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Types of PCB
(I)
Multi Layer
(V)
Flexible PCB
only one side. Which is called as solder side. The other side is called component side.
Flexible Cards
:-
Multi layer Board (MLB, 4L,6L,8L,12L,16L ) :The ckt density is high compare to D/S for inner layer
made of special laminate is used for bonding purpose ( Prepreg). The inner layer
is etched CU and outer layer is Non- etched ckt. After lamination or pressing
the boards are drilled and plated like PTH D/S.
Screen Preparation
Drying
Screen Printing
Board cleaning
Retouching
Etching
Legend Printing
Final Cutting
Q.C.
Drilling
Ink Stripping
Masking
CNC Drilling
Photo Printing
PTH or Electroplating
Board Cleaning
H.A.L.
Green Masking
Legend Printing
Final Cutting
Etching
Tin Stripping
Q.C.
Mechanical Operation
* Sheet Cutting :-
L
W
* Board Area
Panel Sz.
PCB Sz.
Boarder Area
* Laminates or Copper Sheet :1. Glass Epoxy 2. Paper fenolic 3.Teflon 4. Ceramick (CEM)
* Glass Epoxy :-
Thickness
S/S
1.6 35/0
Cu Thickness
Insulating Material
thickness
D/S
0.8-18/18
1.6-18/18
2.4-18/18
3.2-18/18
Base material is reinforced with glass fiber or paper fiber as filler and epoxy resin and the cu
foil is pressured over it to get cu clad laminates.
* Paper Phenolic :-
Phenolic laminates are reinforced with paper fillers and the cu foil
is pressed to the base material.
* Teflon Laminates :-
Manual Shearing
* Shearing Blades
:-Two Blades :-
1 to 1.50
Manual Drilling
CNC Drilling ( Computer numeric Control)
Do path making
Focus the Hole with help of camera and monitor.
For time saving and maintained the accuracy.
After programming Drill one Panel for checking the
program.
Checked Missing Hole, Extra Hole,Shifting, Inter changed Hole, Drill Dia (
Drill dia checked by Hole Gauge. )
(V)
T3
T2
T1
Path Making
3.175
* In double side PCB drill dia is always 0.1mm extra from finish size.
*. Ink Stripping/ Dry film :To remove the ink by using Naoh or Koh solution.
Ink remove and the cu appears on track and pads only.
Masking
#. To cover the panel with insulating ink. # To avoid the short ckt.
#. To protecte the cu for oxidation
(I) Thermal Masking (II) PISM ( Photo Imagable solder Mask)
# Thermal Masking :-
* Chemical Cleaning :- Using Alkali chemical to remove oil, grease & soil particle
on the surface of laminates.
Water rinse
Material Used :-
(I)
Lith film
(ii) Lith film Developer
(iii)
Sodium Thosulphate
(iv)
Developing Trays
(v)
Retouching Ink
(vi)
Retouching Brush
(vii)
Butter Paper
* Art Work :(I) Manual Artwork (ii) Take Design Print out
* Lith film Developer :- PART- A(P-Methyl amino phenol sulphats
PART- B ( Sodium Carbonate )
Temp.- 200 +--30c
SCREEN PRINTING
It is done with the help of a wooden/ Aluminum frame having a
polyester cloth tightened over it. Polyester is available in different meshes. Which
are indicated by T that indicate the number of thread gapping.
Wooden frame
Three methods for Screen Printing :(I) Direct Method :- Ammonium dichromate or Potassium dichromate is mixed
with super coat solution in 1:3 ratio.
ETCHING
(1)Immersion (2) Bubble (3) Splash (4) spray Etching
350-500 g/ltr
60 to 65 ml/ltr
200c to 300c
Cu +Fecl3
Ammonium Bicarbonate
Ammonium Nitrate
Cupric Chloride
Ammonium Chloride
Temp
75g/ltr
80g/ltr
200g/ltr
100 to 110g/ltr
45 to 55oC
* Etching Problems
1- Under Cut
2- Over Hang
Electrolyses/ P.T.H (Plated Through Hole):The Copper will be deposited on hole wall without electricity.
* With the help of chemical reaction
* 2 to 5microne Cu ( Deposit on hole wall)
Most important process in double Side PCBs
Process of Electrolyses
1- Debarring
Drilled panel are cleaned using debarring machine
which uses a 320 grade silicon carbide brush.
3 - Micro Etch:-
Ginplate
CC-50 5% by volume
D. I. Water
50%
Temp.
26 to 70oC
W. R.
1- 2 Min.
Ginplate Ad-481
120-150gm/l
D. I. Water
H2SO4
5cc /ltr.
Time
2-5Min.
W.R.
1Min.
4 - Pre-Activator
5- Activator
D. I. Water
Time
1min.
5ml/l
76ml/l
5-6 Min.
17%
D.I. Water
100ml/ltr
100ml/ltr
10ml/ltr
D.I. Remaining
10-12 Min.
PHOTO PRINTING
# Lamination :- Laminted the D/S Panel with P.P.D.F.R. Film
(Phto Polymer Dry Film Resist ) (1.0,1.5,2.0 mils)
Release Sheet of 1.0mil, Polthin 1.0mils
#. Normalizing
#. Expose in U.V. Light,
used +ve Pattern (ckt) film in D/S
#. Temp- 110-115 0c
Electro Plating
(1) Cu Plating (2) Tin Plating
10%
CuSo4
Cupper acid
Current
Time
Anode
80g/l
7cc/l
Anode Bag
Bath Tank
Anode Hook
2-3 Amp/Sq.dm
15min
Cu. Min-0.04-0.08%
Polypropylene
P.v.c.
Titanium or
Stainless Steel
*. Tin Plating
Stannous Sulphate
H2So4
Stannous Carrer Additive
Stannolume Brighter
Time
Anode Current
Anode
30g/l
100ml/l
30ml/l
2ml/l
5min
1-2 Amp/dm2
60% Tin &40% Lead
Quality Control
(I) Checking for short ckts.
(II) Checking for shifting
(III) Checking for required hole dia.
(IV) Checking for the proper masking.
(v) Checking for final cut and above all whether the PCB is
delivered in the same material as desired or not