ANSYS Multiphysics 8 0 Customer 3

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Multiphysics 8.0 Customer 3.0- 1/30/04

Dr. Paul Lethbridge - Product Manager
ANSYS Multiphysics 8.0
Technology Overview &
Benefits

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Topics Covered
What is Multiphysics?
Multiphysics Benefits
Educational Products
Market Applications
Market segments by Technology
Market Segments by Industry
Multi Field (Coupled Physics) Capabilities
Direct physics coupling
Sequential physics coupling
Multi-field Solver (New feature at release 8.0)
Other New features
Enhanced non-linear Piezoelectric & piezoresistive element.
Fluid damping elements
Cyclic Symmetry for Magnetostatics
Low Frequency Electromagnetic Contact
Coupled E-B Particle Tracing
Re-meshing for FSI
Selected Multi-Physics Examples
Product Roadmap & Strategy
Transition to Workbench Environment
Product Websites
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The ANSYS Family of Products
Educational/Non
Commercial Use
Products
Ease of use &
Entry level capability
Powerful tools
for the physics specialist
High performance
mechanical & Thermal
Extreme functionality
The whole enchilada!
ANSYS Multiphysics
ANSYS Mechanical
ANSYS FLOTRAN
ANSYS Emag
ANSYS Professional
ANSYS Structural
ANSYS MCAD & ECAD Connection products
ANSYS University
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Topics Covered
Market Applications
Other New features
Re-meshing for FSI
Product Websites
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What is ANSYS Multiphysics?
Structural
Fluid
Thermal
Electrostatic
Electrical
Magnetic
Electro-
magnetic
A general purpose analysis tool allowing a user to to combine the
effects of two or more different, yet interrelated physics, within one,
unified simulation environment.
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Benefits of Multiphysics
No other analysis tool provides as many physics under one roof!
Greatest breadth and technical depth of physics.
Fully parametric models across physics, geometry, materials, loads.
Perform Design Optimization across physics, geometry, materials and
loads.
Seamless integration with ANSYS Probabilistic Design System (PDS).
Extremely sophisticated analysis capability.
Bottom line benefits:
Analysis closely match reality bringing reality to the desktop
Reduced assumptions that question certainty and compromise
accuracy.
Lower cost: Fewer analysis software tools to purchase,learn &
manage.
Lower cost: R&D process compression
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Benefits of Multiphysics
The use of Multiphysics allows us to return to the basics
of engineering where a model and the predictive solution
closely approximate reality; this allows the engineer to
design with a high degree of confidence that the answers
are correct.

Dr. Howard Crabb - Ford Motor Company
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Educational Products Problem Size Limits
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Topics Covered
Market Applications
Other New features
Re-meshing for FSI
Product Websites
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Induction heating
RF Heating
Heat-exchangers
Electronics
cooling
Automotive
A/C systems
SEMICON
Ion implanters
PVD / CVD
Fluid systems
Hydraulic
Pneumatic
Fuel
Microfluidics
Electromagnetic
machines
Pumps
Generators
Motors
Solenoids

Inertial
Pressure
Mass
Proximity
Thermal
Acoustic

Market Applications by Technology
Sensors & Transducers Actuators Processes
Three broad Market segments uniquely identified as being inherently Multiphysics
Click mouse to progress
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Market Applications by Industry
Electronics
Automotive
Aerospace / Space
Marine
SEMICON
Government / Military
Medical / BioMed
Pharmaceutical
Appliances
Multiphysics is not limited to any specific industry.
There are analysis applications and opportunity across the board.
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Topics Covered
Market Applications
Other New features
Re-meshing for FSI
Product Websites
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Coupled Physics Capabilities: Methods
There are two methods to couple physics, Direct & Sequential.
Direct - solves all DOFs at the FEA coefficient matrix level.
Sequential - solves DOFs for one physics then passes results as loads &
boundary conditions to the second physics. At least two iterations, one for each
physics, in sequence, are needed to achieve a coupled response.
There are many confusing terms for the two methods:
Coupled Physics Terminology
Preferred ANSYS Inc.
descriptive usage
Direct Sequential
Strict Mathematical usage
Matrix
Load vector
LHS
RHS
Monolithic
Staggered
Archaic
Use at your peril!
Strong
Weak
Tight
Loose
Full
Partial
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Direct Coupled Physics Applications
Coupled Physics Applications
Thermal-Structural
Anything with a structure!
Gas turbines.
Pressure-Structural (Inviscid FSI) Acoustics, sonar, SAW
Piezoelectric
Microphones, sensors
Piezoresistive
Pressure sensors, strain gauges, Accelerometers
Circuit coupled electromagnetics:
CIRCUIT124
CIRCUIT125
Motors, MEMS
Electrostatic- Structural:
TRANS126
TRANS109
MEMS
Electro-thermal-structural -magnetic:
SOLID5, PLANE13
SOLID62, SOLID98
IC, PCB electro-thermal stress, MEMS actuators
Fluid-thermal
Piping networks, manifolds
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Sequential Coupled Physics Applications
Thermal-Structural
Gas turbines.
Electromagnetic-thermal

Electromagnetic-thermal-structural
Induction heating, RF heating
Electrostatic-Structural
Electrostatic-Structural-Fluidic
MEMS
Electrostatic Charged particle
Ion Optics, Field Emission Display Technology,
Analytical instruments
Magnetic - Structural Solenoids, electromagnetic machines
Fluid-Solid:
FLOTRAN based FSI
MpCCI: Bi-directional FSI
CFX-ANSYS unidirectional interface
Aerospace, automotive fuel, hydraulic systems, fluid
bearing,
MEMS fluid damping, drug delivery pumps, heart
valves.
Electromagnetic-Solid-Fluid
Fluid handling systems, EFI, hydraulic systems
Thermal-CFD
Electronics cooling
Multi-field Solver Many! All of the above!
Sigfit: Unidirectional, Structural Optical
Automotive lighting, astronomy, any optical
instruments
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Topics Covered
Market Applications
Other New features
Re-meshing for FSI
Product Websites
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Multi-field Solver - Pretext
Situation Prior to Release 8.0:
Significant number of multi-physics problems can be addressed with
sequential coupling using core elements.
Our current tools for sequential coupling require advanced APDL
and domain knowledge to process solution.
We have out-grown custom-command macros that perform
sequential coupling e.g..:
FSSOLV
ESSOLV
Fluid Solid Interaction (FSI) was a first step towards automated
sequential coupling technology
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Multi-field Solver Why?
There is Growing Market Requirement to:
Solve multi-physics problems from all industries.
Often need to incorporate more than two physics.
Couple more easily to external codes
Provide an easier to use Multiphysics environment for current
analysts.
In Response:
ANSYS have developed a multi-field solver to automate
sequential coupling, and be general enough in the design for
most multi-field solution requirements

The multi-field solver is an evolution of our successful FSI solver

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Multi-field Solver Implementation
Model and mesh
Single model of physical parts.
Multiple, separate meshes for each Field, derived from base solid model.
What is a FIELD ?
A FIELD is an Finite Element model set up to perform a single solution
It may solve for a single physics (e.g. a mechanical structure)
It may solve for directly coupled physics (e.g.. piezoelectrics)
A selection of element types is used to define a FIELD
Each FIELD has its own mesh
Loads, boundary conditions, solver selection are all part of the FIELD
definition
A FIELD may be any analysis type (Static, Harmonic, Transient)
Each FIELD creates its own results file
A FIELD may be defined (imported) from an external code via a CDB file.
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Interfacing between Fields
Fields talk to one another through surface or volumetric interfaces
Field coupling is realized by mapping loads from one mesh to another
Support similar or dissimilar meshes
Supports 1
st
order and 2
nd
order elements or mixtures of both
Automated mesh morphing of non-structural domains is available for all
non-structural element types.
Multifield Solution
The solver loops through all fields
Supports static, transient and harmonic analysis
Convergence is monitored at the interfaces where loads are transferred.

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Time loop:
For transient analysis, refers to solution in time
For static analysis, refers to each load step
For harmonic analysis, refers to harmonic analysis
within time step

Stagger loop:
Implicit coupling of various fields in time loop
Number of stagger iterations determined by
convergence of load transfer or max stagger
iterations

Field loop:
Field solution with specific solution options
Load transfer to a particular field occurs before
solution of the field
Dissimilar mesh across surface/ volume interface
between fields
Time Loop
End Time Loop
Stagger Loop
End Stagger Loop
Field Loop ( i=1,n)
End Field Loop
Physics Field 1
Physics Field 2
Physics Field n
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Multi-field Solver- Physics Loads
PHYSICS
Physics Loads Transferred in Field Loop
SEND RECEIVE
CFD Heat flux, Forces, Temperatures
Displacement, Velocity, Temperature,
Heat rate, Forces
THERMAL
Temperature, heat flux

Temperature, Heat flux, Heat rate,
Displacement
STRUCTURAL Displacement, Velocity Forces, Temperature, Displacement
MAGNETIC Forces, Heat rate Temperature, Displacement
ELECTRIC Forces, Heat rate Temperature, Displacement
High Frequency
ELECTROMAGNETIC
Heat Rate Temperature, Displacement
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Multi-field Solver Multi-user deployment
No need for a super user to handle all physics, separate physics can be
processed by individual analysis experts in the company:

Intra-Company Resource
Multi-field
Analysis
CAD Model
Physics 1 Engineer
e.g. CFD
Model pre processing
(loads, boundary conditions
& mesh)
Physics 2 Engineer
e.g. Electromagnetics
& mesh)
Physics 3 Engineer
e.g. Structural
& mesh)
Physics 4 Consultant
Engineer
e.g. HF electromagnetics
& mesh)
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CFD CDB File
Electromagnetics
CDB file Structural CDB file HF Emag CDB file
Multi-field Solver Multi-user deployment
Each physics has its own CDB and results (*.R*) file.
Solid Model
Physics 1
e.g. CFD
& mesh)
Physics 2
e.g. Electromagnetics
& mesh)
Physics 3
e.g. Structural
& mesh)
Physics 4
e.g. HF electromagnetics
& mesh)
Field1.RFL Results File Field2.RMG Results file Field3.RST Results file Field4.RMG Results file
Multi-field Solver
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Multi-field Solver - dissimilar mesh interface
Example of dissimilar mesh between physics:
CFD mesh: 600,000 elements
(Fluid region not shown)
Thermal-mechanical mesh: 15,000
elements
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Multi-field Solver- Summary
Physics is treated as a "field" with an independent model & mesh
Each field is defined by a group of element types
Load transfer regions are identified by surfaces and/or volumes
Sequential (Load vector) coupling between fields
Each field may have:
Different analysis types
Different solvers and analysis options
Different mesh descretization
Each field can be imported from an external solver (e.g. CFX)
Surface load transfer across fields
Volumetric load transfer across fields
Automated morphing of non-structural elements
Independent results files for each field
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Multi-field Solver- Physics & Applications
Multi-Field Coupled Solver - Physics Applications/ Markets
Thermal-Structural
Gas turbines.
Electromagnetic-thermal
Induction heating, RF heating
Electrostatic-Structural - Fluidic:
MEMS
Electrostatic Charged particle
Ion Optics, Field Emission Display Technology,
Analytical instruments
Magnetic Structural - Thermal Solenoids, electromagnetic machines, Bus bars
Fluid-Solid:
FLOTRAN based FSI
CFX-ANSYS unidirectional interface
Aerospace, automotive fuel, hydraulic systems,
fluid bearing,
MEMS fluid damping, drug delivery pumps,
heart valves.
Thermal CFD
Electronics cooling, engines
Magnetic - CFD MR fluids, Ferro-fluidics, automotive
Third Party/External Product coupling:
Sigfit: Unidirectional, Structural Optical
MpCCI: Bi-directional FSI
Automotive lighting, astronomy, any optical
instruments
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Multi-field Solver- Benefits
Provides an easy to use framework to solve coupled field problems in
ANSYS Multiphysics
Ability to sequentially couple any number of physics fields
Applicable across all physics available in ANSYS Multiphysics
Multiple field specification with different solution option for each field
Analysis type (Transient/Static/Harmonic)
Solver options
Material & geometric non-linearity
Automated surface and volume load transfer across dissimilar mesh
Automated Morphing of field elements
Unidirectional coupling between CFX and ANSYS Multiphysics
Unidirectional coupling between third party solvers and ANSYS
Multiphysics
Provides analysis opportunities in many new market areas where there
have previously been no solutions.
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Multi-field Solver- RF Attenuator Example
RF/microwave energy is attenuated through resistive losses in a Nichrome film
attached to the microstripline waveguide. The energy is lost in the form of heat
which is conducted both through the devices ceramic substrate and top insulating
surface film.
Solid Model:
RF waveguide
Ceramic
substrate
Nichrome
film
Image from KDI data sheet.
Typical Packaged Device:
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HF Emag mesh: 98,175 elements
Thermal Mesh: 6,600 elements
Thermal
Physics Field 2
Heat generation rate
HF Emag
Physics Field 1
High-Frequency electromagnetic coupled to a steady-state thermal analysis:
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E-field
H-field
Resultant temperature
Analysis results:
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Multi-field Solver- MEMS RF Switch Example
Transient response of MEMS RF Switch to a pulsed voltage excitation:
Beam support post
Ground electrode
Beam electrode
Substrate
Perforation holes to
control fluid damping
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Multi-field
Analysis
Physics 1: Mechanical Engineer

Mesh solid model of switch
Apply clamped BCs
Perform squeeze-film damping analysis
using FLUID136, FLUID138.
Prepare structural dynamics analysis run
Physics 2: Electronics Engineer

Create Air mesh around switch
Apply voltage BCs
Prepare electrostatics analysis run
Write CDB file
CAD Model
MFIMPORT
Each physics model is prepared independently:
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Electrostatics
Physics Field 2
Displacement, Forces
Mechanical
Physics Field 1
Structural mesh: 1894 elements
Electrostic mesh: 16,353 elements
Transient, dynamic electrostatics coupled to mechanical analysis:
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Displacement of switch mid-plane
Under pulse voltage excitation
Analysis Results:
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Multi-field Solver Example: CFX Imported field
Gas turbine with internal cooling example:
Unidirectional coupling between CFX and ANSYS
CFX performs conjugate heat transfer fluid solution.
CFX writes an ANSYS CDB file containing surface forces, volumetric
temperatures; defining an external field for the multifield solver
ANSYS interpolates CFX results onto the ANSYS FE mesh
ANSYS solves the thermal-stress analysis
Makes use of Cyclic symmetry (113 blades!)
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ANSYS Internal Physics Field External
Physics Field
Structural
Physics Field 2
Volumetric
Temperatures
Interpolated
Volumetric Temperature
Surface
Forces
Interpolated
Surface Forces
Details of field stagger loop:
CFX Model
Physics Field 1
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Imported field process:
Create CFD model in CFX-build,
Pre-process and Solve Conjugate HT problem in CFX-solve.
Use the export utility in CFX-Post create a ANSYS CDB file
CDB file has SUR152/154 elements with force loads and SOLID70 with temperatures
derived from CFX mesh.
Create solid region in ANSYS Multiphysics and mesh for thermal-stress analysis
Apply boundary conditions (Omega loading, cyclic symmetry)
Read in the cdb file from CFX via the MFIMport command
Create the fluid solid (FSIN) interfaces via SF command for the surface Forces
Create the solid-solid volumetric (FVIN) interface via BFE command for the
temperatures
User defines solid region as "field2" and fluid (CFX) region as "field1"
ANSYS 8.0 multi-field stagger loop algorithm is used to transfer loads from "field2 mesh
to "field1 mesh and then solves the thermal-stress analysis."
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Field 1: CFD Results
Pressure
Streamlines
Temperature
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Field 2: Thermal Mechanical Results
Displacement
Equivalent stress (SEQV)
Temperature
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CFX can export the following to ANSYS Multiphysics
At surfaces
Nodal heat flux
Nodal forces
Within Solid volumes
Nodal temperatures
CFX loads can be read only with the ANSYS Multiphysics Multi-
field Solver
CFX5 export
Stand-alone CFXExport executable available for CFX5.6 customers
ANSYS CDB file created from CFX results files
Works with ANSYS Multiphysics 8.0 and the Multifield solver

Multi-field Solver: CFX support
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Topics Covered
Market Applications
Other New features
Enhanced non-linear Piezoelectric & piezoresistive elements.
Direct coupled piezoresistive elements
Re-meshing for FSI
Product Websites
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Series 22X elements bring consistency and ease of use to our direct
coupled physics:
Capabilities
New material models and coupled-field effects
More special features and loads
Consistency
Flexible setting of DOFs and reactions - controlled by KEYOPT(1)
Element shapes and orders - match our 18X solid structural elements
Load labels - CHRG vs AMPS
Large deflection capability - available for ALL analyses with structural DOFs
New code architecture
Use existing / enhanced core legacy elements as building blocks
Inherit the functionality of core elements - material models, loads, special features.
Calculate directly coupled-field effects inside the element.
Facilitates infrastructure to rapidly deploy additional directly coupled physics.
Direct Coupled-Field Elements - Benefits
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Series 22X Coupled Field Elements
Higher order solid elements for
Piezoelectric analysis
Piezoresistive analysis
Applications
Pressure transducers
Sensors
Accelerometers
Microphones
Elements
PLANE223 2-D 8-Node Quad
SOLID226 3-D 20-Node Brick
SOLID227 3-D 10-Node Tetrahedral
Couples to CIRCU124
Can build Wheatstone bridge etc
Images courtesy Endevco & Fujikura.
Acceleration
R1
R2
R4
R3
Force
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Coupled Field Piezoresistive Element
Strain gauge accelerometer principle of operation:
Proof mass
R1 R2 R3 R4
R1 R4
Acceleration
Force
R1
R2
R4
R3
Acceleration
Force
Piezoresistors
R1
R1
R1
normal
compression
tension
piezo-resistor
color key
Support Frame
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Four Piezoresistor elements
Beam
Strain gauge accelerometer analysis example:
Accelerometer uses four piezoresistive sensors per beam in a Wheatstone Bridge
configuration.
Objective is to compute Output voltage and sensitivity with 5 V DC excitation.
SOLID95 for mass, frame, and beam
SOLID226 for Piezoresistors
Voltage coupling used to create Wheatstone bridge.
Frame
Proof Mass
Detail of beam:
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Analysis results for 1 G acceleration load:
Stress in beam: 1.6-2.9 MPa
Differential voltage in bridge: 2.79 mV
Sensitivity: 2.84e-4 Vsec
2
/m
Axial stress contour plots:
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Damping Elements for Thin Film Applications
FLUID 136 - 2D 4 or 8 node squeeze film fluid element
FLUID 138 - 3D 2 node viscous fluid link element
FLUID 139 - 2 or more node slide film damper

Applicable to MEMS or macro devices where damping attributed to thin films/ air gaps is
required.
KEYOPTS control the flow regime: Continuum, High Knudsen numbers etc.
The fluid environment is defined by a set of real constants.
For FLUID136 & FLUID138: The elements are added to the structure and a static
analysis is used to determine the damping effects at low frequencies, and a harmonic
analysis is used to determine the stiffening and damping effects at high frequencies.
The DMPEXT command is used to extract frequency dependent damping parameters
for use with the MDAMP, DMPRAT, ALPHAD, and BETAD commands for use in
structural dynamics analysis with correct damping.
Accurately extract ALPHA and BETA Rayleigh damping terms for a transient analysis.
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FLUID 136:
Models viscous fluid flow behavior in small gaps between fixed surfaces and
structures moving perpendicular to the fixed surfaces.
Used to determine the stiffening and damping effects that the fluid exerts on the
moving structure.
Based on the Reynolds squeeze film theory and the theory of rarefied gases.
A static analysis is used to determine the damping effects at low frequencies. A
harmonic analysis is used to determine the stiffening and damping effects at high
frequencies.
The DMPEXT command is used to extract frequency dependent damping
parameters for use with the MDAMP, DMPRAT, ALPHAD, and BETAD
commands for use in structural dynamics analysis with correct damping.
Accurately extract ALPHA and BETA Rayleigh damping terms for a transient
analysis.
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FLUID 138:
Models the viscous fluid flow behavior through short channels (i.e., holes) in
microstructures moving perpendicular to fixed surfaces.
Can be used in conjunction with FLUID136 elements to determine the stiffening
and damping effects that the fluid exerts on the moving perforated microstructure.
Assumes isothermal flow at low Reynolds numbers.
Accounts for gas rarefaction effects and fringe effects due to the short channel
length.
Can be used to model either continuous or high Knudsen number flow regimes.
Applicable to static, harmonic, and transient analyses.
FLUID 139:
139 is a combination of Couette (low frequency) and Stokes flow (inertial effects at
high frequency).
The viscous flow between surfaces is represented by a series connection of mass-
damper elements whereby each node corresponds to a local fluid layer
Applicable to large deflection.
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Damping dominant @ low
frequencies represents
fluid displacement effects
Squeeze or Spring dominant
@ higher frequencies
represents compressible fluid
effects
Squeeze & damping constants:
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Automated using the DMPEXT
command macro
Computing damping parameters for flexible bodies using the Modal Projection
Technique:
Build a structural and thin-film fluid model and mesh.
Perform a modal analysis on the structure.
Extract the desired mode eigenvectors.
Select the desired modes for damping parameter calculations.
Perform a harmonic analysis on the thin-film elements.
Compute the modal squeeze stiffness and damping parameters.
Compute modal damping ratio and squeeze stiffness coefficient.
Display the results: MDPLOT.
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Transient dynamic response of damped MEMS RF Switch:
Viscous
FEA Model of damping holes:
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Damping Elements Application Example
Results: Transient dynamic response of the switch to a pulsed voltage excitation.
ALPHA and BETA damping parameters were obtained from a squeeze-film
analysis of the structure
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MEMS Accelerometer harmonic response:
Damping Elements Application Example
Pressure distribution at 20 Hz for
design with no damping control
holes in the plate.
Pressure distribution at 100 Hz for
design with matrix of damping
control holes in the plate.
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MEMS Accelerometer harmonic frequency response 0.1 10 kHz
Shows results of four design iterations:
Damping Elements - Application Examples
Initial design
(no plate holes)
is overdamped

Final design
(honeycomb plate) has
flattest frequency
response
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LF Electromagnetic Cyclic Symmetry
Feature:
Cyclic symmetry (periodicity) for Low Frequency Electromagnetics
Commands: CYCLIC and CYCOPT
Supports: PLANE13, PLANE53, SOLID96, SOLID5, SOLID98, SOLID117
Benefits:
This new feature is applicable to 3D magnetic scalar potential (MSP),
magnetic vector potential (MVP) and edge (SOLID117) formulations .
These commands are also used for cyclic symmetry structural analyses
results greater consistency across physics.
Reduce FEA problem size & faster solution time by making use of
symmetry.
Market applications:
Primarily rotating electromagnetic machines
Electric motors
Alternators
Inductive ignition system sensors
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Example: 4 pole variable reluctance machine reduced to 90 degree sector:
B
circumferential
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Feature:
Contact for Low Frequency Electromagnetic
Commands: TARGET169, CONTAC171
Supports: PLANE13, PLANE53, SOLID96, SOLID5, SOLID98
Benefits:
This new feature is applicable to 3D magnetic scalar potential (MSP), and
2D magnetic vector potential (MVP).
A lot easier to use than constraint equations!
Market applications:
Electric motors
Alternators
Inductive ignition system sensors
Linear Motion Systems
Non Destructive Testing
Eddy current braking systems
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Example: In pipe eddy current based sensor. Sensor slides down pipe
detecting flaw in pipe wall.
B-field contours
Pipe
Sensor
63
Ion Optics Enhancements
Ion Optics - An important feature for the SEMICON and Analytical
instrument markets:

Particle tracing is a post processing feature.
Can trace charged particle in either a electrostatic field or magnetostatic
field or both.
Particles initial conditions definable are:
Mass
Charge
Starting coordinates (x,y,z)
Velocity vector (Vx,Vy,Vz)
Can define 50 particles per run.
Particle trajectory can be plotted in 2D/3D or listed.
Space charge effects are not accommodated.
No relativistic effects (velocity is much smaller than speed of light).
64
Example of a particle trace through homogenous magnetic field, with a
changing electric field. Animation is a composite of static cases
65
Example of a particle trace on a charged particle trace!
PLTRACE command used to slide visualization particles along the charged
particle trajectories.
66
FSI Remeshing Enhancements
Coupled fluid-solid (FSI) meshing capability enhanced to handle applications with
large boundary/domain changes.
This feature opens up a broader range of FSI market applications:
Solid can undergo large deformation or complete rotations. E.g.. Pumps or stirrers.
Detached solid object movement through fluid.

Enhancements:
Moving boundary problem is re-meshed when mesh becomes badly distorted or ALE
mesh morphing scheme fails.
Improved accuracy when the mesh is distorted by ALE mesh moving scheme
Regenerates a new mesh from a selected element group.
All element based loads (e.g. FSI interface) are updated
Body loads on the interior nodes are updated
Nodal values are interpolate from old mesh to new mesh
Redesigned FLOTRAN result files, creates new rfl file for each remesh
Animation is possible across multiple result files (anmres)
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New Commands:
FLDATA39, REMESH, Label, Value
ANMRES, Delay, Min, Max, Inc, Autocntrky, Freq, rfl
Limitations:
Must keep the same topology for surface (boundary) elements.
Applicable to triangle (2D) and tetrahedral (3D) elements
Example: Rigid body rotation, a flap valve in a tube:
68
Cylinder passing through a channel:
69
Topics Covered
Market Applications
Other New features
Re-meshing for FSI
Product Websites
70
Selected Multiphysics
Thermal-structural coupling
Needed for any product subjected to changes in
temperature!
Engines, gas turbines, heat exchangers
Electronic components, package solder joints
Cryogenic components and systems
Test & Measurement Equipment
Heat
Transfer
Solid
Mechanics
71
Thermal Structural Example
BGA IC Package differential thermal expansion
Image courtesy of MCR.
72
Thermal-Fluid Coupling (Conjugate heat transfer)
Heat is transferred between fluid and solid
Convection effects.
Forced flow.
Applications:
Heat exchangers
Electronics device/enclosure temperature management
Heat
Transfer
Fluid
Mechanics
73
Conjugate Heat Transfer Example
Vertical heat sink
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Electro- Thermal Coupling
Resistive (Joule) heating
Electro-Thermal-Structural coupling
Resistive (Joule) heating resulting in thermal expansion
Needed for many electronic power handling
components and systems.
Current-carrying conductors, bus bars
Electric motors, generators, transformers
Electronic components and systems
Actuators
Heat
Transfer
Solid
Mechanics
Electricity
75
Electro-Thermal-Structural Example
Current Density Electrical Power Thermal Stress
Images courtesy of Atila Mertol, LSI Logic.
Detail of Integrated Circuit via & aluminum trace
76
Electrostatic Structural coupling
Piezoelectric effect
Electrostatic-structural-Fluid Coupling
Electrostatic actuated structures incorporating effects of fluid
damping.
The entire MEMS Industry is based on these physics!
Resonators/Actuators
Electro-mechanical band pass filters
Inertial sensors (Accelerometers & gyroscopes)
Inkjet printer heads
Solid
Mechanics
Fluid
Mechanics
Electrostatic
77
MEMS Micromirror Example
78
Electromagnetic-Thermal coupling
Eddy current losses (LF Emag)
Resistive & dielectric losses (HF Emag)
Applications:
Required by those that want heat or those that want to minimize it!
Induction heating systems (LF Emag)
Heat treating processes
Pre-heating for metal forming operations
RF Microwave systems (HF Emag)
Heaters
Attenuators
Heat
Transfer
Electro-
magnetics
79
Induction Heating Example
Solid model meshed
Current in coil
Induced current in plate
Resultant B-Field
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Induction Heating Example
Joule heating
Time averaged joule heating
thermal load
Resultant temperature
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Electromagnetic - Fluid coupling
Applications
Magneto-Rheological (MR) devices
Active structure vibration damping systems
Automotive & biomedical actuators
Induction furnaces for stirring molten metals
MHD power systems, EHD pumps
Fluid
Mechanics
Electro-
magnetics
82
Electromagnetic - Fluid coupling Example
A.C. Induction furnace:
Electromagnetic field solution to
compute Lorentz forces
CFD analysis performed to determine
stirring pattern within furnace core
83
Electromagnetic Solid Coupling
Forces due to magnetic field move/interact with mechanical
structures.
Magnetic force (linear systems)
Magnetic torque (rotary systems)
Applications:
Actuators / Solenoids
Rotating machines
Alternators
Motors
Solid
Mechanics
Electro-
magnetics
84
Moving Magnetic Probe Example
2D Axi-symmetric model using true moving object, sliding mesh boundary
Animation of flux lines when V = 0.4 m/s
85
Magnetic Levitation Example
Flux lines and levitation coil currents:
86
Rotating Machine Examples
Images courtesy of CAD-FEM GmbH.
87
Thermal-Solid-Electromagnetic Coupling
Thermal-mechanical dimensional changes coupled into HF
Emag or LF Emag analysis.
Many applications require knowledge of the effects of
temperature on electromagnetic performance.
Heat
Transfer
Solid
Mechanics
Electromagnetics
88
Waveguide Bend
Electric Field
@ 20
o
C
Waveguide
Displacement
from 20- 60
o
C
Waveguide Bend
Electric Field
@ 60
o
C
20
o
C : S
11
= 0.1901, S
12
= 0.9817
60
o
C : S
11
= 0.1895, S
12
= 0.9819
Thermal-Solid-Electromagnetic Coupling Example
Thermal Effects on microwave wave guide
89
Solid
Mechanics
Viscous Fluid
Mechanics
Coupled Fluid Solid (Fluid Solid Interaction, FSI)
Fluid pressure deforms mechanical structure which in turn
effects fluid flow. May also include heat transfer.
Applications
Aero-elastic problems
Hydraulic / Pneumatic / Fuel systems
Fluid pumps
Biomedical
Blood flow elastic artery
Heart valves
90
FSI Example Pressure Limiting Valve
0.25
mm
2.4 mm
4.0 mm
4.5 mm
10.0 mm
55
Pressure-limiting valves are used in
anti-lock brake systems
Huge liability ramifications
Per VDO, tiny geometric design
changes cause wide variations in valve
response and performance
Without FSI VDO was guessing on
new valve designs.
FSI analysis significantly reduces
overall time to market and improve
reliability.
Courtesy : Siemens VDO
91
FSI Example Pressure Limiting Valve
Mesh detail & dissimilar mesh for solid & fluid
92
FSI Example Results
93
FSI Example Results
Ball displacement time history, f 875 Hz
94
Inviscid fluid-structural coupling (FSI)
Longitudinal pressure wave travels through fluid causing
displacement of solid structure.
Applications (Primarily acoustics):
Loudspeaker design
Microphone
Sonar / ultrasonics
Inviscid Fluid
Mechanics
Solid
Mechanics
95
Acoustics Example
Response of axisymmetric disc in tube to plane wave.
96
Topics Covered
Market Applications
Other New features
Re-meshing for FSI
Product Websites
97
Product Roadmap - Overview
Target markets:
Actuator and Sensors
Low Frequency (Actuators and electric machines)
MEMS
High Frequency (RF) devices
Biomedical - FSI
Short/Medium Term (< 2 years):
Release 8.1/9.0
ROM140 (Damping counterpart to ROM144)
Publish ROM database format & provide additional ports on ROM144 for drive
variable
LinkCAD for ANSYS Process Emulator module
CFX ANSYS integration
Longer Term (2 - 3 years):
Products and technology migrated to ANSYS Workbench Environment.
CFX will take FLOTRANs place in the ANSYS Workbench Environment.
MEMS coupled analysis capability in Workbench Environment.
98
Roadmap Transition to Workbench
Objective is to migrate ALL physics technology to Workbench
We will not to develop standalone physics products.Products and
physics will instead be more modular and controlled through licensing.
Strategy is to migrate and expose technology into the ANSYS Workbench
Environment creating a general purpose product applicable to a broad
range of markets.
Order of physics exposure is:
LF Emag
CFD (CFX technology)
HF Emag
Advanced Physics
99
Topics Covered
Market Applications
Other New features
Re-meshing for FSI
Product Websites
10
0
Product Websites
10
1
Product Websites FSI & MEMS
10
2
The End!
Acknowledgements:

Dale Ostergaard
Barry Christenson
Deepak Ganjoo
Ray Browell
Bill Bulat
Achuth Rao
Stephen Scampoli
Daniel Shaw
Mark Troscinski
Miklos Gyimesi
CAD-FEM GmbH

ANSYS Multiphysics 8 0 Customer 3

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