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Zaven Kalfayan Lindsay Hunting Phyllis Xu Joy Perkinson

Presentation Outline
Motivation Project

of project and materials

goals

Processing Results Cost

analysis

TechWatch

and future work

What is a Metamaterial?
A periodic material that derives its properties from its structure rather than its components.

*Taken From 3.042 handout & Physics Worlds 2005 Sound Ideas

Project Motivation
Developing

field of research

Applications

in wide range of sectors, such as communications, optics, energy

Currently

used for wave manipulation

Project Goals
Design

a process using lithography to fabricate a 3D structure Create macroscale models of 2D structure, phase mask, and 3D structure Create a 3D metamaterial and image using SEM

Process Design
Interference lithography

Phase mask
2-D photoresist pattern

3-D pattern

Titania structure
Sol-gel infiltration

2D Structure Fabrication
Coat
plain Si wafer
coat with HMDS to promote adhesion coat with SU-8 20xx photoresist using spin coater soft bake @95 to evaporate solvent and cut into pieces

Exposure
UV exposure for xx seconds
flip 90 and expose again

post bake at first 65 then 95 to promote crosslink formation

Develop

submerge in PM acetate to dissolve unexposed photoresist (20 min

submerge in isopropanol to wash away all remnantsfinal structure

Phase Mask Fabrication


Step 1
Vacuum sample with open bottle of fluorosilane so that it evaporates onto sample.

Step 2

Layer with PDMS and heat at 65to 75for at least three hours.

Step 3

Gently peel off PDMS layer as phase mask.

3D Structure Fabrication
Coat
plain glass slide coat with HMDS to promote adhesion coat with SU-8 2005 photoresist using spin coater soft bake @95 to evaporate solvent and cut into pieces

Exposure
Place phase mask on top of slide
Expose for xx seconds and remove phase mask

post bake at first 65 then 95 to promote crosslink formation

Develop

submerge in PM acetate to dissolve unexposed photoresist (5-10 min)

submerge in isopropanol to wash away all remnantsfinal structure

Process Tuning

Exposure times (contact lithography):


SU8-2002: 0.5-25 seconds
SU8-2005: 5-40 seconds SU8-2015: 1-45 seconds

Exposure times (interference lithography):


3-20 seconds for all samples

Prototype Functionality
Problems for 2D & 3D patterns
1. Overexposure 2. Unwashed monomer 3. Adhesion problems
15s SU-8 2015 Cross 15s SU-8 2015 Top

4. Inconsistent results

Design Functionality
2-D Patterns
5s

exposure of SU-8 2015

Coated with HMDS Broadband laser filtered at 365nm Top down Hole spacing - 3.38 um Hole length ~1.5um
5s SU-8 2015 Cross 5s SU-8 2015 Top

Design Functionality
Phase mask
PDMS on SU-8 2015 2D pattern Coated with flourosilane Baked overnight 65C Column Spacing ~ 4 um Height ~15 um
PM of 10s SU-8 2015 PDMS on 10s SU-8 2015

Design Functionality
3-D Patterns
3s SU-8 2005Top

3s exposure of SU-8 2005

355 YAG pulse laser

Coated with HMDS


Thickness ~ 5um

Used in continues mode

2-D Pattern

Phase Mask

3-D Pattern

CAD Model

3-D Printing Model

Actual Sample

Cost Analysis

Fixed cost: Spin coater, lasers, SEM General lab equipment, facilities Variable cost: SU-8 20xx and HMDS ($300/1L $30/500mL ) Trifluoroacetic acid and TiO2 ($60/100mL, $117/50mL) Si wafers ($15/piece) Glass wafers ($240/2500 slides) Total costs/sample: $6/sample

Future Work

Optimize process Explore new thicknesses and exposure times

Adhesion promoters Create more complicated 3D structures Characterize 3D structure properties

TechWatch
2004: Miniaturized antennas based on negative permittivity materialsLucent Technologies Metamaterial scanning lens antenna systems and methodsThe Boeing Company
2003: Metamaterials employing photonic crystalMIT Methods of fabricating electromagnetic metamaterialsThe Boeing Company 2002: Resonant antennasLucent Technologies

Questions?

Design Functionality
Thick Film Photoresist
Calculation:
Sin (70) = 58 / t

Thickness (t) ~ 61 microns


Success!

45s SU-8 2050

Design Functionality
Problems in 2-D patterns
1. Un-washed monomer

2. Over exposure
15s SU-8 2015 Top

3. Non-uniform columns Width of top ~ 1.81 um Width of bottom ~ 1.00 um

15s SU-8 2015 Cross

TiO2 Sol Gel Infiltration


Step 1
Dip sample in TiO2 solution (trifluoroacetic acid, titanium oxide, and deionized water) for about 30 seconds.

Step 2

Dry the sample for at least 2 hours.

Step 3

Heat sample up to 600C in 8 hours and cool down to room temperature in 6 hours to evaporate photoresist.

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