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PACKAGING TECHNOLOGY
CHAPTER 1
CLO 1 :
Describe clearly the integrated circuit technology evolution and MicroElectromechanical System (MEMS) concept. (C1)
Dis 2013
WHAT IS ICS?
A complete circuit that usually built on a semiconductor substrate having the same functions with the circuit on PCB in a very small package where the circuit may be a complex circuit consisting of a combination of several tens / hundreds / thousands to the millions of components.
PCB board
A Die inside an IC
An Osborne Executive portable computer, from 1982 with a Zilog Z80 4MHz CPU, and a 2007 Apple iPhone with a 412MHz ARM11 CPU. The Executive weighs 100 times as much, is nearly 500 times as large by volume, costs approximately 10 times as much (inflation adjusted), and has 1/100th the clock frequency of the phone.
DISCRETE COMPONENT VS IC
An elementary (basic) electronic device constructed as a single unit. Before the advent (start) of integrated circuits (chips), all transistors, resistors, capacitors and diodes were discrete (Individually separate). Discrete components are widely used in amplifiers and other electronic products that use large amounts of current. On a circuit board, they are intermingled (bercampur) with the chips, and there is hardly any electronic product that does not have at least one or two discrete resistors or capacitors
Dis 2013
Dis 2013
2000 above
MOORES LAW
Moore's law is the observation that over the history of computing hardware, the number of transistors on integrated circuits doubles approximately every two years.
The law is named after Intel co-founder Gordon E. Moore, who described the trend in his 1965 paper. The paper noted that the number of components in integrated circuits had doubled every year from the invention of the integrated circuit in 1958 until 1965 and predicted that the trend would continue "for at least ten years".
MICROPROCESSOR
IC FABRICATION METHODS
MONOLITHIC FILM HYBRID
IC FABRICATION METHODS
MONOLITHIC
All components (active and passive) is produced on a silicon chip (wafer). The most popular use - low cost high reliability
Weakness The weakness of isolation Limited range of passive components Circuit design is not flexible
Active component: produce new signal from input signal ( transistor, diod) Passive component: can be used to send signal from one part to another part. ( resistor, capacitor, inductor)
FILM
Formed on a chip components such as ceramic or glass insulators Only passive components Wider range of components Less problem of isolation Active components can be added externally, - more flexible design
Active component: produce new signal from input signal ( transistor, diod) Passive component: can be used to send signal from one part to another part. ( resistor, capacitor, inductor)
HYBRID
Combination of two or more chips Combination of film and monolithic fabrication method Active component formed by monolithic method Passive components formed by film method The most flexible design Often used as a prototype of a monolithic integrated circuit
Active component: produce new signal from input signal ( transistor, diod) Passive component: can be used to send signal from one part to another part. ( resistor, capacitor, inductor)
Dis 2013
Active component: produce new signal from input signal ( transistor, diod) Passive component: can be used to send signal from one part to another part. ( resistor, capacitor, inductor)
TRANSISTOR TYPES
transistor
BJT
FET
IIL
JFET
TTL
MOSFET
NPN
PNP
PMOS
NMOS
CMOS
BiCMOS
advantages: The cost of cheap manufacture. simple fabrication methods. weaknesses: Operation of the circuit delay Movement of hole current 2x slower than the electrons.
advantages: smaller size compared to pMOS. fast operating speed compared to pMOS
weaknesses: The size are larger of the pMOS and nMOS. involve more steps during the fabrication process. more silicon area required to build p-wells. The false switching or "latching" if not carefully designed due to parasitic bipolar effects and structure of four layers NPNP.
advantages:
high operating speed. low power dissipation
weaknesses: The size of chip large a complex fabrication process. The cost of making expensive
ICS CLASSIFICATION :
Analog circuit digital circuit mixed signal circuit (both analog and digital on the same chip).
Analog ICs
Analog
ICs, such as sensors, power management circuits, and operational amplifiers, work by processing continuous signals. They perform functions like amplification, active filtering, demodulation, and mixing. Analog ICs ease the burden on circuit designers by having expertly designed analog circuits available instead of designing a difficult analog circuit from scratch.
DIGITAL ICS
Digital ICs can contain anything from one to millions of logic gates, flip-flops, multiplexers, and other circuits in a few square millimeters. The small size of these circuits allows high speed, low power dissipation, and reduced manufacturing cost compared with board-level integration. These digital ICs, typically microprocessors, DSPs, memory and micro controllers, work using binary mathematics to process "one" and "zero" signals.