THE BTEV VACUUM SYSTEM

CHALLENGE

• Requirements for dynamic aperture and

minimal mass leads to pixel elements in
vacuum
• Large Gas Loads
• Confined and Congested Space
• Operating in Dipole Magnetic Field
• Pressure requirements: minimize background to
experiment from beam-gas interactions
• Tolerant to Pressure Upsets
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 RESOURCES
• Engineering
 Vacuum System – Mayling Wong
 Vacuum Vessel – Alex Toukhtarov

• Testing and Prototyping

 PAB – Cary Kendziora
 Lab 7

• Technical Guidance from Mauro Marinelli –

INFN Genova

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 BTEV VACUUM SYSTEM

The BTeV Vacuum System, including

beam pipes and pixel detector
vacuum, has been modeled to better
understand the pressure distribution
• System specifications
• Layout
• Model Input
• Results
• Measured Gas Load
• 10% Mock-Up
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 SYSTEM SPECIFICATIONS

• < 1e-7 torr in system between

RICH detectors
• Determine the gas load in system
and the composition of the gas
• Determine pumping requirements

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 VACUUM SYSTEM LAYOUT
Dirty side:
Clean side: Cryopumps 800 L/sec
Pump 100-1000 L/sec Water Pumps 10,000+ L/sec

Ion Pump
RICH beam Forward beam
80 L/sec
Pipe 1.92” ID Pipe 1.0” ID
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DETAILS OF PIXEL DETECTOR
VACUUM
• Thin metal
membrane isolating
pixels from beam
line
• Thin membrane = RF
shield
• RF shield will
probably not be a
perfect seal

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VACUUM SYSTEM SCHEMATIC

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 MODEL INPUTS
• Geometry of vacuum system
Beam pipes
Clean side of RF shield – beam line
Dirty side of RF shield – pixel detector

• Pumping speeds

• Total gas load in beam pipes due to

outgassing
1e-10 torr-L/cm^2/sec (clean,
unbaked aluminum pipe)

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 MODEL INPUTS (CONT’D)
• Total gas load in pixel detector due to
outgassing
 Initial estimate 1.4 e-2 torr-L/sec (caution
from Mauro: It may require lowering the
temperature of 90% of the detector to
cryogenic temperatures to get the gas load
this low)

 Based on current measurements 1.5 e-3

torr-L/sec (Caution from Mauro: small
sample size may effect accuracy)

• Apertures in RF shield
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 RESULTS
Pressure Distribution in BTeV Vaccum System
1.00E-06

Pumps:
- Beam pipe ion pump 80 L/sec
- "Clean volume" pump 50 L/sec
- "Dirty volume" pump 800 L/sec
Pressure (torr)

1.00E-07 Aperture in RF shield: 0.5 cm dia.

Inside RF shield, max. pressure:

- Gas load 1.5e-3 torr-L/sec:
1.56e-5 torr
- Gas load 1.4e-2 torr-L/sec
1.45e-4 torr

1.00E-08 Pixel gas load 1.5e-3 torr-L/s

Pixel gas load 1.4e-2 torr-L/s

1.00E-09
-10 -5 0 5 10
Distance from C0 (m)
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GAS LOAD MEASUREMENT
PROCEDURE
• Treat sample by baking
and/or cleaning w/ alcohol
• Bake empty stainless steel
vacuum chamber for 3 days
• After cooled, place sample
into chamber
• Pump for 3-10 days
• Measure rate-of-rise each
day
• Record RGA reading
periodically to determine
gas composition

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 MEASURED OUTGASSING RATES

1.00E-06 Glassy c.f. tubes

- 1st
Glassy c.f. tubes
Outgassing Rate (torr-L/s/cm^2)

1.00E-07
- 2nd
HDI
Circuit boards
1.00E-08
SS chamber

1.00E-09
Carbon fiber
panel
Total surface area for each sample:
- Vacuum chamber: 1731 cm^2
1.00E-10 - Glassy c.f. tubes: 84 cm^2
- HDI: 756 cm^2
- Circuit boards: 773 cm^2
- Carbon fiber panels: 380 cm^2

1.00E-11
0.0 50.0 100.0 150.0 200.0 250.0 300.0
Time (hr)
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 MEASURED GAS LOADS

1.00E-05

Fuzzy carbon - 1st run

Fuzzy carbon - 2nd run
Bump bonded chips
Gas load (torr-L/sec)

1.00E-06 Bump bonded chips - solder

1.00E-07 Overall dimensions:

Fuzzy carbon:
5.25"x0.31"x0.75"
Bump bonded chip:
0.5"x0.32"

Total number of chips:

6 indium bonded chips
1.00E-08 6 soldered chips

0.0 50.0 100.0 150.0 200.0 250.0 300.0

Time (hr)

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 PIXEL VACUUM (DIRTY SIDE)
GAS LOADS
Meas.
Est. Outgassing Est. Gas Outgassing Rate gas load
Rate (torr-L- Load (torr- (torr-L-sec^-1- (torr-L-
Component Material sec^-1-cm^-2) L-sec^-1) cm^-2) sec^-1)
pixel vessel inner wall aluminum 1.00E-10 4.08E-06 4.08E-06
silicon sensor / ROC indium or lead-tin
ass'y bump bond 4.00E-09 7.02E-05 3.50E-05
plane (coupon) fuzzy carbon 1.08E-04
plane support structure carbon fiber 7.50E-08 6.29E-03 1.19E-09 9.98E-05
cooling manifold glassy c.f. 7.50E-08 4.62E-04 1.03E-08 6.35E-05
coupon to main cooling plastic 2.90E-07 9.54E-04 9.54E-04
wire bonds aluminum 1.00E-10
HDI kapton 7.50E-08 5.57E-03 8.85E-10 6.57E-05
Circuit boards G-10+elec cmpts 1.00E-08 2.12E-04 5.30E-09 1.12E-04
Beryllium coupon beryllium 1.58E-13 3.45E-09 3.45E-09
RF shielding aluminum 1.00E-10 1.77E-07 1.77E-07
adhesive bonding Hysol epoxy 7.99E-09

Caution from Mauro: It may require lowering the temperature of 90% of the detector
to cryogenic temperatures to get the gas load this low

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 MEASURE GAS LOAD FROM
MOCK-UP OF PIXEL DETECTOR
• Assembly that comprises
10% of the total pixel
detector
• Includes assembly
features (virtual leaks,
adhesives)
• Will include cryopanels
• Good test of temperature
effects on gas load

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 CURRENT DESIGN DIRECTION

• Lower the gas load by cooling as much of the

pixel detector assembly as possible to
cryogenic temperatures
• Add in-situ water pumps (cryo panels) inside
vacuum vessel.
• Develop a seal at the ends of RF shield that
has a conductance less than 1/10 of the
pumping speed on the clean side of the RF
shield

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 FUTURE PLANS
• Measure gas loads and composition
 Continue long-term gas load measurements
 Continue setting up 10% mock-up
• Investigate effect of lowering the entire Pixel
Detector to cryogenic temperatures
• Investigate pump characteristics (speed and
capacity)
• Conduct RF shield mechanical tests
• Work with Mauro on developing and verifying
design of BTeV vacuum system

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