Thermal Management

Electronics Cooling

Paper By:
1. 2. 3. Prof. Kiran D. Devade (Lecturer, Mech Dept.) Prof. Avinash M. Patil (Professor, Mech Dept.) Prof. Sunil B. Ingole (Assistant Professor, Mech Dept)

Thermal Management- Electronic Cooling

Thermal Management
The Paper deals With,

1. 2. 3. 4. 5. 6.

Introduction Need Methods Available Research Work Future Prospective Conclusion

Thermal Management- Electronic Cooling

Introduction
Electronics is developing field, since long through decades it is moving towards miniaturization in size and maximizing capacities.

Thermal Management- Electronic Cooling

History

This was the CPU of a computer before introduction of microprocessors

Thermal Management- Electronic Cooling

PAST
After microprocessors computers became more smaller and cheaper

Thermal Management- Electronic Cooling

Now,
But with advancements the computers are becoming more compact and more cheaper

Thermal Management- Electronic Cooling

The graph indicates the relation of size vs computing ability of a chip it is increasing exponentially.

Thermal Management- Electronic Cooling

Old

Latest

Thermal Management- Electronic Cooling

Why Electronic Cooling

Thermal Management- Electronic Cooling

Other Source of heat generation

Due to the advantages of high local heat and mass transfer rate and a relatively easy control of areas to be cooled or heated, impinging jets are widely used in many industrial applications such as, cooling of hot steel plates. annealing of glass and sheet metals. drying of papers, films , textiles. cooling of turbine blades. electronic components. most recently manufacturing of TFT-LCD plate.

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Methods for cooling- forced convection

Various cooling options that are available till date are:

*Liquid Vapor phase change

*Direct Liquid cooling *Indirect Liquid cooling *Impinging jets *Droplets *Sprays
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Liquid Vapor phase change

It is also known as TWO PHASE HEAT TRANSFER: In this a fluid is used as a media to transfer the heat from source to surrounding, the fluid at liquid state absorbs heat from the hot source and turns vapor. The vapor gives of the absorbed heat to surrounding and regains liquid state. The fluid is transported through closed tube hence it is also called as heat

pipe.

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Mark Aaron Chan, Christopher R. Yap, Kim Choon Ng in 2009 tested a CPU with phase change system and reported that after modeling, design, and testing of a high flux and yet compact two-phase CPU cooler, with excellent attributes of low thermal resistance that are derived from the intrinsic design features of phase change phenomena and minimal vapor pressure drop of the device. For the same footprint of a conventional cooler, the prototype rejects more than twice the capacity of CPUs of today. The unique design minimizes its overall size and yet provides adequate area for forced convection cooling. Testing was conducted over an assorted heat loads and air flow rates flowing through the fins, achieving a best performance of 0.206 K/W of device thermal resistance at a rating of 203 W under an air flow rate of 0.98 m3/min.

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Direct Liquid cooling

In this method of cooling liquid is circulated continuously through the sources of heat generation using small size pumps.

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Cristina H. Amon, Jayathi Murthy, S. C. Yao, Sreekant Narumanchi, ChiFu Wu, Cheng-Chieh Hsieh in 2001 sudied the effects of direct liquid cooling for electronics applications and developed the technique for droplet impingement for integrated cooling of electronics (EDIFICE). The EDIFICE project seeks to develop an integrated droplet impingement cooling device for removing chip heat fluxes in the range 70100 W/cm2, employing latent heat of vaporization of dielectric fluids (50100 m droplets) to achieve these high heat removal rates. Micro-manufacturing and micro electro-mechanical systems (MEMS) will be discussed as enabling technologies for innovative cooling schemes recently proposed. A novel feature to enable adaptive on-demand cooling is MEMS sensing (on-chip temperature, remote IR temperature and ultrasonic dielectric film thickness) and MEMS actuation. EDIFICE will be integrated within the electronics package and fabricated using advanced micromanufacturing technology (e.g., deep reactive ion etching (DRIE) and complementary metal-oxide-semiconductor (CMOS) CMU-MEMS).

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Indirect Liquid cooling

In this method of electronics cooling the cooling is achieved by convection heat transfer principles where the liquid is not in contact with the heat source directly.

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 Yam Lai, Nicols Cordero, Frank Barthel, Frank Tebbe, Jrg Kuhn, Robert Apfelbeck, Dagmar Wrtenberge in 2009 performed experiments with Leds and with liquid cooling the thermal design from device to board to system level has been carried out in this research. Air cooling and passive liquid cooling methods were investigated and excluded as unsuitable, and therefore an active liquid cooling solution was selected. Several configurations of the active liquid cooling system were studied and optimization work was carried out to find an optimum thermal performance.

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Impinging jets
In this method of electronics cooling a jet of air or liquid is directly blown on to the heated surface in normal orientation

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Jemmy S. Bintoro, Aliakbar Akbarzadeh, and Masataka Mochizuki in 2005 carried out experiments with single jet and heat exchangers and reported that the system has the cooling capacity of 200 W over a single chip with a hydraulic diameter of 12 mm. The equivalent heat flux is 177 W/cm2. The cooling system maintains the chips surface temperature below 95 C maximum when the ambient temperature is 30 C. De-ionized water is the working fluid of the system. For the impinging jet, two different nozzles are designed and tested. The hydraulic diameters (dN) are 0.5 mm and 0.8 mm. The corresponding volume flow rates are 280 mL/min and 348 mL/min. Mini channels heat exchanger has 6 (six) copper tubes with the inner diameter of 1.27 mm and the total length of about 1 m. The cooling system has a mini diaphragm pump and a DC electric fan with the maximum power consumptions of 8.4 W and 0.96 W respectively. The coefficient of performance of the system is 21.4 A.M. Kiper in 1984 used water sprays for VLSI circuit cooling new method of cooling of planar Very Large Scale Integrated (VLSI) circuits which allows one to obtain chip heat fluxes in excess of 500 W/cm2 with acceptable temperature rises. It is shown that by scaling impinging fluid jet heat transfer technology to small geometrical dimensions, and by using water as the coolant, a highperformance cooling system can be designed. The convective heat transfer coefficients obtained in this method are significantly greater than that obtained in the convectional liquid cooling technology used for microelectronic devices, including the immersion cooling.

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Droplets
In this method of electronics cooling droplets of various sizes and at varying velocities are used to remove heat fluxes from a electronic system

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 H. Oprins, J. Danneels, B. Van Ham, B. Vandevelde, M. Baelmans in 2008 studied heat transfer rates for varying droplet velocities and It is shown that the internal droplet flow exhibits a parabolic characteristic at one hand and that the presence of two convection cells decreases the heat transfer to the lower part of the droplet, thereby limiting the overall heat transfer through the droplet. A typical enhancement of the heat transfer with a factor 2 is achieved with respect to the minimal value that would be obtained assuming heat conduction as the only means of heat transfer in the liquid. Further an analytic lumped model is presented to estimate the transient average droplet temperature with an accuracy of 5% compared to the full transient computational fluid dynamics modeling.

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Sprays
In this system to remove chip level heat fluxes the liquid or is sprayed using number of nozzles on the heated surface.

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 B.Q. Li, T. Cader, J. Schwarzkopf, K. Okamoto, B. Ramaprian An experimental and inverse computational study is presented of spray cooling of microelectronics with an emphasis on the spray angle effects on cooling performance. A thermal test chip provides the heated target, and is cooled by a single pressure swirl atomizer. Thermal readings were taken at the spray angles of 060, at a fixed distance of 1.4 cm from the heated die surface. An inverse heat transfer computational algorithm is developed to calculate the unknown spray cooling heat fluxes using the measured temperature data inside the die. The computational scheme is a combination of the finite element method and the truncated single value decomposition with the discrepancy principle for determining the optimal truncation threshold value. Good agreement is obtained between the experimental measurements and calculated results. For this particular system, a direct estimate using temperature readings at two adjacent points would produce incorrect heat flux results and an inverse algorithm is deemed essential if an accurate heat flux is to be obtained from the measurements. It is found that a major cause for the drop-off is the reduction in spray volumetric flux delivered to the die at the greater spray angles.

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Research Status
*Liquid Vapor phase change- 5853

*Direct Liquid cooling- 7117 *Indirect Liquid cooling-1737 *Impinging jets-549 *Droplets-2005 *Sprays-1854

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Li qu id va po r D ire ct ph as e

8000 7000 6000 5000 4000 3000 2000 1000 0

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ch an L ge i In qu di id re co ct ol Li in qu g id co ol Im in pi g ng in g je ts D ro pl et s Sp ra ys

Series1

CONCLUSION
Number of solutions have been used till date for electronics cooling problem, as the working demands are higher and heat flux being induced is increasing with time still a satisfactory solution can be put into action For electronics cooling with jet impingement experiments can be performed by varying the nozzle shapes and to break laminar boundary layer various flow patterns can be used to enhance the heat transfer rates. Some fin geometries are in practice till date a compromise between cost and efficiency can be attained by varying the arrangements and fin geometries.

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 for spray cooling the pressurized air and liquid mixture ca be used as mist to spray and combinations of air and liquid can be studied at various flow rates to determine the best suited flow-mixture combination. parabolic droplets of various cooling fluids can be studied for this to remove the heat generated From the graph it is also clear that a lot of scope is there for work in jet impingement cooling area. Cross cutting of flat fins into multiple sections is also suggested to improve heat transfer coefficient. Augmentation of the fins can also improve the performance. Jet impingement cooling using high speed blow directed towards the base of the fin arrangement is effective.

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References
1. Michroelectromechanical system based evaporative thermal management of high heat flux electronics, Journal of heat and mass transfer, Volume 127,January 2005, Pages 66-75, Cristina H. Amon, S.C. Yao, C. F. Wu,C.C. Hseih. 2. Modeling and testing of an advanced compact two-phase cooler for electronics cooling International Journal of Heat and Mass Transfer, Volume 52, Issues 15-16, July 2009, Pages 34563463,Mark Aaron Chan, Christopher R. Yap, Kim Choon Ng 3. The experimental investigation on thermal performance of a flat two-phase thermosyphon International Journal of Thermal Sciences, Volume 47, Issue 9, September 2008, Pages 1195-1203,Ming Zhang, Zhongliang Liu, Guoyuan Ma 4. MEMS-enabled thermal management of high-heat-flux devices EDIFICE: embedded droplet impingement for integrated cooling of electronics Experimental Thermal and Fluid Science, Volume 25, Issue 5, November 2001, Pages 231-242,Cristina H. Amon, Jayathi Murthy, S. C. Yao, Sreekant Narumanchi, Chi-Fu Wu, Cheng-Chieh Hsieh 5. An absorption based miniature heat pump system for electronics cooling International Journal of Refrigeration, Volume 31, Issue 1, January 2008, Pages 23-33 Yoon Jo Kim, Yogendra K. Joshi, Andrei G. Fedorov 6. Development of a chip-integrated micro cooling device Microelectronics Journal, Volume 34, Issue 11, November 2003, Pages 1067-1074 J. Darabi, K. Ekula 7. Modeling and testing of an advanced compact two-phase cooler for electronics cooling International Journal of Heat and Mass Transfer, Volume 52, Issues 15-16, July 2009, Pages 3456-3463 Mark Aaron Chan, Christopher R. Yap, Kim Choon Ng 8. Liquid cooling of bright LEDs for automotive applications Applied Thermal Engineering, Volume 29, Issues 5-6, April 2009, Pages 1239-1244 Yan Lai, Nicols Cordero, Frank Barthel, Frank Tebbe, Jrg Kuhn, Robert Apfelbeck, Dagmar Wrtenberger

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9. Micro cooling systems for high density packaging Revue Gnrale de Thermique, Volume 37, Issue 9, October 1998, Pages 781-787 Bernd Gromoll 10. A closed-loop electronics cooling by implementing single phase impinging jet and mini channels heat exchanger Applied Thermal Engineering, Volume 25, Issues 17-18, December 2005, Pages 27402753,Jemmy S. Bintoro, Aliakbar Akbarzadeh, Masataka Mochizuki 11. Impinging water jet cooling of VLSI circuits International Communications in Heat and Mass Transfer, Volume 11, Issue 6, NovemberDecember 1984, Pages 517-526 A.M. Kiper 12. Convection heat transfer in electrostatic actuated liquid droplets for electronics cooling Microelectronics Journal, Volume 39, Issue 7, July 2008, Pages 966-974 H. Oprins, J. Danneels, B. Van Ham, B. Vandevelde, M. Baelmans 13. Spray angle effect during spray cooling of microelectronics: Experimental measurements and comparison with inverse calculations Applied Thermal Engineering, Volume 26, Issue 16, November 2006, Pages 1788-1795 B.Q. Li, T. Cader, J. Schwarzkopf, K. Okamoto, B. Ramaprian 14. Intermittent spray cooling: A new technology for controlling surface temperature International Journal of Heat and Fluid Flow, Volume 30, Issue 1, February 2009, Pages 117130,Miguel R.O. Pano, Antnio L.N. Moreira 15. WWW.sciencedirect.com

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