the solder past or solder ball

on the stencil

Place the fixture into the hot air convection

oven or hot air reballing station and start the reflow heat cycle.

After reflow process Using tweezers, remove the fixture from the oven or

reballing station and place it on the conductive tray. Allow the package to cool for about 2 minutes before removing it from the fixture.
When the package has cooled, remove the stencil Rinse the package with DI water. This will remove small

bits of flux
Mount the package on PCB