3D ICS

REHANA ABDUL SALAM 1581110059

introduction
End of Moore's law.
Need for a new scenario. 3 challenges-Interconnect, cost , and

complexity. A new solution 3D INTEGRATION.

What is 3d IC.
Mounting 2 or more dice on top of each other. Allow miniaturization /saving space.
Shorter interconnection. Promises more than Moore.

Features in brief..
Higher levels of integration.
Interconnect shorting. Heterogeneous integration. Fine-grained testing.

SOC and 3D IC
All components placed on single die.
Mixed signal integration and verification. Rising development costs.

Continued

Hetrogeneous.

3D IC with TSVS
an efficient 3-D multilevel routing approach.
via that goes through a device layer. provide connections from the upper metal

layers to additional backside metal. Reduced parasitic.

Manufacturing technologies
Monolithic
Wafer-on-Wafer Die-on-Wafer Die-on-Die

Performance Characteristics
Timing
Energy With shorter interconnects in 3D ICs, both switching energy and cycle time are expected to be reduced

Timing

In current technologies, timing is

interconnect driven. Reducing interconnect length in designs can dramatically reduce RC delays and increase chip performance The graph below shows the results of a reduction in wire length due to 3D routing

Energy performance
Wire length reduction has an impact on the cycle time and the energy dissipation Energy dissipation decreases with the number of layers used in the design

Challenges
Thermal Issues in 3D-circuits
EMI Reliability Issues

Thermal challenge
Increased integration results in increased heat.
heat dissipation increases with number of

layers.

Heat Flow in 2D
Heat generated arises due to switching In 2D circuits.

Heat Flow in 3D
With multi-layer circuits , the upper layers will also generate a significant fraction of the heat. Heat increases linearly with level increase

EMI
Interconnect Inductance Effects
Shorter wire lengths help reduce the inductance Presence of second substrate close to global wires

might help lower inductance by providing shorter return paths

Benefits
Cost.
Heterogeneous integration. Shorter interconnect. Power. Design. Circuit security. Bandwith.

Conclusion
Major new trend in the semiconductor industry.
3D IC design is a relief to interconnect driven

IC design. Still many manufacturing and technological difficulties Needs strong EDA applications for automated design

Thank you..