Weapon safing,

arming and fusing

Aditia Aulia
1106052455

Introduction

A fuze is a weapon subsystem that activates the

warhead mechanism in the vicinity of the target and also
maintains the warhead in a safe condition during all prior
phases of the logistic and operational chain.

contd
Basic Functions:
(1) Keep the weapon safe
(2) Arm the weapon
(3) Recognize or detect the target
(4) Initiate the detonation of the warhead
(5) Determine the direction of detonation (special
fuzes only)

Journal

Source : CHINESE JOURNAL OF

MECHANICAL ENGINEERING
Vol. 24, No. 5, 2011

Title : Fabrication of Fuze Micro-electro

mechanical System Safety Device
Discussion:
A new micro fabrication method of metalbased fuze MEMS safety device based on
ultra violet(UV)-LIGA technology.

Fabrication Process

Fabrication Details
Substrate treatment

The nickel substrates were grinded and polished by precision lapping/polishing

machine (DNIPOL-1502).
Immersed in acetone and treated by ultrasonic cleaner (KQ-250DB) for 15 min.
Immersed in ethanol and treated by ultrasonic cleaner (KQ-250DB) for 15 min.

Spincoating SU-8 photoresist

600 r/min for 9 s the speed increased to 1200 r/min for 30 s.

Thickness: 70 m.
The nickel substrate with SU-8 layer was put in electric blast drying oven (WG20).
65 for 1hour 75 for 1hour 85 for 1,5 hour

Contd
1st Lithography

Exposure dose: 200 mJ/cm2, time: 6 minute

Put on a hot plate at 85 for 3 min
Then, the substrate with SU-8 layer was immersed in SU-8
developer for 46 min at room temperature

1st Electroforming

The formulation of electroforming solution was as follows:

Ni(NH2SO3)24H2O (550 g/L), NiCl2 (10 g/L), H3BO3 (35 g/L)
Operating temperature = 50, PH value around 4.0, 8 hour of
process

Contd
Sputtering Cu

Cu films were sputtered by Sputtering System (JS3X-808).

Sputtering time and power were 6 minutes and 300 W.

Spincoating SU-8 photoresist

540 r/min for 9 s the speed increased to 1200 r/min for 30 s.

Thickness: 300 m.
The nickel substrate with SU-8 layer was put in electric blast drying
oven (WG-20).
65 for 1hour 75 for 2hour 85 for 2 hours

Contd
2nd Lithography

Exposure dose: 400 mJ/cm2, time: 12 minute

Put on a hot plate at 85 for 6 min
Then, the substrate with SU-8 layer was immersed in SU-8
developer for 3540 min at room temperature

2nd Electroforming

The formulation of electroforming solution was as follows:

Ni(NH2SO3)24H2O (550 g/L), NiCl2 (10 g/L), H3BO3 (35 g/L)
Operating temperature = 50, PH value around 4.0, 8 hour of
process

Contd
Removal of SU-8 layer

Result
Lower production cost
Shorter production cycle
Smallest dimension of the devices is 40 m
(meets the requirement of size)
The experimental result shows that the
samples are still in good condition and
workable after undergoing impact pulses
with 20 kg peak and 150 s duration and
completely met the requirement of
strength.